WO2008078776A1 - 電気電子部品用複合材料、電気電子部品および電気電子部品用複合材料の製造方法 - Google Patents

電気電子部品用複合材料、電気電子部品および電気電子部品用複合材料の製造方法 Download PDF

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Publication number
WO2008078776A1
WO2008078776A1 PCT/JP2007/074960 JP2007074960W WO2008078776A1 WO 2008078776 A1 WO2008078776 A1 WO 2008078776A1 JP 2007074960 W JP2007074960 W JP 2007074960W WO 2008078776 A1 WO2008078776 A1 WO 2008078776A1
Authority
WO
WIPO (PCT)
Prior art keywords
electric
electronic components
composite material
insulating film
metallic base
Prior art date
Application number
PCT/JP2007/074960
Other languages
English (en)
French (fr)
Inventor
Chikahito Sugahara
Satoru Zama
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to EP07860189A priority Critical patent/EP2119812A4/en
Priority to US12/448,529 priority patent/US20090291318A1/en
Publication of WO2008078776A1 publication Critical patent/WO2008078776A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/1241—Nonplanar uniform thickness or nonlinear uniform diameter [e.g., L-shape]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　打ち抜き加工により加工された後に折り曲げ加工されて形成される電気電子部品の材料として用いられる、金属基材上の少なくとも一部に実質的に１層の絶縁皮膜が設けられており、金属基材と絶縁皮膜との間に、打ち抜き加工後の材料端部における前記絶縁被膜の剥離幅が１０μｍ未満となり、かつ前記曲げ加工後の材料の曲げ内側における前記絶縁皮膜の付着状態および曲げ外側を延長した先の端部における前記絶縁皮膜の付着状態がともに維持されるように金属層が設けられている電気電子部品用複合材料、それを用いて形成された電気電子部品、及び前記電気電子部品用複合材料の製造方法。  
PCT/JP2007/074960 2006-12-27 2007-12-26 電気電子部品用複合材料、電気電子部品および電気電子部品用複合材料の製造方法 WO2008078776A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07860189A EP2119812A4 (en) 2006-12-27 2007-12-26 COMPOSITE MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT, ELECTRICAL / ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT
US12/448,529 US20090291318A1 (en) 2006-12-27 2007-12-26 Composite material for electric and electronic components, electric and electronic components, and method for manufacturing composite material for electric and electronic components

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-350875 2006-12-27
JP2006350875 2006-12-27
JP2007333316A JP5306641B2 (ja) 2006-12-27 2007-12-25 電気電子部品用複合材料、電気電子部品および電気電子部品用複合材料の製造方法
JP2007-333316 2007-12-25

Publications (1)

Publication Number Publication Date
WO2008078776A1 true WO2008078776A1 (ja) 2008-07-03

Family

ID=39562567

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074960 WO2008078776A1 (ja) 2006-12-27 2007-12-26 電気電子部品用複合材料、電気電子部品および電気電子部品用複合材料の製造方法

Country Status (6)

Country Link
US (1) US20090291318A1 (ja)
EP (1) EP2119812A4 (ja)
JP (1) JP5306641B2 (ja)
KR (1) KR20090102766A (ja)
TW (1) TW200841800A (ja)
WO (1) WO2008078776A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102066614B (zh) * 2008-06-24 2013-07-10 古河电气工业株式会社 电气电子部件用复合材料以及使用其的电气电子部件
JP5323418B2 (ja) * 2008-08-11 2013-10-23 古河電気工業株式会社 電気電子部品用複合材料および電気電子部品
CN103317790A (zh) * 2012-03-19 2013-09-25 西门子公司 多层亚光锡镀膜及其制备方法
KR102362734B1 (ko) * 2020-05-06 2022-02-14 에스피텍 주식회사 전자파 차폐 효과가 향상된 전자파 차폐 필름의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05130759A (ja) 1991-10-31 1993-05-25 Toshiba Corp 回転電機巻線の絶縁方法
JP2004197224A (ja) * 2002-12-03 2004-07-15 Furukawa Electric Co Ltd:The 電気電子部品用金属材料
JP2006350875A (ja) 2005-06-20 2006-12-28 Hitachi Ltd Ａｓｐにおけるマルチ会員管理システム
JP2007333316A (ja) 2006-06-15 2007-12-27 Daikin Ind Ltd 液処理装置、空気調和装置、及び加湿器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69011139T2 (de) * 1989-01-12 1995-03-09 Sumitomo Chemical Co Aromatische Allylanim enthaltende warmhärtende Harzzusammensetzung.
JPH09300529A (ja) * 1996-05-08 1997-11-25 Furukawa Electric Co Ltd:The 電子部品カバーケース用樹脂被覆金属板
JPH10265991A (ja) * 1997-03-24 1998-10-06 Nikko Kinzoku Kk 樹脂密着性に優れためっき材
AU2003289136A1 (en) * 2002-12-03 2004-06-23 The Furukawa Electric Co., Ltd. Metal material for electric electronic component
JP4653386B2 (ja) * 2003-04-04 2011-03-16 新日本製鐵株式会社 防熱性に優れた表面処理金属板及びこれを用いた筐体
JP2006086513A (ja) * 2004-08-16 2006-03-30 Furukawa Electric Co Ltd:The 電気電子部品ケースまたはシールドケースの材料及びその製造方法
KR101336559B1 (ko) * 2008-06-24 2013-12-03 후루카와 덴키 고교 가부시키가이샤 전기전자 부품용 복합재료 및 그것을 이용한 전기전자 부품

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05130759A (ja) 1991-10-31 1993-05-25 Toshiba Corp 回転電機巻線の絶縁方法
JP2004197224A (ja) * 2002-12-03 2004-07-15 Furukawa Electric Co Ltd:The 電気電子部品用金属材料
JP2006350875A (ja) 2005-06-20 2006-12-28 Hitachi Ltd Ａｓｐにおけるマルチ会員管理システム
JP2007333316A (ja) 2006-06-15 2007-12-27 Daikin Ind Ltd 液処理装置、空気調和装置、及び加湿器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2119812A4

Also Published As

Publication number Publication date
US20090291318A1 (en) 2009-11-26
JP5306641B2 (ja) 2013-10-02
EP2119812A4 (en) 2010-04-14
KR20090102766A (ko) 2009-09-30
TW200841800A (en) 2008-10-16
JP2008179889A (ja) 2008-08-07
EP2119812A1 (en) 2009-11-18

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