WO2007129411A1 - 薄型表示装置 - Google Patents
薄型表示装置 Download PDFInfo
- Publication number
- WO2007129411A1 WO2007129411A1 PCT/JP2006/309428 JP2006309428W WO2007129411A1 WO 2007129411 A1 WO2007129411 A1 WO 2007129411A1 JP 2006309428 W JP2006309428 W JP 2006309428W WO 2007129411 A1 WO2007129411 A1 WO 2007129411A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- substrate
- electrode
- display device
- emitting unit
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/18—AC-PDPs with at least one main electrode being out of contact with the plasma containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
Definitions
- the present invention relates to a display device, and more specifically, a light emitting unit and a substrate having electrodes or the like that drive predetermined portions of the light emitting unit are individually configured, and the light emitting unit and the substrate are combined.
- the present invention relates to a thin display device.
- Liquid crystal display devices and plasma display panels have realized large-screen and thin display devices. These conventional display devices have a structure in which a liquid crystal or a discharge space is sealed between a front substrate and a rear substrate, and electrodes or the like for selecting and driving desired elements on the front substrate and the rear substrate.
- circuit elements such as TFT are formed on the rear substrate.
- a partition for defining each pixel is formed on one substrate, and a phosphor is applied and baked.
- each member constituting the electrodes and pixels is sequentially formed on the substrate. Therefore, the substrate itself is necessary for the basis of the manufacturing process until the screen is finally completed. Naturally, the display panel becomes thicker, the display panel becomes heavier, and it is difficult to bend the display panel.
- Japanese Unexamined Patent Publication No. 2005-116320 discloses a flexible EL display device in which an electrode for driving an EL element is formed on a film-like insulating substrate on which an EL element as a light emitter is arranged. However, the electrodes of this EL display device are also formed on an insulating substrate.
- this EL display device is flexible, an EL element is formed on an insulating substrate. Therefore, the light-emitting portion must be formed after the insulating substrate is manufactured.
- the conventional thin display device is manufactured by a lamination method in which the light emitter or the light emitting portion is manufactured integrally with the substrate, the thickness is too strong to bend the display screen.
- a display panel must be manufactured in a continuous process using a large number of substrates, and the manufacturing process is greatly limited.
- Patent Document 1 Japanese Patent Laid-Open No. 2005-116320
- the present invention has an object of the present invention to solve these problems simultaneously.
- the present inventors In order to solve the above-mentioned problems, the present inventors, as a result of diligent research, individually formed a light emitting part of a display device and an electrode substrate on which an electrode for emitting light at a predetermined position of the light emitting part was formed. After that, the technical idea that the light emitting part and the electrode substrate may be joined by an adhesive, pressure bonding, or adsorption is obtained, and based on this, a thin display device that solves the above problems is obtained. It came to. By configuring the light emitting unit and the electrode substrate separately, it is possible to use a thin substrate for the substrate that forms the light emitting unit, and the heat resistance of the substrate material of the electrode substrate that is prepared individually, etc.
- the selection range is wide, and flexible materials such as polyethylene terephthalate (PET) can be used for the substrate material. Therefore, the light emitting portion and the electrode substrate can be configured to be flexible, and thus a flexible display device can be configured.
- the light emitting part and the electrode substrate can be manufactured separately, there is no manufacturing restriction that the light emitting part must be formed after the electrode substrate is created, and the light emitting part, the electrode substrate, etc. Since performance evaluation is possible, defective products can be selected at this component level, so that the yield can be improved and the cost can be reduced compared to the conventional continuous manufacturing method described above. It becomes possible to obtain.
- a light emitting layer and a front side of the light emitting layer A light emitting section having a front substrate and a rear substrate on the back side, and an electrode substrate having an electrode for applying a voltage to the light emitting layer, the electrode substrate being a front substrate or a back substrate.
- the display device is characterized in that the electrode substrate disposed on at least one side has flexibility.
- the electrode substrate on the front side and the back side of the light emitting unit.
- the light emitting unit and the electrode substrate may be bonded via an adhesive layer.
- the light emitting unit includes a front substrate on the front side of a light emitting layer having a discharge gas and a phosphor layer, and a rear substrate on the back side. And a front electrode substrate having an electrode disposed on the front substrate side and a rear electrode substrate having an electrode disposed on the rear substrate side, and at least the front electrode substrate or the back electrode substrate One is characterized by having flexibility.
- a plurality of sustain electrode pairs are formed on the front electrode substrate, a plurality of address electrodes are formed on the back electrode substrate, and a configuration of a three-electrode surface discharge type PDP is also preferable. .
- a light emitting unit module in which a plurality of light emitting units are arranged in a plane in contact with each other, and an electrode is provided on the front side of the plurality of light emitting unit modules.
- the light emitting unit includes a front electrode substrate and a back electrode substrate having electrodes on the back side of the plurality of light emitting unit modules, and adjacent light emitting units of the plurality of light emitting units are in contact with each other.
- the thickness of the front substrate on the front side of the light emitting layer and the back substrate on the back side is preferably a glass substrate, and the thickness is about 0.2 mm so that the light emitting part can be flexibly bent.
- the thickness is preferably 0.1 mm or less, and 30 zm or more is preferred because of the strength of forming a light emitting layer.
- the light emitting unit and the electrode substrate on which the light emitting unit is driven to emit light are individually configured, the light emitting unit can be configured to be thin.
- the selection range of the substrate material of the electrode substrate is widened and a flexible material can be used, the display device itself can be configured flexibly.
- light emitting part and electrode Since the substrate can be manufactured separately, the degree of freedom in the process of manufacturing the display device is increased, and the light emitting part and the electrode substrate can be manufactured in individual processes or a manufacturing line. Furthermore, it is possible to judge the quality of the performance at the component level such as the light emitting unit and the electrode substrate, and the cost reduction in the production of the display device can be realized. Furthermore, it is possible to easily increase the screen size by arranging multiple light emitting units 1J.
- FIG. 1 is a diagram showing a basic structure of the present invention, and is a diagram showing a main part of a display device using an inorganic phosphor material for a light emitting layer.
- FIG. 2 is a diagram showing an outline of a display device having a configuration in which a light emitting unit and an electrode substrate are bonded with an adhesive layer.
- FIG. 3 is a diagram showing an outline of a display device provided with a light emitting section in which a light emitting layer uses gas discharge.
- FIG. 4 is a diagram showing a configuration of a thin display device in which a light emitting layer includes a light emitting unit using gas discharge.
- FIG. 5 is a view showing members and the like of the light emitting part.
- FIG. 6A to FIG. 6D are diagrams showing a schematic manufacturing process of a light emitting unit in a vacuum chamber.
- FIG. 7 is a diagram showing a schematic outer shape of a light emitting unit.
- FIG. 8 is a diagram showing an outline of a light emitting unit module including a plurality of light emitting units.
- FIG. 9 is a diagram showing the positional relationship between the light emitting unit module, the front electrode substrate, and the back electrode substrate.
- FIG. 10 is a diagram showing a positional relationship between a joint between light emitting portions and a non-light emitting region.
- FIG. 11 is a diagram showing a schematic shape of a partition frame used in the light emitting unit.
- FIG. 12 is a diagram showing an example of the groove cross-sectional shape of the partition frame.
- FIG. 13 is a view showing a light emitting unit having a structure in which a phosphor chip is arranged in a groove of a partition frame.
- FIG. 1 is a diagram showing a basic configuration of the present invention.
- the light emitting unit 10 includes a light emitting layer 20A, 20B, and 20C, for example, a substrate 12 on the front and back surfaces of a light emitting layer that emits red, green, and blue, respectively. 14 and the light emitting layers 20A, 20B, and 20C are formed on any of the substrates by a printing method.
- Each light emitting layer for example, the light emitting layer 20A is a phosphor layer based on ZnS: Sm, Cl, ZnS: Mn, etc.
- the light emitting layer 20B is based on ZnS: Tb, F, CaS: Ce, etc.
- the light emitting layer 20C is a phosphor layer having ZnS: Tm, F or the like as a base material.
- the material of the substrates 12 and 14 is an inorganic insulating material, and a non-light-emitting material such as ceramic may be used for glass or a substrate located on the back side. These substrates 12, 14 use BaTiO, TaO, etc., which may function as an insulating layer or dielectric layer.
- a glass substrate it is preferable to use a glass substrate with a thickness of 0.2 mm or less so that the light emitting part 10 can be flexibly bent. 0.1 mm or less 30 ⁇ m or more provides more flexibility and strength in manufacturing.
- the front side of the light emitting unit 10 is the substrate 30 side, but the substrate 30 has an electrode 32 on the side in contact with the light emitting unit 10 in a direction perpendicular to the light emitting layers 20A, 20B, and 20C. It is formed.
- the back side of the light emitting unit 10 is the substrate 40 side in FIG. 1.
- an electrode 42 is formed on the side in contact with the light emitting unit 10 in the direction along the light emitting layers 20A, 20B, and 20C. is there.
- the substrate 30 may be any material as long as it has optical transparency and can form the electrode 32 with a transparent electrode ITO film or NESA film, but a polyethylene terephthalate (PET) thickness of about 120 ⁇ m is preferable.
- PET polyethylene terephthalate
- the substrate 40 can also use PET, but light transmission is not always necessary.
- a plating or a conductive paste may be formed by a printing method.
- a method of forming a metal layer such as a copper foil adhered to the substrate on the electrode 42 having a desired shape by etching is also acceptable.
- the thickness of the light emitting layers 20A, 20B, and 20C may be about 30 ⁇ m, for example, but may be appropriately selected depending on the driving voltage, light emission intensity, and the like.
- FIG. 2 is a diagram showing a configuration in which the light emitting unit 10 is bonded to the substrate 30 and the substrate 40 using the adhesive layer 50 and the adhesive layer 52.
- the adhesive layer 50 is preferably a light-transmitting, soft epoxy resin or photo-curable resin at room temperature.
- the adhesive layer 52 is preferably an epoxy resin or a photocurable resin that is soft at room temperature. In addition, you may use a film with general adhesion.
- the adhesive layers 50 and 52 shown in FIG. 2 may use a sheet-like adhesive in addition to the liquid adhesive, and further charge the substrates 12 and 14 and the substrates 30 and 40, respectively, by static electricity.
- the method of adsorbing is particularly effective when the light emitting portion 10 has a large area.
- the substrates 12 and 14 and the substrates 30 and 40 are brought into close contact with each other by the atmospheric pressure and bonded to each other. Also good.
- the front side and the back side may be joined differently. Further, only the peripheral part of the light emitting part 10 is bonded to the substrates 30 and 40 with epoxy resin or the like. It is good even if used together.
- the light emitting unit 100 has ribs 124 between the front substrate 102 and the rear substrate 104, and the discharge gas 122 force S is sealed between the ribs 124.
- the phosphors are arranged to emit light of red, green and blue, respectively.
- the front substrate 102 and the rear substrate 104 are preferably glass substrates of 0.1 mm or less and 30 / m or more, like the substrates 12 and 14 of FIGS.
- the front substrate 102 is preferably a light-transmitting glass substrate, but the back substrate 104 may be a glass substrate containing a good pigment that does not have light transmittance.
- a protective film such as a HgO film is formed on the front substrate 102 and the surface where the rib 124 and the discharge gas 122 are in contact with each other for protection from plasma generated during discharge.
- a front electrode substrate 130 is disposed on the front substrate 102 side, and on the side of the front electrode substrate 130 in contact with the front substrate 102, in a direction perpendicular to the longitudinal direction of the phosphors 120A, 120B, 120C,
- a rear electrode substrate 140 is disposed on the rear substrate 104 side, and address electrodes 142 are formed on the side of the rear electrode substrate 140 in contact with the rear substrate 104 in a direction along the longitudinal direction of the phosphors 120A, 120B, and 120C. Yes.
- the front electrode substrate 130 is light transmissive and can be formed of a transparent electrode ITO film or NESA film so long as the electrode 132 can be formed.
- Polyethylene terephthalate (PET ) Thickness around 120 zm is preferred.
- PET Polyethylene terephthalate
- the back electrode substrate 140 can also use PET, but light transmission is not always necessary.
- the address electrode 142 does not necessarily need to be light transmissive, so that a plating or conductive paste may be formed by a printing method.
- a method may be used in which a metal layer such as a copper foil bonded to the substrate is formed on the electrode 142 having a desired shape by etching.
- FIG. 3 the method for bonding the light emitting unit 100 to the front electrode substrate 130 and the back electrode substrate 140 is not shown, but the same method as described in FIG. 2 can be employed.
- a light emitting portion comprising a light emitting layer having a light emitting substance composed of a plurality of inorganic materials and a substrate not having a display electrode, and an electrode that is in contact with at least one side of the light emitting portion and applies a voltage to the light emitting portion.
- a display device comprising an electrode substrate, wherein the light emitting portion and the electrode substrate are independent of each other, and the electrode substrate is made of an organic material that can be bent.
- a display device comprising a light emitting part having a plurality of inorganic material forces and an electrode substrate having an electrode that is in contact with at least one side of the light emitting part and applies a voltage to the light emitting part, the light emitting part has a thickness of the thinnest part.
- a display device comprising a substrate having a thickness of 0.1 mm or less and a light emitting layer formed on the substrate, and the electrode substrate can be bent.
- a display device comprising a light emitting portion made of a plurality of inorganic materials and an electrode substrate having electrodes that are in contact with both sides of the light emitting portion and apply a voltage to the light emitting portion, the light emitting portion has a thickness of 0.1 mm or less.
- a display device comprising a substrate and a light emitting layer formed on the substrate, the electrode substrate being bendable, and at least one of the electrode substrates having translucency.
- a display device including a plurality of light emitting portions having inorganic material power and an electrode substrate having an electrode that is in contact with at least one side of the light emitting portion and applies a voltage to the light emitting portion, the light emitting portion includes a thin substrate,
- a display device comprising: a light emitting layer force formed on the substrate; an adhesive layer between the light emitting portion and the electrode substrate; and the electrode substrate being bendable.
- a display device comprising a light emitting portion made of a plurality of inorganic materials and an electrode substrate having electrodes that are in contact with both sides of the light emitting portion and apply a voltage to the light emitting portion
- the light emitting portion includes a thin substrate and the substrate
- the light-emitting layer is formed on the light-emitting part and has an adhesive layer between the electrode substrate, the electrode substrate is bendable, and at least one of the electrode substrates has translucency.
- the light emitting layer includes a discharge gas and a phosphor layer
- the display device characterized in that the light emitting section includes a phosphor layer and a dielectric substrate.
- a light-emitting part comprising a light-emitting layer having a light-emitting substance composed of a plurality of inorganic materials and a substrate having no electrode, and an electrode for applying a voltage to the light-emitting layer in contact with at least one side of the light-emitting part are bent and bent
- a display device manufacturing method for manufacturing a display device by manufacturing the light emitting unit and the electrode substrate independently and combining them in a display device comprising an electrode substrate that can be used.
- a display device including a plurality of light emitting portions having inorganic material power and an electrode substrate having an electrode that is in contact with at least one side of the light emitting portion and applies a voltage to the light emitting portion, the light emitting portion has a thickness of the thinnest portion.
- a display device manufacturing method in which a substrate having a thickness of 0.1 mm or less, a light emitting layer formed on the substrate, and a bendable electrode substrate are combined.
- a display device comprising a light emitting portion having a plurality of inorganic material forces and an electrode substrate having electrodes that are in contact with both sides of the light emitting layer and apply a voltage to the light emitting layer, the light emitting layer has a thickness of 0.1 mm or less.
- a display device comprising a substrate and a light-emitting portion formed on the substrate, the electrode substrate being bendable, and at least one of the electrode substrates having translucency.
- FIG. 4 shows a configuration of a display device 200 in which a thin display device using the display device shown in FIG. 3 and a peripheral circuit are combined.
- a drive unit 500 is connected to the display device 200, and in this embodiment, the sustain electrode pairs 135 extend in the row direction of the display screen, and each sustain electrode pair 135 includes a scan / sustain Y electrode and a sustain X electrode. And a pair.
- the area where the sustain electrode pair 135 and the address electrode 142 intersect is called a cell, and the scan / sustain Y electrode is selected in units of rows when selecting a cell to emit light by discharge between the sustain electrode pair 135 in each cell. It is used as a scan electrode for selecting cells.
- the address electrode 142 extends in the column direction and is used as an electrode for selecting cells in units of columns.
- the drive unit 500 includes a controller 512, a data processing circuit 514, an X dryer 516, a scan driver 518, a Y common driver 520, an address driver 522, and a memory circuit, an electrical circuit, and the like shown in the figure. Les.
- the drive unit 500 has the power of an external device such as a TV tuner, a computer, etc., and the brightness level (gradation level) (in the case of color display, the brightness level of each color of R, G, B). It is input together with various synchronization signals.
- This field data DF is stored in the frame memory 524 in the data processing circuit 514 and then stored in the frame memory 524 after being processed for gradation display, and transferred to the address driver 522 as appropriate. Is done.
- the X driver 516 applies a drive voltage to all the X electrodes.
- the scan driver 518 applies a drive voltage to each scan / sustain Y electrode individually in cell selection.
- the Y common driver 520 applies a drive voltage to all the scan / sustain Y electrodes at once to maintain lighting in the selected cell.
- FIG. 5 is a diagram showing an outline of the light emitting unit 100.
- glass substrates are used for the front substrate 102, the rear substrate 104, the ribs 124, and the end substrate 300.
- 300 L of terminal B substrates are also provided on the front side of the drawing where only one end substrate 300 is shown.
- Each light body 120A, 120B, 120C is partitioned, and the light body 120A, 120B, 120C is re-mounted on the rear substrate 104 in order to secure a distance between the front substrate 102 and the rear substrate 104.
- Force in which the groove 124 is formed The rib 124 may be provided on the front substrate 102 side.
- the thickness of the front substrate 102, the rear substrate 104, the rib 124, and the end substrate 300 is preferably 0.1 mm or less and 30 ⁇ or more, but the thickness of the rib 124 affects the ease of bending in the illustrated ⁇ ⁇ direction. Because there is little, it is good even if it is about 0.2mm.
- the height of the rib 124 is preferably 50 to 200 ⁇ force S, but this height can be appropriately selected depending on the desired light emission intensity, the applied applied voltage, and the like.
- the back substrate 104 and the rib 124 may be bonded to each other with a low-melting glass or the like.
- a conventionally known sandblasting method or etching method may be used.
- an adhesion method of bonding may be used.
- back substrate 104 and rib 124 are integrated, and a predetermined amount of phosphors 120A, 120B, and 120C are applied between ribs 124, dried, and ribs 124 at both ends of light emitting unit 100 are applied.
- a sealant 302 (for example, LS-3075 manufactured by Nippon Electric Glass Co., Ltd.) is applied to the top of the substrate.
- the front substrate 102 may be aligned and overlapped with the ribs 124 at both ends, the sealing material 302 may be melted, and the front substrate 102 and the ribs 124 may be fixed, but preferably the vacuum described below is used. It is further preferred to bond within the chamber.
- the front substrate 102 In addition to fixing the front substrate 102 to the ribs 124 at both ends shown in the drawing, it is also possible to fix the front substrate 102 to the tops of the other ribs 124.
- the sealant 302 when the sealant 302 is applied to the top of the rib 124, it may be applied to the entire top, but in order to avoid the flow into the phosphor 120C, a part of the rib 124 in the thickness direction as shown in the figure is used. Sealing material 302 may be applied.
- Sealing material 302 may be applied.
- seal material 304 is applied.
- the end substrate 300 of the light emitting unit 100 is not yet fixed to the front substrate 102, the back substrate 104, and the ribs 124 at both ends.
- the light emitting unit 100 'in a state where the front substrate 102 and the end substrate 300 are not bonded is shown in FIG.
- the light emitting unit 100 ′ that is not yet attached is placed in the vacuum chamber 310 (disposed in a vacuum, and the vacuum chamber 310 is evacuated to remove gas, moisture, etc. in the light emitting unit 100 ′.
- a discharge gas is introduced into the vacuum chamber 310 from a gas cylinder (not shown) through a pipe or the like.
- a mixture of neon gas and xenon gas is used as discharge gas (Ne-Xe gas).
- FIG. 6D shows a state in which the sealing material 304 is fixed.
- FIG. 7 shows a schematic external view of the completed light emitting unit 100.
- FIG. 8 shows a state in which nine light emitting units 100 are arranged IJ in a planar shape.
- FIG. 9 shows a state in which the electrode substrates are arranged on both surfaces of the light emitting unit module 350 composed of the nine light emitting units 100 arranged in this manner.
- members having the same functions as those shown in FIG. 8 to FIG. 10 members having the same functions as those shown in FIG.
- FIG. 3 shows a partial view of the light emitting unit 100, the front electrode substrate 130, and the back electrode substrate 140, but FIG. 9 uses a light emitting unit module 350 including nine light emitting units 100. .
- the vertical and horizontal sizes of the light emitting unit module 350 are measured. Force A substantially identical adhesive layer 352 is provided.
- an adhesive layer 354 is provided on the surface of the back electrode substrate 140 attached to the back side of the light emitting unit module 350 and in contact with the light emitting unit module 350.
- the vertical and horizontal dimensions of the adhesive layer 354 also emit light.
- the vertical and horizontal dimensions of the unit module 350 are substantially matched.
- FIG. 10 shows the details between the light emitting units 100 indicated by the dotted circle D after being bonded.
- the light emitting unit 100A and the light emitting unit 100B are arranged so that the end substrates 300 are in contact with each other, and the end substrate 300 is in contact with the non-light emitting region 137 between the sustain electrode pair 135.
- the front electrode substrate 130 is attached to the light emitting module 350 so as to be located near the center.
- the phosphors 120A, 120B, and 120C of the light emitting unit 100 shown in FIG. 3 and the end substrate 300 of the light emitting unit 100 shown in FIG. 5 are configured with fewer members.
- FIG. 11A shows a perspective view of a partition frame 400 in which the rib 124 of the light emitting unit 100 and the end substrate 300 shown in FIG. 5 are integrated.
- the perspective direction of the partition frame 400 is the same as the perspective direction of FIG.
- phosphors that emit red, green, and blue light are applied to the grooves 412, 414, and 416, respectively.
- the width of each groove in the direction of arrow B shown in FIG. 11A may be the same, but the width of the groove where the phosphor with good luminous efficiency (luminous intensity) is applied is narrow and the luminous efficiency (luminous intensity) is inferior.
- the partition frame 400 may be configured to increase the groove width of the phosphor.
- the pitch of the groove 412 and the groove 414, the pitch of the groove 414 and the groove 416, and the pitch of the groove 412 adjacent to the groove 416 may be changed.
- the pitch between these grooves may be the same.
- this groove is illustrated as 10 mm IJ, 2 rows, but the number of columns in this groove is 3
- FIG. 11B shows a partial plan view of the partition frame 400 shown in FIG. 11A. Sectional view along line AA shown in Fig. 11B The shape is shown in Fig. 11C. As shown in FIG.
- the cross-sectional shape of the ribs 416 of the grooves 412 and 414 or ⁇ or 416 is a skirt shape. This is because the phosphor is applied to the skirt wall, but this shape reduces the amount of application and makes the phosphor easily enter the bottom of the groove by making it smooth.
- FIGS. 12A, 12B, and 12C shapes corresponding to the cross-sectional shape of FIG. 11C are shown in FIGS. 12A, 12B, and 12C.
- the groove shape shown in FIG. 12A connects the bottoms of the partitions 432 corresponding to the ribs, and shows a groove 430 having a concave cross section.
- FIG. 12A connects the bottoms of the partitions 432 corresponding to the ribs
- the partition 442 corresponding to the rib is a groove 440 having a cross-sectional shape orthogonal to the bottom 444, and in the case of the grooves 430 and 440, the cross-sectional shape closing the hole 410 shown in FIG. A substrate corresponding to the rear substrate 104 shown in FIG.
- the groove 450 shown in FIG. 12C has a cross-sectional shape partitioned only by the partition 452, and since the bottom is not closed, the case where the phosphor is applied or the case shown in FIG. When the inside of the vacuum chamber 310 is evacuated, defoaming can be easily performed.
- the seventh embodiment shows a configuration of a light emitting unit obtained by further subdividing each component of the light emitting unit 100 shown in FIG. 13A and 13B show that the groove formed in a separate process has a concave cross section in each groove of the partition frame 602 having a groove corresponding to the shape of the pixel for each color corresponding to the partition frame 400 shown in FIG. 11A.
- a plan view of the light emitting layer 600 when the phosphor chip 660 that emits light, the phosphor chip 650 that emits green light, and the chip 660 that emits blue light are inserted is shown.
- the partition frame 602 is composed of partition bodies 610 and 620.
- FIG. 13B is a perspective view showing a part of the light emitting unit 600 shown in FIG. 13A.
- each phosphor chip 640, 650, 660 has a concave cross section, but it may be a flat plate that fits into the bottom of the groove in the plan view of FIG. 13A. Other shapes may be used.
- the phosphor chips 640, 650, and 660 can be arranged by arranging phosphor chips that emit the same color in the illustrated column direction as shown in FIG. 13A, and red in the same column. It is also possible to arrange green, blue, etc. in order.
- the phosphor itself is made into a chip, and the phosphor chips 640, 650, and 660 that are made into chips are inserted into the grooves of the partition frame 602 or bonded, so that The phosphor chip can be manufactured under the optimum conditions for molding and In addition, the phosphor is uniformly applied to the wide screen area required for a large screen, without the process of deteriorating the yield. Placement can be performed without deteriorating yield. Conventionally, since phosphors of each color are applied to the same substrate, the phosphors of each color are mixed, and there has been a problem of deterioration in display quality. However, in this embodiment, phosphors of each color are used. Since chips are manufactured individually, the problem of color mixing can be avoided.
- the light emitting part and the electrode substrate on which the light emitting part is driven to emit light are individually configured, the light emitting part can be made thin and lightweight, and the electrode substrate Since the selection range of the substrate material is wide and a flexible material can be used, the display device itself can be configured flexibly. Furthermore, since the light emitting part and the electrode substrate can be manufactured separately, the degree of freedom in the process of manufacturing the display device is increased, and the light emitting part and the electrode substrate are produced in separate processes or production lines. In addition, it is possible to judge the quality of the performance at the component level such as the light emitting unit and the electrode substrate, and the cost reduction in the production of the display device can be realized.
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Description
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CNA2006800544926A CN101438336A (zh) | 2006-05-10 | 2006-05-10 | 薄型显示装置 |
JP2008514353A JPWO2007129411A1 (ja) | 2006-05-10 | 2006-05-10 | 薄型表示装置 |
PCT/JP2006/309428 WO2007129411A1 (ja) | 2006-05-10 | 2006-05-10 | 薄型表示装置 |
US12/300,335 US20090179546A1 (en) | 2006-05-10 | 2006-05-10 | Thin-shaped display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2006/309428 WO2007129411A1 (ja) | 2006-05-10 | 2006-05-10 | 薄型表示装置 |
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WO2007129411A1 true WO2007129411A1 (ja) | 2007-11-15 |
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PCT/JP2006/309428 WO2007129411A1 (ja) | 2006-05-10 | 2006-05-10 | 薄型表示装置 |
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US (1) | US20090179546A1 (ja) |
JP (1) | JPWO2007129411A1 (ja) |
CN (1) | CN101438336A (ja) |
WO (1) | WO2007129411A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009251101A (ja) * | 2008-04-02 | 2009-10-29 | Dainippon Printing Co Ltd | 表示装置用電極フィルムおよび表示装置用電極フィルムの製造方法 |
JP2017027912A (ja) * | 2015-07-28 | 2017-02-02 | 合同会社紫光技研 | ガス放電発光装置 |
JP2017123340A (ja) * | 2017-02-24 | 2017-07-13 | 合同会社紫光技研 | ガス放電発光装置 |
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CN102024834A (zh) * | 2009-09-23 | 2011-04-20 | 鸿富锦精密工业(深圳)有限公司 | 场致发光显示装置 |
JP6524477B2 (ja) * | 2015-05-28 | 2019-06-05 | 株式会社紫光技研 | ガス放電発光装置とその駆動回路 |
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JPH05135873A (ja) * | 1991-11-12 | 1993-06-01 | Toyota Motor Corp | 全固体型薄膜エレクトロルミネツセンス素子の製造方法 |
JPH11297203A (ja) * | 1998-04-13 | 1999-10-29 | Fujitsu Ltd | プラズマディスプレイパネルの蛍光体層形成方法と装置並びにそれらに用いるフィラメント状成形体とその成形体の製造方法 |
JP2002190385A (ja) * | 2000-12-21 | 2002-07-05 | Dainippon Printing Co Ltd | エレクトロルミネッセンス素子製造用の転写材料およびエレクトロルミネッセンス素子の製造方法 |
JP2003092085A (ja) * | 2001-09-17 | 2003-03-28 | Fujitsu Ltd | 表示装置 |
JP2003197095A (ja) * | 2003-01-17 | 2003-07-11 | Matsushita Electric Ind Co Ltd | ガス放電パネルの製造方法 |
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US6935913B2 (en) * | 2000-10-27 | 2005-08-30 | Science Applications International Corporation | Method for on-line testing of a light emitting panel |
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- 2006-05-10 WO PCT/JP2006/309428 patent/WO2007129411A1/ja active Application Filing
- 2006-05-10 JP JP2008514353A patent/JPWO2007129411A1/ja active Pending
- 2006-05-10 US US12/300,335 patent/US20090179546A1/en not_active Abandoned
- 2006-05-10 CN CNA2006800544926A patent/CN101438336A/zh active Pending
Patent Citations (5)
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JPH05135873A (ja) * | 1991-11-12 | 1993-06-01 | Toyota Motor Corp | 全固体型薄膜エレクトロルミネツセンス素子の製造方法 |
JPH11297203A (ja) * | 1998-04-13 | 1999-10-29 | Fujitsu Ltd | プラズマディスプレイパネルの蛍光体層形成方法と装置並びにそれらに用いるフィラメント状成形体とその成形体の製造方法 |
JP2002190385A (ja) * | 2000-12-21 | 2002-07-05 | Dainippon Printing Co Ltd | エレクトロルミネッセンス素子製造用の転写材料およびエレクトロルミネッセンス素子の製造方法 |
JP2003092085A (ja) * | 2001-09-17 | 2003-03-28 | Fujitsu Ltd | 表示装置 |
JP2003197095A (ja) * | 2003-01-17 | 2003-07-11 | Matsushita Electric Ind Co Ltd | ガス放電パネルの製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009251101A (ja) * | 2008-04-02 | 2009-10-29 | Dainippon Printing Co Ltd | 表示装置用電極フィルムおよび表示装置用電極フィルムの製造方法 |
JP2017027912A (ja) * | 2015-07-28 | 2017-02-02 | 合同会社紫光技研 | ガス放電発光装置 |
JP2017123340A (ja) * | 2017-02-24 | 2017-07-13 | 合同会社紫光技研 | ガス放電発光装置 |
Also Published As
Publication number | Publication date |
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JPWO2007129411A1 (ja) | 2009-09-17 |
US20090179546A1 (en) | 2009-07-16 |
CN101438336A (zh) | 2009-05-20 |
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