WO2008041446A1 - Cartouche de ruban pour nettoyage d'ouvrage - Google Patents

Cartouche de ruban pour nettoyage d'ouvrage Download PDF

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Publication number
WO2008041446A1
WO2008041446A1 PCT/JP2007/067411 JP2007067411W WO2008041446A1 WO 2008041446 A1 WO2008041446 A1 WO 2008041446A1 JP 2007067411 W JP2007067411 W JP 2007067411W WO 2008041446 A1 WO2008041446 A1 WO 2008041446A1
Authority
WO
WIPO (PCT)
Prior art keywords
tape
adhesive
workpiece
adhesive tape
tape cartridge
Prior art date
Application number
PCT/JP2007/067411
Other languages
English (en)
Japanese (ja)
Inventor
Takuji Okeyui
Kazuo Oouchi
Yoshimasa Nishida
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2008041446A1 publication Critical patent/WO2008041446A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L25/00—Domestic cleaning devices not provided for in other groups of this subclass 
    • A47L25/005—Domestic cleaning devices not provided for in other groups of this subclass  using adhesive or tacky surfaces to remove dirt, e.g. lint removers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning

Definitions

  • the present invention relates to a substrate cleaning tape cartridge that is used for removing foreign matters such as particles and dust adhering to a workpiece such as a semiconductor wafer, a liquid crystal panel, a multilayer substrate, and a lead frame.
  • an oxide film is formed by rubbing the tip of a probe needle against a bump electrode made of, for example, aluminum for confirming the operation of a semiconductor element or the like formed on the surface of the substrate. Etc. are removed to establish electrical continuity with the electrode (see, for example, Patent Document 1).
  • the oxide film fragments released from the electrodes by rubbing the probe needle become foreign matters and remain attached to the substrate. Therefore, since it affects the reliability of the package formed after the subsequent steps, it is necessary to remove this foreign matter.
  • a means for removing the foreign matter remaining on the substrate a means for cleaning the substrate, a means for attaching and peeling the adhesive tape to the entire surface of the substrate, transferring the foreign matter to the adhesive tape and removing it, etc. are appropriately selected. Yes.
  • Patent Document 1 Japanese Patent Laid-Open No. 11 133116 [paragraphs (0002) to (0005)]
  • Some substrates such as semiconductor wafers, are not resistant to cleaning, and foreign substances are removed from such substrates by attaching and peeling an adhesive tape on the substrate.
  • adhesive tape is applied to and peeled from the entire surface of large and thin substrates, there is a high risk of damage to the substrate due to the pressing force at the time of application and the release stress at the time of peeling. . In other words, careful sticking and peeling of the adhesive tape is required, and processing takes time.
  • the present invention has been made in view of such a situation, and foreign substances adhering to workpieces such as various substrates and lead frames can be accurately and efficiently removed using an adhesive tape. Its main purpose is to provide tape cartridges for work cleaning.
  • the first invention is a tape supply unit for supplying an adhesive tape
  • a tape recovery unit that winds and collects the adhesive tape after being attached to and peeled from the work, and stores the tape supply unit and the tape recovery unit, and has a tape exposed part for attaching the adhesive tape to the work.
  • the adhesive tape that is exposed from a part of the housing is locally attached to the foreign matter adhesion site of the workpiece and peeled off, so that the adhesive tape is applied more widely than necessary.
  • the transferred material from the adhesive tape can be suppressed as much as possible, and foreign matters can be transferred to the adhesive tape and removed.
  • the adhesive tape from which foreign matter has been transferred is wound up and collected in the housing, so there is no risk that the foreign matter will be released from the treated adhesive tape and reattached to the workpiece.
  • a second invention is the above first invention, wherein
  • the tape supply unit and the tape recovery unit are separated from each other inside the housing by a partition wall.
  • a third invention is the above first invention, wherein
  • the tape portion exposed from the housing can be attached to the foreign matter adhering portion of the workpiece with certainty.
  • a fourth invention is the above first invention, wherein
  • the pressure-sensitive adhesive tape is characterized in that a separator is bonded to the pressure-sensitive adhesive surface, and includes a separator recovery unit that peels and collects the separator from the pressure-sensitive adhesive tape supplied.
  • the adhesive surface of the adhesive tape can be supplied with the separator covered until immediately before the pasting process so that the adhesive performance is not deteriorated. I'll do it.
  • a fifth invention is the above first invention, wherein
  • the adhesive tape has a separator bonded to the adhesive surface
  • It is characterized by comprising a laminating mechanism for laminating the separator peeled from the adhesive tape supplied from the tape supply unit and the adhesive tape from which foreign matter has been transferred.
  • the transferred foreign matter is contained by the adhesive tape and the separator. Therefore, it is a force to prevent foreign matters from re-adhering to the unused adhesive tape and workpiece supplied.
  • a sixth invention is the above first invention, wherein
  • the pressure-sensitive adhesive tape is characterized in that a pressure-sensitive adhesive layer is formed on a base material.
  • a seventh invention is the above sixth invention, wherein
  • the tape collecting section is characterized in that it is wound up with the adhesive surface of the adhesive tape peeled off from the workpiece facing inside.
  • the separated foreign matter moves in the housing without the possibility that the foreign matter transferred to the adhesive surface is released, and adheres to the adhesive tape before use or from the housing. It can be reliably prevented from coming out and reattaching to the workpiece.
  • An eighth invention is the above first invention, wherein
  • An engagement portion is provided which is engaged and interlocked with a driving means for transmitting power for feeding and winding the adhesive tape.
  • a ninth invention is based on the eighth invention.
  • the drive chamber for performing the power transmission is formed as a separate chamber from the tape supply unit.
  • a tenth invention is the above first invention, wherein
  • An eleventh aspect of the present invention is the above first aspect
  • a ratchet is provided on at least one of the rotating shafts of the tape supply unit or the tape collection unit.
  • the pressure-sensitive adhesive tape is guided to the front end of the pressing member by side walls provided upright on both side ends of the pressing member.
  • the adhesive tape can be accurately guided to the center of the tip of the pressing member. The Therefore, the adhesive tape can be reliably guided to the foreign material transfer position.
  • the work cleaning tape cartridge according to the present invention can be effectively used to accurately and efficiently remove foreign substances adhering to the work.
  • FIG. 1 is a side view of a substrate cleaning apparatus.
  • FIG. 2 is a plan view of the substrate cleaning apparatus.
  • FIG. 3 is a vertical side view of the tape cartridge.
  • FIG. 4 is a vertical side view of the tape cartridge.
  • FIG. 5 is an aa cross-sectional view in FIG.
  • FIG. 6 is a flowchart of a foreign matter removing process.
  • FIG. 7 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 8 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 9 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 10 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 11 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 12 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 13 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 14 is an enlarged side view of the main part showing the foreign substance removal processing operation.
  • FIG. 15 is a side view of a modified tape force cartridge.
  • FIG. 16 is a side view showing a pressing member of a modified example.
  • FIG. 17 is a side view showing a modified tape force cartridge.
  • FIG. 18 is a side view of a modified tape force cartridge.
  • FIG. 19 is an aa cross-sectional view in FIG.
  • the workpiece of the present invention includes various substrates such as a liquid crystal panel and a multilayer substrate in addition to the semiconductor wafer. Also included are lead frames.
  • FIG. 1 is a side view of a substrate cleaning apparatus used in one embodiment of the present invention
  • FIG. 2 is a plan view of the substrate cleaning apparatus.
  • FIG. 1 A basic configuration of a substrate cleaning apparatus that executes the substrate cleaning method according to the present invention is shown in FIG.
  • This substrate cleaning apparatus includes a chuck table 1 for positioning and mounting a semiconductor wafer w, which is a substrate, and a cleaning unit 2.
  • the chuck table 1 is supported on a movable base 3 that can be moved back and forth through a guide rail 4 so as to be horizontally movable left and right, and has a servo function. Driven and moved by a feed screw 6 that is driven forward and backward by 5.
  • the movable table 3 is supported on a base 7 so as to be horizontally movable back and forth via a guide rail 8 and is driven and moved by a feed screw 10 that is driven forward and backward by a motor 9 with a servo function.
  • the cleaning unit 2 includes a column 11 standing on the base 7, a boom 12 cantilevered forward from the upper end of the column 11, and a guide frame provided at the tip of the boom 12.
  • the elevator 14 is screw-driven up and down by a motor 17, and the bracket 15 is driven up and down by an air cylinder 18.
  • the housing 19 of the tape cartridge 16 has a side surface formed in a substantially triangular shape.
  • the interior is composed of three parts. In other words, the interior is separated into two chambers by the partition wall 20 in the tape width direction, and further partitioned by the partition wall 21 on the front side of the partition wall 20 into the tape supply unit 22, the separator collection unit 23, and the tape collection unit 24. It has been.
  • the tape supply unit 22 located at the lower part is formed long in the front-rear direction, a tape supply shaft 25 is provided at the rear part thereof, and a pressing member 26 is provided at the front end of the tape supply unit 22. . Further, a separator collection shaft 27 is provided in a separator collection unit 23 formed above the rear part of the tape supply unit 22. Further, a tape collection shaft 28 is provided in a tape collection unit 24 formed above the front portion of the tape supply unit 22.
  • a supply reel 29 around which an adhesive tape T with a separator is wound is externally attached to the tape supply shaft 25.
  • the separator collecting shaft 27 is mounted so as to be able to rotate integrally with the separator collecting shaft 27, which is a separator collecting reel 30 for winding the separator s peeled off from the adhesive tape T.
  • a tape recovery reel 31 for winding the adhesive tape T drawn from the supply reel 29 is mounted on the tape recovery shaft 28 so as to be rotatable together with the tape recovery shaft 28.
  • the separator s peeled from the adhesive tape T is a guide roll.
  • the adhesive tape T from which the separator s has been peeled is guided by the guide roll 33, guided to the pressing member 26 with the adhesive surface facing downward, and received by the lower surface of the pressing member 26, and then retracted in the diagonally upward traveling direction.
  • the adhesive tape T is guided to the tape recovery line 31 via the guide roll 33 and is guided back and forth!
  • the pressing member 26 is provided so as to slightly protrude from the opening 34 formed on the lower surface of the front end of the tape supply unit 22, and the downward adhesive surface of the adhesive tape with the non-adhesive surface received by the pressing member 26. Is exposed from the opening 34.
  • a drive chamber 35 that is completely isolated from the outside is formed on the back side of the partition wall 20.
  • the drive chamber 35 supports a separator collection shaft 27, a tape collection shaft 28, and a drive shaft 36 that receives external rotational power, and also drives the drive shaft 36, the separator collection shaft 27, and the tape collection shaft 28.
  • a transmission mechanism 37 is housed.
  • the transmission mechanism 37 has a structure in which gears 38 and 39 integrally connected to the separator recovery shaft 27 and the tape recovery shaft 28 are engaged with a pinion gear 40 integrally connected to the drive shaft 36. As shown in FIG. 5, one end of the drive shaft 36 is exposed to the outside of the rear surface of the housing 19, and a groove-like engagement portion 36a provided at the protruding end of the drive shaft 36 is attached to the bracket 15.
  • the motor 41 is engaged and interlocked with the output shaft 42 of the motor 41.
  • the substrate w is first carried into a foreign object inspection device 44 (see Fig. 2) having specifications as appropriate (Step 1), and the entire surface of the substrate w is scanned (Step 2).
  • the position information of the adhesion site is acquired, and the acquired information is transferred to the control device 43 (see FIG. 2) of the substrate cleaning device (step 3).
  • the substrate w on which the adhesion of foreign matter is detected is transferred to the substrate cleaning device, positioned and mounted on the chuck table 1 in a predetermined posture, and held by suction.
  • the tape cartridge 16 in the cleaning unit 2 stands by at the upper position (step 4).
  • step 5 foreign matter removal processing based on the inspection information in step 5 is performed.
  • the data related to the substrate w held in the chuck table 1 is read by the control device 43, and the motor is based on the signal that the movement amount is changed to the rotation amount of the motors 5 and 9 to the foreign substance adhesion position included in this data.
  • 5 and 9 are activated and the chuck table 1 is moved horizontally back and forth and left and right. It is. That is, the substrate w is positioned so that the foreign matter adhesion site is located below the tape cartridge 16 waiting in the upper position.
  • the motor 17 is actuated, and the lifting platform 14 is lowered to the lower limit. As shown in FIG. 7, the pressing member 26 is directed directly above the foreign material adhesion site.
  • the air cylinder 18 is actuated to swing the tape cartridge 16 downward about the fulcrum X, and the pressing member 26 facing the opening 34 at the tip of the tape cartridge 16 applies a predetermined pressure to the substrate surface. Pressed with. That is, as shown in FIG. 8, the adhesive tape T wound around the pressing member 26 with the adhesive surface n facing downward is attached to a site where the foreign matter p is adhered in a small area.
  • the motor 41 When the tape cartridge 16 is lifted, the motor 41 operates, and as shown in FIG. 10, the adhesive tape T is wound around the tape collection reel 31 by a predetermined amount, and a new adhesive tape is formed on the lower surface of the pressing member 26. T is supplied.
  • the forward movement of the chuck table 1 is stopped, and the tape cartridge 16 is swung upward about the fulcrum X as shown in FIG.
  • the adhesive tape T is peeled from the substrate w.
  • the peeled processed adhesive tape T is fed into the tape collecting unit 24 with the adhesive surface facing upward, and wound up with the adhesive surface facing inward, so that the transferred foreign matter is removed.
  • the tape cartridge 16 will not spill and fall off the adhesive surface.
  • the chuck table 1 is moved so that the next foreign material adhesion site is located below the tape cartridge 16, and the above operation is repeated thereafter.
  • step S6 When the foreign matter removal at all the foreign matter adhesion sites is completed, the lifting platform 14 is raised and returned to the standby position, and the processed substrate w is unloaded (step S6).
  • the foreign substance removing process for one substrate w is completed, and the next substrate w is prepared for loading.
  • the tape cartridge 16 is replaced with a new one.
  • the collected tape cartridge 16 can be re-used for IJ by exchanging the reel and cleaning it.
  • the adhesive tape T is applied only to the foreign matter p, and the substrate w Power to remove from S. Therefore, it is necessary to affix the adhesive tape to the entire surface of the substrate that cannot be cleaned! /. Therefore, the pressing force when applying adhesive tape T and the peeling stress when peeling adhesive tape T are minimized. Can be suppressed. In other words, damage to the substrate due to these effects can be suppressed.
  • the peeled and collected adhesive tape T is wound around the tape collecting reel 31 with the adhesive surface on the inner side (reel center axis side), so that the separation and scattering of the foreign matter p are prevented.
  • the tape collection unit 24 itself is isolated inside the tape cartridge 16 by the partition wall 21! /, So even if foreign matter falls off, the tape collection unit 24 is scattered to the tape supply unit 22 side and the adhesive tape T is applied. There is no contamination.
  • the adhesive surface n of the adhesive tape T can be covered with the separator s until just before the attaching process, it can be supplied without deterioration of the adhesive performance, and good foreign matter p.
  • the power S can be transferred.
  • Either one of the tape collection shaft 28 or the separator collection shaft 27 can be linked to the motor 41, and the pinion gear 40 can be configured as an idler gear.
  • the separator s after being peeled off from the adhesive tape T is wound up and collected on the individual separator collection reel 30. You may comprise so that it may collect
  • the tape supply reel force also feeds the adhesive tape T, and the separated separator s is guided to the upper part in the figure, and is guided to the tape collecting unit 24 through the gap of the partition wall 21.
  • the separator s is further guided to the nip roller 50 and bonded to the adhesive tape T from which foreign matter has been transferred, and is wound around the tape collection reel 30.
  • the nip roller 50 corresponds to the laminating mechanism of the present invention.
  • the foreign matter transferred to the adhesive tape T is sealed by the adhesive tape T and the separator s, so that it does not scatter again in the tape cartridge.
  • this is a force that prevents the unused adhesive surface supplied from the tape supply reel 31 from being contaminated by foreign matter.
  • a force that used a block-like member for the pressing member 26 is provided with a side wall 45 that functions as a positioning and guide in the width direction of the adhesive tape T as shown in FIG. It may be configured. In this case, when the tape cartridge 16 is swung, it is preferable that the front end side of the side wall 45 is cut away so that the exposed surface of the adhesive tape T is easily attached to the substrate T.
  • the tape cartridge 16 includes the pressing member 26.
  • the tape cartridge 16A has a shape in which the supply side and the recovery side protrude downward, and the adhesive tape T is exposed in a bridge shape across both ends, and formed on the non-adhesive surface side.
  • the pressing member 26A is configured to be disposed in the formed space. That is, by raising and lowering the pressing member 26A in the space, the adhesive surface n of the adhesive tape T can be locally attached to the foreign matter p on the substrate at its tip.
  • the adhesive tape T with a separator is used, and the force that peels and collects the separator s at the same time that the adhesive tape T with a force of 22 is fed out.
  • Reel adhesive tape T without separator with adhesive layer formed on the substrate You may utilize what was wound in the shape.
  • the tape cartridge 16 can be configured as follows, for example.
  • the interior of the housing 19 is partitioned into a tape supply unit 22 and a tape collection unit 24 by a partition wall 21.
  • the tape supply unit 22 is provided with a tape supply shaft 25.
  • the tape supply shaft 25 is free to rotate or has an appropriate rotational resistance.
  • a pressing member 26 is provided so that the tip slightly protrudes from an opening formed in the lower surface of the front end of the tape supply unit 22.
  • the pressure-sensitive adhesive tape T received by the pressing member 26 from the non-adhesive surface side exposes the downward-adhesive surface from the opening.
  • side walls 45 are provided on both side ends of the pressing member 26 to guide to the tip while restricting the wobbling in the tape width direction when the adhesive tape is running.
  • the output shaft 42 of the motor 41 is directly connected to the tape collection shaft 28. Therefore, it is configured to collect the adhesive tape T if it is wound in conjunction with the drive of the motor 41.
  • the number of drive shafts can be two as compared with the above embodiment, and the output shaft 42 of the motor 41 can be directly connected to the tape recovery shaft 28.
  • the drive mechanism can be simplified.
  • using two drive shafts absorbs (adjusts) the difference in rotational speed between the two shafts when collecting and collecting the tape. Therefore, it is easy to suppress tape winding, loosening, and winding deviation.
  • the present invention is suitable for removing foreign substances adhering to workpieces such as various substrates and lead frames using an adhesive tape.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne une cartouche de ruban pour nettoyage de substrats pouvant être utilisée de manière effective pour éliminer correctement et efficacement des matières étrangères fixées sur des substrats, autrement dit des ouvrages, au moyen d'un ruban adhésif. La cartouche de ruban comporte: une unité d'alimentation en ruban (22) chargée de l'alimentation en ruban adhésif (T); une unité de récupération de ruban (24) chargée d'enrouler et de récupérer le ruban adhésif (T) après que le ruban a adhéré au substrat, autrement dit à l'ouvrage, et de retirer le ruban du substrat; et un boîtier (19) qui contient l'unité d'alimentation en ruban (22) et l'unité de récupération de ruban (24) et qui comprend une unité d'exposition de ruban permettant au ruban adhésif (T) d'adhérer au substrat.
PCT/JP2007/067411 2006-09-29 2007-09-06 Cartouche de ruban pour nettoyage d'ouvrage WO2008041446A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006-267518 2006-09-29
JP2006267518 2006-09-29
JP2007230244A JP2008105015A (ja) 2006-09-29 2007-09-05 ワーククリーニング用のテープカートリッジ
JP2007-230244 2007-09-05

Publications (1)

Publication Number Publication Date
WO2008041446A1 true WO2008041446A1 (fr) 2008-04-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/067411 WO2008041446A1 (fr) 2006-09-29 2007-09-06 Cartouche de ruban pour nettoyage d'ouvrage

Country Status (3)

Country Link
JP (1) JP2008105015A (fr)
TW (1) TW200828483A (fr)
WO (1) WO2008041446A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103599893A (zh) * 2013-09-12 2014-02-26 宁波康强电子股份有限公司 功率集成电路引线框架原材料的清刷方法
CN108746083A (zh) * 2018-05-11 2018-11-06 贵港市申德机械设备有限公司 一种基于密闭结构的电雕制版用表面除尘装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4626669B2 (ja) 2008-04-14 2011-02-09 ソニー株式会社 送信装置、通信システム、送信方法及びプログラム
CN105817453A (zh) * 2016-05-20 2016-08-03 周末 一种电力设备用清洗装置
JP6420415B2 (ja) * 2017-03-16 2018-11-07 株式会社荏原製作所 基板処理装置
JP7429824B2 (ja) 2021-03-29 2024-02-08 株式会社フジクラ 清掃工具及び清掃方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182826A (ja) * 1982-04-20 1983-10-25 Nippon Kogaku Kk <Nikon> 異物の自動除去装置
JPH01175764U (fr) * 1988-05-30 1989-12-14
JP2006181425A (ja) * 2004-12-27 2006-07-13 Fujicopian Co Ltd ごみ取り用テープカートリッジ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182826A (ja) * 1982-04-20 1983-10-25 Nippon Kogaku Kk <Nikon> 異物の自動除去装置
JPH01175764U (fr) * 1988-05-30 1989-12-14
JP2006181425A (ja) * 2004-12-27 2006-07-13 Fujicopian Co Ltd ごみ取り用テープカートリッジ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103599893A (zh) * 2013-09-12 2014-02-26 宁波康强电子股份有限公司 功率集成电路引线框架原材料的清刷方法
CN108746083A (zh) * 2018-05-11 2018-11-06 贵港市申德机械设备有限公司 一种基于密闭结构的电雕制版用表面除尘装置
CN108746083B (zh) * 2018-05-11 2020-12-22 苏州丹运制版有限公司 一种基于密闭结构的电雕制版用表面除尘装置

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TW200828483A (en) 2008-07-01
JP2008105015A (ja) 2008-05-08

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