WO2008099934A1 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
WO2008099934A1
WO2008099934A1 PCT/JP2008/052572 JP2008052572W WO2008099934A1 WO 2008099934 A1 WO2008099934 A1 WO 2008099934A1 JP 2008052572 W JP2008052572 W JP 2008052572W WO 2008099934 A1 WO2008099934 A1 WO 2008099934A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor package
base section
thin plates
heat transfer
adhering
Prior art date
Application number
PCT/JP2008/052572
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi Hasegawa
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008029614A external-priority patent/JP5112101B2/ja
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to EP08711402.1A priority Critical patent/EP2120261A4/en
Publication of WO2008099934A1 publication Critical patent/WO2008099934A1/ja
Priority to US12/393,680 priority patent/US8049316B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

　本発明は、ベース部の一表面に半導体素子が設けられた半導体パッケージに関するものであり、前記ベース部が複数枚の薄板（５２，５４，５６，５８）を相互に密着させて一体的に接合することにより構成されており、前記複数枚の薄板のうち、相互に隣接した２枚の間に、前記ベース部よりも高い熱伝達効率を有する材料により構成された粒体からなる高熱伝達要素（７０）が分散されている。
PCT/JP2008/052572 2007-02-15 2008-02-15 半導体パッケージ WO2008099934A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08711402.1A EP2120261A4 (en) 2007-02-15 2008-02-15 SEMICONDUCTOR PACKAGE
US12/393,680 US8049316B2 (en) 2007-02-15 2009-02-26 Semiconductor package

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-035356 2007-02-15
JP2007035356 2007-02-15
JP2008-029614 2008-02-08
JP2008029614A JP5112101B2 (ja) 2007-02-15 2008-02-08 半導体パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/393,680 Continuation US8049316B2 (en) 2007-02-15 2009-02-26 Semiconductor package

Publications (1)

Publication Number Publication Date
WO2008099934A1 true WO2008099934A1 (ja) 2008-08-21

Family

ID=39690159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052572 WO2008099934A1 (ja) 2007-02-15 2008-02-15 半導体パッケージ

Country Status (1)

Country Link
WO (1) WO2008099934A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037196A (ja) * 2001-07-25 2003-02-07 Kyocera Corp 光半導体素子収納用パッケージ
EP1414064A1 (en) 2002-10-22 2004-04-28 Sumitomo Electric Industries, Ltd. Semiconductor device and package for housing semiconductor chip made of a metal-diamond composite
JP2004249589A (ja) * 2003-02-20 2004-09-09 Toshiba Corp 銅−モリブデン複合材料およびそれを用いたヒートシンク
JP2005175006A (ja) 2003-12-08 2005-06-30 Mitsubishi Materials Corp 放熱体及びパワーモジュール
JP2005236276A (ja) * 2004-01-20 2005-09-02 Mitsubishi Materials Corp 絶縁伝熱構造体及びパワーモジュール用基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037196A (ja) * 2001-07-25 2003-02-07 Kyocera Corp 光半導体素子収納用パッケージ
EP1414064A1 (en) 2002-10-22 2004-04-28 Sumitomo Electric Industries, Ltd. Semiconductor device and package for housing semiconductor chip made of a metal-diamond composite
JP2004249589A (ja) * 2003-02-20 2004-09-09 Toshiba Corp 銅−モリブデン複合材料およびそれを用いたヒートシンク
JP2005175006A (ja) 2003-12-08 2005-06-30 Mitsubishi Materials Corp 放熱体及びパワーモジュール
JP2005236276A (ja) * 2004-01-20 2005-09-02 Mitsubishi Materials Corp 絶縁伝熱構造体及びパワーモジュール用基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2120261A4 *

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