WO2008102620A1 - Procédé de production d'une structure columnaire présentant une structure hiérarchique bi-étagée - Google Patents

Procédé de production d'une structure columnaire présentant une structure hiérarchique bi-étagée Download PDF

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Publication number
WO2008102620A1
WO2008102620A1 PCT/JP2008/051427 JP2008051427W WO2008102620A1 WO 2008102620 A1 WO2008102620 A1 WO 2008102620A1 JP 2008051427 W JP2008051427 W JP 2008051427W WO 2008102620 A1 WO2008102620 A1 WO 2008102620A1
Authority
WO
WIPO (PCT)
Prior art keywords
stage hierarchical
columnar structure
producing
producing columnar
resin
Prior art date
Application number
PCT/JP2008/051427
Other languages
English (en)
Japanese (ja)
Inventor
Youhei Maeno
Yoshinori Yoshida
Yuki Sugo
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2008102620A1 publication Critical patent/WO2008102620A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00111—Tips, pillars, i.e. raised structures
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/0154—Film patterning other processes for film patterning not provided for in B81C2201/0149 - B81C2201/015
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/31—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive effect being based on a Gecko structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Micromachines (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

Cette invention concerne un procédé qui permet de produire artificiellement, de manière simple et facile, une structure imitant une structure hiérarchique fine bi-étagée, telle qu'elle apparaît à la plante des pattes d'un hémidactyle. Le procédé consiste à: 1) remplir de résine les pores d'un film poreux disposé sur un matériau de base; 2) polymériser la résine pour former une structure columnaire; 3) graver au plasma la pièce d'extrémité de la structure columnaire pour former une pièce à structure columnaire hiérarchique bi-étagée; et 4) retirer le film poreux du matériau de base.
PCT/JP2008/051427 2007-02-20 2008-01-30 Procédé de production d'une structure columnaire présentant une structure hiérarchique bi-étagée WO2008102620A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007038771A JP2008200793A (ja) 2007-02-20 2007-02-20 二段の階層を有する柱状構造体の製造方法
JP2007-038771 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102620A1 true WO2008102620A1 (fr) 2008-08-28

Family

ID=39709899

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051427 WO2008102620A1 (fr) 2007-02-20 2008-01-30 Procédé de production d'une structure columnaire présentant une structure hiérarchique bi-étagée

Country Status (3)

Country Link
JP (1) JP2008200793A (fr)
TW (1) TW200914366A (fr)
WO (1) WO2008102620A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101837946A (zh) * 2010-05-14 2010-09-22 华中科技大学 一种干性粘合剂的制作方法
JP2011530416A (ja) * 2008-08-19 2011-12-22 コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズ 階層化構造物およびその製造方法
WO2012030570A1 (fr) * 2010-08-30 2012-03-08 Advanced Technologies And Regenerative Medicine, Llc Structure adhésive dotée de saillies rigides sur la surface adhésive
CN103937419A (zh) * 2013-01-22 2014-07-23 香港纺织及成衣研发中心有限公司 一种具有微纳图案表面结构的粘弹胶带
US8926881B2 (en) 2012-04-06 2015-01-06 DePuy Synthes Products, LLC Super-hydrophobic hierarchical structures, method of forming them and medical devices incorporating them
US8969648B2 (en) 2012-04-06 2015-03-03 Ethicon, Inc. Blood clotting substrate and medical device
US9211176B2 (en) 2010-08-30 2015-12-15 Ethicon Endo-Surgery, Inc. Adhesive structure with stiff protrusions on adhesive surface
US9492952B2 (en) 2010-08-30 2016-11-15 Endo-Surgery, Inc. Super-hydrophilic structures
US10278701B2 (en) 2011-12-29 2019-05-07 Ethicon, Inc. Adhesive structure with tissue piercing protrusions on its surface

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102958473A (zh) * 2010-09-22 2013-03-06 泰尔茂株式会社 生物体粘附片及片粘附用器件
JP2014107319A (ja) * 2012-11-26 2014-06-09 Canon Inc 接着力が制御可能な接着用部材
CN103274354B (zh) * 2013-05-17 2015-07-01 哈尔滨工业大学 一种仿壁虎结构粘合剂的制备方法
CN104803348A (zh) * 2015-04-20 2015-07-29 中国科学院光电技术研究所 一种牺牲模板制备高深宽比聚合物纳米柱阵列的方法
CN105128971B (zh) * 2015-09-07 2017-05-17 南京航空航天大学 基于钩爪附着的仿生四足爬壁机器人

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359031A (ja) * 1991-06-04 1992-12-11 Matsushita Electric Ind Co Ltd 撥水撥油性フィルム及びその製造方法
JPH09296057A (ja) * 1996-05-01 1997-11-18 Agency Of Ind Science & Technol 高分子成形体の凹凸状表面形成方法
WO2001049776A2 (fr) * 1999-12-20 2001-07-12 The Regents Of The University Of California Microstructure adhesive et son procede de formation
WO2003095190A1 (fr) * 2002-05-13 2003-11-20 California, The Regents Of The University Microstructure adhesive amelioree, et son procede de realisation
JP2004502554A (ja) * 2000-03-22 2004-01-29 ユニバーシティー　オブ　マサチューセッツ ナノシリンダー・アレイ
JP2005219255A (ja) * 2004-02-04 2005-08-18 Nitto Denko Corp 繊維凸状構造転写形成用シート
JP2006306909A (ja) * 2005-04-26 2006-11-09 Konica Minolta Holdings Inc 表面処理方法、表面処理装置、防眩層の形成方法、防眩性フィルム、及び、防眩性低反射フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008221A (ja) * 2001-06-19 2003-01-10 Ibiden Co Ltd 多層プリント配線板および多層プリント配線板の製造方法
JP4180289B2 (ja) * 2002-03-18 2008-11-12 喜萬 中山 ナノチューブ先鋭化方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359031A (ja) * 1991-06-04 1992-12-11 Matsushita Electric Ind Co Ltd 撥水撥油性フィルム及びその製造方法
JPH09296057A (ja) * 1996-05-01 1997-11-18 Agency Of Ind Science & Technol 高分子成形体の凹凸状表面形成方法
WO2001049776A2 (fr) * 1999-12-20 2001-07-12 The Regents Of The University Of California Microstructure adhesive et son procede de formation
JP2004502554A (ja) * 2000-03-22 2004-01-29 ユニバーシティー　オブ　マサチューセッツ ナノシリンダー・アレイ
WO2003095190A1 (fr) * 2002-05-13 2003-11-20 California, The Regents Of The University Microstructure adhesive amelioree, et son procede de realisation
JP2005219255A (ja) * 2004-02-04 2005-08-18 Nitto Denko Corp 繊維凸状構造転写形成用シート
JP2006306909A (ja) * 2005-04-26 2006-11-09 Konica Minolta Holdings Inc 表面処理方法、表面処理装置、防眩層の形成方法、防眩性フィルム、及び、防眩性低反射フィルム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SITTI M. ET AL.: "Synthetic Gecko Foot-Hair Micro/Nano-Structures for Future Wall-Climbing Robots", PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS & AUTOMATION, vol. 1, 2003, pages 1164 - 1170, XP010667294 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011530416A (ja) * 2008-08-19 2011-12-22 コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズ 階層化構造物およびその製造方法
US8551353B2 (en) 2008-08-19 2013-10-08 Korea Institute Of Machinery & Materials Hierarchical structure and manufacturing method thereof
CN101837946A (zh) * 2010-05-14 2010-09-22 华中科技大学 一种干性粘合剂的制作方法
WO2012030570A1 (fr) * 2010-08-30 2012-03-08 Advanced Technologies And Regenerative Medicine, Llc Structure adhésive dotée de saillies rigides sur la surface adhésive
US9211176B2 (en) 2010-08-30 2015-12-15 Ethicon Endo-Surgery, Inc. Adhesive structure with stiff protrusions on adhesive surface
US9492952B2 (en) 2010-08-30 2016-11-15 Endo-Surgery, Inc. Super-hydrophilic structures
US10278701B2 (en) 2011-12-29 2019-05-07 Ethicon, Inc. Adhesive structure with tissue piercing protrusions on its surface
US8926881B2 (en) 2012-04-06 2015-01-06 DePuy Synthes Products, LLC Super-hydrophobic hierarchical structures, method of forming them and medical devices incorporating them
US8969648B2 (en) 2012-04-06 2015-03-03 Ethicon, Inc. Blood clotting substrate and medical device
CN103937419A (zh) * 2013-01-22 2014-07-23 香港纺织及成衣研发中心有限公司 一种具有微纳图案表面结构的粘弹胶带

Also Published As

Publication number Publication date
TW200914366A (en) 2009-04-01
JP2008200793A (ja) 2008-09-04

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