JP5445943B2 - 光接続装置 - Google Patents
光接続装置 Download PDFInfo
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- JP5445943B2 JP5445943B2 JP2009502488A JP2009502488A JP5445943B2 JP 5445943 B2 JP5445943 B2 JP 5445943B2 JP 2009502488 A JP2009502488 A JP 2009502488A JP 2009502488 A JP2009502488 A JP 2009502488A JP 5445943 B2 JP5445943 B2 JP 5445943B2
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
- H04B10/505—Laser transmitters using external modulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/516—Details of coding or modulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/67—Optical arrangements in the receiver
- H04B10/671—Optical arrangements in the receiver for controlling the input optical signal
- H04B10/675—Optical arrangements in the receiver for controlling the input optical signal for controlling the optical bandwidth of the input signal, e.g. spectral filtering
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B2210/00—Indexing scheme relating to optical transmission systems
- H04B2210/517—Optical NRZ to RZ conversion, or vice versa
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Communication System (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
Description
図1に、本発明の実施形態の光接続装置100の構成を示す。光接続装置100は、複数の伝送チャンネルのそれぞれに対応した波長の光を出力する波長多重光源50と、基板19に形成された光送信部10と、基板29に形成された光受信部20と、光送信部10及び光受信部20間に1系統の光線路を与える光配線部30に挿入された信号変換部40とを備える。光配線部30は、光ファイバあるいは光導波路により構成することができる。
図1及び図2を参照して、光接続装置100の動作について説明する。光接続装置100は、光導波路群14に集積されたアレイ状の光変調部13Aにより、LSI16の信号ピンと同程度の密度で差動位相差変調を行う。
Claims (6)
- 複数の伝送チャンネルに対応した複数の波長の光信号を出力する光源と、集積回路が搭載され且つ相互間が単一系統の光線路により接続された光送信部および光受信部と、前記光線路に挿入され且つ位相変調信号を強度変調信号に変換する信号変換部とを備え、
前記光送信部は、前記光源からの光信号を伝送チャンネル別に分離する分波器と、前記集積回路からの信号により動作タイミングが同期される複数の光変調器により前記分波器からの光信号を位相変調して位相変調信号を生成する光変調部と、前記光変調部からの位相変調信号を合波し該合波した位相変調信号を前記光線路を介して前記信号変換部へ出力する合波器とを有し、
前記光受信部は、前記信号変換部からの強度変調信号を伝送チャンネル別に分離する分波器と、前記分波器からの強度変調信号を電気信号に変換する受光部とを有し、
前記信号変換部は前記光送信部からの前記合波された位相変調信号を、全伝送チャンネル分について一括して強調信号に変換することを特徴とする光接続装置。 - 前記光送信部の前記光変調部の各光変調器は、連続する2つの動作タイミングにおける光信号の差分を位相変調信号として出力し、
前記信号変換部は、一対の光経路間に信号1ビット分の時間差が設けられた光干渉計により前記光送信部からの位相変調信号を強度変調信号に変換することを特徴とする請求項1記載の光接続装置。 - 前記光変調部の複数の光変調器は、基板に形成された光導波路群に接続され且つアレイ状に配置されていることを特徴とする請求項1又は2記載の光接続装置。
- 前記光源は、伝送チャンネル数と同数の半導体レーザ装置からなることを特徴とする請求項1乃至3のいずれか1項に記載の光接続装置。
- 前記光源は、前記複数の伝送チャンネルに対応する波長の光信号を一括的に出力するレーザ装置からなることを特徴とする請求項1乃至3のいずれか1項に記載の光接続装置。
- 前記光線路が、光ファイバ、又は、基板に形成された光導波路であることを特徴とする請求項1乃至5のいずれか1項に記載の光接続装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009502488A JP5445943B2 (ja) | 2007-03-06 | 2008-02-13 | 光接続装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007055831 | 2007-03-06 | ||
JP2007055831 | 2007-03-06 | ||
JP2009502488A JP5445943B2 (ja) | 2007-03-06 | 2008-02-13 | 光接続装置 |
PCT/JP2008/052298 WO2008108142A1 (ja) | 2007-03-06 | 2008-02-13 | 光接続装置 |
Publications (2)
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JPWO2008108142A1 JPWO2008108142A1 (ja) | 2010-06-10 |
JP5445943B2 true JP5445943B2 (ja) | 2014-03-19 |
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JP2009502488A Active JP5445943B2 (ja) | 2007-03-06 | 2008-02-13 | 光接続装置 |
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US (1) | US8401390B2 (ja) |
JP (1) | JP5445943B2 (ja) |
WO (1) | WO2008108142A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI686904B (zh) * | 2012-03-16 | 2020-03-01 | 美商樂仕特拉公司 | 光子材料中介層的方法及系統 |
WO2015141188A1 (ja) * | 2014-03-19 | 2015-09-24 | 日本電気株式会社 | 光送信器、光通信装置、光通信システムおよび光送信方法 |
US20160204868A1 (en) * | 2015-01-13 | 2016-07-14 | Huawei Technologies Co., Ltd. | Summation of Parallel Modulated Signals of Different Wavelengths |
JP6830790B2 (ja) * | 2016-10-26 | 2021-02-17 | 技術研究組合光電子融合基盤技術研究所 | ネットワークシステム |
CN106992817B (zh) * | 2017-05-17 | 2023-08-18 | 华数传媒网络有限公司 | 光接收装置及装备 |
US10756839B1 (en) * | 2019-05-09 | 2020-08-25 | Hewlett Packard Enterprise Development Lp | Hybrid coarse wavelength division multiplexing (CWDM) transceiver |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11149064A (ja) * | 1997-09-08 | 1999-06-02 | Northern Telecom Ltd | 相互位相及び/又は自己位相変調補償を具備した伝送システム |
JP2003244100A (ja) * | 2002-02-13 | 2003-08-29 | Nippon Telegr & Teleph Corp <Ntt> | 光波長多重リングネットワーク |
Family Cites Families (13)
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JP3413839B2 (ja) | 1991-09-06 | 2003-06-09 | ソニー株式会社 | 光電子集積回路装置 |
JPH05333396A (ja) | 1992-05-29 | 1993-12-17 | Hitachi Ltd | 高次元光素子アレイ及び超並列光インターコネクション |
JPH0779212A (ja) | 1993-09-06 | 1995-03-20 | Nippon Telegr & Teleph Corp <Ntt> | 光波長多重伝送装置 |
JP2000059300A (ja) | 1998-08-06 | 2000-02-25 | Nippon Telegr & Teleph Corp <Ntt> | 光送受信装置 |
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
JP2000201106A (ja) | 1999-01-05 | 2000-07-18 | Oki Electric Ind Co Ltd | 光伝送システム |
JP3694638B2 (ja) | 2000-07-19 | 2005-09-14 | 日本電信電話株式会社 | コヒーレント多波長信号発生装置 |
US6941078B1 (en) | 2001-05-10 | 2005-09-06 | Fujitsu Limited | Method and system for communicating a clock signal over an optical link |
JP4278332B2 (ja) | 2001-06-29 | 2009-06-10 | 日本電信電話株式会社 | 光送信器および光伝送システム |
US7206510B2 (en) * | 2001-10-09 | 2007-04-17 | Nippon Telegraph And Telephone Corporation | Ring network using multi-wavelength generator |
JP3837358B2 (ja) | 2002-04-16 | 2006-10-25 | 株式会社東芝 | 光通信システム |
JP3927913B2 (ja) | 2003-03-05 | 2007-06-13 | キヤノン株式会社 | 光電気混載装置、及びその駆動方法 |
JP4320573B2 (ja) | 2003-07-14 | 2009-08-26 | 日本電気株式会社 | 光受信方法、光受信装置及びこれを用いた光伝送システム |
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2008
- 2008-02-13 US US12/528,927 patent/US8401390B2/en active Active
- 2008-02-13 WO PCT/JP2008/052298 patent/WO2008108142A1/ja active Application Filing
- 2008-02-13 JP JP2009502488A patent/JP5445943B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11149064A (ja) * | 1997-09-08 | 1999-06-02 | Northern Telecom Ltd | 相互位相及び/又は自己位相変調補償を具備した伝送システム |
JP2003244100A (ja) * | 2002-02-13 | 2003-08-29 | Nippon Telegr & Teleph Corp <Ntt> | 光波長多重リングネットワーク |
Non-Patent Citations (1)
Title |
---|
JPN6013007975; R. Nagarajan, et al: '400 Gbit/s (10 channel×40 Gbit/s) DWDM photonic integrated circuits' Electronics Letters Vol. 41, No. 6, 20050317, IET * |
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Publication number | Publication date |
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US8401390B2 (en) | 2013-03-19 |
WO2008108142A1 (ja) | 2008-09-12 |
JPWO2008108142A1 (ja) | 2010-06-10 |
US20100104289A1 (en) | 2010-04-29 |
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