WO2023093105A1 - 一种光背板互连装置及通信设备 - Google Patents

一种光背板互连装置及通信设备 Download PDF

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Publication number
WO2023093105A1
WO2023093105A1 PCT/CN2022/108647 CN2022108647W WO2023093105A1 WO 2023093105 A1 WO2023093105 A1 WO 2023093105A1 CN 2022108647 W CN2022108647 W CN 2022108647W WO 2023093105 A1 WO2023093105 A1 WO 2023093105A1
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WO
WIPO (PCT)
Prior art keywords
optical
board
backplane
optical backplane
cross
Prior art date
Application number
PCT/CN2022/108647
Other languages
English (en)
French (fr)
Inventor
滕霜叶
孔凡华
樊会忠
龚涛
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023093105A1 publication Critical patent/WO2023093105A1/zh

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3869Mounting ferrules to connector body, i.e. plugs
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/03Arrangements for fault recovery
    • H04B10/032Arrangements for fault recovery using working and protection systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q11/00Selecting arrangements for multiplex systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q11/00Selecting arrangements for multiplex systems
    • H04Q11/0001Selecting arrangements for multiplex systems using optical switching
    • H04Q11/0003Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q11/00Selecting arrangements for multiplex systems
    • H04Q11/0001Selecting arrangements for multiplex systems using optical switching
    • H04Q11/0005Switch and router aspects
    • H04Q2011/0037Operation
    • H04Q2011/0043Fault tolerance

Definitions

  • the present application relates to the field of information communication technologies, and in particular to an optical backplane interconnection device and communication equipment.
  • the backplane is an important part of communication equipment.
  • the backplane is generally installed on the back or in the middle of the cabinet, and can provide signal connection and physical support for single boards or modules.
  • the backplane plays an important role in the system capacity, cooling air duct, and maintenance performance of communication equipment.
  • Backplanes can be divided into electric backplanes and optical backplanes.
  • the electrical backplane is generally composed of printed circuit boards, connectors, guide pins and other components. Considering the high reliability, low failure rate, and small business load of the components of the electrical backplane, the electrical backplane is usually directly fixed on the subrack, that is, the electrical backplane can be non-replaceable.
  • Optical backplanes are generally composed of optical fibers, optical connectors, supporting structures, and guide pins.
  • the reliability and failure rate of the components of an optical backplane are comparable to those of an electrical backplane.
  • the optical backplane needs to be fixed on the subrack due to the position restriction of other components on the optical backplane, so that the optical backplane cannot be replaced. If a channel in the optical backplane is damaged, the service transmission effect will be affected, and the entire cabinet may even be replaced.
  • Embodiments of the present application provide an optical backplane interconnection device and communication equipment to solve the problem that the optical backplane cannot be replaced in the related art.
  • an embodiment of the present application provides an optical backplane interconnection device, and the optical backplane interconnection device may include: at least one optical backplane and at least one single board.
  • Each optical backplane is orthogonal to any single board, and one side of each optical backplane is opposite to one side of any single board, and each single board is located on the same side of any single board.
  • Each optical backplane is pluggably connected to any single board.
  • each optical backplane is arranged to be orthogonal to any single board, and one side of each optical backplane is arranged opposite to one side of any single board,
  • Each board is located on the same side of any optical backplane, that is to say, the optical backplane is only connected to any single board on one side, so that the position of the optical backplane is not restricted by other components, so that the optical backplane and the single board can be connected to each other.
  • Pluggable connections are realized between the optical backplanes. When the optical backplane fails, the optical backplane can be replaced separately without replacing the entire cabinet.
  • each optical backplane is configured to be pluggably connected to any single board, so that the optical backplane can be replaced more flexibly and easily.
  • the single board in this embodiment of the application may be any single board capable of transmitting optical signals, for example, the single board may be a service processing board or a cross-connect board.
  • the service processing board may be a line card (Line Card, LC) for accessing services and processing services.
  • the optical backplane interconnection device may include a plurality of single boards arranged along a first direction, where the first direction is a direction perpendicular to the single boards. Arranging the veneers in the optical backplane interconnection device in parallel can facilitate interconnection between the veneers and the optical backplane.
  • the optical backplane may be connected to at least two single boards. In this way, optical signal transmission through the optical backplane can realize optical signal transmission between the at least two single boards.
  • the multiple single boards in the optical backplane interconnection device may all be service processing boards; or, the multiple single boards in the optical backplane interconnection device may all be cross boards; or, the optical backplane interconnection device Multiple single boards may include both service processing boards and cross-connect boards.
  • the optical backplane interconnection device may include a plurality of optical backplanes arranged along a second direction, and the second direction is a direction perpendicular to the optical backplanes. Arranging the optical backplanes in the optical backplane interconnection device in parallel can facilitate the interconnection between the optical backplanes and the single board.
  • each optical backplane can be connected to any single board, so that optical signals can be transmitted between any two single boards through the optical backplane.
  • the optical backplane interconnection device by arranging multiple optical backplanes in the optical backplane interconnection device, redundancy protection can be achieved.
  • at least one optical backplane can be used as a working backplane, and the remaining optical backplanes can be used as redundant backplanes.
  • the redundant backplane can be in the standby state.
  • the working backplane fails, it can control the redundant backplane to switch from the standby state to the working state to replace the function of the redundant backplane to ensure The board interconnect is functioning normally.
  • the optical backplane can be replaced on the live network without interrupting services.
  • each optical backplane is provided with a first optical connector on a side close to the single board, and a surface of each single board is provided with a second optical connector.
  • Each optical backplane is connected to any single board through the first optical connector and the second optical connector to realize optical signal connection.
  • the first optical connector (or the second optical connector) can be: various types of optical connections such as MT optical fiber connector, multi-core multi-channel pluggable (MPO) optical fiber connector or LC optical fiber connector device.
  • the first optical connector can be fixed on the side of the optical backplane close to the side of the board; or, the first optical connector can also be arranged on the surface of the optical backplane near the edge of the board, which can be determined according to the actual situation.
  • the position of the first optical connector needs to be set, which is not limited here.
  • the optical backplane and the single board can be connected through two first optical connectors and two second optical connectors; or, the optical backplane and the single board can also be connected through a first optical connector and a second optical connector , during specific implementation, the number of first optical connectors and second optical connectors between the optical backplane and the single board can be set according to actual needs, which is not limited here.
  • the foregoing single board is a service processing board
  • the optical backplane interconnection device may further include: at least one cross-connection board.
  • Each cross board is located on a side of any single board facing the optical backplane, and each cross board is orthogonal to any single board, and each cross board is pluggably connected to any single board. That is to say, the cross-connection board and the optical backplane are located on the same side of the single board, and the cross-connection board and the optical backplane are arranged in parallel.
  • the optical backplane interconnection device can also process electrical services while processing optical services.
  • Unified architecture the single board can be connected with the cross board and the optical backplane on the same side, which is convenient for setting the positions of various connectors on the single board, and can also easily replace the optical backplane or the cross board.
  • the cross-connect board can receive the electrical-layer services transmitted by the single board, and perform cross-connect scheduling for the received electrical-layer services.
  • the optical backplane interconnection device can simultaneously have the function of processing optical services and electrical services.
  • the number of cross boards may be one or more, and the number of cross boards may be set according to actual needs, which is not limited here.
  • the optical backplane interconnection device may include multiple cross boards, and the multiple cross boards in the optical backplane interconnection device are distributed on both sides of the at least one optical backplane. That is, the optical backplane is located in the middle.
  • the number of cross boards in the optical backplane interconnection device can be an even number, and each cross board can be symmetrically distributed on both sides of all the optical backplanes in the optical backplane interconnection device.
  • the multiple cross boards in the optical backplane interconnection device may also be distributed on the same side of the at least one optical backplane.
  • each cross board is provided with a first electrical connector on the side close to the single board, and the surface of each single board is provided with a second electrical connector, and each cross board is connected to any single board through
  • the first electrical connector and the second electrical connector implement electrical signal connection.
  • a reed can be provided on the first electrical connector, and a contact matching the reed can be provided on the second electrical connector; or, A contact is arranged on one electrical connector, and a reed matched with the contact is arranged on the second electrical connector.
  • the connection between the first electrical connector and the second electrical connector may also be implemented in other ways, which is not limited here.
  • the first electrical connector can be fixed on the surface of the cross board close to the edge of the single board; or, the first electrical connector can also be arranged on the side of the cross board close to the single board, and the second electrical connector can be set according to actual needs.
  • the position of an electrical connector is not limited here.
  • the optical backplane can integrate an electrical signal transmission module, and each optical backplane is provided with a first optical connector and a third electrical connector on the side close to the single board, and the surface of each single board A second optical connector and a second electrical connector are provided.
  • the optical backplane is connected to the single board through the first optical connector and the second optical connector for optical signals, and the optical backplane is connected to the single board through the third electrical connector and the second electrical connector to realize the electrical signal connection.
  • the optical backplane by integrating the electrical signal transmission module into the optical backplane, and respectively setting optical connectors and electrical connectors on the optical backplane and the service transmission board, the optical backplane can be integrated to transmit optical signals and electrical signals.
  • the cross board in the optical backplane interconnection device can be omitted, and the space occupied by the optical backplane interconnection device can be reduced.
  • the cross board is omitted, fewer components are arranged on the side of the single board, and the air volume can be increased, which is beneficial to improving the heat dissipation effect of each component in the communication device.
  • the second optical connector and the second electrical connector are respectively located on different surfaces of the single board.
  • the space on the upper surface and the lower surface of the single board can be fully utilized, and the positions of the corresponding first optical connector and the third electrical connector on the optical backplane are also easier to set, which facilitates the realization of the connection between the optical backplane and the single board. Pluggable connections.
  • the second optical connector and the second electrical connector can also be arranged on the same surface of the single board, that is, both are arranged on the upper surface or the lower surface of the single board.
  • the optical backplane interconnection device may include multiple boards, forming at least one board group.
  • Each veneer group includes two veneers, namely a first veneer and a second veneer.
  • the first board and the second board are arranged side by side in the first direction, the first board is connected to the optical backplane near the second board, and the second board is connected to the optical backplane near the first board.
  • the position of the board is connected to the optical backplane, and the first direction is a direction perpendicular to the single board.
  • the first single board is provided with a second optical connector at a position close to the second single board
  • the second single board is provided with a second optical connector at a position close to the first single board.
  • the optical backplane is provided with two first optical connectors at positions corresponding to each board group, one of the first optical connectors is connected to the second optical connector of the first board, and the other first optical connector is connected to the second optical connector of the first board.
  • the second optical connector of the second single board is connected.
  • the optical backplane interconnection device in the embodiment of the present application can be applied to communication equipment.
  • a fan can be installed in the communication equipment to reduce the temperature of each component in the communication equipment.
  • the first optical connectors on the optical backplane can also be concentrated, the width of the optical backplane in the first direction can be narrowed, and the space occupied by the optical backplane can be reduced. Therefore, the light backplane will not block the air duct, so that the air volume can be increased, so that the heat dissipation effect of the components in the communication device is better.
  • the structure of the first board and the second board may be the same, for example, the lines or modules in the first board and the second board may be set in the same position, the first The arrangement positions of the second optical connectors on the surface of the single board and the second single board can be the same, so that the accessories of the first single board and the second single board can be shared, and the processing cost of the accessories can be reduced.
  • the first board can be inserted forward and the second board can be inserted backwards.
  • the forward insertion of the first board can be understood as the first board being on the upper surface.
  • the second optical connector connected to the optical backplane is provided, and the reverse insertion of the second single board can be understood as the second optical connector connected to the optical backplane is provided on the lower surface of the second single board.
  • the single board is a service processing board
  • the optical backplane interconnection device may further include: at least two cross-connect boards, which are divided into a first cross-connect board group and a second cross-connect board group.
  • the first cross plate set includes at least one cross plate
  • the second cross plate set includes at least one cross plate.
  • Each cross board is located on the side of the single board facing the optical backplane, and each cross board is orthogonal to any single board.
  • the first cross board group and the second cross board group are respectively located on two sides of the optical backplane.
  • the first single board is pluggably connected to the cross boards in the first cross board group
  • the second single board is pluggably connected to the cross boards in the second cross board group.
  • each cross board and the optical back board in the optical back board interconnection device are located on the same side of the single board, and each cross board and the optical back board are arranged in parallel, so that the single board can be connected to each cross board and the optical back board on the same side. board connection, it is convenient to set the positions of various connectors on the single board, and it is also easy to replace the optical backplane or cross board.
  • the cross-connect board can receive the electrical-layer services transmitted by the single board, and perform cross-connect scheduling for the received electrical-layer services.
  • the optical backplane interconnection device can simultaneously have the function of processing optical services and electrical services.
  • the optical backplane interconnection device may further include: an electrical backplane located between the single board and the optical backplane, and each cross board is located on a side of the electrical backplane away from the single board.
  • the electrical backplane is pluggably connected to the first single board and the second single board in each single board group.
  • the electrical backplane is pluggably connected to each cross-connect board in the first cross-connect board group, and the electrical backplane is pluggably connected to each cross-connect board in the second cross-connect board group.
  • the surface on one side of the electric backboard is connected to the first single board and the second single board, and the surface on the other side of the electric backboard is connected to the first cross board group and the second cross board
  • Each cross board in the group is connected, so that each cross board in the first cross board group can be electrically connected with each cross board in the second cross board group, so that the first cross board group and the second cross board Electrical signal transmission can be realized between any two cross-connect boards in the group.
  • a plurality of openings corresponding to the positions of the first optical connectors in the optical backplane may be provided on the electrical backplane, and the first optical connectors pass through the openings at the corresponding positions to communicate with the second optical connectors. connector connection.
  • each first optical connector in the optical backplane can be connected to the second optical connector after passing through the openings, so that the electrical backplane can be arranged between the optical backplane and the optical backplane.
  • the position between the single boards can make reasonable use of the space in the optical backplane interconnection device, and the electric backplane does not affect the position of the optical backplane, ensuring the pluggable connection between the optical backplane and the single boards.
  • each cross board is provided with a first electrical connector on a side close to the single board, and a surface of each single board is provided with a second electrical connector.
  • the electrical backplane is provided with a fourth electrical connector on a side close to the cross board, and the electrical backplane is provided with a fifth electrical connector on a side close to the single board.
  • the electrical backplane is connected to the cross-connect board through the first electrical connector and the fourth electrical connector, and the electrical backplane is connected to the single board through the second electrical connector and the fifth electrical connector.
  • a reed can be provided on the first electrical connector, and a contact matching the reed can be provided on the fourth electrical connector; or, in Contacts are provided on the first electrical connector, and reeds matching the contacts are provided on the fourth electrical connector.
  • the first electrical connector and the fourth electrical connector can be connected through the reed and the contact.
  • the connection between the first electrical connector and the fourth electrical connector may also be implemented in other ways, which is not limited here.
  • a reed can be provided on the second electrical connector, and a contact matching the reed can be provided on the fifth electrical connector; or, in Contacts are provided on the second electrical connector, and reeds matching the contacts are provided on the fifth electrical connector.
  • the second electrical connector and the fifth electrical connector can be connected through the reed and the contact.
  • the connection between the second electrical connector and the fifth electrical connector may also be implemented in other ways, which is not limited here.
  • the optical backplane interconnection device may further include: a subrack. Groove rails are arranged in the subrack, and slide rails matching the groove rails are arranged on the optical backplane.
  • the optical backplane can be easily inserted into the subrack to realize the connection with the single board, and the optical backplane can also be easily pulled out from the subrack.
  • a pull ring can be provided on the side of the optical backplane, and a wrench or other components can also be used instead of the pull ring during specific implementation.
  • the optical backplane interconnection device may further include: at least one fixing member.
  • the fixing piece is used to detachably fix the optical backplane on the subrack.
  • a through hole may be provided in the optical backplane, and the fixing member may pass through the optical backplane and be fixed to the subrack, so as to fix the optical backplane on the subrack and prevent the optical backplane from falling off during processing or transportation.
  • the fixing parts can be removed, so that the optical backplane can be pulled out smoothly, ensuring smooth replacement of the optical backplane.
  • the fixing member can be a captive or a screw rod and the like.
  • the embodiment of the present application further provides a communication device, and the communication device may include: any one of the optical backplane interconnection devices described above, and a housing.
  • the communication device may be an optical communication device, a router, a switch, a server, and the like. Since the optical backplane and the single board in the above-mentioned optical backplane interconnection device are pluggably connected, when the optical backplane fails, the optical backplane can be replaced separately without replacing the entire cabinet.
  • the optical backplane interconnection device has a relatively flexible structure and high reliability. Therefore, the structure of the communication equipment including the optical backplane interconnection device is relatively flexible and the reliability is high.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of an optical backplane interconnection device provided in an embodiment of the present application
  • Fig. 2 is the top view of the three-dimensional structural schematic diagram shown in Fig. 1;
  • FIG. 3 is a schematic diagram of another three-dimensional structure of the optical backplane interconnection device provided by the embodiment of the present application.
  • Fig. 4 is the top view of the three-dimensional structural schematic diagram shown in Fig. 3;
  • FIG. 5 is a schematic diagram of another three-dimensional structure of the optical backplane interconnection device provided by the embodiment of the present application.
  • Fig. 6 is a top view of the three-dimensional structural schematic diagram shown in Fig. 5;
  • FIG. 7 is a schematic diagram of another three-dimensional structure of the optical backplane interconnection device provided by the embodiment of the present application.
  • Fig. 8 is a top view of the three-dimensional structural schematic diagram shown in Fig. 7;
  • FIG. 9 is another schematic structural view of the optical backplane interconnection device provided by the embodiment of the present application.
  • Fig. 10 is a top view of the schematic three-dimensional structure shown in Fig. 9;
  • Fig. 11 is another schematic structural view of the optical backplane interconnection device provided by the embodiment of the present application.
  • Fig. 12 is a top view of the schematic three-dimensional structure shown in Fig. 11;
  • Fig. 13 is a schematic top view structural diagram of the optical backplane interconnection device in the embodiment of the present application.
  • Fig. 14 is a schematic plan view of the electric backplane in the embodiment of the present application.
  • FIG. 15 is a schematic diagram of a three-dimensional structure of an optical backplane in an embodiment of the present application.
  • Embodiments of the present application provide an optical backplane interconnection device and communication equipment.
  • the optical backplane interconnection device can be applied to various types of communication equipment, for example, the communication equipment can be optical communication equipment, routers, switches, servers, etc.
  • the optical backplane interconnection device can also be applied to other types of In the communication device, there is no limitation here.
  • FIG. 1 is a schematic three-dimensional structure diagram of an optical backplane interconnection device provided by an embodiment of the present application
  • FIG. 2 is a top view of the three-dimensional structural schematic diagram shown in FIG. 1
  • the optical backplane interconnection device provided in the embodiment of the present application may include: at least one optical backplane 11 and at least one single board 12 .
  • the optical backplane interconnection device includes an optical backplane 11 and three single boards 12 as an example for illustration. In actual implementation, the number of optical backplanes 11 and single boards 12 can be set according to needs, which is not limited here. .
  • Each optical backplane 11 is orthogonal to any single board 12, and one side of each optical backplane 11 is opposite to one side of any single board 12, and each single board 12 is located on the same side of any optical backplane 11 .
  • Each optical backplane 11 is pluggably connected to any single board 12 .
  • each optical backplane is arranged to be orthogonal to any single board, and one side of each optical backplane is arranged opposite to one side of any single board,
  • Each board is located on the same side of any optical backplane, that is to say, the optical backplane is only connected to any single board on one side, so that the position of the optical backplane is not restricted by other components, so that the optical backplane and the single board can be connected to each other.
  • Pluggable connections are realized between the optical backplanes. When the optical backplane fails, the optical backplane can be replaced separately without replacing the entire cabinet.
  • each optical backplane is configured to be pluggably connected to any single board, so that the optical backplane can be replaced more flexibly and easily.
  • each single board 12 in the optical backplane interconnection device is parallel to
  • the optical backplane 11 can be arranged parallel to the yz plane, so that the optical backplane 11 and the single board 12 are orthogonal to each other.
  • each single board 12 is located on the same side of the optical backplane 11, one side of the optical backplane 11 faces each single board 12, so that the position of the optical backplane 11 is not restricted by other components.
  • the optical backplane 11 can be installed in the direction of arrow S1 in the figure, and when the optical backplane 11 needs to be replaced, the optical backplane 11 can be removed in the direction of S2 in the figure.
  • each single board 12 is located on the left side of the optical backplane 11, and the single board 12 is placed horizontally, and the optical backplane 11 is vertically placed as an example. The position of 12 is not limited here.
  • the single board 12 in the embodiment of the present application may be any single board capable of transmitting optical signals, for example, the single board may be a service processing board or a cross-connect board.
  • the above-mentioned single board 12 may be a line card (Line Card, LC) for accessing services and processing services.
  • the optical backplane interconnection device may include a plurality of single boards 12 arranged along a first direction (for example, the direction shown by arrow z in the figure), and the first The direction is the direction perpendicular to the veneer 12 .
  • Arranging the single boards 12 in the optical backplane interconnection device in parallel can facilitate the interconnection of the single boards 12 with the optical backplane 11 .
  • the optical backplane 11 may be connected to at least two single boards 12 , so that optical signal transmission is performed through the optical backplane 11 , and optical signal transmission between at least two single boards 12 can be realized.
  • the multiple single boards 12 in the optical backplane interconnection device may all be service processing boards; or, the multiple single boards 12 in the optical backplane interconnection device may all be cross boards; or, the optical backplane interconnection device
  • the multiple single boards 12 in the system may include both service processing boards and cross-connect boards.
  • FIG. 3 is another perspective structural diagram of the optical backplane interconnection device provided by the embodiment of the present application
  • FIG. 4 is a top view of the stereoscopic structural diagram shown in FIG. 3 .
  • the optical backplane interconnection device may include a plurality of optical backplanes 11 arranged along a second direction (such as the direction shown by arrow x in the figure), and the second direction is the direction perpendicular to the optical backplane 11 .
  • Arranging the optical backplanes 11 in the optical backplane interconnection device in parallel can facilitate the interconnection between the optical backplanes 11 and the single board 12 .
  • each optical backplane 11 can be connected to any single board 12 , so that optical signals can be transmitted between any two single boards 12 through the optical backplane 11 .
  • the optical backplane interconnection device redundancy protection can be achieved, specifically, at least one optical backplane 11 can be used as a working backplane, and the remaining optical backplanes 11 can be used as redundant backplanes .
  • the redundant backplane can be in the standby state.
  • the working backplane fails, it can control the redundant backplane to switch from the standby state to the working state to replace the function of the redundant backplane to ensure The board interconnect is functioning normally.
  • the optical backplane can be replaced on the live network without interrupting services.
  • each optical backplane 11 is provided with a first optical connector 13 on the side close to the board 12, and a second optical connector is provided on the surface of each board 12. 14.
  • Each optical backplane 11 is connected to any single board 12 through a first optical connector 13 and a second optical connector 14 to realize an optical signal connection.
  • the first optical connector (or the second optical connector) can be: various types of optical connections such as MT optical fiber connector, multi-core multi-channel pluggable (MPO) optical fiber connector or LC optical fiber connector device.
  • the first optical connector 13 is fixed on the side of the optical backplane 11 close to the board 12 as an example for illustration.
  • the first optical connector 13 can also be arranged on the surface of the optical backplane 11 near the edge of the single board 12, and the position of the first optical connector 13 can be set according to actual needs, which is not done here limited.
  • the connection between the optical backplane 11 and the single board 12 through two first optical connectors 13 and two second optical connectors 14 is used as an example for illustration.
  • FIG. 3 and FIG. The connection between the optical backplane 11 and the single board 12 through a first optical connector 13 and a second optical connector 14 is illustrated as an example.
  • the numbers of the first optical connectors 13 and the second optical connectors 14 are not limited here.
  • FIG. 5 is another perspective structural diagram of the optical backplane interconnection device provided by the embodiment of the present application
  • FIG. 6 is a top view of the stereoscopic structural diagram shown in FIG. 5
  • the above board is a service processing board
  • the optical backplane interconnection device in this embodiment of the present application may further include: at least one cross board 15 .
  • Each cross board 15 is located on a side of any single board 12 facing the optical backplane 11 , and each cross board 15 is orthogonal to any single board 12 .
  • Each cross board 15 is pluggably connected to any single board 12 .
  • the cross board 15 and the optical backplane 11 are located on the same side of the single board 12, and the cross board 15 and the optical backplane 11 are arranged in parallel.
  • the optical backplane interconnection device can handle both optical services and Electric business, realizing the integrated structure of photoelectricity.
  • the single board 12 can be connected with the cross board 15 and the optical backplane 11 on the same side, which is convenient for setting the positions of various connectors on the single board 12 and can also easily replace the optical backplane 11 or the cross board 15 .
  • the cross-connect board 15 can receive the electrical layer services transmitted by the single board 12, and perform cross-connect scheduling on the received electrical layer services.
  • the optical backplane interconnection device can have the function of processing optical services and electrical services at the same time.
  • the number of cross boards 15 may be one or more, and the number of cross boards 15 may be set according to actual needs, which is not limited here.
  • the optical backplane interconnection device may include a plurality of cross boards 15, and each cross board 15 is distributed on both sides of all optical backplanes 11 in the optical backplane interconnection device, That is, the optical backplane 11 is located in the middle position.
  • the number of cross boards 15 in the optical backplane interconnection device may be an even number, and each cross board 15 may be symmetrically distributed on both sides of all optical backplanes 11 in the optical backplane interconnection device.
  • FIG. 7 is another perspective structural diagram of the optical backplane interconnection device provided by the embodiment of the present application
  • FIG. 8 is a top view of the stereoscopic structural diagram shown in FIG. 7
  • an optical backplane 11 is provided in the optical backplane interconnection device as an example for illustration, and the cross boards 15 in the optical backplane interconnection device are distributed on both sides of the optical backplane 11 .
  • multiple optical backplanes 11 can also be installed in the optical backplane interconnection device.
  • two optical backplanes 11 are set in the optical backplane interconnection device as an example. Set the number of optical backplanes 11.
  • the cross boards 15 in the optical backplane interconnection device may be distributed on both sides of all the optical backplanes 11 .
  • the multiple cross boards in the optical backplane interconnection device may also be distributed on the same side of the at least one optical backplane, which is not limited here.
  • each cross board 15 is provided with a first electrical connector 16 on the side close to the single board 12, and the surface of each single board 12 is provided with a second electrical connector 17.
  • Each cross board 15 is connected to any single board 12 through a first electrical connector 16 and a second electrical connector 17 to realize electrical signal connection.
  • a reed can be provided on the first electrical connector 16, and a contact matching the reed can be provided on the second electrical connector 17;
  • a contact is provided on the first electrical connector 16
  • a reed matching the contact is provided on the second electrical connector 17 .
  • the first electrical connector 16 and the second electrical connector 17 can be connected through the contact and the reed.
  • the connection between the first electrical connector 16 and the second electrical connector 17 can also be implemented in other ways, which is not limited here.
  • the first electrical connector 16 is fixed on the surface of the cross board 15 close to the edge of the single board 12 for illustration.
  • the position of the first electrical connector 16 can be set according to actual needs, which is not limited here.
  • FIG. 9 is another perspective structural diagram of the optical backplane interconnection device provided by the embodiment of the present application
  • FIG. 10 is a top view of the stereoscopic structural diagram shown in FIG. 9
  • the optical backplane 11 can integrate an electrical signal transmission module (not shown in the figure), and each optical backplane 11 is provided on a side close to the single board 12
  • a second optical connector 14 and a second electrical connector 17 are provided on the surface of each single board 12 .
  • the optical backplane 11 and the single board 12 realize the optical signal connection through the first optical connector 13 and the second optical connector 14, and the optical backplane 11 and the single board 12 realize the electrical signal through the third electrical connector 18 and the second electrical connector 17 connect.
  • the optical backplane 11 can be integrated to transmit optical signals. And the function of the electrical signal, so that the cross board in the optical backplane interconnection device can be omitted, and the space occupied by the optical backplane interconnection device can be reduced. Moreover, since the cross board is omitted, fewer components are arranged on the side of the single board 12, and the air volume can be increased, which is beneficial to improving the heat dissipation effect of each component in the communication device.
  • the second optical connector 14 and the second electrical connector 17 are respectively located on different surfaces of the single board 12 .
  • the space on the upper surface and the lower surface of the single board 12 can be fully utilized, and the positions of the corresponding first optical connector 13 and the third electrical connector 18 on the optical backplane 11 are also easier to set, so as to facilitate the realization of optical backplane 11 and A pluggable connection between boards 12 .
  • the second optical connector 14 and the second electrical connector 17 can also be arranged on the same surface of the single board 12, that is, both are arranged on the top of the single board 12. surface or subsurface.
  • FIG. 11 is another schematic perspective view of the optical backplane interconnection device provided by the embodiment of the present application
  • FIG. 12 is a top view of the perspective schematic diagram shown in FIG. 11
  • the optical backplane interconnection device may include multiple boards, forming at least one board group 12M.
  • each veneer group 12M includes two veneers, respectively a first veneer 12a and a second veneer 12b.
  • each veneer group 12M the first veneer 12a and the second veneer 12b are arranged side by side in the first direction (the direction shown by the arrow x in the figure), and the first veneer 12a is close to the second veneer 12b is connected to the optical backplane 11, and the second single board 12b is connected to the optical backplane 11 at a position close to the first single board 12a.
  • the first direction is a direction perpendicular to the single board.
  • the first veneer 12a and the second veneer 12b are arranged side by side in the first direction, and the first veneer 12a and the second veneer
  • the single boards 12b are all connected to the optical backplane 11 near the middle, so that the number of single boards connected to the optical backplane 11 can be increased, and the number of slots of the optical backplane 11 can be increased.
  • each veneer group 12M the first veneer 12a is provided with a second optical connector 14 at a position close to the second veneer 12b, and the second veneer 12b is provided with a second optical connector 14 at a position close to the first veneer 12a.
  • Two optical connectors 14 The optical backplane 11 is provided with two first optical connectors 13 at positions corresponding to each board group 12M, one of the first optical connectors 13 is connected to the second optical connector 14 of the first board 12a, and the other The first optical connector 13 is connected 14 with the second optical connector of the second board 12b.
  • the optical backplane interconnection device in the embodiment of this application can be applied to communication equipment.
  • a fan F can be installed in the communication equipment to reduce the temperature of each component in the communication equipment.
  • the wind direction formed by the fan F can be indicated by the arrow f in the figure.
  • the first optical connectors 13 on the optical backplane 11 can also be relatively concentrated, and the optical backplane 11 can be aligned in the first direction.
  • the width is narrower, reducing the space occupied by the optical backplane 11. Therefore, the optical backplane 11 will not block the air duct, so that the air volume can be increased, and the heat dissipation effect of the components in the communication device is better.
  • the structure of the first veneer 12a and the second veneer 12b may be the same, for example, the first veneer 12a and the second veneer 12b in the line or module setting position can be the same, the setting position of the second optical connector 14 on the surface of the first veneer 12a and the second veneer 12b can be the same, like this, the first veneer 12a and the second veneer 12b Accessories can be shared, which can reduce the processing cost of accessories.
  • the first board 12a When connecting the boards in each board group 12M to the optical backplane 11, the first board 12a can be inserted forwardly, and the second board 12b can be inserted backwardly, wherein the forward insertion of the first board 12a can be understood as the first
  • the upper surface of the single board 12a is provided with the second optical connector 14 connected to the optical backplane 11
  • the reverse insertion of the second single board 12b can be understood as the second single board 12b is provided with the second optical connector 14 connected with the optical backplane 11 on the lower surface .
  • Fig. 13 is a top-view structural diagram of the optical backplane interconnection device in the embodiment of the present application.
  • the above-mentioned single board is a service processing board
  • the optical backplane interconnection device in the embodiment of the present application may also include:
  • the at least two cross plates are divided into a first cross plate group 15M and a second cross plate group 15N, wherein the first cross plate group 15M includes at least one cross plate 15 , and the second cross plate group 15N includes at least one cross plate 15 .
  • Each cross board 15 is located on a side of the single board facing the optical backplane 11 , and each cross board 15 is orthogonal to any single board.
  • the first intersecting plate group 15M and the second intersecting plate group 15N are respectively located on two sides of the optical backplane 11.
  • the first single board 12a is pluggably connected to the cross board 15 in the first cross board group 15M
  • the second single board 12b is pluggably connected to the cross board 15 in the second cross board group 15N. Unplug the connection.
  • each cross board 15 in the optical backplane interconnection device is located on the same side of the single board as the optical back board 11, and each cross board 15 is arranged in parallel with the optical back board 11, so that the single board can be on the same side as each
  • the cross board 15 is connected to the optical backplane 11, which is convenient for setting the positions of various connectors on the single board, and also makes it easier to replace the optical backplane 11 or the cross board 15.
  • the cross-connect board 15 can receive the service transmitted by the single board 12, and perform cross-connect scheduling on the received service.
  • the optical backplane interconnection device can have the function of processing optical services and electrical services at the same time.
  • the optical backplane interconnection device may further include: an electrical backplane 19 located between the single board and the optical backplane 11, and each cross board 15 is located on the electrical backplane 19 away from the single board. side.
  • the electric backplane 19 is pluggably connected to the first single board 12a and the second single board 12b in each single board group 12M, and the electric backplane 19 is pluggably connected to each cross board 15 in the first cross board group 15M , the electrical backplane 19 is pluggably connected to each cross board 15 in the second cross board group 15N.
  • the surface on one side of the electric backplane 19 is connected to the first veneer 12a and the second veneer 12b, and the surface on the other side of the electric backplane 19 is connected to the first cross board group 15M is connected to each cross board 15 in the second cross board group 15N, so that each cross board 15 in the first cross board group 15M can be electrically connected to each cross board 15 in the second cross board group 15N, In this way, electrical signal transmission can be realized between any two cross boards 15 in the first cross board group 15M and the second cross board group 15N.
  • Fig. 14 is a schematic plan view of the planar structure of the electric backplane in the embodiment of the present application.
  • the electric backplane 19 is provided with a plurality of The opening U
  • the first optical connector 13 is connected to the second optical connector 14 through the opening U at a corresponding position.
  • the first optical connectors 13 in the optical backplane 11 can pass through the openings U and then be connected to the second optical connectors 14.
  • the board 19 is arranged at the position between the optical backplane 11 and the single board, so that the space in the optical backplane interconnection device can be reasonably utilized, and the electric backplane 19 does not affect the position of the optical backplane 11, ensuring that the optical backplane 11 can be connected to the single board. pluggable connections.
  • each cross board 15 is provided with a first electrical connector 16 on a side close to the single board, and a second electrical connector 17 is provided on the surface of each single board,
  • the electrical backplane 19 is provided with a fourth electrical connector 20 on the side close to the cross board 15, and the electrical backplane 19 is provided with a fifth electrical connector 21 on the side close to the single board.
  • the electrical backplane 19 and the cross board 15 pass through The first electrical connector 16 and the fourth electrical connector 20 implement electrical signal connection, and the electrical backplane 19 and the single board implement electrical signal connection through the second electrical connector 17 and the fifth electrical connector 21 .
  • a reed can be provided on the first electrical connector 16, and a contact matching the reed can be provided on the fourth electrical connector 20. or, a contact is provided on the first electrical connector 16, and a reed matching the contact is provided on the fourth electrical connector 20. In this way, the first electrical connector 16 and the fourth electrical connector 20 can be connected through the reed and the contact.
  • the connection between the first electrical connector 16 and the fourth electrical connector 20 can also be implemented in other ways, which is not limited here.
  • a reed can be provided on the second electrical connector 17, and a contact matching the reed can be provided on the fifth electrical connector 21;
  • a contact is provided on the second electrical connector 17
  • a reed matching the contact is provided on the fifth electrical connector 21 .
  • the second electrical connector 17 and the fifth electrical connector 21 can be connected through the reed and the contact.
  • the connection between the second electrical connector 17 and the fifth electrical connector 21 can also be implemented in other ways, which is not limited here.
  • Fig. 15 is a schematic diagram of the three-dimensional structure of the optical backplane in the embodiment of the present application.
  • the optical backplane interconnection device in the embodiment of the present application may further include: a subrack (not shown in the figure), in which There are grooved rails, and the optical backplane 11 is provided with slide rails 22 matching the grooved rails.
  • a pull ring 24 may be provided on the side of the optical backplane 11 , and a wrench or other components may also be used instead of the pull ring 24 during actual implementation.
  • the optical backplane interconnection device may further include: at least one fixing piece 23, the fixing piece 23 is used to detachably fix the optical backplane 11 on the subrack, and optionally, a through hole may be provided in the optical backplane 11 to fix
  • the component 23 can pass through the optical backplane 11 and be fixed to the subrack, so as to fix the optical backplane 11 on the subrack and prevent the optical backplane 11 from falling off during processing or transportation.
  • the fixing member 23 can be removed, so that the optical backplane 11 can be pulled out smoothly, ensuring that the optical backplane 11 can be replaced smoothly.
  • the fixing member 23 can be a captive or a screw rod or the like.
  • an embodiment of the present application further provides a communication device, which may include any of the above optical backplane interconnection devices, and a housing.
  • the communication device may be an optical communication device, a router, a switch, a server, and the like. Since the optical backplane and the single board in the above-mentioned optical backplane interconnection device are pluggably connected, when the optical backplane fails, the optical backplane can be replaced separately without replacing the entire cabinet.
  • the optical backplane interconnection device has a relatively flexible structure and high reliability. Therefore, the structure of the communication equipment including the optical backplane interconnection device is relatively flexible and the reliability is high.

Abstract

本申请提供一种光背板互连装置及通信设备,光背板互连装置可以包括:至少一个光背板和至少一个单板。每一个光背板与任一单板相互正交,且每一个光背板的一个侧面与任一单板的一个侧面相对设置,各单板均位于任一光背板的同一侧。每一个光背板与任一单板可插拔连接。本申请实施例中,光背板仅以一个侧面与任一单板连接,使得光背板的位置不受其他部件的限制,从而可以使光背板与单板之间实现可插拔连接,在光背板出现故障时,可以对光背板进行单独更换,无需更换整个机柜。并且,将每一个光背板设置为与任一单板可插拔连接,可以更灵活、更容易地更换光背板。

Description

一种光背板互连装置及通信设备
相关申请的交叉引用
本申请要求在2021年11月26日提交中国专利局、申请号为202111420485.6、申请名称为“一种光背板互连装置及通信设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及信息通信技术领域,尤其涉及一种光背板互连装置及通信设备。
背景技术
背板是通信设备中的重要组成部分,背板一般安装在机柜的背面或中间位置,可以为单板或模块等提供信号连接和物理支撑。背板对通信设备的系统容量、散热风道、维护性能等方面起重要作用。背板可以分为电背板和光背板。
其中,电背板一般由印刷电路板、连接器和导销等部件组成。考虑电背板的组成部件的高可靠性、低失效率及承载的业务量较少等方面的原因,一般电背板直接固定在子架上,即电背板可以采用不可更换的方案。
光背板一般由光纤、光连接器、支撑结构件和导销构成,光背板的组成部件的可靠性和失效率与电背板相当。但是,由于光背板承载的业务量较多,且光纤端面对灰尘敏感等原因,在传输功率较高的情况下,光背板采用不可更换的方案,已经难以满足信号传输需求。然而,在相关技术中,由于其他部件对光背板的位置限制,需要将光背板固定在子架上,导致光背板无法更换。若出现光背板中某个通道损坏的情况,会影响业务传输效果,甚至会导致更换整个机柜。
发明内容
本申请实施例提供了一种光背板互连装置及通信设备,用以解决相关技术中光背板无法更换的问题。
第一方面,本申请实施例提供了一种光背板互连装置,该光背板互连装置可以包括:至少一个光背板和至少一个单板。每一个光背板与任一单板相互正交,且每一个光背板的一个侧面与任一单板的一个侧面相对设置,各单板均位于任一光背板的同一侧。每一个光背板与任一单板可插拔连接。
本申请实施例提供的光背板互连装置中,通过将每一个光背板设置为与任一单板相互正交,并且,每一个光背板的一个侧面与任一单板的一个侧面相对设置,各单板均位于任一光背板的同一侧,也就是说,光背板仅以一个侧面与任一单板连接,使得光背板的位置不受其他部件的限制,从而可以使光背板与单板之间实现可插拔连接,在光背板出现故障时,可以对光背板进行单独更换,无需更换整个机柜。并且,将每一个光背板设置为与任一单板可插拔连接,可以更灵活、更容易地更换光背板。
本申请实施例中的单板可以为任何能够传输光信号的单板,例如,该单板可以为业务 处理板或交叉板。例如,业务处理板可以为接入业务和处理业务的线卡(Line Card,LC)。
在本申请的一些实施例中,光背板互连装置可以包括沿第一方向排列的多个单板,第一方向为垂直于单板的方向。将光背板互连装置中的各单板平行设置,可以便于将各单板与光背板进行互连。可选地,光背板可以与至少两个单板连接,这样,通过光背板进行光信号传输,可以实现至少两个单板之间的光信号传输。可选地,光背板互连装置中的多个单板可以均为业务处理板;或者,光背板互连装置中的多个单板可以均为交叉板;或者,光背板互连装置中的多个单板可以既包括业务处理板也包括交叉板。
在本申请的另一些实施例中,光背板互连装置可以包括沿第二方向排列的多个光背板,第二方向为垂直于光背板的方向。将光背板互连装置中的各光背板平行设置,可以便于将各光背板与单板进行互连。可选地,每一个光背板可以与任一单板连接,这样,任意两个单板之间可以通过光背板进行光信号传输。
此外,通过在光背板互连装置中设置多个光背板,可以起到冗余保护作用,具体地,可以将至少一个光背板作为工作背板,其余的光背板作为冗余背板。当工作背板正常工作时,冗余背板可以处于待机状态,当工作背板出现故障时,可以控制冗余背板从待机状态切换为工作状态,以替代冗余背板的功能,保证光背板互连装置能够正常运行。并且,通过设置冗余背板,当工作背板出现故障时,可以在不断开业务的情况下,实现光背板的现网更换。
在具体实施时,每一个光背板在靠近单板的一侧设有第一光连接器,每一个单板的表面设有第二光连接器。每一个光背板与任一单板通过第一光连接器和第二光连接器实现光信号连接。可选地,第一光连接器(或第二光连接器)可以为:MT光纤连接器、多芯多通道插拔(MPO)光纤连接器或LC型光纤连接器等各种类型的光连接器。
在本申请实施例中,第一光连接器可以固定于光背板靠近单板一侧的侧面;或者,第一光连接器也可以设置在光背板的表面靠近单板的边缘处,可以根据实际需要设置第一光连接器的位置,此处不做限定。此外,光背板与单板可以通过两个第一光连接器和两个第二光连接器连接;或者,光背板与单板也可以通过一个第一光连接器和一个第二光连接器连接,在具体实施时,可以根据实际需要,来设置光背板与单板之间的第一光连接器和第二光连接器的数量,此处不做限定。
在一种可能的实现方式中,上述单板为业务处理板,光背板互连装置还可以包括:至少一个交叉板。每一个交叉板位于任一单板朝向光背板的一侧,且每一个交叉板与任一单板相互正交,每一个交叉板与任一单板可插拔连接。也就是说,交叉板与光背板位于单板的同一侧,并且,交叉板与光背板平行设置,这样,可以使光背板互连装置在处理光业务的同时,也能够处理电业务,实现光电合一架构。并且,可以使单板在同一侧面与交叉板和光背板连接,便于对单板上的各种连接器的位置进行设置,也可以较容易地更换光背板或交叉板。
在具体实施时,交叉板可以接收单板传输的电层业务,并对接收的电层业务进行交叉调度。本申请实施例中,通过在光背板互连装置中设置光背板和交叉板,可以使光背板互连装置同时具有处理光业务和电业务的功能。
可选地,在本申请实施例中的光背板互连装置中,交叉板的数量可以是一个或多个,可以根据实际需要对交叉板的数量进行设置,此处不做限定。
在一种可能的实现方式中,光背板互连装置可以包括多个交叉板,光背板互连装置中 的多个交叉板分布于上述至少一个光背板的两侧。即可以使光背板位于中间位置,可选地,光背板互连装置中的交叉板的数量可以为偶数,各交叉板可以对称分布于光背板互连装置中所有光背板的两侧。或者,光背板互连装置中的多个交叉板也可以分布于上述至少一个光背板的同一侧。
在具体实施时,每一个交叉板在靠近单板的一侧设有第一电连接器,每一个单板的表面设有第二电连接器,每一个交叉板与任一单板之间通过第一电连接器和第二电连接器实现电信号连接。为了便于实现交叉板与单板之间的可插拔连接,可以在第一电连接器上设置簧片,并在第二电连接器上设置与该簧片匹配的触点;或者,在第一电连接器上设置触点,并在第二电连接器上设置与该触点匹配的簧片。这样,可以使第一电连接器与第二电连接器通过触点与簧片实现连接。当然,第一电连接器与第二电连接器也可以采用其他方式实现连接,此处不做限定。
可选地,第一电连接器可以固定于交叉板的表面靠近单板的边缘处;或者,第一电连接器也可以设置在交叉板靠近单板一侧的侧面,可以根据实际需要设置第一电连接器的位置,此处不做限定。
在一种可能的实现方式中,光背板可以集成电信号传输模块,每一个光背板的在靠近单板的一侧设有第一光连接器和第三电连接器,每一个单板的表面设有第二光连接器和第二电连接器。光背板与单板通过第一光连接器和第二光连接器实现光信号连接,光背板与单板通过第三电连接器和第二电连接器实现电信号连接。本申请实施例中,通过将电信号传输模块集成到光背板中,并在光背板和业务传输板上分别设置光连接器和电连接器,可以使光背板集成了传输光信号和电信号的功能,从而可以省去光背板互连装置中的交叉板,减小光背板互连装置占用的空间。并且,由于省去了交叉板,可以使单板侧面设置的部件较少,能够增大风量,有利于提高通信设备中各部件的散热效果。
在一种可能的实现方式中,每一个单板中,第二光连接器与第二电连接器分别位于单板不同的表面。这样,可以充分利用单板的上表面和下表面的空间,也使光背板上对应的第一光连接器和第三电连接器的位置更容易设置,便于实现光背板与单板之间的可插拔连接。当然,在光背板和单板的空间允许的情况下,第二光连接器与第二电连接器也可以设置在单板的同一表面,即都设置在单板的上表面或下表面。
在一种可能的实现方式中,光背板互连装置可以包括多个单板,组成至少一个单板组。每一个单板组包括两个单板,分别为第一单板和第二单板。每一个单板组中,第一单板与第二单板在第一方向上并排设置,第一单板在靠近第二单板的位置与光背板连接,第二单板在靠近第一单板的位置与光背板连接,第一方向为垂直于单板的方向。本申请实施例中,通过将第一单板与第二单板设置为在第一方向上并排设置,并且,第一单板和第二单板均在靠近中间的位置处与光背板连接,从而,可以增加光背板连接的单板的数量,增加光背板的槽位数量。
在每一个单板组中,第一单板在靠近所第二单板的位置设置有第二光连接器,第二单板在靠近第一单板的位置设有第二光连接器。光背板在对应每一个单板组的位置处设有两个第一光连接器,其中一个第一光连接器与第一单板的第二光连接器连接,另一个第一光连接器与第二单板的第二光连接器连接。
本申请实施例中的光背板互连装置可以应用于通信设备中,一般在通信设备中可以设置风扇,以降低通信设备中各部件的温度,通过将单板组中的第二光连接器集中在中间位 置,这样,可以使光背板上的第一光连接器也比较集中,可以使光背板在第一方向上的宽度较窄,减小光背板占用的空间。因而,光背板不会遮挡风道,从而可以增大风量,使通信设备中各部件的散热效果较好。
在具体实施时,在每一个单板组中,第一单板与第二单板的结构可以相同,例如,第一单板与第二单板中的线路或模块设置位置可以相同,第一单板与第二单板表面的第二光连接器的设置位置可以相同,这样,第一单板与第二单板的配件可以共用,可以减少配件加工成本。将每一个单板组中的单板与光背板连接时,可以使第一单板正插,第二单板反插,其中,第一单板正插可以理解为第一单板在上表面设置与光背板连接的第二光连接器,第二单板反插可以理解为第二单板在下表面设置与光背板连接的第二光连接器。
在一种可能的实现方式中,上述单板为业务处理板,光背板互连装置还可以包括:至少两个交叉板,分为第一交叉板组和第二交叉板组。第一交叉板组包括至少一个交叉板,第二交叉板组包括至少一个交叉板。每一个交叉板位于单板朝向光背板的一侧,且每一个交叉板与任一单板相互正交。第一交叉板组与第二交叉板组分别位于光背板的两侧。在每一个单板组中,第一单板与第一交叉板组中的交叉板可插拔连接,第二单板与第二交叉板组中的交叉板可插拔连接。
也就是说,光背板互连装置中的各交叉板与光背板位于单板的同一侧,并且,各交叉板与光背板平行设置,这样,可以使单板在同一侧与各交叉板和光背板连接,便于对单板上的各种连接器的位置进行设置,也可以较容易地更换光背板或交叉板。在具体实施时,交叉板可以接收单板传输的电层业务,并对接收的电层业务进行交叉调度。本申请实施例中,通过在光背板互连装置中设置光背板和交叉板,可以使光背板互连装置同时具有处理光业务和电业务的功能。
本申请的一些实施例中,光背板互连装置还可以包括:位于单板与光背板之间的电背板,每一个交叉板位于电背板远离单板的一侧。电背板与每一个单板组中的第一单板和第二单板可插拔连接。电背板与第一交叉板组中的各交叉板可插拔连接,电背板与第二交叉板组中的各交叉板可插拔连接。本申请实施例中,通过设置电背板,电背板一侧的表面与第一单板和第二单板连接,电背板另一侧的表面与第一交叉板组和第二交叉板组中的各交叉板连接,从而,可以使第一交叉板组中的各交叉板,与第二交叉板组中的各交叉板实现电连接,这样,第一交叉板组与第二交叉板组中的任意两个交叉板之间都能够实现电信号传输。
在具体实施时,电背板上可以设有分别与光背板中的各第一光连接器的位置对应的多个开孔,第一光连接器穿过对应位置处的开孔与第二光连接器连接。通过在电背板上设置多个开孔,可以使光背板中的各第一光连接器穿过开孔后与第二光连接器连接,从而,可以实现将电背板设置在光背板与单板之间的位置,可以合理利用光背板互连装置中的空间,并且,电背板不影响光背板的位置,保证光背板能够与单板之间可插拔连接。
在一种可能的实现方式中,每一个交叉板在靠近单板的一侧设有第一电连接器,每一个单板的表面设有第二电连接器。电背板在靠近交叉板的一侧设有第四电连接器,电背板在靠近单板的一侧设有第五电连接器。电背板与交叉板通过第一电连接器和第四电连接器实现电信号连接,电背板与单板通过第二电连接器和第五电连接器实现电信号连接。
为了便于实现交叉板与电背板之间的可插拔连接,可以在第一电连接器上设置簧片,并在第四电连接器上设置与该簧片匹配的触点;或者,在第一电连接器上设置触点,并在 第四电连接器上设置与该触点匹配的簧片。这样,可以使第一电连接器与第四电连接器通过簧片与触点实现连接。当然,第一电连接器与第四电连接器也可以采用其他方式实现连接,此处不做限定。
为了便于实现单板与电背板之间的可插拔连接,可以在第二电连接器上设置簧片,并在第五电连接器上设置与该簧片匹配的触点;或者,在第二电连接器上设置触点,并在第五电连接器上设置与该触点匹配的簧片。这样,可以使第二电连接器与第五电连接器通过簧片与触点实现连接。当然,第二电连接器与第五电连接器也可以采用其他方式实现连接,此处不做限定。
在一种可能的实现方式中,光背板互连装置还可以包括:子架。子架中设有槽轨,光背板上设有与槽轨匹配的滑轨。这样,可以便于将光背板插入子架中实现与单板的连接,并且,也可以使光背板较容易地从子架中拔出。为了便于将光背板取出,可以在光背板的侧面设置拉环,在具体实施时,也可以采用扳手或其他部件替代拉环。
此外,光背板互连装置还可以包括:至少一个固定件。固定件用于将光背板可拆卸地固定于子架上。可选地,可以在光背板中设置通孔,固定件可以穿过光背板与子架固定,从而将光背板固定在子架上,防止在加工或运输过程中,光背板脱落。当需要更换光背板时,可以将固定件拆除,使光背板顺利拔出,保证光背板能够顺利更换。例如,该固定件可以为松不脱或螺杆等。
第二方面,本申请实施例还提供了一种通信设备,该通信设备可以包括:上述任一光背板互连装置,以及壳体。该通信设备可以为光通信设备、路由器、交换机、服务器等。由于上述光背板互连装置中的光背板与单板可插拔连接,在光背板出现故障时,可以对光背板进行单独更换,无需更换整个机柜。光背板互连装置的结构比较灵活、可靠性较高。因而,包括该光背板互连装置的通信设备的结构也比较灵活、可靠性较高。
附图说明
图1为本申请实施例提供的光背板互连装置的立体结构示意图;
图2为图1所示的立体结构示意图的顶视图;
图3为本申请实施例提供的光背板互连装置的另一立体结构示意图;
图4为图3所示的立体结构示意图的顶视图;
图5为本申请实施例提供的光背板互连装置的另一立体结构示意图;
图6为图5所示的立体结构示意图的顶视图;
图7为本申请实施例提供的光背板互连装置的另一立体结构示意图;
图8为图7所示的立体结构示意图的顶视图;
图9为本申请实施例提供的光背板互连装置的另一立体结构示意图;
图10为图9所示的立体结构示意图的顶视图;
图11为本申请实施例提供的光背板互连装置的另一立体结构示意图;
图12为图11所示的立体结构示意图的顶视图;
图13为本申请实施例中光背板互连装置的一种顶视结构示意图;
图14为本申请实施例中电背板的平面结构示意图;
图15为本申请实施例中光背板的立体结构示意图。
附图标记:
11-光背板;12-单板;12M-单板组;12a-第一单板;12b-第二单板;13-第一光连接器;14-第二光连接器;15-交叉板;15M-第一交叉板组;15N-第二交叉板组;16-第一电连接器;17-第二电连接器;18-第三电连接器;19-电背板;20-第四电连接器;21-第五电连接器;22-滑轨;23-固定件;24-拉环;F-风扇;U-开孔。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。
应注意的是,本申请的附图中相同的附图标记表示相同或类似的结构,因而将省略对它们的重复描述。本申请中所描述的表达位置与方向的词,均是以附图为例进行的说明,但根据需要也可以做出改变,所做改变均包含在本申请保护范围内。本申请的附图仅用于示意相对位置关系不代表真实比例。
为了解决相关技术中光背板无法更换的问题。本申请实施例提供了一种光背板互连装置及通信设备。该光背板互连装置可以应用于各种类型的通信设备中,例如,该通信设备可以为光通信设备、路由器、交换机、服务器等,当然,该光背板互连装置也可以应用于其他类型的通信设备中,此处不做限定。
图1为本申请实施例提供的光背板互连装置的立体结构示意图,图2为图1所示的立体结构示意图的顶视图。结合图1和图2,本申请实施例提供的光背板互连装置可以包括:至少一个光背板11和至少一个单板12。图1中以该光背板互连装置包括一个光背板11和三个单板12为例进行示意,在具体实施时,可以根据需要设置光背板11和单板12的数量,此处不做限定。每一个光背板11与任一单板12相互正交,且每一个光背板11的一个侧面与任一单板12的一个侧面相对设置,各单板12均位于任一光背板11的同一侧。每一个光背板11与任一单板12可插拔连接。
本申请实施例提供的光背板互连装置中,通过将每一个光背板设置为与任一单板相互正交,并且,每一个光背板的一个侧面与任一单板的一个侧面相对设置,各单板均位于任一光背板的同一侧,也就是说,光背板仅以一个侧面与任一单板连接,使得光背板的位置不受其他部件的限制,从而可以使光背板与单板之间实现可插拔连接,在光背板出现故障时,可以对光背板进行单独更换,无需更换整个机柜。并且,将每一个光背板设置为与任一单板可插拔连接,可以更灵活、更容易地更换光背板。
为了更清楚的示意光背板互连装置中各部件的方位,图1和图2中标识出了xyz坐标系,继续参照图1和图2,光背板互连装置中的各单板12平行于xy平面时,可以将光背板11设置为平行于yz平面,以使光背板11与单板12相互正交。并且,由于各单板12均位于光背板11的同一侧,光背板11的一个侧面朝向各单板12,从而,使光背板11的位置不受其他部件的限制。在具体实施时,可以按照图中箭头S1的方向安装光背板11,当光背板11需要更换时,可以按照图中S2的方向拆除光背板11。图1中以各单板12位于光背板11的左侧,且单板12水平放置,光背板11竖直放置为例进行示意,在具体实施时,可以根据实际需要设置光背板11和单板12的位置,此处不做限定。
本申请实施例中的单板12可以为任何能够传输光信号的单板,例如,该单板可以为业务处理板或交叉板。例如,上述单板12可以为用于接入业务和处理业务的线卡(Line Card,LC)。
在本申请的一些实施例中,如图1和图2所示,光背板互连装置可以包括沿第一方向(例如图中箭头z所示的方向)排列的多个单板12,第一方向为垂直于单板12的方向。将光背板互连装置中的各单板12平行设置,可以便于将各单板12与光背板11进行互连。可选地,光背板11可以与至少两个单板12连接,这样,通过光背板11进行光信号传输,可以实现至少两个单板12之间的光信号传输。可选地,光背板互连装置中的多个单板12可以均为业务处理板;或者,光背板互连装置中的多个单板12可以均为交叉板;或者,光背板互连装置中的多个单板12可以既包括业务处理板也包括交叉板。
图3为本申请实施例提供的光背板互连装置的另一立体结构示意图,图4为图3所示的立体结构示意图的顶视图。结合图3和图4,在本申请的另一些实施例中,光背板互连装置可以包括沿第二方向(例如图中箭头x所示的方向)排列的多个光背板11,第二方向为垂直于光背板11的方向。将光背板互连装置中的各光背板11平行设置,可以便于将各光背板11与单板12进行互连。可选地,每一个光背板11可以与任一单板12连接,这样,任意两个单板12之间可以通过光背板11进行光信号传输。
此外,通过在光背板互连装置中设置多个光背板11,可以起到冗余保护作用,具体地,可以将至少一个光背板11作为工作背板,其余的光背板11作为冗余背板。当工作背板正常工作时,冗余背板可以处于待机状态,当工作背板出现故障时,可以控制冗余背板从待机状态切换为工作状态,以替代冗余背板的功能,保证光背板互连装置能够正常运行。并且,通过设置冗余背板,当工作背板出现故障时,可以在不断开业务的情况下,实现光背板的现网更换。
在具体实施时,如图1和图2所示,每一个光背板11在靠近单板12的一侧设有第一光连接器13,每一个单板12的表面设有第二光连接器14,每一个光背板11与任一单板12通过第一光连接器13和第二光连接器14实现光信号连接。可选地,第一光连接器(或第二光连接器)可以为:MT光纤连接器、多芯多通道插拔(MPO)光纤连接器或LC型光纤连接器等各种类型的光连接器。
在图1和图2中,以第一光连接器13固定于光背板11靠近单板12一侧的侧面为例进行示意。如图3和图4所示,第一光连接器13也可以设置在光背板11的表面靠近单板12的边缘处,可以根据实际需要设置第一光连接器13的位置,此处不做限定。此外,在图1和图2中,以光背板11与单板12通过两个第一光连接器13和两个第二光连接器14连接为例进行示意,图3和图4中,以光背板11与单板12通过一个第一光连接器13和一个第二光连接器14连接为例进行示意,在具体实施时,可以根据实际需要,来设置光背板11与单板12之间的第一光连接器13和第二光连接器14的数量,此处不做限定。
图5为本申请实施例提供的光背板互连装置的另一立体结构示意图,图6为图5所示的立体结构示意图的顶视图。如图5和图6所示,上述单板为业务处理板,本申请实施例中的光背板互连装置还可以包括:至少一个交叉板15。每一个交叉板15位于任一单板12朝向光背板11的一侧,且每一个交叉板15与任一单板12相互正交。每一个交叉板15与任一单板12可插拔连接。也就是说,交叉板15与光背板11位于单板12的同一侧,并且,交叉板15与光背板11平行设置,这样,可以使光背板互连装置在处理光业务的同时,也能够处理电业务,实现光电合一架构。并且,可以使单板12在同一侧面与交叉板15和光背板11连接,便于对单板12上的各种连接器的位置进行设置,也可以较容易地更换光背板11或交叉板15。
在具体实施时,交叉板15可以接收单板12传输的电层业务,并对接收的电层业务进行交叉调度。本申请实施例中,通过在光背板互连装置中设置光背板11和交叉板15,可以使光背板互连装置同时具有处理光业务和电业务的功能。
可选地,在本申请实施例中的光背板互连装置中,交叉板15的数量可以是一个或多个,可以根据实际需要对交叉板15的数量进行设置,此处不做限定。
继续参照图5和图6,在一种可能的实现方式中,光背板互连装置可以包括多个交叉板15,各交叉板15分布于光背板互连装置中所有光背板11的两侧,即可以使光背板11位于中间位置。可选地,光背板互连装置中的交叉板15的数量可以为偶数,各交叉板15可以对称分布于光背板互连装置中所有光背板11的两侧。
图7为本申请实施例提供的光背板互连装置的另一立体结构示意图,图8为图7所示的立体结构示意图的顶视图。图5和图6中,以光背板互连装置中设有一个光背板11为例进行示意,光背板互连装置中的各交叉板15分布于该光背板11的两侧。如图7和图8所示,光背板互连装置中也可以设置多个光背板11,图7和图8中以光背板互连装置中设置两个光背板11为例,可以根据实际需要设置光背板11的数量。光背板互连装置中的各交叉板15可以分布于所有光背板11的两侧。
当然,在具体实施时,光背板互连装置中的多个交叉板也可以分布于上述至少一个光背板的同一侧,此处不做限定。
在具体实施时,如图5和图6所示,每一个交叉板15在靠近单板12的一侧设有第一电连接器16,每一个单板12的表面设有第二电连接器17。每一个交叉板15与任一单板12之间通过第一电连接器16和第二电连接器17实现电信号连接。为了便于实现交叉板15与单板12之间的可插拔连接,可以在第一电连接器16上设置簧片,并在第二电连接器17上设置与该簧片匹配的触点;或者,在第一电连接器16上设置触点,并在第二电连接器17上设置与该触点匹配的簧片。这样,可以使第一电连接器16与第二电连接器17通过触点与簧片实现连接。当然,第一电连接器16与第二电连接器17也可以采用其他方式实现连接,此处不做限定。
在图5和图6中,以第一电连接器16固定于交叉板15的表面靠近单板12的边缘处为例进行示意,在具体实施时,第一电连接器16也可以设置在交叉板15靠近单板12一侧的侧面,可以根据实际需要设置第一电连接器16的位置,此处不做限定。
图9为本申请实施例提供的光背板互连装置的另一立体结构示意图,图10为图9所示的立体结构示意图的顶视图。如图9和图10所示,在一种可能的实现方式中,光背板11可以集成电信号传输模块(图中未示出),每一个光背板11的在靠近单板12的一侧设有第一光连接器13和第三电连接器18,每一个单板12的表面设有第二光连接器14和第二电连接器17。光背板11与单板12通过第一光连接器13和第二光连接器14实现光信号连接,光背板11与单板12通过第三电连接器18和第二电连接器17实现电信号连接。
本申请实施例中,通过将电信号传输模块集成到光背板11中,并在光背板11和业务传输板12上分别设置光连接器和电连接器,可以使光背板11集成了传输光信号和电信号的功能,从而可以省去光背板互连装置中的交叉板,减小光背板互连装置占用的空间。并且,由于省去了交叉板,可以使单板12侧面设置的部件较少,能够增大风量,有利于提高通信设备中各部件的散热效果。
继续参照图9和图10,每一个单板12中,第二光连接器14与第二电连接器17分别 位于单板12不同的表面。这样,可以充分利用单板12的上表面和下表面的空间,也使光背板11上对应的第一光连接器13和第三电连接器18的位置更容易设置,便于实现光背板11与单板12之间的可插拔连接。当然,在光背板11和单板12的空间允许的情况下,第二光连接器14与第二电连接器17也可以设置在单板12的同一表面,即都设置在单板12的上表面或下表面。
图11为本申请实施例提供的光背板互连装置的另一立体结构示意图,图12为图11所示的立体结构示意图的顶视图。如图11和图12所示,光背板互连装置可以包括多个单板,组成至少一个单板组12M。其中,每一个单板组12M包括两个单板,分别为第一单板12a和第二单板12b。每一个单板组12M中,第一单板12a与第二单板12b在第一方向(如图中箭头x所示的方向)上并排设置,第一单板12a在靠近第二单板12b的位置与光背板11连接,第二单板12b在靠近第一单板12a的位置与光背板11连接。第一方向为垂直于单板的方向。
对比图1和图11可以明显看出,本申请实施例中,通过将第一单板12a与第二单板12b设置为在第一方向上并排设置,并且,第一单板12a和第二单板12b均在靠近中间的位置处与光背板11连接,从而,可以增加光背板11连接的单板的数量,增加光背板11的槽位数量。
在每一个单板组12M中,第一单板12a在靠近所第二单板12b的位置设置有第二光连接器14,第二单板12b在靠近第一单板12a的位置设有第二光连接器14。光背板11在对应每一个单板组12M的位置处设有两个第一光连接器13,其中一个第一光连接器13与第一单板12a的第二光连接器14连接,另一个第一光连接器13与第二单板12b的第二光连接器连接14。
本申请实施例中的光背板互连装置可以应用于通信设备中,一般在通信设备中可以设置风扇F,以降低通信设备中各部件的温度,风扇F形成的风向可以如图中箭头f所示,通过将单板组12M中的第二光连接器14集中在中间位置,这样,可以使光背板11上的第一光连接器13也比较集中,可以使光背板11在第一方向上的宽度较窄,减小光背板11占用的空间。因而,光背板11不会遮挡风道,从而可以增大风量,使通信设备中各部件的散热效果较好。
继续参照图11和图12,在具体实施时,在每一个单板组12M中,第一单板12a与第二单板12b的结构可以相同,例如,第一单板12a与第二单板12b中的线路或模块设置位置可以相同,第一单板12a与第二单板12b表面的第二光连接器14的设置位置可以相同,这样,第一单板12a与第二单板12b的配件可以共用,可以减少配件加工成本。将每一个单板组12M中的单板与光背板11连接时,可以使第一单板12a正插,第二单板12b反插,其中,第一单板12a正插可以理解为第一单板12a在上表面设置与光背板11连接的第二光连接器14,第二单板12b反插可以理解为第二单板12b在下表面设置与光背板11连接的第二光连接器14。
图13为本申请实施例中光背板互连装置的一种顶视结构示意图,如图13所示,上述单板为业务处理板,本申请实施例中的光背板互连装置还可以包括:至少两个交叉板,分为第一交叉板组15M和第二交叉板组15N,其中,第一交叉板组15M包括至少一个交叉板15,第二交叉板组15N包括至少一个交叉板15。每一个交叉板15位于单板朝向光背板11的一侧,且每一个交叉板15与任一单板相互正交。第一交叉板组15M与第二交叉板组 15N分别位于光背板11的两侧。在每一个单板组12M中,第一单板12a与第一交叉板组15M中的交叉板15可插拔连接,第二单板12b与第二交叉板组15N中的交叉板15可插拔连接。
也就是说,光背板互连装置中的各交叉板15与光背板11位于单板的同一侧,并且,各交叉板15与光背板11平行设置,这样,可以使单板在同一侧与各交叉板15和光背板11连接,便于对单板上的各种连接器的位置进行设置,也可以较容易地更换光背板11或交叉板15。在具体实施时,交叉板15可以接收单板12传输的业务,并对接收的业务进行交叉调度。本申请实施例中,通过在光背板互连装置中设置光背板11和交叉板15,可以使光背板互连装置同时具有处理光业务和电业务的功能。
继续参照图13,本申请的一些实施例中,光背板互连装置还可以包括:位于单板与光背板11之间的电背板19,每一个交叉板15位于电背板19远离单板的一侧。电背板19与每一个单板组12M中的第一单板12a和第二单板12b可插拔连接,电背板19与第一交叉板组15M中的各交叉板15可插拔连接,电背板19与第二交叉板组15N中的各交叉板15可插拔连接。本申请实施例中,通过设置电背板19,电背板19一侧的表面与第一单板12a和第二单板12b连接,电背板19另一侧的表面与第一交叉板组15M和第二交叉板组15N中的各交叉板15连接,从而,可以使第一交叉板组15M中的各交叉板15,与第二交叉板组15N中的各交叉板15实现电连接,这样,第一交叉板组15M与第二交叉板组15N中的任意两个交叉板15之间都能够实现电信号传输。
图14为本申请实施例中电背板的平面结构示意图,结合图13和图14,电背板19上设有分别与光背板11中的各第一光连接器13的位置对应的多个开孔U,第一光连接器13穿过对应位置处的开孔U与第二光连接器14连接。通过在电背板19上设置多个开孔U,可以使光背板11中的各第一光连接器13穿过开孔U后与第二光连接器14连接,从而,可以实现将电背板19设置在光背板11与单板之间的位置,可以合理利用光背板互连装置中的空间,并且,电背板19不影响光背板11的位置,保证光背板11能够与单板之间可插拔连接。
继续参照图13,在一种可能的实现方式中,每一个交叉板15在靠近单板的一侧设有第一电连接器16,每一个单板的表面设有第二电连接器17,电背板19在靠近交叉板15的一侧设有第四电连接器20,电背板19在靠近单板的一侧设有第五电连接器21,电背板19与交叉板15通过第一电连接器16和第四电连接器20实现电信号连接,电背板19与单板通过第二电连接器17和第五电连接器21实现电信号连接。
为了便于实现交叉板15与电背板19之间的可插拔连接,可以在第一电连接器16上设置簧片,并在第四电连接器20上设置与该簧片匹配的触点;或者,在第一电连接器16上设置触点,并在第四电连接器20上设置与该触点匹配的簧片。这样,可以使第一电连接器16与第四电连接器20通过簧片与触点实现连接。当然,第一电连接器16与第四电连接器20也可以采用其他方式实现连接,此处不做限定。
为了便于实现单板与电背板19之间的可插拔连接,可以在第二电连接器17上设置簧片,并在第五电连接器21上设置与该簧片匹配的触点;或者,在第二电连接器17上设置触点,并在第五电连接器21上设置与该触点匹配的簧片。这样,可以使第二电连接器17与第五电连接器21通过簧片与触点实现连接。当然,第二电连接器17与第五电连接器21也可以采用其他方式实现连接,此处不做限定。
图15为本申请实施例中光背板的立体结构示意图,如图15所示,本申请实施例中的光背板互连装置还可以包括:子架(图中未示出),子架中设有槽轨,光背板11上设有与槽轨匹配的滑轨22。这样,可以便于将光背板11插入子架中实现与单板的连接,并且,也可以使光背板11较容易地从子架中拔出。为了便于将光背板11取出,可以在光背板11的侧面设置拉环24,在具体实施时,也可以采用扳手或其他部件替代拉环24。
此外,光背板互连装置还可以包括:至少一个固定件23,固定件23用于将光背板11可拆卸地固定于子架上,可选地,可以在光背板11中设置通孔,固定件23可以穿过光背板11与子架固定,从而将光背板11固定在子架上,防止在加工或运输过程中,光背板11脱落。当需要更换光背板11时,可以将固定件23拆除,使光背板11顺利拔出,保证光背板11能够顺利更换。例如,该固定件23可以为松不脱或螺杆等。
基于同一技术构思,本申请实施例还提供了一种通信设备,该通信设备可以包括:上述任一光背板互连装置,以及壳体。该通信设备可以为光通信设备、路由器、交换机、服务器等。由于上述光背板互连装置中的光背板与单板可插拔连接,在光背板出现故障时,可以对光背板进行单独更换,无需更换整个机柜。光背板互连装置的结构比较灵活、可靠性较高。因而,包括该光背板互连装置的通信设备的结构也比较灵活、可靠性较高。
尽管已描述了本申请的优选实施例,但本领域内的技术人员一旦得知了基本创造性概念,则可对这些实施例作出另外的变更和修改。所以,所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。
显然,本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请实施例的精神和范围。这样,倘若本申请实施例的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。

Claims (18)

  1. 一种光背板互连装置,其特征在于,包括:至少一个光背板和至少一个单板;
    每一个所述光背板与任一所述单板相互正交,且每一个所述光背板的一个侧面与任一所述单板的一个侧面相对设置,各所述单板均位于任一所述光背板的同一侧;
    每一个所述光背板与任一所述单板可插拔连接。
  2. 如权利要求1所述的光背板互连装置,其特征在于,所述光背板互连装置包括沿第一方向排列的多个所述单板;所述第一方向为垂直于所述单板的方向。
  3. 如权利要求1所述的光背板互连装置,其特征在于,所述光背板互连装置包括沿第二方向排列的多个所述光背板;所述第二方向为垂直于所述光背板的方向。
  4. 如权利要求1~3任一项所述的光背板互连装置,其特征在于,每一个所述光背板在靠近所述单板的一侧设有第一光连接器,每一个所述单板的表面设有第二光连接器;
    每一个所述光背板与任一所述单板通过所述第一光连接器和所述第二光连接器实现光信号连接。
  5. 如权利要求1~4任一项所述的光背板互连装置,其特征在于,所述单板为业务处理板;
    所述光背板互连装置还包括:至少一个交叉板;
    每一个所述交叉板位于任一所述单板朝向所述光背板的一侧,且每一个所述交叉板与任一所述单板相互正交;
    每一个所述交叉板与任一所述单板可插拔连接。
  6. 如权利要求5所述的光背板互连装置,其特征在于,所述光背板互连装置包括多个所述交叉板;
    所述光背板互连装置中的多个所述交叉板分布于所述至少一个光背板的一侧或两侧。
  7. 如权利要求6所述的光背板互连装置,其特征在于,所述光背板互连装置中的所述交叉板的数量为偶数;
    所述光背板互连装置中的多个所述交叉板对称分布于所述至少一个光背板的两侧。
  8. 如权利要求5~7任一项所述的光背板互连装置,其特征在于,每一个所述交叉板在靠近所述单板的一侧设有第一电连接器,每一个所述单板的表面设有第二电连接器;
    每一个所述交叉板与任一所述单板之间通过所述第一电连接器和所述第二电连接器实现电信号连接。
  9. 如权利要求1~8任一项所述的光背板互连装置,其特征在于,所述光背板集成电信号传输模块;
    每一个所述光背板的在靠近所述单板的一侧设有第一光连接器和第三电连接器;
    每一个所述单板的表面设有第二光连接器和第二电连接器;
    所述光背板与所述单板通过所述第一光连接器和所述第二光连接器实现光信号连接,所述光背板与所述单板通过所述第三电连接器和所述第二电连接器实现电信号连接。
  10. 如权利要求9所述的光背板互连装置,其特征在于,每一个所述单板中,第二光连接器与所述第二电连接器分别位于所述单板不同的表面。
  11. 如权利要求1~4任一项所述的光背板互连装置,其特征在于,所述光背板互连装置包括多个所述单板,组成至少一个单板组;
    每一个所述单板组包括两个所述单板,分别为第一单板和第二单板;
    每一个所述单板组中,所述第一单板与所述第二单板在第一方向上并排设置,所述第一单板在靠近所述第二单板的位置与所述光背板连接,所述第二单板在靠近所述第一单板的位置与所述光背板连接;所述第一方向为垂直于所述单板的方向。
  12. 如权利要求11所述的光背板互连装置,其特征在于,所述单板为业务处理板;
    所述光背板互连装置还包括:至少两个交叉板,分为第一交叉板组和第二交叉板组;所述第一交叉板组包括至少一个所述交叉板,所述第二交叉板组包括至少一个所述交叉板;
    每一个所述交叉板位于所述单板朝向所述光背板的一侧,且每一个所述交叉板与任一所述单板相互正交;
    所述第一交叉板组与所述第二交叉板组分别位于所述光背板的两侧;
    在每一个所述单板组中,所述第一单板与所述第一交叉板组中的所述交叉板可插拔连接,所述第二单板与所述第二交叉板组中的所述交叉板可插拔连接。
  13. 如权利要求12所述的光背板互连装置,其特征在于,还包括:位于所述单板与所述光背板之间的电背板,每一个所述交叉板位于所述电背板远离所述单板的一侧;
    所述电背板与每一个所述单板组中的所述第一单板和所述第二单板可插拔连接;
    所述电背板与所述第一交叉板组中的各所述交叉板可插拔连接,所述电背板与所述第二交叉板组中的各所述交叉板可插拔连接。
  14. 如权利要求13所述的光背板互连装置,其特征在于,在每一个所述单板组中,所述第一单板在靠近所第二单板的位置设置有第二光连接器,所述第二单板在靠近所述第一单板的位置设有第二光连接器;
    所述光背板在对应每一个所述单板组的位置处设有两个第一光连接器,其中一个所述第一光连接器与所述第一单板的所述第二光连接器连接,另一个所述第一光连接器与所述第二单板的所述第二光连接器连接;
    所述电背板上设有分别与所述光背板中的各所述第一光连接器的位置对应的多个开孔;
    所述第一光连接器穿过对应位置处的所述开孔与所述第二光连接器连接。
  15. 如权利要求13所述的光背板互连装置,其特征在于,每一个所述交叉板在靠近所述单板的一侧设有第一电连接器,每一个所述单板的表面设有第二电连接器;
    所述电背板在靠近所述交叉板的一侧设有第四电连接器,所述电背板在靠近所述单板的一侧设有第五电连接器;
    所述电背板与所述交叉板通过所述第一电连接器和所述第四电连接器实现电信号连接,所述电背板与所述单板通过所述第二电连接器和所述第五电连接器实现电信号连接。
  16. 如权利要求1~15任一项所述的光背板互连装置,其特征在于,还包括:子架;
    所述子架中设有槽轨,所述光背板上设有与所述槽轨匹配的滑轨。
  17. 如权利要求16所述的光背板互连装置,其特征在于,还包括:至少一个固定件;
    所述固定件用于将所述光背板可拆卸地固定于所述子架上。
  18. 一种通信设备,其特征在于,包括:如权利要求1~17任一项所述的光背板互连装置,以及壳体。
PCT/CN2022/108647 2021-11-26 2022-07-28 一种光背板互连装置及通信设备 WO2023093105A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882955A (zh) * 2010-04-26 2010-11-10 华为技术有限公司 光背板互连系统及通信设备
CN102695393A (zh) * 2012-05-04 2012-09-26 华为技术有限公司 一种垂直正交互连系统及通信设备
EP3382434A1 (en) * 2017-03-27 2018-10-03 Nokia Solutions and Networks Oy Modular mid- or backplane structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101882955A (zh) * 2010-04-26 2010-11-10 华为技术有限公司 光背板互连系统及通信设备
CN102695393A (zh) * 2012-05-04 2012-09-26 华为技术有限公司 一种垂直正交互连系统及通信设备
EP3382434A1 (en) * 2017-03-27 2018-10-03 Nokia Solutions and Networks Oy Modular mid- or backplane structure

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