WO2008076199A3 - Dispositifs de conditionnement de tampons de cmp et procédés associés - Google Patents

Dispositifs de conditionnement de tampons de cmp et procédés associés Download PDF

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Publication number
WO2008076199A3
WO2008076199A3 PCT/US2007/024169 US2007024169W WO2008076199A3 WO 2008076199 A3 WO2008076199 A3 WO 2008076199A3 US 2007024169 W US2007024169 W US 2007024169W WO 2008076199 A3 WO2008076199 A3 WO 2008076199A3
Authority
WO
WIPO (PCT)
Prior art keywords
cmp pad
associated methods
pad conditioners
cutting element
cutting
Prior art date
Application number
PCT/US2007/024169
Other languages
English (en)
Other versions
WO2008076199A2 (fr
Inventor
Chien-Min Sung
Original Assignee
Chien-Min Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chien-Min Sung filed Critical Chien-Min Sung
Publication of WO2008076199A2 publication Critical patent/WO2008076199A2/fr
Publication of WO2008076199A3 publication Critical patent/WO2008076199A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

L'invention concerne un procédé pour réduire un degré de compression d'un tampon de polissage mécano-chimique (CMP) lors du conditionnement du tampon de CMP. Selon ce procédé, le tampon de CMP est mis en prise avec au moins un élément de coupe extra-dur, cet élément de coupe comprenant une face de coupe qui forme un angle inférieur ou égal à 90° avec une surface finie du tampon de CMP, puis le tampon de CMP et l'élément de coupe sont déplacés l'un par rapport à l'autre dans une direction de façon à obtenir un enlèvement de matière du tampon de CMP au moyen de la face de coupe et conditionner ainsi le tampon de CMP.
PCT/US2007/024169 2006-11-16 2007-11-16 Dispositifs de conditionnement de tampons de cmp et procédés associés WO2008076199A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86620206P 2006-11-16 2006-11-16
US60/866,202 2006-11-16

Publications (2)

Publication Number Publication Date
WO2008076199A2 WO2008076199A2 (fr) 2008-06-26
WO2008076199A3 true WO2008076199A3 (fr) 2008-08-21

Family

ID=39536874

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/024169 WO2008076199A2 (fr) 2006-11-16 2007-11-16 Dispositifs de conditionnement de tampons de cmp et procédés associés

Country Status (4)

Country Link
US (1) US20080153398A1 (fr)
CN (1) CN101557904A (fr)
TW (1) TWI356449B (fr)
WO (1) WO2008076199A2 (fr)

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US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US20150017884A1 (en) * 2006-11-16 2015-01-15 Chien-Min Sung CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
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WO2010141464A2 (fr) * 2009-06-02 2010-12-09 Saint-Gobain Abrasives, Inc. Outils de conditionnement cmp résistants à la corrosion et leurs procédés de fabrication et d'utilisation
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CN102612734A (zh) 2009-09-01 2012-07-25 圣戈班磨料磨具有限公司 化学机械抛光修整器
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
JP6133218B2 (ja) * 2011-03-07 2017-05-24 インテグリス・インコーポレーテッド 化学機械平坦化パッドコンディショナー
CN103329253B (zh) 2011-05-23 2016-03-30 宋健民 具有平坦化尖端的化学机械研磨垫修整器
CN102229105A (zh) * 2011-06-28 2011-11-02 清华大学 化学机械抛光方法
KR101339722B1 (ko) * 2011-07-18 2013-12-10 이화다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너
WO2013166516A1 (fr) * 2012-05-04 2013-11-07 Entegris, Inc. Tampons de conditionneur de polissage chimicomécanique (cmp) avec amélioration de matière superabrasive
WO2014022453A1 (fr) 2012-08-02 2014-02-06 3M Innovative Properties Company Précurseur d'élément abrasif ayant des caractéristiques aux formes précises et procédé de fabrication de celui-ci
KR102089383B1 (ko) 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 물품 및 그의 제조 방법
KR20150072404A (ko) * 2012-10-19 2015-06-29 다우 글로벌 테크놀로지스 엘엘씨 성형가능 및/또는 붕괴가능 물질을 절단하기 위한 장치 및 방법
US9457450B2 (en) 2013-03-08 2016-10-04 Tera Xtal Technology Corporation Pad conditioning tool
TWI511841B (zh) * 2013-03-15 2015-12-11 Kinik Co 貼合式化學機械硏磨修整器及其製法
JP6542793B2 (ja) * 2014-03-21 2019-07-10 インテグリス・インコーポレーテッド 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ
CN106078517A (zh) * 2016-08-03 2016-11-09 咏巨科技有限公司 一种抛光垫修整装置
SG11202101908TA (en) * 2018-08-31 2021-03-30 Best Engineered Surface Technologies Llc Hybrid cmp conditioning head
CN118510629A (zh) * 2021-12-31 2024-08-16 3M创新有限公司 具有微型特征部的修整盘
KR20240011952A (ko) * 2022-07-20 2024-01-29 새솔다이아몬드공업 주식회사 패드 컨디셔너
CN117103123B (zh) * 2023-10-24 2024-01-30 华南理工大学 一种金刚石磨粒修平表面的微纳结构成型控制方法

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EP1075898A2 (fr) * 1999-08-13 2001-02-14 Mitsubishi Materials Corporation Outil et dispositif de dressage
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Also Published As

Publication number Publication date
TW200837823A (en) 2008-09-16
WO2008076199A2 (fr) 2008-06-26
CN101557904A (zh) 2009-10-14
US20080153398A1 (en) 2008-06-26
TWI356449B (en) 2012-01-11

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