WO2008090792A1 - 潜在性硬化剤 - Google Patents

潜在性硬化剤 Download PDF

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Publication number
WO2008090792A1
WO2008090792A1 PCT/JP2008/050484 JP2008050484W WO2008090792A1 WO 2008090792 A1 WO2008090792 A1 WO 2008090792A1 JP 2008050484 W JP2008050484 W JP 2008050484W WO 2008090792 A1 WO2008090792 A1 WO 2008090792A1
Authority
WO
WIPO (PCT)
Prior art keywords
curing agent
reacting
latent curing
compound
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050484
Other languages
English (en)
French (fr)
Inventor
Katsuhiko Komuro
Masahiko Ito
Tadasu Kawashima
Daisuke Masuko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to US12/227,905 priority Critical patent/US20090230360A1/en
Priority to CN2008800026714A priority patent/CN101583648B/zh
Publication of WO2008090792A1 publication Critical patent/WO2008090792A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)

Abstract

　比較的低温で短時間の条件で熱硬化性エポキシ樹脂を硬化させることが可能なアルミニウムキレート系潜在性硬化剤は、アルミニウムキレート剤に、シルセスキオキサン型オキセタン誘導体を、脂環式エポキシ化合物の存在下で反応させた後、更に液状エポキシ樹脂とイミダゾール化合物とを反応させて潜在化又は芳香族ビニル化合物とラジカル重合開始剤とを反応させて潜在化させたものである。  
PCT/JP2008/050484 2007-01-24 2008-01-17 潜在性硬化剤 Ceased WO2008090792A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/227,905 US20090230360A1 (en) 2007-01-24 2008-01-17 Latent Curing Agent
CN2008800026714A CN101583648B (zh) 2007-01-24 2008-01-17 潜伏性固化剂

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007014252A JP5298431B2 (ja) 2007-01-24 2007-01-24 潜在性硬化剤
JP2007-014252 2007-01-24

Publications (1)

Publication Number Publication Date
WO2008090792A1 true WO2008090792A1 (ja) 2008-07-31

Family

ID=39644368

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050484 Ceased WO2008090792A1 (ja) 2007-01-24 2008-01-17 潜在性硬化剤

Country Status (6)

Country Link
US (1) US20090230360A1 (ja)
JP (1) JP5298431B2 (ja)
KR (1) KR101082630B1 (ja)
CN (1) CN101583648B (ja)
TW (1) TW200835711A (ja)
WO (1) WO2008090792A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084804A1 (ja) * 2009-01-21 2010-07-29 ソニーケミカル＆インフォメーションデバイス株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
WO2016043066A1 (ja) * 2014-09-16 2016-03-24 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2017222782A (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物
WO2017217276A1 (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物、及びその製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481995B2 (ja) * 2009-07-24 2014-04-23 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤及びそれらの製造方法
JP5365811B2 (ja) 2010-06-28 2013-12-11 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤
CN102268126B (zh) * 2011-06-01 2012-08-08 上海大学 有机硅潜伏性环氧树脂固化剂的制备方法
DE102014219844A1 (de) * 2014-09-30 2016-03-31 Siemens Aktiengesellschaft Isolationssystem für elektrische Maschinen
DE102014221715A1 (de) 2014-10-24 2016-04-28 Siemens Aktiengesellschaft Tränkharz, Leiteranordnung, elektrische Spule und elektrische Maschine
CN113248714B (zh) * 2021-06-25 2022-06-10 山东大学 一种含POSS的α-胺基三乙氧基硅烷及其制备方法与应用
CN118580755B (zh) * 2024-06-18 2025-02-14 安徽永昌新材料科技股份有限公司 一种超低温固化聚酯材料制备工艺及应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564625A (en) * 1979-06-25 1981-01-19 Toshiba Corp Epoxy resin composition
JP2003013036A (ja) * 2001-06-27 2003-01-15 Sony Chem Corp 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP2006131848A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd ポリオルガノシロキサン及びその製造方法、並びにポリオルガノシロキサンを含有する硬化性組成物
JP2006131849A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 二液型硬化性組成物
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤
JP2007211056A (ja) * 2006-02-07 2007-08-23 Sony Chemical & Information Device Corp 潜在性硬化剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817536B2 (ja) * 1979-06-21 1983-04-07 株式会社東芝 エポキシ樹脂系組成物
US5733954A (en) * 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole
JP3565797B2 (ja) * 2001-06-06 2004-09-15 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
US7557230B2 (en) * 2005-06-06 2009-07-07 Sony Corporation Latent curing agent
KR101039546B1 (ko) * 2007-01-24 2011-06-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 잠재성 경화제

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564625A (en) * 1979-06-25 1981-01-19 Toshiba Corp Epoxy resin composition
JP2003013036A (ja) * 2001-06-27 2003-01-15 Sony Chem Corp 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP2006131848A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd ポリオルガノシロキサン及びその製造方法、並びにポリオルガノシロキサンを含有する硬化性組成物
JP2006131849A (ja) * 2004-11-09 2006-05-25 Toagosei Co Ltd 二液型硬化性組成物
WO2006132133A1 (ja) * 2005-06-06 2006-12-14 Sony Chemical & Information Device Corporation 潜在性硬化剤
JP2007211056A (ja) * 2006-02-07 2007-08-23 Sony Chemical & Information Device Corp 潜在性硬化剤

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010084804A1 (ja) * 2009-01-21 2010-07-29 ソニーケミカル＆インフォメーションデバイス株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
US8198342B2 (en) 2009-01-21 2012-06-12 Sony Chemical And Information Device Corporation Aluminum chelate latent curing agent and production method thereof
KR101246468B1 (ko) 2009-01-21 2013-03-21 데쿠세리아루즈 가부시키가이샤 알루미늄 킬레이트계 잠재성 경화제 및 그 제조 방법
WO2016043066A1 (ja) * 2014-09-16 2016-03-24 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
JP2017222782A (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物
WO2017217275A1 (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物
WO2017217276A1 (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物、及びその製造方法
JP2017222781A (ja) * 2016-06-15 2017-12-21 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物、及びその製造方法
US10669458B2 (en) 2016-06-15 2020-06-02 Dexerials Corporation Thermosetting epoxy resin composition and production method for same
US10745551B2 (en) 2016-06-15 2020-08-18 Dexerials Corporation Latent curing agent, production method therefor, and thermosetting epoxy resin composition

Also Published As

Publication number Publication date
JP2008179701A (ja) 2008-08-07
KR101082630B1 (ko) 2011-11-10
CN101583648B (zh) 2012-01-11
KR20090082351A (ko) 2009-07-30
US20090230360A1 (en) 2009-09-17
JP5298431B2 (ja) 2013-09-25
TW200835711A (en) 2008-09-01
CN101583648A (zh) 2009-11-18

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