WO2008087756A1 - 集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法 - Google Patents

集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法 Download PDF

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Publication number
WO2008087756A1
WO2008087756A1 PCT/JP2007/063158 JP2007063158W WO2008087756A1 WO 2008087756 A1 WO2008087756 A1 WO 2008087756A1 JP 2007063158 W JP2007063158 W JP 2007063158W WO 2008087756 A1 WO2008087756 A1 WO 2008087756A1
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WO
WIPO (PCT)
Prior art keywords
integrated circuit
circuit device
controlling operation
circuit
temperature
Prior art date
Application number
PCT/JP2007/063158
Other languages
English (en)
French (fr)
Inventor
Yuka Takahashi
Norihiko Mizobata
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2008526700A priority Critical patent/JP4623683B2/ja
Priority to US12/282,214 priority patent/US8089180B2/en
Publication of WO2008087756A1 publication Critical patent/WO2008087756A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Sources (AREA)

Abstract

　起動に必要な処理を行なう起動時動作回路（１０１）と前記起動に必要な処理が終了後に通常動作を行なう起動後動作回路（１０２）とを備えた集積回路装置において、起動後動作回路（１０２）の動作保証温度の下限値を、起動時動作回路（１０１）の動作保証温度の下限値よりも高く構成する。そして、起動後動作回路（１０２）は、集積回路装置の温度が、起動後動作回路（１０２）の動作保証温度の下限値である閾値温度を越えた後に、通常動作を開始するようにする。
PCT/JP2007/063158 2007-01-16 2007-06-29 集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法 WO2008087756A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008526700A JP4623683B2 (ja) 2007-01-16 2007-06-29 集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法
US12/282,214 US8089180B2 (en) 2007-01-16 2007-06-29 Integrated circuit device, method of controlling operation of integrated circuit device, and method of fabricating integrated circuit device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-006771 2007-01-16
JP2007006771 2007-01-16

Publications (1)

Publication Number Publication Date
WO2008087756A1 true WO2008087756A1 (ja) 2008-07-24

Family

ID=39635765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063158 WO2008087756A1 (ja) 2007-01-16 2007-06-29 集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法

Country Status (3)

Country Link
US (1) US8089180B2 (ja)
JP (1) JP4623683B2 (ja)
WO (1) WO2008087756A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225111A (ja) * 2009-03-25 2010-10-07 Toshiba Tec Corp 電子機器
JP2011049242A (ja) * 2009-08-25 2011-03-10 Nec Computertechno Ltd 温度変化調整モジュール及び温度変化調整方法
JP2014102607A (ja) * 2012-11-19 2014-06-05 Fujitsu Ltd 電子装置、その制御プログラムおよび制御方法
WO2017098801A1 (ja) * 2015-12-11 2017-06-15 京セラドキュメントソリューションズ株式会社 画像形成装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8572412B1 (en) 2010-02-01 2013-10-29 Marvell Israel (M.I.S.L) Ltd. Method and apparatus for warming up integrated circuits
US8954017B2 (en) * 2011-08-17 2015-02-10 Broadcom Corporation Clock signal multiplication to reduce noise coupled onto a transmission communication signal of a communications device

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JPS6252620A (ja) * 1985-09-02 1987-03-07 Hitachi Ltd 情報処理装置の低温検出制御方式
JP2002111006A (ja) * 2000-10-02 2002-04-12 Seiko Epson Corp 電圧発生回路、これを備えた時計及び電子機器
JP2004006473A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 半導体集積回路
JP2005340486A (ja) * 2004-05-27 2005-12-08 Fujitsu Ltd 温度適応回路、回路の昇温方法及び回路の昇温プログラム

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JPH06265593A (ja) 1993-03-15 1994-09-22 Toshiba Corp 半導体集積回路装置
US7216064B1 (en) * 1993-09-21 2007-05-08 Intel Corporation Method and apparatus for programmable thermal sensor for an integrated circuit
JPH08292819A (ja) * 1995-04-20 1996-11-05 Shikoku Nippon Denki Software Kk 情報処理装置
JPH10332494A (ja) * 1997-06-03 1998-12-18 Oki Data:Kk 温度検出回路、駆動装置及びプリンタ
US6076161A (en) * 1997-08-25 2000-06-13 National Semiconductor Corporation Microcontroller mode selection system and method upon reset
DE10034262C1 (de) 2000-07-14 2001-09-20 Infineon Technologies Ag Halbleitervorrichtung mit Temperaturregelung, insb. geeignet für den Kfz-Bereich
US7478031B2 (en) * 2002-11-07 2009-01-13 Qst Holdings, Llc Method, system and program for developing and scheduling adaptive integrated circuity and corresponding control or configuration information
JP2005203427A (ja) * 2004-01-13 2005-07-28 Sanyo Electric Co Ltd 集積回路
GB0408876D0 (en) * 2004-04-21 2004-05-26 Level 5 Networks Ltd User-level stack
US7541776B2 (en) * 2004-12-10 2009-06-02 Apple Inc. Method and system for operating a portable electronic device in a power-limited manner
JP4357409B2 (ja) * 2004-12-17 2009-11-04 株式会社東芝 半導体集積回路装置及びその設計方法
US20060145673A1 (en) * 2005-01-03 2006-07-06 Fogg John K Method and apparatus for reducing inrush current to a voltage regulating circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252620A (ja) * 1985-09-02 1987-03-07 Hitachi Ltd 情報処理装置の低温検出制御方式
JP2002111006A (ja) * 2000-10-02 2002-04-12 Seiko Epson Corp 電圧発生回路、これを備えた時計及び電子機器
JP2004006473A (ja) * 2002-05-31 2004-01-08 Matsushita Electric Ind Co Ltd 半導体集積回路
JP2005340486A (ja) * 2004-05-27 2005-12-08 Fujitsu Ltd 温度適応回路、回路の昇温方法及び回路の昇温プログラム

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225111A (ja) * 2009-03-25 2010-10-07 Toshiba Tec Corp 電子機器
JP2011049242A (ja) * 2009-08-25 2011-03-10 Nec Computertechno Ltd 温度変化調整モジュール及び温度変化調整方法
JP2014102607A (ja) * 2012-11-19 2014-06-05 Fujitsu Ltd 電子装置、その制御プログラムおよび制御方法
WO2017098801A1 (ja) * 2015-12-11 2017-06-15 京セラドキュメントソリューションズ株式会社 画像形成装置
CN107921800A (zh) * 2015-12-11 2018-04-17 京瓷办公信息系统株式会社 图像形成装置
JPWO2017098801A1 (ja) * 2015-12-11 2018-05-24 京セラドキュメントソリューションズ株式会社 画像形成装置
CN107921800B (zh) * 2015-12-11 2019-11-05 京瓷办公信息系统株式会社 图像形成装置

Also Published As

Publication number Publication date
JP4623683B2 (ja) 2011-02-02
US8089180B2 (en) 2012-01-03
JPWO2008087756A1 (ja) 2010-05-06
US20090045866A1 (en) 2009-02-19

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