WO2008012973A1 - Procédé de formation d'un motif conducteur, processus de production d'un substrat en résine à l'aide du procédé, et substrat en résine - Google Patents

Procédé de formation d'un motif conducteur, processus de production d'un substrat en résine à l'aide du procédé, et substrat en résine Download PDF

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Publication number
WO2008012973A1
WO2008012973A1 PCT/JP2007/059753 JP2007059753W WO2008012973A1 WO 2008012973 A1 WO2008012973 A1 WO 2008012973A1 JP 2007059753 W JP2007059753 W JP 2007059753W WO 2008012973 A1 WO2008012973 A1 WO 2008012973A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
conductor pattern
diameter portion
resin
main surface
Prior art date
Application number
PCT/JP2007/059753
Other languages
English (en)
Japanese (ja)
Inventor
Masashi Arai
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Publication of WO2008012973A1 publication Critical patent/WO2008012973A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another

Definitions

  • the present invention relates to a method for forming a conductor pattern of an electronic circuit, and more specifically, a method for forming a conductor pattern for transferring a conductor pattern formed on a support plate to a resin layer, and a resin substrate using this method
  • the present invention relates to a manufacturing method and a resin substrate.
  • Patent Document 1 As a conventional technology of this type, for example, there is a substrate proposed in Patent Document 1 and a manufacturing method thereof.
  • a stainless steel plate 1 is prepared as shown in FIG. 7 (a), this stainless steel plate 1 is coated with a photoresist film 2A as shown in FIG.
  • the resist film 2A is exposed and developed to form a resist layer 2 having openings of a predetermined pattern as shown in FIG.
  • the resist layer 2 is removed by treatment with a resist stripping solution as shown in (e) of the figure. To do.
  • a pre-preda 4 having good peelability from the stainless steel 1 is pressure-bonded to the stainless plate 1 to thereby pre- After being embedded in 4 and heat-curing the prepreader 4, the stainless steel plate 1 is peeled off to obtain a substrate having the conductor layer 3 transferred in the prepreader 4.
  • Patent Document 1 JP 2004-214633 A
  • the pre-preder 4 is in close contact with the conductor layer 3 due to the anchor effect of the conductor layer 3 roughened on the surface.
  • the surface of the roughened conductor layer 3 has a sufficient anchor effect, stainless steel 1 is peeled off by prepreader 4 force, and when conductor layer 3 is peeled off by prepreader 4 force, conductor layer 3 is completely removed from stainless steel plate 1 into prepreg 4. There is a possibility that it cannot be transferred.
  • the conductor layer 3 Since a surface roughening process is required, the manufacturing cost increases accordingly.
  • the present invention has been made to solve the above-described problems.
  • a conductor pattern formed on a support plate can be completely transferred to the resin layer with the support plate force. It is an object of the present invention to provide a method of forming a conductor pattern that can reduce the manufacturing cost by omitting the surface roughening step of the pattern, a method of manufacturing a resin substrate using this method, and a resin substrate. .
  • the conductor pattern forming method of the present invention includes a conductor pattern having an overhanging cross section in which a small diameter portion and a large diameter portion are sequentially formed on a main surface of a support plate from the main surface vertically upward.
  • a second step of providing a resin layer on the main surface of the support plate, and embedding the conductor pattern having the cross-sectional overhang in the resin layer, and the cross-over overhang A third step of peeling the resin layer from the support plate with the large-diameter portion of the conductor-like conductor as an anchor, and transferring the cross-overhanging conductor pattern from the support plate to the resin layer; have.
  • the first step includes a step of forming a resist layer having an opening having the same diameter as the small diameter portion on the main surface of the support plate.
  • a plating film is grown on the opening of the resist layer to form the small-diameter portion of the conductor pattern having an overhanging cross section, and the plating film is further applied to the outer edge of the opening of the resist layer. It is preferable to have a step of growing to form the large diameter portion of the conductor pattern having an overhanging cross section and a step of removing the resist layer from the support plate.
  • the support layer is peeled off with the resin layer force while the resin layer is in a semi-cured state.
  • the method for producing a resin substrate according to the present invention includes at least one resin layer, and an input / output electrode for connection to the mother substrate on the main surface of the resin layer.
  • This is a method for producing a fat substrate, which is a method for obtaining a conductor pattern having an overhanging cross section in which a small diameter portion and a large diameter portion are sequentially formed on a main surface of a support plate in a direction vertically upward of the main surface force. Step 1 and a resin layer is provided on the main surface of the support plate, and the cross-sectional overhang is formed on the resin layer.
  • the conductor pattern having an overhanging cross section is transferred as an input / output electrode to form an input / output electrode provided by the exposed end face on the small diameter side of the conductor pattern on the main surface side of the resin layer.
  • the first step includes a step of forming a resist layer having an opening having the same diameter as the small diameter portion on the main surface of the support plate.
  • a plating film is grown on the opening of the resist layer to form the small-diameter portion of the conductor pattern having an overhanging cross section, and the plating film is also formed on the upper peripheral edge of the opening of the resist layer. Is preferably further grown to form the large-diameter portion of the conductor pattern having an overhanging cross-section and the step of removing the support plate force and the resist layer.
  • the support plate is peeled from the resin layer while the resin layer is in a semi-cured state.
  • the resin layer is formed on the opposite side from the side on which the conductor pattern is provided. It is preferable to have a step of forming an interlayer connection conductor pattern that reaches the conductor pattern.
  • another method for manufacturing a resin substrate of the present invention is to manufacture a resin substrate having at least one resin layer and having a surface-mounted electronic component embedded in the resin layer.
  • the conductor layer having the cross-sectional overhang shape is peeled off from the resin layer.
  • the first step forms a resist layer having an opening having the same diameter as the small diameter portion on the main surface of the support plate. And a step of growing a plating film in the opening of the resist layer to form the small-diameter portion of the conductor pattern having an overhanging cross section, and also forming a plating film on the upper peripheral edge of the opening of the resist layer. And a step of forming the large-diameter portion of the conductor pattern having an overhanging cross section and a step of removing the resist layer from the support plate. preferable.
  • the support plate is peeled off from the resin layer while the resin layer is in a semi-cured state.
  • the method for producing a resin multilayer substrate according to the present invention includes at least one resin layer, and a small-diameter portion and a large-diameter portion are sequentially formed from the main surface of the resin layer in a vertically upward direction.
  • a first conductor pattern having a cross-sectionally overhanging shape is embedded, and the small-diameter portion side of the first conductor pattern having a cross-sectionally overhanging shape is exposed as an input / output electrode for connecting the main surface side force.
  • the second step of obtaining the oil layer and the main surface of the first oil layer A third step of bonding the first resin layer and the second resin layer so that the opposite main surface and the main surface of the second resin layer are in contact with each other; have.
  • the first resin layer and the second resin layer are bonded together via an intermediate layer.
  • the resin substrate of the present invention is a resin substrate having at least one resin layer, on which an input / output electrode for connection to a mother substrate is formed.
  • the input / output electrode is composed of a conductor pattern having a cross-sectional overhang shape in which a small-diameter portion and a large-diameter portion are sequentially formed from a main surface of the resin layer in a vertical direction. Given by the exposed end face on the small diameter side of the conductor pattern having an overhanging cross section. It is.
  • an interlayer connection conductor pattern reaching the large diameter portion of the conductor pattern having an overhanging cross section from the main surface opposite to the main surface of the resin layer is provided. Have, and prefer.
  • solder resist is formed on a peripheral portion of the input / output electrode surface
  • Another resin substrate of the present invention is a resin substrate having at least one resin layer and having a surface-mount electronic component embedded in the resin layer,
  • the oil layer has a conductor pattern with an overhanging cross-section in which a small diameter portion and a large diameter portion are sequentially formed in a direction perpendicular to the main surface force thereof.
  • the terminal electrode of the surface-mounted electronic component is mounted so as to be joined to the upper side of the large-diameter portion of the conductor pattern having an overhanging cross section.
  • an interlayer connection conductor reaching the large diameter portion of the conductor pattern having an overhanging cross section from the main surface opposite to the main surface of the resin layer may be provided.
  • the resin multilayer substrate of the present invention includes a first resin layer in which an input / output electrode for connection made of the first conductor pattern is embedded and having at least one resin layer;
  • Each of the conductor patterns and the surface mount type electronic components mounted so as to be bonded to the conductor pattern are embedded and bonded to the second resin layer having at least one resin layer.
  • the first conductive pattern has a cross-sectional overhang formed by sequentially forming a small-diameter portion and a large-diameter portion vertically upward from the main surface in the first resin layer.
  • the exposed end face of the main surface force on the small diameter portion side is formed as an input / output electrode for connection, and the second conductor pattern is formed of the second conductor pattern force.
  • the main surface force in the fat layer The surface-mounted electronic component is bonded to the upper side of the large-diameter portion of the second conductor pattern, and has the above-mentioned first resin.
  • the main surface opposite to the main surface of the layer is joined to the main surface of the second resin layer.
  • the conductor pattern formed on the support plate can be completely transferred from the support plate into the resin layer, and the surface roughness of the conductor pattern can be eliminated.
  • FIG. 1 is a cross-sectional view showing one embodiment of a resin multilayer substrate according to the present invention.
  • FIG. 2 (a) and (b) are explanatory diagrams of the conductor pattern shown in FIG. 1, respectively.
  • FIG. 3 (a) to (h) are cross-sectional views showing an embodiment of the method for forming a conductor pattern of the present invention in the order of steps.
  • FIG. 4 (a) to (f) are cross-sectional views showing an embodiment of a method for producing a resin substrate of the present invention in the order of steps.
  • FIG. 5 (a) to (d) are cross-sectional views showing, in the order of steps, another embodiment of the method for producing a resin substrate of the present invention.
  • FIG. 6 is a cross-sectional view showing main steps of an embodiment of the method for producing a resin multilayer substrate of the present invention.
  • FIG. 7 is a cross-sectional view showing an example of a conventional method for forming a conductor pattern in the order of steps.
  • FIG. 1 is a cross-sectional view showing an embodiment of the resin multilayer substrate of the present invention
  • FIGS. 2 (a) and 2 (b) are explanatory diagrams and diagrams of the conductor pattern shown in FIG. 3 (a) to (h) are sectional views showing one embodiment of the method for forming a conductor pattern of the present invention in the order of steps
  • FIGS. 4 (a) to (f) are the resin substrates of the present invention.
  • FIG. 5A is a cross-sectional view showing another embodiment of the method of manufacturing a resin substrate according to the present invention
  • FIG. It is sectional drawing which shows the principal part process of one Embodiment of the manufacturing method of the resin multilayer substrate of this invention.
  • the resin multilayer substrate 50 of the present embodiment includes a lowermost first resin layer 10, an uppermost second resin layer 20, and a first resin layer. And an intermediate resin layer 30 interposed between the first resin layer 10 and the second resin layer 2, and these resin layers are laminated together.
  • the first resin layer 10 has a first wiring pattern 11, and the second resin layer 20 has a second wiring pattern 21 and a surface mount electronic component 22.
  • the intermediate resin layer 30 has a third wiring pattern 31 that connects the first wiring pattern 11 of the first resin layer 10 and the second wiring pattern 21 of the second resin layer 20. ing.
  • the first wiring pattern 11 is formed on the first resin layer 10. As shown in FIG. 1, the first wiring pattern 11 has a predetermined pattern from the first main surface (lower surface) of the first resin layer 10 toward the second main surface (upper surface) on the opposite side.
  • a first conductor pattern 12 formed so as to extend vertically upward
  • a first via-hole conductor 13 formed in a predetermined pattern so as to be appropriately connected to the upper end of the first conductor pattern 12
  • a first in-plane conductor 14 formed in a predetermined pattern on the upper surface of the one resin layer 10, and the first conductor pattern 12 and the first in-plane conductor 14 are the first in-plane conductor 14. They are electrically connected to each other via via-hole conductors 13.
  • the first conductor pattern 12 has a resin multilayer substrate 50 mounted on it. It is configured as an input / output electrode for connection to the one substrate, and its lower end surface is flush with the lower surface of the first resin layer 10.
  • the lower surface of the first resin layer 10 is covered with a solder resist film 15, and the solder resist film 15 is opened in a predetermined pattern so that the lower end surface of the first conductor pattern 12 is exposed.
  • the first conductor pattern 12 has a small-diameter portion 12A and a large-diameter portion 12B sequentially formed from the bottom surface of the first resin layer 10 vertically upward.
  • the cross-sectional shape is overhanging.
  • the first conductor pattern 12 is formed by transferring it into the first resin layer 10 using the conductor pattern forming method of the present invention as will be described later.
  • the large diameter portion 12B of the first conductor pattern 12 functions as an anchor so as not to be peeled off from the first resin layer 10 when transferred into the first resin layer 10.
  • the first conductor pattern 12 of the present embodiment is formed as a cylindrical land pattern having an overhanging cross section by a small diameter portion 12A and a large diameter portion 12B as shown in FIG. 2 (a). .
  • the first conductor pattern 12 is not limited to a cylindrical shape, and a narrow portion 12C and a large portion 12D are sequentially formed from the bottom surface of the first resin layer 10 vertically upward as shown in FIG. It may be formed as an overhang-shaped wiring line (rail-shaped wiring line: routing pattern).
  • the difference tl between the outer diameter of the large diameter portion 12B and the outer diameter of the small diameter portion 12A is preferably in the range of 5 to 50 ⁇ m, for example. If the difference tl is less than 5 ⁇ m, the anchor effect is small.
  • the height t2 of the small-diameter portion 12A is preferably in the range of 10 to 50 m, for example, when using the Mitz method.
  • the difference t3 between the height of the large diameter portion 12B and the height of the small diameter portion 12A is preferably in the range of, for example, 5 to L0 m.
  • the anchor effect is small, and if it exceeds 50 m, it is not suitable for low profile.
  • the outer diameter t4 of the small diameter portion is preferably about 250 ⁇ 50 m in the case of the land pattern, and about 50 to about L00 ⁇ m in the case of the routing pattern.
  • the first via hole conductor 13 is arranged in a predetermined pattern in the first resin layer 10, and the lower end of the first via hole conductor 13 is the large diameter portion 12 B of the first conductor pattern 12. It reaches the upper surface and is electrically connected, and its upper end is connected to the first in-plane conductor 14.
  • the conductor 13 is formed, for example, by filling a conductive resin in a via hole formed in a predetermined pattern.
  • the first via-hole conductor 13 is not limited to conductive resin, and can also be formed by performing a metallization process and metallizing the inside of the via hole with a conductive metal.
  • the first in-plane conductor 14 is formed in a predetermined wiring pattern with a conductive metal. The top and bottom surfaces of the first in-plane conductor 14 are subjected to surface roughening treatment, and are bonded to both the first and intermediate resin layers 10 and 30 by using the anchor effect. preferable.
  • the first resin layer 10 is preferably formed of a thermosetting resin containing an inorganic filler such as a pre-predder or silica in which a base material is impregnated with a thermosetting resin or the like. Good.
  • the thermosetting resin for example, epoxy resin, phenol resin, cyanate resin and the like excellent in heat resistance and moisture resistance are preferable.
  • the first conductor pattern 12 is preferably formed by plating with a conductive metal such as electrolytic copper.
  • the conductive resin of the first via-hole conductor 13 is preferably formed of a conductive resin composition containing, for example, metal particles and a thermosetting resin.
  • the thermosetting resin in which metal such as gold, silver and nickel is preferred as the metal particle a resin according to the resin layer 10 is preferable.
  • the first in-plane conductor 14 can be formed by patterning, for example, a metal foil, a plating film, or the like by a photolithography technique.
  • the in-plane conductor 14 is obtained by transferring a previously patterned metal foil onto the upper surface of the first resin layer 10.
  • the in-plane conductor 14 may be formed by patterning a metal foil previously provided on the upper surface of the first resin layer 10.
  • the in-plane conductor 14 can be obtained by patterning the plating film provided on the first resin layer 10.
  • the second resin layer 20 is preferably formed of a resin having a small difference between the coefficient of thermal expansion and the coefficient of thermal expansion of the first resin layer 10. More preferably, it is formed of the same resin as layer 10.
  • the second wiring pattern 21 is formed on the second resin layer 20, and the surface mounting type electronic component 22 is connected to the wiring pattern 21.
  • the second wiring pattern 21 is a second conductor pattern 2 formed so as to extend vertically upward in a predetermined pattern from the lower surface of the second resin layer 10 toward the upper surface. 3 and a second via hole conductor 24 formed in a predetermined pattern so as to be appropriately connected to the upper end of the second conductor pattern 23, and formed in a predetermined pattern on the upper surface of the second resin layer 20.
  • the second in-plane conductor 25, and the second conductor pattern 23 and the second in-plane conductor 25 are electrically connected to each other through the second via-hole conductor 24.
  • the second conductor pattern 23 has a small-diameter portion 23A and a large-diameter portion 23B with the bottom surface force of the second resin layer 20 also directed vertically upward. They are formed sequentially, and the cross-sectional shape is an overhang shape, which is formed according to the first conductor pattern 12.
  • the second conductor pattern 23 includes, for example, a terminal electrode (land pattern) 231 for mounting the surface-mounted electronic component 22 and a routing electrode (routing pattern) 232.
  • the second via-hole conductor 24 and the second in-plane conductor 25 are also formed in accordance with the first via-hole conductor 13 and the first in-plane conductor 14.
  • the second in-plane conductor 25 is configured as a shield electrode film that covers the upper surface of the second resin layer 20 and protects the surface-mounted electronic component 22 from electromagnetic interference.
  • the surface mount electronic component 22 includes a first surface mount electronic component 22A composed of active electronic components such as a silicon semiconductor device and a gallium arsenide semiconductor device, and a second surface composed of passive electronic components such as a capacitor and an inductor.
  • the surface mount electronic component 22B The first surface-mounted electronic component 22A is mounted on the upper surface of the terminal electrode 231 of the second conductor pattern 23, and is electrically connected to the upper surface of the terminal electrode 231 by a solder ball 26.
  • the second surface mount electronic component 22B is mounted across the terminal electrode 231 and the routing electrode 232, and the external electrode of the second surface mount electronic component 22B is electrically connected to the electrodes 231 and 23 2 via solder. Connected.
  • the intermediate resin layer 30 is preferably formed of the same resin as the first and second resin layers 10 and 20.
  • the third wiring pattern 31 in the intermediate resin layer 30 is formed as a via-hole conductor (hereinafter also referred to as “third via-hole conductor”) 31.
  • the via-hole conductor 31 electrically connects the first in-plane conductor 14 of the first resin layer 10 and the second conductor pattern 23 of the second resin layer 20 to each other.
  • various patterns of in-plane conductors may be incorporated as the third wiring pattern in the intermediate resin layer 30.
  • the resin multilayer substrate 50 of the present embodiment uses the first conductor pattern 12 as an input / output electrode. Then, it is mounted on a mother board (not shown) and can serve as an electronic component that provides various functions to the mother board side by the surface-mounted electronic component 22.
  • the resin multilayer substrate 50 since the resin multilayer substrate 50 has the first and second conductor patterns 12 and 23 in an overhang shape, the first and second conductor patterns 12 and 23 are transferred by a transfer method as described later. Can be transferred into the first and second resin layers 10 and 20 in a complete form, and the force does not require surface roughness treatment of the first and second conductor patterns 12 and 23. Combined with low-cost manufacturing, yield can be improved.
  • the first and second conductor patterns 12 and 23 are different from each other, but for convenience, the same reference numerals as those of the first resin layer 10 are attached and the conductor pattern of the present invention is used.
  • the forming method will be described.
  • a support for example, a stainless steel plate 100 having a thickness of 0.08 mm and a surface roughness Rz of about 4 ⁇ m is cut into a 4-inch square as shown in FIG. prepare.
  • a dry film resist film (for example, a film thickness of 25 to 40 111) 200 is applied on the upper surface of the stainless steel plate 100, and a laminator is used for a lamination pressure of 0.3 MPa and a temperature of 100.
  • the dry film resist film 200 is exposed with an exposure amount of 60 mjZcm 2 or more, and development is performed in a time double the development break point.
  • a predetermined conductor pattern 12 is formed. Formed as a mask pattern 200B having a corresponding opening 200A
  • a conductor pattern 12 having an overhanging cross-sectional shape in which the portion 12A and the large diameter portion 12B are sequentially formed can be obtained.
  • the size of the large-diameter portion 12B can be appropriately controlled depending on the processing time of the mesh.
  • a semi-cured prepreader (hereinafter referred to as "wax layer") 110 is laminated, and the vacuum layer is used with a vacuum press at a temperature of 70 ° C or higher and a pressure of IMPa or higher. 110 is pressure-bonded to the stainless steel plate 100, and the conductor pattern 12 is embedded in the resin layer 110 as shown in FIG.
  • a vacuum press and a spacer mold pressurize the resin layer 110 under conditions of a temperature of 100 ° C or more and a load of 1 ton or more, and heat-treat the resin layer 110.
  • the resin layer 10 in which the thermosetting resin is completely cured is obtained.
  • the conductor pattern 12 remains in the resin layer 10, and as a result, the resin layer 10 to which the conductor pattern 12 is transferred can be obtained.
  • the lower end surface of the small diameter portion 12 ⁇ / b> A of the conductor pattern 12 is exposed in a state where it is flush with the lower surface of the resin layer 10. Further, the resin layer 110 may be peeled off from the stainless steel plate 100 in a semi-cured state.
  • the conductor pattern 12 is not peeled from the resin layer 110 by the anchor effect of the large diameter portion 12B. If the resin layer 10 is completely cured, the conductor pattern 12 is firmly fixed in the resin layer 10 and does not peel off.
  • the peel strength of the conductor layer 3 embedded in the pre-preda 2 was about 3 NZcm with respect to the thickness of the conductor layer 3 of 35 ⁇ m.
  • the overhang portion that is, the large diameter portion 12B is structured to be hooked in the resin layer 10
  • the conductor pattern 12 does not peel off unless the pre-preda 10 is broken.
  • the peel strength increases to 5 NZcm or more in a 1 mm wide cross-over-hang line (see Fig. 2 (b)). That is, in the present embodiment, the conductor pattern 12 can be transferred into the pre-preder 10 in a complete form.
  • the first resin layer 10, the second resin layer 20, and the intermediate resin layer 30 are individually manufactured and then bonded together to manufacture the resin multilayer substrate 50. Therefore, in the following, the manufacturing methods of the first and second resin layers 10, 20 and the intermediate resin layer 30 will be described below. The methods will be explained sequentially.
  • the first resin layer 10 is produced.
  • the first conductor pattern 12 shown in FIG. 4A is formed on the stainless steel plate 100 by the above-described conductor pattern forming method.
  • the semi-cured resin layer 110 is pressure-bonded onto the stainless steel plate 100, and the first conductor pattern 12 is embedded in the resin layer 110.
  • a plurality of via holes 110A reaching the upper surface of the conductor pattern 12 are formed in the resin layer 110 in a predetermined pattern using, for example, a carbon dioxide laser, and then in (d) of the figure.
  • the conductive resin 113 is filled in each via hole 110A.
  • the conductive resin 113 shows a hot / cold state when the thermosetting resin is cured.
  • the in-plane conductor 14 is formed on the upper surface of the resin layer 110.
  • the in-plane conductor 14 can be formed, for example, by transferring a metal foil such as a copper foil formed in a predetermined pattern onto the upper surface of the resin layer 110.
  • a metal foil is affixed onto a PET film, the metal foil is patterned using photolithography technology and etching technology, and then the metal foil is transferred to the upper surface of the PET film force-resin layer 110. By doing so, the in-plane conductor 14 is obtained.
  • the in-plane conductor 14 can also be obtained by forming a metal foil covering the upper surface of the resin layer 110 in advance and patterning the metal foil by photolithography technique and etching technique.
  • a metal film such as copper is formed on the upper surface of the resin layer 110 by electroless plating, and an in-plane conductor 14 having a predetermined pattern can be obtained by using a photolithography technique and an etching technique. .
  • the resin layer 110 and the conductive resin 113 are completely cured to form the first resin layer 10 and the first via-hole conductor 13, and the stainless steel plate 100 is peeled off, thereby It can be obtained as a resin substrate comprising the first resin layer 10 having one wiring pattern 11.
  • the second conductor pattern 12 is not peeled off from the first resin layer 10 due to the anchor effect of the large diameter portion 12B. Further, as described above, the stainless steel plate 100 can be peeled while the resin layer 110 is in a semi-cured state.
  • a solder resist 15 is applied to the lower surface of the first resin layer 10 so that the lower end surface of the first conductor pattern 12 is exposed and cured, so that the lower surface is protected by the solder resist 15.
  • a first resin layer 10 can be obtained.
  • the second resin layer 20 is produced as shown in FIGS. 5 (a) to (d). In this case, a stainless steel plate having the same size as that used for producing the first resin layer 10 is used.
  • the second conductor pattern 23 shown in FIG. 5 (a) is formed in a predetermined pattern on the stainless steel plate 100 by the same method as that for manufacturing the first resin layer 10.
  • the first surface mount electronic component 22A and the second surface mount electronic component 22B are aligned with the second conductor pattern 23, the second conductor pattern 23 Mounted so as to be joined to the upper surface of the large-diameter portion 23B.
  • the first surface mount electronic component 22 A is electrically connected to the terminal electrode 231 of the first conductor pattern 23 via the solder ball 26.
  • the second surface-mount electronic component 22B is electrically connected to each of the terminal electrode 231 and the routing electrode 232 through solder (not shown).
  • a semi-cured resin layer 120 is pressed onto the stainless steel plate 100 to attach the surface mount electronic component 22 and the second conductor pattern 23 to the resin layer 120. Buried inside.
  • a plurality of via holes 120A reaching the upper surface of the second conductor pattern 23 are formed in the resin layer 120 in a predetermined pattern using, for example, a carbon dioxide laser, and then each via hole 120A Filled with conductive grease.
  • an in-plane conductor 25 is provided as a shield electrode film on the upper surface of the resin layer 120, and after the second conductor pattern 23 and the in-plane conductor 25 are connected, the resin layer 120 and the conductive resin are completely separated from each other.
  • a second resin layer 20 and a second via-hole conductor 24 can be obtained as shown in FIG. Thereafter, the second resin layer 20 is peeled off from the stainless steel plate 100 to obtain a resin substrate made of the second resin layer 20 having the second wiring pattern 21 and the surface mount electronic component 22. Can do.
  • the second conductor pattern 23 is not peeled off from the second resin layer 20 by the anchor effect of the large diameter portion 23B.
  • the intermediate resin layer 30 when the intermediate resin layer 30 is produced, a via hole is provided in a predetermined pattern after the resin layer is pressure-bonded on the stainless steel plate in the same manner as the first resin layer 10 is produced.
  • the conductive resin can be filled in the via hole and cured to obtain the intermediate resin layer 30 and the third via hole conductor 31.
  • the resin substrate cured as described above may be used, or the first and second resin resins in a semi-cured state may be used.
  • Tier 10, 20 In addition, an intermediate resin layer 30 may be used.
  • first resin layer 10, intermediate resin layer 30 and second resin layer 20 are laminated together in this order, and heat By bonding the first resin layer 10, the intermediate resin layer 30 and the second resin layer 20 together, and completely curing each resin layer, the resin multilayer shown in FIG. A substrate 50 can be obtained.
  • the number of the resin layers increases, it is advantageous because each layer can be laminated at once.
  • a conductor having an overhanging cross section in which the small diameter portion 12A and the large diameter portion 12B are sequentially formed on the upper surface of the stainless steel plate 100 from the upper surface to the vertically upward direction.
  • a semi-cured resin layer 110 is provided on the stainless steel plate 100, and the conductor pattern 12 having an overhanging cross section is embedded in the resin layer 110, and then the semi-cured resin 110 is provided.
  • the resin layer 110 is peeled off from the stainless steel plate 100 using the large diameter portion 12B of the conductor pattern 12 having an overhanging cross-sectional shape as an anchor, and the cross-sectional overhanging shape from the stainless steel plate 100 to the resin layer 110 is obtained.
  • the conductor pattern 12 formed on the stainless steel plate 100 can be completely transferred from the stainless steel plate 100 into the resin layer 10, and the force is also reduced on the surface of the conductor pattern 12. It is possible to reduce the manufacturing cost by omitting the I spoon step.
  • the mask pattern 200B having the opening 200A having the same diameter as the small diameter portion 12A is formed on the upper surface of the stainless steel plate 100, and this opening portion is formed.
  • the plating film 12'A is grown on 200 to form the small diameter portion 12A
  • the plating film 12'A is further grown on the outer edge of the opening 200A to form the large diameter portion 12B, and then the stainless steel plate Since the mask pattern 200B is removed from 100, it is ensured that the conductor pattern 12 having a cross-sectional overhang shape, in which the small-diameter portion 12A and the large-diameter portion 12B are sequentially formed on the upper surface of the stainless steel plate 100 vertically upward.
  • the conductor pattern 12 that can be formed and can be reliably transferred from the stainless steel plate 100 into the resin layer 10 can be obtained.
  • the stainless steel plate 100 is peeled off from the resin layer 110 while the resin layer 110 to which the conductor pattern 12 has been transferred is in a semi-cured state. Even in the layer 110, the conductor pattern 12 can be reliably transferred into the resin layer 110, The resin multilayer substrate 50 can be used for production.
  • the above-described conductor pattern is formed.
  • the resin substrate in which the first conductor pattern 12 as a part of the first wiring pattern 11 is transferred into the first resin layer 10 as an input / output electrode The lower end surface where the main surface force of the first resin layer 10 of the small diameter portion 12A of the first conductor pattern 12 is also exposed can be used as the input / output electrode.
  • the resin substrate obtained here can be used as a resin substrate for input / output of the resin multilayer substrate 50.
  • the above-described method for forming a conductor pattern is used when manufacturing a resin substrate in which the surface mount type electronic component 22 is embedded in the second resin layer 20. Then, after the second conductor pattern 23 is provided in the second resin layer 20, the surface mount type electronic component 22 is bonded to the upper surface of the large diameter portion 23B of the conductor pattern 23 whose terminal electrode has an overhanging cross section.
  • a second resin layer 20 is provided on the stainless steel plate 100, and a conductor pattern 23 and a surface-mounted electronic component 22 having an overhanging cross section are embedded in this resin layer 20 Then, the second resin layer 20 is peeled off from the stainless steel plate 100 using the large diameter portion 23B as an anchor, and the conductor pattern 23 and the surface-mount type electronic component 22 having a cross-sectional overhang are integrally transferred to the second resin layer 20. As a result, the second conductor pattern 23 is used as the terminal electrode.
  • a surface-mounted electronic component 22 is incorporated, and a resin substrate with various functions can be obtained. Further, the resin substrate obtained here can be used as a resin substrate for the function of the resin multilayer substrate 50.
  • the first and second conductor patterns 12 and 23 are reached from the upper surface of the resin layers 110 and 120. Since the first and second via-hole conductors 13 and 24 are formed, the first and second conductor patterns 12 and 23 that become input / output electrodes or terminal electrodes are connected to the first and second via-hole conductors 13 and 24, respectively. Thus, the first and second wiring patterns 11 and 21 can be connected.
  • the present invention can be suitably used for a resin substrate used in various electronic devices and the manufacturing method thereof.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procédé de formation d'un motif conducteur, selon lequel un motif conducteur formé sur une plaque de support peut être complètement transféré de la plaque de support dans une couche de résine, et selon lequel l'étape consistant à gratter la surface du motif conducteur peut être évitée afin de réduire les coûts de production. Dans le procédé de formation d'un motif conducteur, un motif conducteur (12) de section saillante comporte une partie de petit diamètre (12A) et une partie de grand diamètre (12B) superposées sur la surface supérieure de l'élément de support (100), d'une manière séquentielle, vers le haut dans la direction verticale à partir de la surface supérieure. Ensuite, une couche de résine semi-durcie (110) est appliquée sur l'élément de support (100), de telle sorte que le motif conducteur (12) de section saillante soit noyé dans la couche de résine (110), puis la couche de résine semi-durcie (110) est totalement durcie. Ensuite, la couche de résine (110) est détachée de l'élément de support (100) en utilisant comme un ancrage la partie de grand diamètre (12B) du motif conducteur (12) de section saillante, de telle sorte que le motif conducteur (12) de section saillante soit transféré de l'élément de support (100) dans la couche de résine (110).
PCT/JP2007/059753 2006-07-28 2007-05-11 Procédé de formation d'un motif conducteur, processus de production d'un substrat en résine à l'aide du procédé, et substrat en résine WO2008012973A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-207186 2006-07-28
JP2006207186 2006-07-28

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Publication Number Publication Date
WO2008012973A1 true WO2008012973A1 (fr) 2008-01-31

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PCT/JP2007/059753 WO2008012973A1 (fr) 2006-07-28 2007-05-11 Procédé de formation d'un motif conducteur, processus de production d'un substrat en résine à l'aide du procédé, et substrat en résine

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WO (1) WO2008012973A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002004077A (ja) * 2000-06-20 2002-01-09 Kyushu Hitachi Maxell Ltd 電鋳製品およびその製造方法
JP2002076578A (ja) * 2000-08-25 2002-03-15 Ibiden Co Ltd プリント配線板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002004077A (ja) * 2000-06-20 2002-01-09 Kyushu Hitachi Maxell Ltd 電鋳製品およびその製造方法
JP2002076578A (ja) * 2000-08-25 2002-03-15 Ibiden Co Ltd プリント配線板及びその製造方法

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