WO2008031250A1 - Cellule solaire de mémoire à puits quantiques - Google Patents
Cellule solaire de mémoire à puits quantiques Download PDFInfo
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- WO2008031250A1 WO2008031250A1 PCT/CN2006/002063 CN2006002063W WO2008031250A1 WO 2008031250 A1 WO2008031250 A1 WO 2008031250A1 CN 2006002063 W CN2006002063 W CN 2006002063W WO 2008031250 A1 WO2008031250 A1 WO 2008031250A1
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- 238000009792 diffusion process Methods 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 238000005468 ion implantation Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 29
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 19
- 229920005591 polysilicon Polymers 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- 238000000206 photolithography Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 230000003601 intercostal effect Effects 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical group FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 229910015900 BF3 Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000011065 in-situ storage Methods 0.000 claims description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- WKFBZNUBXWCCHG-UHFFFAOYSA-N phosphorus trifluoride Chemical compound FP(F)F WKFBZNUBXWCCHG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- KODMFZHGYSZSHL-UHFFFAOYSA-N aluminum bismuth Chemical compound [Al].[Bi] KODMFZHGYSZSHL-UHFFFAOYSA-N 0.000 claims 1
- 230000009194 climbing Effects 0.000 claims 1
- 230000002550 fecal effect Effects 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000012858 packaging process Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
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- 238000005286 illumination Methods 0.000 description 3
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 241000282441 Helarctos malayanus Species 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000272201 Columbiformes Species 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- Quantum bank solar cell and preparation method thereof are Quantum bank solar cell and preparation method thereof.
- the invention relates to a solar cell, in particular to a quantum library solar cell, and a preparation process of the novel solar cell.
- a solar cell is a semiconductor device having a photoelectric conversion function based on a semiconductor material.
- the principle of solar cells is to convert solar radiant energy directly into electrical energy based on the photovoltaic effect of the semiconductor.
- the existing solar cell is generally composed of a PN junction formed by a semiconductor substrate and a diffusion layer and an electrode drawn at both ends of the PN junction, which migrates photogenerated carriers generated under illumination conditions by a self-built electric field of the PN junction.
- a photo-generated current is formed on both sides of the PN junction to achieve the effect of photoelectric conversion.
- the efficiency of solar cells is a matter of concern.
- Monocrystalline silicon cells are the most efficient solar cells before conversion, and 3 ⁇ 4 can convert 16% ⁇ ?? 0% of incident light into current.
- the reason why only a small percentage of sunlight is converted into electrical energy is due to the fact that existing solar cells cannot convert most of the sunlight into electricity.
- the sunlight contains a wide aperture in the electric wave (0.25 ⁇ 2.2 ⁇ ), that is, from infrared light through various colors of visible light until the ultraviolet light is divided into ultraviolet light 7%, visible light 45% and infrared 47 %about.
- the light having a wavelength of less than 1,1 ⁇ m has sufficient energy.
- the length of the ⁇ is greater than 1,1 ⁇ long ⁇ part can not produce electricity to the ⁇ hole pair, but turned into heat. About 25% of the solar radiation can be used. For example, the energy of the light 4 produces electron-hole pairs, and the remaining energy is changed to the heat used by Qin. Add 30% of the solar unit will have ⁇ socks use.
- the structure of the new battery enables it to perform photoelectric conversion, and it is more capable of collecting "thermal energy carriers" to generate current, forming the main current of the battery, thereby making the conversion efficiency a qualitative leap.
- the present invention will also provide a process for the preparation of such a new structure quantum bank solar cell, enabling it to achieve large scale industrial production.
- a quantum library solar cell comprising a semiconductor substrate, a diffusion layer and upper and lower electrodes, wherein a lightly doped epitaxial layer of the same conductivity type as the semiconductor substrate is disposed on the edge of the semiconductor substrate layer,
- the ribs are elongated structures, including a plurality of parallel vertical ribs and at least one transverse rib, the transverse ribs are connected through a plurality of parallel vertical ribs; vertical ribs and transverse ribs
- the interval is a rib section;
- the elongated rib is provided with: a nano-ion implantation layer of opposite conductivity type to the epitaxial layer, and a highly doped layer of opposite conductivity type of the ion implantation layer, covered by a highly doped layer
- the high-doped layer is covered with a metal layer;
- the upper electrode lead is connected to the metal layer on the lateral rib;
- the diffusion layer is disposed in the entire inter-rib
- the epitaxial layer on the upper portion of the rib is subjected to a semiconductor process to form a nano ion implantation layer, a highly doped layer, and a metal.
- the spread of the 4 force g is the same as that of the traditional wood solar cell structure.
- the transverse ribs and the vertical ribs are substantially wished.
- the quantum-bank solar cell of the present invention is constructed by connecting a solar cell chip in series with a DC power source that generates a back-field voltage.
- the structure difference between the present invention and the conventional solar cell is: a rib and an intercostal region are divided on the epitaxial layer; and a diffusion layer is disposed in the intercostal region.
- An ion implantation layer and a highly doped layer are disposed on the rib; the highly doped layer covers the ion implantation layer, and the ion implantation layer is sandwiched between the epitaxial layer and the highly doped layer to form a sandwich structure, and the ion implantation layer is electrically conductive.
- the conductivity type of the type and epitaxial layer, the highly doped layer is opposite, and two PN junctions are formed in the sandwich structure.
- a diffusion layer Between the ribs of the plurality of sandwich structures is a diffusion layer, and the conductivity type of the diffusion layer is opposite to that of the epitaxial layer and the substrate.
- the sandwich structure on the ribs is joined to the diffusion layer provided in the intercostal region to form a reservoir well, that is, a quantum reservoir.
- the semiconductor substrate material and the epitaxial layer described in the above scheme together constitute a semiconductor base layer.
- the semiconductor epitaxial layer may be p-type, the diffusion layer is n + type, the ion implantation layer is n + type, and the highly doped layer is p ++ type; or
- the semiconductor epitaxial layer may be n-type, the diffusion layer is p+ type, the ion implantation layer is p+ type, and the highly doped layer is n ++ type;
- the ", + , ++ " in the above description indicates the degree of impurity doping in the semiconductor material, which indicates light doping, heavy doping, and overweight doping, respectively.
- the ion implantation layer has a lift of 10 14 10 19 cm' 3 and a thickness between lnra and 100 nm.
- the doping concentration of the highly doped layer is much higher than that of the diffusion layer in the conventional process, and the thickness of the highly doped layer can reach 10 17 to 10 21 cm - 3 and the thickness is about several thousand A.
- the metal layer may be a commonly used metal A1 or the like.
- the back field voltage is applied between the upper and lower electrodes, and a reverse bias voltage source is applied between the upper and lower electrodes.
- the structure of the present invention is quite different from conventional solar cells, such as:
- the invention is provided with an epitaxial layer having a thickness of between 15 ⁇ m and 20 ⁇ m, which plays a role in increasing the quantum reservoir capacity in the device to ensure optimum output power.
- Conventional solar cells do not have this structure; if an epitaxial layer is placed on a conventional solar cell, it will result in an increase in the open circuit voltage and a reduction in the photoelectric conversion rate. In the structure of the present invention, it is an important structural condition for improving the transfer rate.
- the special structure of the solar cell in the above scheme and the added reverse back-field voltage supply become the key to improve the conversion efficiency. As long as the back-field voltage is kept rated and the working state is stable, the quantum-tank solar cell can maintain an effective output power.
- the invention has the following optimization schemes:
- the principle of setting the reverse back-field voltage of the solar cell solar cell is: the back-field voltage is a reverse bias voltage, and the internal resistance of the reverse bias voltage DC power supply is less than/equal to the internal resistance of the load battery.
- N where ⁇ is greater than 3, can be 3, 4, 5, etc. (not excluding non-integer ratio), the larger the ideal value, the better the effect; the value of practical industrial use is above.
- the ratio of the back field voltage DC power supply to the internal resistance of the load battery will be close to infinity. With such a low internal resistance battery as the back field voltage direct current power supply, the conversion efficiency of the present invention can be further improved.
- the back-field voltage is the reverse bias voltage and should be higher than the load battery voltage.
- the reverse bias voltage is always higher than the load battery voltage of about 2V.
- the present invention recommends the following data:
- the back-field voltage of the fan is 1 5 V.
- the strip-shaped vertical ribs may be arranged in a plurality of parallel dam shapes, each of which has a width of between several micrometers and ten kilometers, and a distance between adjacent two vertical ribs (ie The intercostal space width is several hundred microns.
- Each of the vertical ribs and its adjacent intercostal zone form a strip-shaped unit, and a plurality of strip-shaped units are sequentially connected to constitute the main structure of the present invention.
- a comb-like electrode structure is formed on the front side (negative electrode) of the battery.
- the upper electrode connecting line may be disposed on the metal layer at the top of the transverse rib, and the horizontal rib may be set 2 pieces.
- a highly doped electrode layer of a heavily doped polysilicon material may be provided on one side of the semiconductor epitaxial layer, and the lower electrode connection line is directly extracted from the highly doped electrode layer.
- the thickness of the epitaxial layer is 15-20 microns, and the resistivity is 7.5 ⁇ 8.50.cm; the thickness of the ion implantation layer is 1 ⁇ 100 nm; the thickness of the highly doped layer Use on the order of submicron.
- the back-field voltage power supply can be used without a battery, and the back-field voltage is set by a circuit composed of a transformer and a rectifier.
- An intrinsic layer ( ⁇ ) capable of buffering may be provided between the ion implantation layer and the highly doped layer; and between the ion implantation layer and the semiconductor base layer.
- An isolation trench is provided by diffusion at the periphery of the substrate layer.
- the semiconductor substrate material is made of a heavily doped semiconductor material having a resistivity of less than 0.005 Q, pm.
- the present invention described technical solution can have a variety of implementations, including various forms of prior art technique and help, for example: passivation layer, antireflection film, using the gate electrode and the like, and can be conventional
- the solar cells are the same.
- the output voltage of the solar panel is about to be larger than the back-field voltage, and the power supply of the back-field voltage cannot output current to the load, so during use, the voltage of the back-field voltage power supply is basically stable.
- the invention adopts a technical scheme of increasing the ion implantation layer and the highly doped layer and the epitaxial layer, and setting the back field voltage between the semiconductor substrate and the highly doped layer, in particular, selecting a specific back-field voltage power supply.
- the efficiency of the solar cell is greatly improved under the boundary conditions of the internal resistance ratio: the output current of the conventional solar cell is 30 mA; and the output current of the quantum solar cell of the present invention can be increased from 150 mA; the conventional solar cell The output voltage is 0.
- the transmission voltage of the present invention is about 15V, even up to 1TV;
- the output power of the conventional solar cell is generally 0.02W/cm 2 ;
- the present invention i
- the output power of the solar panel can reach 2W/ Cm 2 ; 7W/cm 2 can be achieved under the conditions of the real room.
- the efficiency of the invention is the result of actual test and detection; the data far exceeds the limit efficiency of current solar power generation theory.
- the self-built electric field (built-in field) of the solar cell and the external DC power source electric field (external field) ⁇ " lightly form a new electric field, and this new total electric field can expand the original space charge area by many times.
- the disordered motion of the hot electrons is Ordered motion, the formation of current, thus greatly seeking high conversion efficiency.
- the photoelectric conversion efficiency in the traditional sense is not suitable for estimating the conversion efficiency of the battery, because the battery mainly has thermoelectric conversion in addition to photoelectric conversion, and the surrounding heat is difficult to measure, and the battery cannot be converted by conversion efficiency. Indicates that it is represented only by the measured power. The details of its specific mechanism of action need further discussion.
- the method for preparing a quantum library solar cell of the present invention comprises the following steps:
- the formation of the diffusion region is oxidized on the epitaxial layer and subjected to lithography on the predetermined intercostal region, and then diffused to form a p + type or n + type diffusion region;
- the formation of the ion-injecting layer regenerates a layer of silicon dioxide, followed by lithography: a window is formed at a position of the rib left between the diffusion regions, and the oxide layer of the window region is etched away; Or diffusing a compound of a three or five element, and annealing to advance the shield to a desired depth to form a p+ or n + ion implantation layer;
- Formation of a highly doped layer re-grows a layer of silicon oxide on the ion implantation layer, followed by a third photolithography, engraving a window, growing polysilicon; performing a fourth photolithography, etching away the polysilicon a layer, and engraving a diffusion window, injecting or diffusing a compound of a three or five-element element by forming an ion implantation, or forming a highly doped layer by an LPCVD method;
- the aluminum is vaporized on the surface of the highly doped layer to form a vaporized aluminum storm, and the fifth photolithography is performed to form a metal electrode interconnection;
- the back-field voltage supply is operated in the electric room.
- the last step in the preparation process (connecting the back-field voltage supply) can be temporarily not performed during the production phase, and the connection is made while the solar cell is in use.
- the substrate material is a heavily doped semiconductor material, such as n ++ type or P ++ type silicon, and the resistivity is less than 0.005 ⁇ -cm;
- the thickness of the epitaxial layer prepared is 15 ⁇ 20 ⁇ m; the resistivity is 7, 5 « 8.5 ⁇ -cm;
- 3 ⁇ 4 moments of the process conditions are: temperature control at 30 ⁇ 50 ° C, time 3 ⁇ 5 minutes;
- the process conditions are: temperature control at 1000 ⁇ 1200 °C, time 16 20 minutes;
- the process conditions are as follows: injecting a tri- or five-membered element at 50 kV
- the temperature is controlled at 1000 ° C, the time is about 3 hours, the concentration is 10 14 ⁇ 10 19 cm - 3 ; the thickness is made in Inm ⁇ 100mn, and the width is several micrometers to several tens of micrometers;
- the conditions of the in-situ doping process are as follows: temperature control at S50 650 ° C, vacuum degree control at 10 ⁇ 5 ⁇ , heat preservation for three hours, growth of mixed polysilicon, thickness Controlled at about 1 micron; concentration 10 17 ⁇ 10 21 cm - 3 ; width from a few microns to tens of microns;
- the conditions for evaporating the aluminum layer on the surface of the highly doped implantation region are: temperature 1148 ° C, substrate temperature 250 ° C, constant temperature 8 to 12 minutes, forming a surface on the highly doped layer Steamed aluminum layer;
- the voltage of the back-field voltage supply is a reverse bias voltage applied between the electrodes, so that the reverse bias voltage of the device is 0.1 to 3V. If the load is a battery, the internal resistance of the DC power supply is less than / equal to 1/N of the battery, and the optimum value of N is equal to or greater than 6.
- the invention overcomes the deficiencies of the conventional solar cell light unit area output power is too low, and provides a new structure of the quantum-bank solar cell, which can fully absorb the "thermal energy carrier" to generate current while performing photoelectric conversion, thereby forming the battery.
- the main current so that the conversion efficiency is qualitatively leap.
- the preparation process of the new structure quantum library solar cell provided by the invention is a mature process, and can realize large-scale industrial production.
- Embodiment 1 is a schematic structural view of Embodiment 1 of the present invention.
- Fig. 2 is a schematic structural view of Embodiment 2 of the present invention.
- Embodiment 1 a quantum-bank solar cell, which is composed of a solar cell panel and a DC power source with a back-field voltage connected in series.
- the structure thereof is as shown in FIG. 1:
- a metal electrode layer 14 is disposed under the over-doped n ++ type silicon substrate 1 and connected There is a lower electrode 6, n ++ fish silicon substrate 1 is provided with a lightly doped ITO-type silicon epitaxial layer 10, the epitaxial layer 10 has a thickness of 15-20 microns, and a plurality of parallel verticals are arranged thereon.
- the section of the vertical rib 11 transverse rib 13 is a rib section 12;
- the vertical rib 11 is provided with a p + -type ion implantation layer 3 and an n ++ type highly doped layer 4, highly doped Layer 4 covers the ion method into the layer?
- the upper layer 4 is covered with a metal aluminum; the upper electrode is connected to the metal aluminum layer 9 of the T-shaped portion of the transverse rib 13; the inter-rib region is p + type diffusion easy 2, and the diffusion layer 2 is An oxide layer 5 is provided.
- a power source 15 having a DC back-field voltage is externally connected between the upper and lower electrodes 7, 6 and has a back-field voltage of 15 V, and an internal resistance of less than or equal to one-sixth of the internal resistance of the load battery.
- the ion implantation layer 3 is sandwiched between the ⁇ -type epitaxial layer 1 and the n ++ -type high-porosity layer 4, and the two junctions are formed to form a 1! ++ ⁇ + , 11-sandwich structure.
- the + -type ion implantation layer 3 is covered by the n ++ high-porosity layer 4 and has a thickness of lrnn to 100 nm.
- the n ++ , p + , n- sandwich structure is arranged in a rib shape, and each vertical rib 11 has a width of several micrometers to ten Between a few micrometers, which are rectangular regions formed by the p+ type diffusion layer 2, the distance between adjacent two vertical ribs 11 (i.e., the width of the intercostal zone) is several hundred micrometers.
- the upper surface of the diffusion layer 2 is covered with an oxide layer 5 for receiving solar energy incident energy during operation.
- the ribs 11, 13 formed by the respective n ++ , p + , n - sandwich structures are connected by the metal aluminum layer 5. Electrodes 6 and 7 are taken up from the aluminum layer 5 at the top of the sinus electrode layer 14 and the transverse ribs 13, respectively.
- the specific preparation process of the nano quantum library solar cell of this embodiment is shown in FIG. 2, and includes the following steps:
- the substrate is prepared by using a heavily doped ⁇ ++ huang silicon semiconductor material with a resistivity of less than 0.005 ⁇ -cm; a standard (100 ) crystal plane is selected;
- epitaxial layer growth epitaxial growth of a layer of lightly doped n-silicon the thickness of the epitaxial layer prepared is 15 ⁇ 20 microns; resistivity 7.5 ⁇ 8.5i c;
- the formation of the diffusion layer is about 5 parts dry oxygen plus 60 parts wet oxygen plus 5 parts dry oxygen.
- the oxidation temperature is controlled at 1100 °C to regenerate a layer of silicon dioxide on the surface of the rT type epitaxial layer 10; the temperature is controlled at 40. °G, time 4 minutes, etch away the oxide layer of the diffusion region to form a diffusion window; temperature control at 1100 ° C, time 18 minutes, through the diffusion of boron on the rib section 12 of the n-type silicon epitaxial layer, impurity promotion a depth of micron, forming a ⁇ + diffusion layer 2;
- the formation of the ion implantation layer about 30 minutes of wet oxygen plus 40 parts of dry oxygen, the temperature is controlled at 1050 ⁇ , and then a layer of silicon dioxide, followed by a second photolithography, vertical ribs 11 between the diffusion regions and The oxide layer is etched away from the position of the transverse rib 13; the trifluorochemical shed is injected at 50 kV, the temperature is controlled at 1000 ° C, the time is about 3 hours, and the thickness is controlled at km! ⁇ lOOrnn, concentration 10 14 ⁇ 10 19 cm ⁇ 3 , annealing to form ion implantation layer 3;
- the third lithography of the high-doping storm the window is carved on the surface of the ion implantation layer 3, and the oxide layer is etched to grow polysilicon;
- the fourth photolithography is performed, and the temperature is controlled at 600 ° C, the degree of vacuum Controlled at 1 (T S ⁇ , held for three hours, concentration 10 17 ⁇ 10 21 cm - 3 , arsenic doped with polysilicon, forming a highly doped layer 4;
- the main difference between the embodiment 2 shown in FIG. 2 and the embodiment 1 is that the semiconductor substrate 1 is of the p ++ type, the epitaxial layer is p type, the diffusion layer 2 is of the n + type, and the ion implantation layer 3 is of the n + type.
- the highly doped layer 4 is of the p ++ type.
- the high-permeability impurity layer is doped with polysilicon, and the doped polysilicon can be used not only as a doping diffusion source, but also as a doping diffusion source.
- the highly permeable electrode layer 8 on one side of the semiconductor epitaxial layer is directly used as the extraction electrode of the lower electrode 6. In this way, not only the extraction of the electric raft is more square, but also the planar structure can be realized, which can be produced by using single crystal silicon, and the cost is low.
- the method for preparing a quantum-storage solar cell of the present embodiment is different from that of the first embodiment in that: in the diffusion layer forming step, boron diffusion is replaced by phosphorus diffusion; in the ion implantation layer forming step, phosphorus trifluoride ion implantation is substituted. Boron trifluoride ion implantation; in the highly doped layer formation step, growth of boron-doped polysilicon is used to grow the arsenic-doped polysilicon.
- an intrinsic layer may be provided between the highly doped layer and the ion implantation layer, and between the ion implantation layer and the substrate.
- a ⁇ + or ⁇ + isolation trench is provided by diffusion at the periphery of the substrate (in order to reduce the cost, the isolation trench may not be provided).
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800111949A CN101167192B (zh) | 2006-08-14 | 2006-08-14 | 量子库太阳能电池及其制备方法 |
EP06775381A EP2068376A1 (en) | 2006-08-14 | 2006-08-14 | A solar cell of quantum well store |
US12/312,447 US20100018575A1 (en) | 2006-08-14 | 2006-08-14 | Solar cell of quantum well store and method of preparation thereof |
PCT/CN2006/002063 WO2008031250A1 (fr) | 2006-08-14 | 2006-08-14 | Cellule solaire de mémoire à puits quantiques |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2006/002063 WO2008031250A1 (fr) | 2006-08-14 | 2006-08-14 | Cellule solaire de mémoire à puits quantiques |
Publications (1)
Publication Number | Publication Date |
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WO2008031250A1 true WO2008031250A1 (fr) | 2008-03-20 |
Family
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Family Applications (1)
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PCT/CN2006/002063 WO2008031250A1 (fr) | 2006-08-14 | 2006-08-14 | Cellule solaire de mémoire à puits quantiques |
Country Status (4)
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US (1) | US20100018575A1 (zh) |
EP (1) | EP2068376A1 (zh) |
CN (1) | CN101167192B (zh) |
WO (1) | WO2008031250A1 (zh) |
Families Citing this family (1)
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CN102347400B (zh) * | 2011-08-13 | 2013-04-24 | 吴忠举 | 太阳能电池板自动跟踪及自动清洁装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4367368A (en) * | 1981-05-15 | 1983-01-04 | University Patents Inc. | Solar cell |
JP2000183379A (ja) * | 1998-12-11 | 2000-06-30 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
US6147297A (en) * | 1995-06-21 | 2000-11-14 | Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Solar cell having an emitter provided with a surface texture and a process for the fabrication thereof |
CN1319898A (zh) * | 2001-04-11 | 2001-10-31 | 陈钟谋 | 纳米光-热伏电池及其制备方法 |
CN1341969A (zh) * | 2001-10-17 | 2002-03-27 | 陈钟谋 | 微型高效宽光谱换能器及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3936319A (en) * | 1973-10-30 | 1976-02-03 | General Electric Company | Solar cell |
US5410175A (en) * | 1989-08-31 | 1995-04-25 | Hamamatsu Photonics K.K. | Monolithic IC having pin photodiode and an electrically active element accommodated on the same semi-conductor substrate |
AU8872891A (en) * | 1990-10-15 | 1992-05-20 | United Solar Systems Corporation | Monolithic solar cell array and method for its manufacture |
US5747967A (en) * | 1996-02-22 | 1998-05-05 | Midwest Research Institute | Apparatus and method for maximizing power delivered by a photovoltaic array |
-
2006
- 2006-08-14 WO PCT/CN2006/002063 patent/WO2008031250A1/zh active Application Filing
- 2006-08-14 CN CN2006800111949A patent/CN101167192B/zh not_active Expired - Fee Related
- 2006-08-14 US US12/312,447 patent/US20100018575A1/en not_active Abandoned
- 2006-08-14 EP EP06775381A patent/EP2068376A1/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4367368A (en) * | 1981-05-15 | 1983-01-04 | University Patents Inc. | Solar cell |
US6147297A (en) * | 1995-06-21 | 2000-11-14 | Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Solar cell having an emitter provided with a surface texture and a process for the fabrication thereof |
JP2000183379A (ja) * | 1998-12-11 | 2000-06-30 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
CN1319898A (zh) * | 2001-04-11 | 2001-10-31 | 陈钟谋 | 纳米光-热伏电池及其制备方法 |
CN1341969A (zh) * | 2001-10-17 | 2002-03-27 | 陈钟谋 | 微型高效宽光谱换能器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100018575A1 (en) | 2010-01-28 |
EP2068376A1 (en) | 2009-06-10 |
CN101167192B (zh) | 2011-07-20 |
CN101167192A (zh) | 2008-04-23 |
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