WO2008064581A1 - Plan médian de dispositif de communication - Google Patents

Plan médian de dispositif de communication Download PDF

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Publication number
WO2008064581A1
WO2008064581A1 PCT/CN2007/070242 CN2007070242W WO2008064581A1 WO 2008064581 A1 WO2008064581 A1 WO 2008064581A1 CN 2007070242 W CN2007070242 W CN 2007070242W WO 2008064581 A1 WO2008064581 A1 WO 2008064581A1
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WO
WIPO (PCT)
Prior art keywords
connector
communication device
backplane
connectors
card connector
Prior art date
Application number
PCT/CN2007/070242
Other languages
English (en)
French (fr)
Inventor
Wenxiang Zhou
Baohong Li
Original Assignee
Hangzhou H3C Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou H3C Technologies Co., Ltd. filed Critical Hangzhou H3C Technologies Co., Ltd.
Priority to US12/297,045 priority Critical patent/US7955087B2/en
Publication of WO2008064581A1 publication Critical patent/WO2008064581A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/035—Cooling of active equipments, e.g. air ducts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/03—Power distribution arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/06—Cable ducts or mountings specially adapted for exchange installations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/08—Frames or mounting racks for relays; Accessories therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/09—Frames or mounting racks not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections

Definitions

  • the present invention relates to communication devices in communication systems and computer networks, and more particularly to intermediate backplanes for communication devices.
  • FIG. 1 An exemplary structure of the first intermediate backplane is shown in Fig. 1. Both sides of the intermediate backplane 100 have connectors for card insertion, and the connectors are generally arranged in a longitudinal direction.
  • Figure la is a front view of the intermediate backplane 100. In the middle of one side of the middle backplane 100, there are two control card connectors 130 for connecting the main control card or other control cards; the two sides of the control card connector 130 are respectively The three interface card connectors 110 are used to connect the interface cards;
  • FIG. 1b is a rear view of the middle backplane 100, and the middle of the other side of the middle backplane 100 is Three switch card connectors 120 for connecting switch cards; two sides of the switch card connector 120 are three service card connectors 140 for connecting service processing cards.
  • Figure lc is a top view of the intermediate backplane 100.
  • the service card connector 140 and the interface card connector 110 are on opposite sides of the intermediate backplane 100, so that the service processing card and the interface card are respectively inserted into the corresponding services in a plug-in manner.
  • the card connector 140 and the interface card connector 110 together perform the functions of the line card.
  • the switch card since the switch card is responsible for data exchange between the service processing card and the interface card, there is a communication between each switch card connector 120 and each interface card connector 110 and each service card connector 140. High speed channel.
  • the switch card connector 120 is relatively concentrated in the middle of the intermediate backplane 100, so that the intermediate backplane 100 has a local wiring density that is too large, resulting in an increase in the number of layers and design complexity of the intermediate backplane 100, thereby resulting in design cost and equipment cost. increase.
  • each frame includes a respective interface card connector 110, a service card connector 140, and a switch card connector 120, respectively.
  • the intermediate backplanes are respectively arranged correspondingly in the space of each frame. In this way, the high-speed channel between the upper frame switch card connector 120 and the lower frame interface card connector 110 and the service card connector 140 is bridged between the upper and lower frames, occupying a large number of wiring layers, and the intermediate backplane can only be used at most. There are a small number of layers that can be used to lay out the power supply. The power consumption of such a large-capacity communication device is very large, and the power distribution problem on the backplane has to be solved by means of bus bars or local wiring, which further increases Design cost and equipment cost.
  • FIG. 2 An example structure of the second intermediate backplane is shown in Figure 2. Both sides of the intermediate backplane 200 have connectors for inserting cards, and the connectors are arranged longitudinally and laterally on both sides of the intermediate backplane 200, respectively.
  • 2a is a front elevational view of the intermediate backplane 200 with a plurality of line card connectors 210 arranged longitudinally parallel to one another on one side of the intermediate backplane 200.
  • 2b is a rear view of the intermediate backplane 200, on the other side of the intermediate backplane, a plurality of switch card connectors 220 are laterally aligned parallel to each other; below the switch card connector 220, a plurality of control card connectors 230 are The switch card connectors 220 on the same side are arranged in parallel.
  • each of the switch card connectors 220 and each of the line card connectors 210 have different intersections on the intermediate backplane, and the high speed channel connection between the two can be completed at the intersection point.
  • the two types of card insertion modes are completely different on both sides of the intermediate backplane 200, the direction of the heat dissipation air channel of the intermediate backplane 200 is inconsistent.
  • the vertical card on one side needs to adopt the upper and lower air duct design, and the horizontal card on the other side needs to adopt the left and right air ducts. In this way, two different heat dissipation systems are required, which also leads to an increase in the design cost and equipment cost of the communication device.
  • the intermediate backplane is not suitable for the structure of upper and lower frames or multiple frames, which brings limitations in system capacity.
  • the problem to be solved by the present invention is that the intermediate backplane in the prior art has a local wiring density that is too large or requires two heat dissipation systems.
  • the intermediate backplane of the communication device of the present invention includes a first connector and a second connector interconnected by a high speed channel, wherein the first connectors are arranged in parallel on one side of the intermediate backplane; the second connector is in the middle back The other side of the board is arranged in parallel and is parallel to the first connector.
  • the first connector and the second connector are interposed between the two sides of the intermediate backplane.
  • the first connector and the second connector are arranged laterally or longitudinally.
  • the intermediate backplane further includes a third connector that is co-located and parallel to the first connector or the second connector.
  • the third connector is a control card connector.
  • the first connector is a switch card connector
  • the second connector is a line card connector.
  • Another intermediate backplane for a communication device of at least two-frame structure provided by the present invention includes a first connector and a second connector interconnected by a high-speed channel, wherein: the first connector is in the middle backplane The sides are arranged in parallel, each of the first connectors spans the respective frames; the second connectors are arranged in parallel in the respective frames on the other side of the intermediate back plate, and are parallel to the first connector.
  • the first connector and the second connector are interposed between the two sides of the intermediate backplane.
  • the first connector of the communication device is longitudinally aligned with the second connector.
  • the intermediate backplane further comprises a third connector arranged on the same side and parallel to the first connector or on the same side as the second connector and arranged in parallel in the frame.
  • the third connector is a control card connector.
  • the first connector is a switch card connector
  • the second connector is a line card connector
  • the first connector and the second connector are respectively disposed on both sides of the intermediate backplane, so that the high-speed channel wiring therebetween can be distributed over the entire intermediate backplane, thereby avoiding excessive local wiring density and reducing the backplane.
  • the first connector and the second connector are parallel to each other, and the heat dissipation air channels are in the same direction, so that only one heat dissipation system can complete the heat dissipation of the entire communication device, thereby reducing the design complexity of the communication device;
  • the first connector is connected to each frame, and the second connector is located in each frame, and the high-speed channel interconnected therebetween can be separately wired in each frame.
  • the area between the frames of the intermediate backplane can be used to distribute power, reducing the cost of the communication device.
  • FIG. 1 is a view showing an example of the structure of a first intermediate backboard in the prior art
  • FIG. 2 is a view showing an example of the structure of a second intermediate backboard in the prior art
  • Embodiment 1 of the intermediate backplane according to the present invention is a structural example view of Embodiment 1 of the intermediate backplane according to the present invention.
  • FIG. 4 is a schematic view showing the route of the high speed channel between the two connectors in the first embodiment of the intermediate backplane according to the present invention
  • Embodiment 2 of the intermediate backplane according to the present invention is a structural diagram of Embodiment 2 of the intermediate backplane according to the present invention.
  • Figure 6 is a schematic view showing the alignment of the high speed channels between the two connectors in the second embodiment of the intermediate backplane of the present invention.
  • the switch card connector 120 is concentratedly distributed in the middle of the middle backplane, and the interface card connector 110 and the service card connector 140 are concentratedly distributed on both sides of the middle backplane, resulting in The local wiring density is too large.
  • the switch card connector is distributed on one side of the middle backplane, and the line card connector is distributed on the other side of the middle backplane in a direction parallel to the switch card connector, and the high speed channel connection therebetween can cover the entire
  • the middle backplane does not have to rely on the intersection of the switch card connector 220 and the line card connector 210 for high speed channel routing as in the configuration shown in FIG. 2, nor does it cause too much local wiring.
  • FIG. Figure 3a is a front elevational view of the intermediate backplane 300, including six longitudinally disposed line card connectors 310 and two longitudinally disposed control card connectors 330 on one side of the intermediate backplane 300, all of the line card connectors 310 and The control card connectors 330 are arranged in parallel.
  • 3b is a rear view of the intermediate backplane 300, and the other side of the intermediate backplane 300 includes a plurality of longitudinally disposed switch card connectors 320 arranged in parallel with each other, and the switch card connector 320 is disposed in a direction parallel to the line card connector.
  • 310. 3c is a top view of the intermediate backplane 300.
  • the middle backplane 300-side line card connector 310, the control card connector 330, and the other side of the switch card connector 320 may be interleaved, that is, the connector is in the middle.
  • the two sides of the back plate 300 are not facing each other, staggered with each other, and arranged in parallel. Since the signals inside the connectors on both sides of the intermediate backplane 300 in this embodiment are not the same, the interleaving distribution makes it easier to define different signals in the connectors on both sides.
  • the high speed channel between the line card connector 310 and the switch card connector 320 in the intermediate backplane 300 in this embodiment can be routed in the manner shown in FIG. 4, and the other side of the middle backplane 300 is indicated by a dashed border in FIG. Switch card connector 320.
  • Switch card connector 320 For the sake of clarity, only one of the switch card connectors 320 is connected to the high speed path of each line card connector 310 in FIG.
  • the high speed channel between a switch card connector 320 and each line card connector 310 can be routed in parallel at any height on the intermediate backplane 300, since all of the line card connector 310 and switch card connector 320 are respectively distributed
  • the different sides of the intermediate backplane 300, the high speed passage therebetween can be substantially evenly distributed throughout the intermediate backing plate 300.
  • control card connector 330 can be connected to the line card connector 310 and the switch card connector 320 through a low-speed control channel, it can also be connected through a small number of high-speed channels; and the number of control card connectors 330 in the entire communication device is very high. Less, usually only one to two, does not have much influence on the wiring of the middle backplane, so the control card connector 330 can be placed at any position on the middle backplane, and any one of the side of the line card connector 310 The slot can be either in any of the slots of the switch card connector 320.
  • the embodiment is applicable to the arrangement of two or more line card connectors and two or more control card connectors on the middle back board, and is not limited to the connector shown in FIG. Number.
  • the line card connector, the switch card connector, and the control card connector can all be arranged in a horizontal arrangement, and the same technical effects can be obtained.
  • FIG. 1 An exemplary structure of the second embodiment of the intermediate backplane of the present invention is shown in FIG.
  • the intermediate backplane in the second embodiment is applied to a communication device having a top and bottom frame structure.
  • the communication device of the multi-frame structure generally includes only one intermediate backplane.
  • the communication device in this embodiment has a two-frame structure on one side of the middle backplane and a single-frame structure on the other side.
  • the width of the communication device is generally limited by the width of the standard rack, and thus the frames in the multi-frame communication device are generally vertically aligned.
  • the middle back plate 500 includes eight longitudinal designs in the space of the upper frame
  • the line card connectors 510 are arranged in parallel with each other; in the space of the lower frame, there are six longitudinally arranged line card connectors 510 and two longitudinally arranged control card connectors 530, and all the connectors in the lower frame are arranged in parallel with each other. .
  • Figure 5b is a rear view of the intermediate backplane 500.
  • the rear side of the intermediate backplane 500 has a single-frame structure including seven longitudinally disposed switch card connectors 520 arranged in parallel with each other. The arrangement of the switch card connectors 520 is parallel.
  • the centerline card connector 510 has a portion of the switch card connector 520 on the opposite side of the backplane.
  • Figure 5c is a top plan view of the intermediate backplane 500, with the line card connector 510 on one side of the midplane 500, the control card connector 530 and the other side of the switch card connector 520 being interleaved. Since the signals inside the connectors on both sides of the intermediate backplane 500 in this embodiment are not the same, the interleaving distribution makes it easier to define different signals in the connectors on both sides.
  • the high-speed channel between the line card connector 510 and the switch card connector 520 of the intermediate backplane 500 can be routed as shown in FIG. 6, and the back side of the middle backplane 500 is indicated by a broken line frame in FIG. Switch card connector 520.
  • the switch card connectors 520 is connected to the high speed channel of each line card connector 510 in FIG.
  • the switch card connector 520 bridges the frames so that the high speed path between the respective line card connector 510 and the switch card connector 520 in each frame can be parallel at any height of the portion of the intermediate backplane 500 corresponding to each frame.
  • the line that is, the high speed channel between the switch card connector 520 and the upper frame line card connector 510 is at a high speed between the intermediate backplane 500 corresponding to the upper frame portion and the lower frame line card connector 510.
  • the channels are laterally parallel to the portion of the lower backplane 500 that corresponds to the lower frame.
  • the switch card connector 520 in this embodiment spans the frames, and the connected switch card can have a larger area.
  • a large bandwidth connection with other communication devices is completed by a switch card, and a larger switch card can provide a parallel optical module for a large bandwidth connection or There is enough space for the electrical interface.
  • control card connector 530 Since the control card connector 530 is connected to the line card connector 510, the switch card connector 520 through a low-speed control channel, or through a certain number of high-speed channels; and in the entire communication device
  • the number of control card connectors 530 is small, usually only one to two, and does not have much influence on the wiring of the intermediate backplane. Therefore, the control card connector 530 can be placed at any position on the middle backplane, in the middle. Any one of the upper frame and the lower frame on the front side of the back plate 500 or any one of the slots on the rear side may be used.
  • the embodiment is applicable to the arrangement of two or more line card connectors and two or more control card connectors on the middle back board, and is not limited to the connector shown in FIG. Number.
  • the line card connector, the switch card connector, and the control card connector can all be arranged in a horizontal arrangement, and the same technical effect can be obtained, but at this time, the frames of the communication device should also be arranged in a horizontal direction.
  • the intermediate backplane of the present invention adopts a distributed structure of the switch card connector to ensure the scalability of the communication device; the structure does not cause the local wiring density of the intermediate backplane to be too high, and the number of layers of the intermediate backplane is reduced.
  • the complexity of the design reduces the cost of the intermediate backplane; and because the intermediate backplane wiring density is relatively uniform, the crosstalk between signals is reduced, so the signal quality of the high-speed channel interconnect signal is improved, and the stability of the communication device is improved. .
  • the communication device adopts parallel card insertion structures on both sides of the middle backplane, and the heat dissipation air channels on both sides are in the same direction, so that the communication device can adopt a heat dissipation system, which reduces the complexity of the design and improves Reliability also reduces the cost of communication equipment.
  • the middle can be The layers of the printed board in the area between the frames of the backboard are used to distribute the power, so that the wiring of the middle backboard supports the distribution of large currents, thereby reducing the difficulty of power distribution of the communication equipment, thereby reducing the cost of the communication equipment.
  • the high-speed channel interconnection is a switch card connector and a line card connector, which are respectively disposed on both sides of the middle backplane; the connection with other connectors only through the low-speed channel is control
  • the card connector can be placed anywhere on the middle backplane. Any of the different types of connectors that need to be interconnected by a high speed channel can be configured on the intermediate backplane using the structure of the present invention.
  • the intermediate backplane can also include connectors that are connected to other connectors at low speed channels.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

通信设备的中间背板
本申请要求于 2006 年 11 月 30 日提交中国专利局、 申请号为 200610160833.X, 发明名称为"通信设备的中间背板"的中国专利申请的优先 权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及通信系统与计算机网络中的通信设备，尤其涉及通信设备的中 间背板。
背景技术
随着互联网的发展， 网络支持的业务在不断丰富。现在的网络不仅仅支持 网页浏览等业务， 还支持视频、 多媒体等高带宽要求的业务。 为了适应宽带业 务的发展，在企业网、城域网的宽带设备中占据重要位置的交换机和路由器等 通信设备面临着更高的要求。 随着网络容量的增加，通信设备需要支持越来越 多的端口数目和越来越快的端口速度，通信设备的系统总容量也上升到几百个 Gbps (千兆位每秒）到几个 Tbps (兆兆位每秒；)， 未来还要到几十甚至几百个 T。
通信设备系统容量的增长带来了设备架构的变化。当今的高端通信设备普 遍采用多平面交换技术， 采用多个交换卡协同工作，共同完成线卡间的数据交 换功能。 这样， 每个线卡需要有高速数据链路连接至每个交换卡。 每个线卡的 带宽可以达到数十甚至数百 Gbps (千兆位每秒）， 至各个交换卡的高速数据链 路相应达到数十甚至数百条， 整个通信设备的高速数据链路可达数千条。
由于这些高速数据链路通常均在背板中走线，因此对背板的设计提出了相 当高的要求。 同时为了提供更多的插卡槽位， 可以两面插卡的中间背板 ( midplane )成为大容量通信设备的主要选择。 现有技术中， 主要采用以下两 种中间背板：
第一种中间背板的示例结构如图 1所示，中间背板 100的两面都有用来插 卡的连接器， 连接器通常为纵向平行排列。 图 la为中间背板 100的正视图， 在中间背板 100的一侧中部为两个控制卡连接器 130， 用来连接主控卡或者其 它的控制卡； 控制卡连接器 130的两侧分别为 3个接口卡连接器 110, 用来连 接接口卡； 图 lb为中间背板 100的后视图， 在中间背板 100的另一侧中部为 3个用来连接交换卡的交换卡连接器 120; 交换卡连接器 120的两侧分别是 3 个用来连接业务处理卡的业务卡连接器 140。 图 lc为中间背板 100的俯视图， 业务卡连接器 140和接口卡连接器 110在中间背板 100的两侧——正对，使得 业务处理卡和接口卡以对插方式分别插入对应的业务卡连接器 140 和接口卡 连接器 110, 共同完成线卡的功能。
对这种中间背板， 由于交换卡负责业务处理卡和接口卡之间的数据交换， 每个交换卡连接器 120与每个接口卡连接器 110和每个业务卡连接器 140之间 都有高速通道。 交换卡连接器 120相对集中地分布在中间背板 100的中间，使 得中间背板 100局部布线密度过大，造成中间背板 100层数和设计复杂度的增 加， 因而导致设计成本和设备成本的增加。
当通信设备包括两框或多框时， 一般仍具有统一的一个中间背板。 以两框 结构为例， 两框结构的通信设备采用类似于第一种中间背板的结构时，各框分 别包括各自的接口卡连接器 110、 业务卡连接器 140和交换卡连接器 120， 中 间背板对应于各框的空间内分别分布配置。这样，上框交换卡连接器 120与下 框接口卡连接器 110和业务卡连接器 140之间的高速通道跨接在上下框之间， 占用大量的布线层数， 中间背板上最多只能有很少的层数能用来布置电源， 而 这种大容量通信设备的电源功耗很大，不得不采用汇流条或者局部配线等方式 来解决背板上的电源分配问题 , 进一步增加了设计成本和设备成本。
第二种中间背板的示例结构如图 2所示。中间背板 200的两面都有用来插 卡的连接器， 连接器在中间背板 200的两侧分别采用纵向和横向排列。 图 2a 为中间背板 200的正视图 ,多个线卡连接器 210在中间背板 200的一侧相互平 行地纵向排列。 图 2b为中间背板 200的后视图， 在中间背板的另一侧， 多个 交换卡连接器 220相互平行地横向排列； 在交换卡连接器 220的下方， 多个控 制卡连接器 230与同侧的交换卡连接器 220平行排列。
对这种中间背板，每个交换卡连接器 220与每个线卡连接器 210均在中间 背板上有位置不同的相交点 , 可以在相交点处完成二者之间的高速通道连接， 解决了中间背板布线集中的问题。但是， 由于中间背板 200的两侧采用了方向 完全不同的两种插卡方式，导致中间背板 200的散热风道方向不一致。一侧的 纵向插卡需要采用上下的风道设计 ,另一侧的横向插卡需要采用左右的风道设 计，这样就需要两个不同的散热系统， 同样会导致通信设备的设计成本和设备 成本的增加。
另外， 由于需要保证每一块交换卡和每一块线卡互连， 所以这种中间背板 不适用于上下两框或者多框的结构， 带来了系统容量上的限制。
发明内容
本发明要解决的是现有技术中的中间背板局部布线密度过大或者需要两 个散热系统的问题。
本发明所述通信设备的中间背板，包括通过高速通道互连的第一连接器和 第二连接器，其中第一连接器在中间背板的一侧平行排列； 第二连接器在中间 背板的另一侧平行排列， 并且与第一连接器平行。
优选地， 所述第一连接器与第二连接器在中间背板的两侧间插分布。 优选地， 所述第一连接器和第二连接器横向或者纵向排列。
优选地 ,所述中间背板还包括与第一连接器或者第二连接器同侧且平行排 列的第三连接器。
优选地， 所述第三连接器为控制卡连接器。
优选地， 所述第一连接器为交换卡连接器， 第二连接器为线卡连接器。 本发明提供的另一种应用于至少两框结构的通信设备的中间背板，包括通 过高速通道互连的第一连接器和第二连接器，其中： 第一连接器在中间背板的 一侧平行排列，每个第一连接器跨接各框； 第二连接器于中间背板的另一侧分 别在各框内平行排列， 并且与第一连接器平行。
优选地 , 所述第一连接器与第二连接器在中间背板的两侧间插分布。 优选地， 所述通信设备的第一连接器与第二连接器纵向排列。
优选地， 所述中间背板还包括第三连接器， 与第一连接器同侧且平行排列 或者与第二连接器同侧且在框内平行排列。
优选地， 所述第三连接器为控制卡连接器。
优选地， 所述第一连接器为交换卡连接器， 第二连接器为线卡连接器。 本发明中 , 第一连接器和第二连接器分别设置在中间背板的两侧 ,使得其 间的高速通道布线可以分布在整个中间背板上，避免了局部布线密度过大， 减 少了背板的层数和设计复杂度， 并且减少了信号间的串扰； 同时， 本发明中第 一和第二连接器相互平行分布，散热风道方向一致，从而只需一个散热系统即 可完成整个通信设备的散热 , 降低了通信设备的设计复杂度；
进一步，对两框或多框结构的通信设备，本发明中令第一连接器跨接各框， 而第二连接器位于各框内，其间互连的高速通道可以在各框内分别布线，这样 中间背板各框之间的区域可以用来分配电源， 降低了通信设备的成本。
附图说明
图 1为现有技术中第一种中间背板的结构示例图；
图 2为现有技术中第二种中间背板的结构示例图；
图 3为本发明所述中间背板实施例一的结构示例图；
图 4 为本发明所述中间背板实施例一中两种连接器间高速通道的走线示 意图；
图 5为本发明所述中间背板实施例二的结构示例图；
图 6 为本发明所述中间背板实施例二中两种连接器间高速通道的走线示 意图。
具体实施方式
在具有图 1所示结构的中间背板上，交换卡连接器 120集中分布在中间背 板的中部，而接口卡连接器 110和业务卡连接器 140集中分布在中间背板的两 侧， 造成了局部布线密度过大。 本发明中， 令交换卡连接器分布在中间背板的 一侧， 线卡连接器以平行于交换卡连接器的方向分布在中间背板的另一侧，其 间的高速通道连接基本可以覆盖整个中间背板，而不必像图 2所示的结构中需 要依赖于交换卡连接器 220和线卡连接器 210的相交点来进行高速通道走线， 同样不会使得某个局部的布线过多。
本发明所述中间背板实施例一的一种示例结构如图 3所示。 图 3a为中间 背板 300的正视图， 在中间背板 300的一侧包括 6个纵向设置的线卡连接器 310和 2个纵向设置的控制卡连接器 330, 所有的线卡连接器 310和控制卡连 接器 330平行排列。
图 3b为中间背板 300的后视图， 在中间背板 300的另一侧包括 Ί个纵向 设置的交换卡连接器 320, 相互平行排列， 交换卡连接器 320的设置方向平行 于线卡连接器 310。 图 3c为中间背板 300的俯视图， 中间背板 300—侧的线卡连接器 310、 控制卡连接器 330与另一侧的交换卡连接器 320可以采用间插方式分布，即连 接器在中间背板 300上的两侧不正对， 彼此交错， 平行排列。 由于本实施例中 的中间背板 300两侧的连接器内部的信号不尽相同，间插分布使得在两侧的连 接器内各自定义不同的信号更为便利。
本实施例中的中间背板 300上线卡连接器 310与交换卡连接器 320之间高 速通道可以采用图 4所示的方式走线， 图 4 中以虚线边框表示中间背板 300 另一侧的交换卡连接器 320。 为清楚起见， 图 4中只表示了一个交换卡连接器 320与每个线卡连接器 310的高速通道连接。 一个交换卡连接器 320与各个线 卡连接器 310之间的高速通道可以在中间背板 300上的任意高度平行走线，而 由于所有的线卡连接器 310和交换卡连接器 320分别分布在中间背板 300的不 同侧面， 其间的高速通道基本上可以均匀地遍布中间背板 300。
由于控制卡连接器 330与线卡连接器 310、 交换卡连接器 320之间可以通 过低速的控制通道连接，也可以通过少量的高速通道连接； 而且整个通信设备 中控制卡连接器 330的数量很少，通常只有 1个至 2个，对中间背板的布线不 会造成多大影响， 因而控制卡连接器 330在中间背板上可以设置在任意的位 置，在线卡连接器 310—侧的任一个槽位或者在交换卡连接器 320的任一个槽 位均可。
任何本领域技术人员均可了解，本实施例适用于两个以上的线卡连接器和 两个以上的控制卡连接器在中间背板上的布置，而不局限于图 3所示的连接器 个数。 同样， 本实施例中线卡连接器、 交换卡连接器以及控制卡连接器也可以 全都采用横向排列的设置方式， 能够取得相同的技术效果。
本发明所述中间背板实施例二的一种示例结构如图 5所示。实施例二中的 中间背板应用于具有上下两框结构的通信设备。多框结构的通信设备通常只包 括一个中间背板，本实施例中的通信设备在中间背板的一侧为两框结构， 另一 侧为单框结构。通信设备的宽度一般受限于标准机架的宽度， 因而多框结构的 通信设备中各框一般为纵向排列。
图 5a为中间背板 500及通信设备外框的正视图 , 在中间背板 500的正面 一侧通信设备分为上框和下框。中间背板 500在上框的空间内包括 8个纵向设 置的线卡连接器 510， 相互平行排列； 在下框的空间内包括 6个纵向设置的线 卡连接器 510和 2个纵向设置的控制卡连接器 530, 下框内的所有连接器相互 平行排列。
图 5b为中间背板 500的后视图，在中间背板 500的后面一侧为单框结构， 包括 7个纵向设置的交换卡连接器 520， 相互平行排列， 交换卡连接器 520的 设置方向平行于正面一侧的线卡连接器 510; 每个交换卡连接器 520在纵向延 伸至中间背板 500对应于每个框的部分， 即每个交换卡连接器 520跨接各框， 在各框中线卡连接器 510的背板对侧都有部分交换卡连接器 520。
图 5c为中间背板 500的俯视图， 中间背板 500一侧的线卡连接器 510、 控制卡连接器 530与另一侧的交换卡连接器 520可以采用间插方式分布。由于 本实施例中的中间背板 500两侧的连接器内部的信号不尽相同，间插分布使得 在两侧的连接器内各自定义不同的信号更为便利。
本实施例中的中间背板 500上线卡连接器 510与交换卡连接器 520之间高 速通道可以采用图 6所示的方式走线， 图 6 中以虚线边框表示中间背板 500 后面一侧的交换卡连接器 520。 清楚起见， 图 6中只表示了一个交换卡连接器 520与每个线卡连接器 510的高速通道连接。
交换卡连接器 520跨接各框，因而每个框中的各个线卡连接器 510与该交 换卡连接器 520之间的高速通道可以在对应于各框的部分中间背板 500的任意 高度平行走线，即交换卡连接器 520与上框线卡连接器 510之间的高速通道在 中间背板 500对应于上框的部分横向平行走线，与下框线卡连接器 510之间的 高速通道在中间背板 500对应于下框的部分横向平行走线。这样，在中间背板 500对应于上框和下框的两个部分之间没有高速通道走线， 可以将这部分中间 背板用来分配电源或者进行其他信号的布线。
另夕卜，本实施例中的交换卡连接器 520跨接各框， 所连接的交换卡可以具 有更大的面积。 当多个通信设备采用堆叠方式互连为一个逻辑上的通信设备 时， 与其他通信设备间的大带宽连接由交换卡完成， 面积较大的交换卡可以为 大带宽连接提供放置并行光模块或者电接口的足够空间。
由于控制卡连接器 530与线卡连接器 510、 交换卡连接器 520之间通过低 速的控制通道连接，或者通过一定数量的高速通道连接； 而且整个通信设备中 控制卡连接器 530的数量很少，通常只有 1个至 2个，对中间背板的布线不会 造成多大影响 , 因而控制卡连接器 530在中间背板上可以设置在任意的位置 , 在中间背板 500正面一侧上框和下框中的任一个槽位或者在后面一侧的任一 个槽位均可。
任何本领域技术人员均可了解，本实施例适用于两个以上的线卡连接器和 两个以上的控制卡连接器在中间背板上的布置，而不局限于图 5所示的连接器 个数。 同样， 本实施例中线卡连接器、 交换卡连接器以及控制卡连接器也可以 全都采用横向排列的设置方式， 能够取得相同的技术效果，但此时通信设备的 各框也应为横向排列。
本发明的中间背板采用交换卡连接器的分布式结构，保证了通信设备的可 扩展性； 这种结构不会造成中间背板的局部布线密度过高， 减少了中间背板的 层数和设计的复杂度，从而降低了中间背板的成本； 并且因为中间背板布线密 度比较均匀 ,减少了信号间的串扰，所以提高了高速通道互连信号的信号质量， 提高了通信设备的稳定性。
再者，通信设备在中间背板的两侧采用了相互平行的插卡架构， 两侧的散 热风道为相同方向，这样通信设备可以采用一套散热系统， 降低了设计的复杂 度， 在提高了可靠性的同时降低了通信设备的成本。
对于两框或多框结构的通信设备， 由于可以连接跨接各框的大交换卡， 并 且可以保证中间背板上高速通道的互连信号不会跨接在各框之间 ,因此可以将 中间背板各框间区域的印制板各层用来分配电源 ,使得中间背板的布线支持大 电流的配电，进而降低了通信设备电源分配的难度，从而降低了通信设备的成 本。
本发明的上述两个实施例中，需要采用高速通道互连的是交换卡连接器和 线卡连接器，分别设置于中间背板的两侧； 只通过低速通道与其他连接器连接 的是控制卡连接器，可以设置于中间背板的任意位置。任何需要通过高速通道 互连的不同类型连接器在中间背板上的设置都可以采用本发明所述的结构 ,此 外 , 中间背板还可以包括以低速通道连至其他连接器的连接器。
以上所述的本发明实施方式， 并不构成对本发明保护范围的限定。任何在 本发明的精神和原则之内所作的修改、等同替换和改进等， 均应包含在本发明 的权利要求保护范围之内。

Claims

权 利 要 求
I. 一种通信设备的中间背板， 其特征在于， 包括通过高速通道互连的第 一连接器和第二连接器， 其中： 所述第一连接器在中间背板的一侧平行排列； 所述第二连接器在中间背板的另一侧平行排列， 并且与所述第一连接器平行。
2. 如权利要求 1所述通信设备的中间背板， 其特征在于： 所述第一连接 器与第二连接器在中间背板的两侧间插分布。
3. 如权利要求 1所述通信设备的中间背板， 其特征在于： 所述第一连接 器和第二连接器横向或者纵向排列。
4. 如权利要求 1所述通信设备的中间背板， 其特征在于： 所述中间背板 还包括与第一连接器或者第二连接器同侧且平行排列的第三连接器。
5. 如权利要求 4所述通信设备的中间背板， 其特征在于： 所述第三连接 器为控制卡连接器。
6. 如权利要求 1所述通信设备的中间背板， 其特征在于： 所述第一连接 器为交换卡连接器， 第二连接器为线卡连接器。
7. 一种通信设备的中间背板， 所述通信设备为至少两框结构， 其特征在 于， 包括通过高速通道互连的第一连接器和第二连接器， 其中： 所述第一连接 器在中间背板的一侧平行排列，每个第一连接器跨接各框； 所述第二连接器于 中间背板的另一侧分别在各框内平行排列， 并且与第一连接器平行。
8. 如权利要求 7所述通信设备的中间背板， 其特征在于： 所述第一连接 器与第二连接器在中间背板的两侧间插分布。
9. 如权利要求 7所述通信设备的中间背板， 其特征在于： 所述通信设备 的第一连接器与第二连接器纵向排列。
10. 如权利要求 7所述通信设备的中间背板， 其特征在于： 所述中间背板 还包括第三连接器 ,与第一连接器同侧且平行排列或者与第二连接器同侧且在 框内平行排列。
II. 如权利要求 10所述通信设备的中间背板， 其特征在于： 所述第三连 接器为控制卡连接器。
12. 如权利要求 7所述通信设备的中间背板， 其特征在于： 所述第一连接 器为交换卡连接器， 第二连接器为线卡连接器。
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