WO2008105133A1 - Ｉｃタグ及びその製造方法 - Google Patents

Ｉｃタグ及びその製造方法 Download PDF

Info

Publication number
WO2008105133A1
WO2008105133A1 PCT/JP2007/075065 JP2007075065W WO2008105133A1 WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1 JP 2007075065 W JP2007075065 W JP 2007075065W WO 2008105133 A1 WO2008105133 A1 WO 2008105133A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
inlet
tag
laminate
elastic layer
Prior art date
Application number
PCT/JP2007/075065
Other languages
English (en)
French (fr)
Inventor
Wakahiro Kawai
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Publication of WO2008105133A1 publication Critical patent/WO2008105133A1/ja

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

【課題】耐熱性及び耐水性に優れ、外部からの機械的応力負荷に対する強度を備えたＩＣタグを提供すること。 【解決手段】インレット１１０の片面にゴム材からなる弾力層１２０を積層したインレット積層体１３０を形成し、このインレット積層体１３０を樹脂製のトレー１４０の収納部に配置し、弾力層１２０の上に液体状の樹脂を流し込んだ後その樹脂を硬化させてインレット積層体１３０の周囲を樹脂製のトレー１４０と封止樹脂１５０で覆って密封するようにした。
PCT/JP2007/075065 2007-02-28 2007-12-27 Ｉｃタグ及びその製造方法 WO2008105133A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007048973A JP2008210344A (ja) 2007-02-28 2007-02-28 Ｉｃタグ及びその製造方法
JP2007-048973 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105133A1 true WO2008105133A1 (ja) 2008-09-04

Family

ID=39720976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075065 WO2008105133A1 (ja) 2007-02-28 2007-12-27 Ｉｃタグ及びその製造方法

Country Status (2)

Country Link
JP (1) JP2008210344A (ja)
WO (1) WO2008105133A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3035248A4 (en) * 2013-08-15 2016-08-03 Fujitsu Ltd RADIO FREQUENCY IDENTIFICATION LABEL (RFID) AND METHOD FOR MANUFACTURING THE SAME
EP2472438A4 (en) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Non-contact communication medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5427401B2 (ja) * 2008-12-19 2014-02-26 株式会社ユニバーサルエンターテインメント Ｉｄタグ内蔵型遊技媒体
JP2016053874A (ja) * 2014-09-04 2016-04-14 アールエフ・テクノロジー株式会社 Ｒｆｉｄタグ及び管理システム並びにｒｆｉｄタグの製造方法
JP6658607B2 (ja) 2017-02-22 2020-03-04 オムロン株式会社 製品の製造方法、外装部品およびアンテナパターン選択装置
JP6750591B2 (ja) 2017-10-05 2020-09-02 カシオ計算機株式会社 インサート成形方法及びインサート成形部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (ja) * 1997-09-26 1999-04-13 Toshiba Chem Corp 非接触データキャリアパッケージ
JP2000099675A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 無線情報記憶媒体
JP2001229358A (ja) * 2000-02-18 2001-08-24 Ripuro:Kk 情報記憶モジュールおよびこれを用いる靴等の物品
JP2005100114A (ja) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd 床面設置用ｉｃタグ
JP2005096423A (ja) * 2003-08-29 2005-04-14 Omron Corp 無線ｉｃタグ接合方法、無線ｉｃタグ付き物品、及び車両
JP2007018487A (ja) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ｉｃタグ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237351A (ja) * 2000-02-22 2001-08-31 Hitachi Maxell Ltd 半導体装置
JP4274867B2 (ja) * 2003-08-06 2009-06-10 リンテック株式会社 Ｉｃタグ
JP2006031599A (ja) * 2004-07-21 2006-02-02 Toppan Forms Co Ltd 半導体装置およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11102424A (ja) * 1997-09-26 1999-04-13 Toshiba Chem Corp 非接触データキャリアパッケージ
JP2000099675A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 無線情報記憶媒体
JP2001229358A (ja) * 2000-02-18 2001-08-24 Ripuro:Kk 情報記憶モジュールおよびこれを用いる靴等の物品
JP2005096423A (ja) * 2003-08-29 2005-04-14 Omron Corp 無線ｉｃタグ接合方法、無線ｉｃタグ付き物品、及び車両
JP2005100114A (ja) * 2003-09-25 2005-04-14 Toppan Printing Co Ltd 床面設置用ｉｃタグ
JP2007018487A (ja) * 2005-06-07 2007-01-25 Hitachi Chem Co Ltd Ｉｃタグ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2472438A4 (en) * 2009-08-26 2017-11-08 Toppan Printing Co., Ltd. Non-contact communication medium
EP3035248A4 (en) * 2013-08-15 2016-08-03 Fujitsu Ltd RADIO FREQUENCY IDENTIFICATION LABEL (RFID) AND METHOD FOR MANUFACTURING THE SAME
US9740976B2 (en) 2013-08-15 2017-08-22 Fujitsu Limited RFID tag and manufacturing method thereof

Also Published As

Publication number Publication date
JP2008210344A (ja) 2008-09-11

Similar Documents

Publication Publication Date Title
WO2008105133A1 (ja) Ｉｃタグ及びその製造方法
JP5219829B2 (ja) センサ付きタイヤ
EP1744453A4 (en) SURFACE ACOUSTIC WAVE DEVICE
WO2009120738A9 (en) Vehicular trim applications using film adhesive in lieu of stitching
WO2008042883A3 (en) Method of making multilayer polyurethane protective film
TW200517973A (en) Electronic device, rubber product, and method of making the device and the product
TW200721934A (en) Electronic component embedded board and its manufacturing method
WO2008065670A3 (en) Controllable coupling force
WO2009075513A3 (en) A thin film bio valve device and its controlling apparatus
WO2006001971A3 (en) Embedded antenna connection method and system
WO2013003207A3 (en) Sport ball casing with thermoplastic reinforcing material
WO2008133293A1 (ja) 接着シート
WO2005095087A3 (en) Reinforced resinous article and method of making the reinforced resinous article
BRPI0710988A8 (pt) composição adesiva aquosa, combinação de camadas múltiplas e métodos de adesão de material termoplástico a substrato rígido de poliolefina
FR2940181B1 (fr) Ensemble de conditionnement comportant un dispositif d'aimantation module.
TW200801675A (en) Reinforcing sheet for image display, image display, and method for reinforcing the same
ATE555634T1 (de) Bonden von thermoplasten
WO2006055164A3 (en) Multi-functional structural circuits
EP2042553A4 (en) THEROMPLASTIC RESIN COMPOSITION, MULTILAYER LAMINATE PRODUCED THEREOF, OBJECT OBTAINED BY THE PURPOSES OF THE THERMOPLASTIC RESIN COMPOSITION, AND METHOD FOR PROTECTING THE SURFACE OF AN ITEM
GB2453934B (en) Aircraft leading edge component with thermoplastic heater
EP2584014A3 (en) Method for joining aluminum part and resin and composite made by same
WO2009022578A1 (ja) 素子構造およびその製造方法
WO2009095347A3 (de) Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung
WO2011020809A3 (de) Dekorelement für ein kältegerät
DE50302977D1 (de) Mehrschicht laminate zum versteifen

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07860287

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07860287

Country of ref document: EP

Kind code of ref document: A1