WO2008102807A1 - エッチング方法及び装置並びに被処理物 - Google Patents

エッチング方法及び装置並びに被処理物 Download PDF

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Publication number
WO2008102807A1
WO2008102807A1 PCT/JP2008/052862 JP2008052862W WO2008102807A1 WO 2008102807 A1 WO2008102807 A1 WO 2008102807A1 JP 2008052862 W JP2008052862 W JP 2008052862W WO 2008102807 A1 WO2008102807 A1 WO 2008102807A1
Authority
WO
WIPO (PCT)
Prior art keywords
subject
processed
etching method
jetting section
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/052862
Other languages
English (en)
French (fr)
Inventor
Tomohiro Otsuka
Tetsuya Ishii
Setsuo Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to CN2008800054593A priority Critical patent/CN101617393B/zh
Priority to JP2008525290A priority patent/JP4180109B2/ja
Publication of WO2008102807A1 publication Critical patent/WO2008102807A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Drying Of Semiconductors (AREA)

Abstract

【課題】シリコンエッチングにおける処理ムラを抑え、均一性を向上させる。 【解決手段】略大気圧下において、フッ化水素とオゾンを含む処理ガスを噴出部４１から被処理物１０に吹き付けながら、噴出部４１を含む処理ヘッド３９を被処理物１０に対し左右に往復又は片道移動させ、被処理物１０の表面に形成されたシリコンをエッチングする。被処理物１０の表面上に形成される凝縮層１８の厚さｔが所定以下になるよう、前記移動速度を所定以上、好ましくは３～４ｍ／ｍｉｎ以上に設定する。
PCT/JP2008/052862 2007-02-23 2008-02-20 エッチング方法及び装置並びに被処理物 Ceased WO2008102807A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800054593A CN101617393B (zh) 2007-02-23 2008-02-20 蚀刻方法及装置
JP2008525290A JP4180109B2 (ja) 2007-02-23 2008-02-20 エッチング方法及び装置並びに被処理物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-043574 2007-02-23
JP2007043574 2007-02-23

Publications (1)

Publication Number Publication Date
WO2008102807A1 true WO2008102807A1 (ja) 2008-08-28

Family

ID=39710081

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052862 Ceased WO2008102807A1 (ja) 2007-02-23 2008-02-20 エッチング方法及び装置並びに被処理物

Country Status (5)

Country Link
JP (1) JP4180109B2 (ja)
KR (1) KR100944340B1 (ja)
CN (1) CN101617393B (ja)
TW (1) TWI409876B (ja)
WO (1) WO2008102807A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011141516A3 (en) * 2010-05-11 2012-01-26 Ultra High Vaccum Solutions Ltd. T/A Nines Engineering Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices
WO2012043272A1 (ja) * 2010-09-28 2012-04-05 積水化学工業株式会社 表面処理用搬送装置
JP2013077721A (ja) * 2011-09-30 2013-04-25 Sekisui Chem Co Ltd 表面粗化方法及び表面粗化装置
WO2014156681A1 (ja) * 2013-03-29 2014-10-02 東京エレクトロン株式会社 エッチング方法
JP2019071407A (ja) * 2017-10-10 2019-05-09 積水化学工業株式会社 表面処理方法及び装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103155116B (zh) * 2010-09-28 2014-03-12 积水化学工业株式会社 蚀刻方法及装置
TWI396484B (zh) * 2010-11-05 2013-05-11 Zhen Ding Technology Co Ltd 蝕刻裝置及使用該蝕刻裝置蝕刻基板之方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06168922A (ja) * 1992-06-25 1994-06-14 Texas Instr Inc <Ti> シリコンの気相エッチング法
JP2003264160A (ja) * 2002-03-11 2003-09-19 Dainippon Screen Mfg Co Ltd シリコンエッチング方法およびシリコンエッチング装置
JP2004055753A (ja) * 2002-07-18 2004-02-19 Dainippon Screen Mfg Co Ltd 残渣除去方法および残渣除去装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4377090B2 (ja) 2001-07-16 2009-12-02 株式会社アライドマテリアル 炭化チタン粉末とその製造方法
TW200707511A (en) * 2005-06-23 2007-02-16 Tokyo Electron Ltd Substrate Processing method and substrate processing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06168922A (ja) * 1992-06-25 1994-06-14 Texas Instr Inc <Ti> シリコンの気相エッチング法
JP2003264160A (ja) * 2002-03-11 2003-09-19 Dainippon Screen Mfg Co Ltd シリコンエッチング方法およびシリコンエッチング装置
JP2004055753A (ja) * 2002-07-18 2004-02-19 Dainippon Screen Mfg Co Ltd 残渣除去方法および残渣除去装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011141516A3 (en) * 2010-05-11 2012-01-26 Ultra High Vaccum Solutions Ltd. T/A Nines Engineering Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices
US9548224B2 (en) 2010-05-11 2017-01-17 Ultra High Vacuum Solutions Ltd. Method and apparatus to control surface texture modification of silicon wafers for photovoltaic cell devices
WO2012043272A1 (ja) * 2010-09-28 2012-04-05 積水化学工業株式会社 表面処理用搬送装置
JP2013077721A (ja) * 2011-09-30 2013-04-25 Sekisui Chem Co Ltd 表面粗化方法及び表面粗化装置
WO2014156681A1 (ja) * 2013-03-29 2014-10-02 東京エレクトロン株式会社 エッチング方法
JP2019071407A (ja) * 2017-10-10 2019-05-09 積水化学工業株式会社 表面処理方法及び装置

Also Published As

Publication number Publication date
TWI409876B (zh) 2013-09-21
JPWO2008102807A1 (ja) 2010-05-27
CN101617393B (zh) 2011-05-18
KR100944340B1 (ko) 2010-03-02
CN101617393A (zh) 2009-12-30
KR20090094404A (ko) 2009-09-04
JP4180109B2 (ja) 2008-11-12
TW200901310A (en) 2009-01-01

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