Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
  • G01R1/073—Multiple probes
  • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
  • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Definitions

• the present invention relates to a probe card and a method for drilling a glass substrate.
• a so-called pogo pin type probe card usually has a support plate called a contactor guide plate that supports a large number of needle-like probe pins, and a circuit board that is electrically connected to the support plate. Yes.
• the support plate is disposed so that the lower surface from which the probe pin tip contact portion protrudes faces the wafer, and the circuit board is disposed so as to overlap the upper surface of the support plate.
• the probe pin is accommodated in a guide hole formed in the support plate so as to be slidable in the vertical direction.
• the horizontal cross-sectional shape of the guide hole was circular (Patent Document 1).
• Patent Document 1 JP 2004-156969 A
• the horizontal cross-sectional shape of the guide hole is circular, however, it cannot be applied to a recent highly integrated device.
• the shape of the guide hole is a circular hole, it is necessary to reduce the pitch between the holes, and in the case of a fine hole, the minimum required for drilling regardless of the diameter of the hole. Since the spacing of the partition between the hole and the circular hole does not change, the diameter of the hole must be made extremely small.
• there is a limit to reducing the size of the punch pin and pogo pin and there is a limit to narrowing the pitch between adjacent probe pins in response to high integration.
• the coil spring used as the inertia material is suitable for being accommodated in the circular guide hole, the total length becomes long, and the inductance increases accordingly. This is not preferable for weak inspection signals and disadvantageous for fine measurement. In addition, I picked up the surrounding noise! In order to prevent them, the pogo pins are structurally enlarged and cannot be used for high integration.
• the present invention has been made in view of the points to be applied.
• a guide hole that can accommodate the probe pin is formed at a narrower pitch and with a higher positional accuracy than in the past, thereby achieving high concentration.
• the purpose is to carry out precise inspection of stacked devices.
• a circuit board and a support plate that is disposed under the circuit board and supports the probe pin are provided, and the electrical characteristics of the object to be inspected are inspected.
• a probe card is inserted into a guide hole formed in the support plate, and the tip of the probe pin protrudes below the support plate.
• the guide hole has a plurality of probe pin insertion portions in parallel.
• the probe card of the present invention has a narrower pitch than a probe card having a conventional circular guide hole.
• Probe pins can be arranged on Further, since the probe pins are inserted into a plurality of insertion portions arranged in parallel with one guide hole, the probe pins can be arranged with high accuracy and positioning accuracy.
• the guide hole of the probe card has a square horizontal cross-sectional shape of the guide hole, each of which has a plurality of groove portions on opposing side surfaces of the guide hole, and the groove portions are provided to face each other.
• the insertion portion is a hole between the opposing groove portions in the guide hole, and the probe pin may be inserted into the insertion portion.
• the guide hole has the above-mentioned shape, for example, a wave spring can be used as the probe pin, which is thicker than the coil spring and has a shorter overall length, thereby reducing the inductance.
• the probe pin may be configured to have a locking portion that is locked to the upper edge of the guide hole.
• the quadrangle of the horizontal cross-sectional shape of the guide hole particularly a rectangle, it is possible to arrange probe pins with a narrower pitch in the same region.
• width 300 ⁇ In a rectangular guide hole of m, opposing groove portions of 60 m ⁇ 50 m can be formed on opposing side surfaces. Probe pins are inserted into the insertion part between the opposing groove parts, and can be arranged in parallel at intervals of 100 ⁇ m.
• the guide hole may be formed in a resin layer provided through the support plate.
• the support plate may further include another guide hole into which one probe pin is inserted.
• a hole mold having a plurality of insertion portions into which probe pins are inserted in parallel is erected in a hole provided in the mold support substrate.
• the glass substrate is accommodated in a container whose upper surface is opened, and the mold-standing substrate is disposed to face the glass substrate so that the mold of the mold-standing substrate faces the glass substrate side in the container.
• the glass substrate in the container is heated by heating, the glass substrate is melted, the mold stand substrate is brought close to the melted glass substrate, and the mold of the mold stand substrate is inserted into the glass substrate.
• the glass substrate in the container is cooled to solidify the glass substrate.
• the mold stand substrate is a substrate for standing the mold.
• the mold may have a quadrangular horizontal cross-sectional shape, and the mold may have a plurality of opposed convex portions on a pair of side surfaces opposed to each other. [0015]
• the quadrangular shape of the horizontal cross-sectional shape of the mold is particularly a rectangular shape, so that probe pins with a narrower pitch can be arranged in the same region.
• the hole may have a shape adapted to the mold. As a result, the mold can be erected on the mold stand substrate more reliably.
• the holes may be formed in the standing substrate by etching. As a result, the holes can be formed in the standing substrate with higher accuracy.
• the step of inserting the mold into the glass substrate may be performed by holding the mold standing substrate by a liftable holding member and lowering the mold standing substrate at a predetermined speed by the holding member. Good.
• the mold-standing substrate should be heated.
• the mold-standing substrate can be constituted by, for example, a silicon substrate.
• the container may be formed by a single force. Carbon that has excellent thermal conductivity and a thermal expansion coefficient equivalent to or lower than that of whikeate glass is used. Accordingly, the heat of the container can be efficiently transferred to the glass substrate during heating, and carbon has gaps between the particles of the material, and bubbles in the glass substrate are likely to escape. Further, since carbon does not adhere to the glass substrate, the glass substrate can be easily taken out of the container.
• the mold is preferably made of a material having heat resistance against the heating temperature of the glass substrate.
• the mold may be melted with a liquid and removed from the glass substrate.
• the mold may be made of metal and aqua regia may be used for the liquid.
• tungsten, stainless steel, molybdenum, nickel, or a nickel alloy can be used as the mold material.
• the mold may be burned so as to be removed from the glass substrate.
• carbon can be used for the mold material.
• a temporary hole having a horizontal section larger than the guide hole is formed in the glass substrate.
• a temporary hole having a horizontal section larger than the guide hole is formed in the glass substrate.
• a step of inserting a dummy mold having a shape suitable for the temporary hole into the lower portion of the temporary hole, and filling molten temporary resin into the temporary hole above the dummy mold, and then A glass substrate drilling method may be used which includes a step of solidifying fat, a step of removing the dummy mold from the temporary hole, and a step of forming the guide hole in the solidified resin.
• the guide hole has a quadrangular horizontal cross-sectional shape, and each of the guide holes has a plurality of groove portions on opposite side surfaces, the groove portions are provided to face each other, and the insertion portion is provided with the guide hole. It may be a hole between the facing grooves in the hole.
• a temporary hole having a horizontal section larger than the guide hole is formed in the guide substrate.
• the step of solidifying the resin, the step of removing the mold inserted in the resin, the other surface of the glass substrate is polished, and the guide hole is formed at the position where the mold of the glass substrate is removed. And a method of drilling a glass substrate having a process.
• the guide hole has a quadrangular horizontal cross-sectional shape, and each of the guide holes has a plurality of groove portions on opposite side surfaces, the groove portions are provided facing each other, and the insertion portion is This is a hole between the opposing grooves in the guide hole.
• the mold When the mold is inserted, the mold may be inserted using a jig for erecting the mold, and the jig may be removed after the resin is solidified.
• the mold may be inserted into a temporary hole by placing a mold stand jig on the lower side of the glass substrate and then standing the mold on the mold stand jig.
• a mold may be erected in advance on a mold holder, the mold holder may be brought closer to the lower surface side of the glass substrate, and the molds may be simultaneously inserted into the temporary holes.
• the guide hole can be accurately formed at a predetermined position of the glass substrate.
• a plurality of insertion portions for mounting probe pins are provided in parallel in one guide hole. Therefore, a large number of probes can be provided at a narrower pitch than in the prior art on the support plate in the same region.
• a pin can be attached and a probe pin can be arranged with high position accuracy. Further, the position accuracy and dimensional accuracy of the guide hole can be formed with high accuracy. As a result, it is possible to finely inspect a highly integrated device.
• the probe pin thickness can be increased while the pitch is narrow, so the design flexibility of the probe pin is increased and a highly reliable probe can be manufactured.
• FIG. 1 is a side view of a probe card that works according to an embodiment.
• FIG. 2 is a plan view of a support plate used in the probe card of FIG.
• FIG. 3 is a plan view of a guide hole showing a state where a probe pin is inserted into the guide hole.
• FIG. 4 is a vertical sectional view of a guide hole showing a state where a probe pin is inserted into the guide hole.
• FIG. 5 is an explanatory diagram showing a state in which the contact portion of the probe pin is in contact with the measurement target on the wafer and the contact portion of the locking portion of the probe pin is in contact with the circuit board.
• FIG. 6 is a longitudinal sectional view showing the outline of the configuration of the drilling device.
• FIG. 7 is a perspective view of a silicon substrate.
• FIG. 8 is a longitudinal sectional view of a silicon substrate to which a drilling pin is fixed.
• ⁇ 10 The process of forming guide holes in the glass substrate following Fig. 9 is shown (a) shows the glass substrate taken out of the container, and (b) shows the silicon substrate removed and the pins removed. (C) has shown the mode that the lower surface of the glass substrate was grind
• FIG. 11 is a longitudinal sectional view showing the outline of the configuration of a drilling device that is useful in other embodiments.
• FIG. 12 is a plan view of a support plate that is helpful in another embodiment.
• FIG. 13 is a plan view of a support plate that is helpful in another embodiment.
• FIG. 14 is a plan view of a support plate that is helpful in another embodiment.
• FIG. 15 is a plan view of a support plate that is helpful in another embodiment.
• FIG. 16 is an explanatory view showing a process of forming a guide hole in the support plate, (a) shows a state where a temporary hole is formed, (b) shows a state where a resin layer is formed, and (c) Shows the completed guide hole.
• FIG. 1 shows a schematic side view of a probe card 1 according to the present embodiment.
• This probe card 1 has a circuit board 2 and a support plate 3 disposed on the lower surface of the circuit board 2. is doing.
• the entire probe force mode 1 is supported by a probe device (not shown) so as to face and be parallel to the wafer W, which is an object to be inspected, placed on the mounting table 4.
• the support plate 3 is made of a glass plate and has a substantially disc shape as a whole as shown in FIG. 2, and a plurality of guide holes 5 are formed in the central portion of the mounting table 4 facing the wafer W. Is formed.
• the guide hole 5 has a quadrangular horizontal cross-sectional shape, and has a plurality of groove portions 5a on opposite sides of the hole, and the groove portions 5a are provided to face each other.
• an insertion portion 5b is formed in a region between the opposing groove portions 5a, and the probe pin 11 is inserted into the insertion portion 5b.
• the guide hole 5 has a width D of 300 ⁇ m, and the groove 5a is arranged with a size of A of 50 ⁇ m and B of 60 ⁇ m and a pitch of 100 ⁇ m.
• the probe pin 11 has a configuration in which an elastic portion 12 and a locking portion 13 at the upper end of the elastic portion 12 are integrated.
• the elastic portion 12 has a band shape and a corrugated shape.
• the lower end portion of the elastic portion 12 is molded into a substantially C shape, and a contact portion 12 a that contacts the wafer W is provided at the tip of the elastic portion 12.
• the locking part 13 is longer than the width D of the groove part 5a of the guide hole 5.
• the locking portion 13 functions as a stopper.
• a contact portion 13 a that contacts the circuit board 2 is provided on the upper surface of the locking portion 13.
• the probe pin 11 has a length E of 1500 m
• the elastic portion 12 has a thickness of 50 ⁇ m.
• a contact portion 12a protrudes from the lower surface side of the support plate 3 and is in contact with a predetermined portion on the wafer W, for example, an electrode portion of the formed device, as shown in FIG.
• a contact portion 13 a of the elastic portion 13 protrudes and is in contact with a predetermined contact portion 2 a of the circuit board 2. Then, the electrode part on the wafer W and the contact part 2a on the circuit board 2 are electrically connected.
• FIG. 6 shows an outline of the configuration of a drilling device 21 for forming the guide hole 5 in the glass substrate.
• the drilling device 21 includes a container 23 for accommodating the glass substrate 22 serving as the support plate 3. Yes.
• the container 23 is formed in a box shape whose upper surface is open and whose longitudinal section is concave.
• the inner side surface of the container 23 is formed in a tapered shape so that the inner diameter of the container 23 gradually increases from the bottom surface of the container 23 toward the opening surface.
• the container 23 is made of a material such as carbon, which has a linear expansion coefficient slightly smaller than that of the glass substrate 22 and has a good thermal conductivity and does not fuse with the glass substrate 22. As a result, it is possible to prevent the glass substrate 22 in the container 23 from being damaged due to reduction during cooling, or the glass substrate 22 from being removed from the container 23 after cooling.
• the container 23 is supported by the support member 30 and accommodated in the heating container 31.
• the heating container 31 is formed, for example, in a substantially cylindrical shape having an upper surface opened and a bottom surface closed.
• the heating container 31 is made of, for example, quartz glass.
• the upper surface opening of the heating container 31 is hermetically closed by the lid 32.
• the lid 32 is made of ceramics, for example.
• a heater 33 that generates heat when electric power is supplied is disposed.
• the heater 33 is disposed on the outer surface and the lower surface of the heating container 31, for example.
• the heating container 31 is covered with an external force bar 34 formed of a heat insulating material.
• the heater 33 is interposed between the external force bar 34 and the heating container 31.
• a through hole 32a penetrating in the vertical direction is formed in the center of the lid 32.
• a shaft 40 extending vertically from the top of the lid 32 to the inside of the heating container 31 is passed through 32a.
• the shaft 40 is made of, for example, ceramics.
• the shaft 40 is formed hollow, for example.
• a holding member 41 having a shape of a thick rectangular plate is attached.
• the lower surface 41a of the holding member 41 is formed horizontally.
• a suction port 41 b is formed on the lower surface 41 a of the holding member 41.
• the suction port 41b communicates with a negative pressure generator such as a vacuum pump (not shown) through a vacuum line 42 passing through the shaft 40.
• the upper end portion of the shaft 40 is connected to an elevating drive unit 60 such as a motor disposed above the lid 32.
• the elevating drive unit 60 is supported on a support body 61 installed on the upper surface of the lid body 32, for example.
• the operation of the lifting drive unit 60 is controlled by a control unit 62, for example.
• the raising / lowering drive unit 60 moves the shaft 40 up and down to move the holding member 41 up and down, thereby moving the silicon substrate 50 held by the holding member 41 forward and backward with respect to the glass substrate 22 in the container 23. it can.
• the raising / lowering speed and raising / lowering position of the silicon substrate 50 are controlled by the control unit 62.
• a disc-shaped flange 70 is attached to the shaft 40 between the lid 32 and the elevating drive unit 60, for example.
• An expandable / contractible bellows 71 is interposed between the flange 70 and the lid 32.
• the bellows 71 is provided with a cooling mechanism (not shown) to suppress the heat on the heating container 31 side from being transferred to the lifting drive unit 60 side.
• the vacuum line 42 is connected from the flange 70 to an external negative pressure generator.
• the drilling device 21 is provided with a gas supply pipe 75 for supplying a predetermined gas into the heating container 31.
• the gas supply pipe 75 is connected to the side surface of the heating container 31, for example.
• the gas supply pipe 75 leads to a gas supply source (not shown).
• nitrogen gas is sealed in the gas supply source, and nitrogen gas is supplied into the heating container 31 through the gas supply pipe 75.
• a plurality of holes 50 a are formed at predetermined positions of the rectangular silicon substrate 50.
• the hole 50a has a quadrangular horizontal cross-sectional shape, and a plurality of groove portions 50b are formed on opposite sides of the hole 50a, and the groove portions 50b are provided to face each other.
• a punching die 80 having a peripheral surface adapted to the shape of the hole 50a is inserted.
• the horizontal cross-sectional shape of the punching die 80 matches the horizontal cross-sectional shape of the guide hole 5, and the height F of the punching die 80 in this embodiment is, for example, 10000 ⁇ m.
• the hole 50a of the silicon substrate 50 is formed, for example, by dry etching using a photolithography technique.
• the hole 50a has a positional accuracy and dimensional accuracy within 2 m.
• the hole 50a is formed in a size slightly larger than the drilling die 80 to be inserted.
• the arrangement and number of holes 50a in the silicon substrate 50 are appropriately set according to the positions of the guide holes 5 finally formed in the glass substrate 22.
• the method for forming the hole 50a is not limited to dry etching. Further, the hole 50a may not be a through hole.
• the hole punching die 80 has heat resistance to, for example, a heating temperature described later, for example, 1000 ° C., and is formed of a metal such as tungsten, stainless steel, molybdenum, nickel, or a nickel alloy.
• the drilling die 80 is formed by, for example, an etching cache. Further, the punching die 80 may be formed by, for example, machining or electric plating.
• the adhesive L is applied to the silicon substrate 50, and the punching die 80 is fixed to the silicon substrate 50.
• the punching die 80 may be fixed by, for example, press fitting.
• the silicon substrate 50 to which the punching die 80 is fixed is adsorbed and held on the lower surface 41a of the holding member 41 in the punching device 21 with the punching die 80 facing down as shown in FIG.
• the adsorption of the silicon substrate 50 is performed by suction from the suction port 41b.
• a rectangular and flat glass substrate 22 is accommodated in the container 23 of the drilling device 21.
• nitrogen gas is supplied from the gas supply pipe 75 into the heating container 31, and the inside of the heating container 31 is maintained in a nitrogen atmosphere.
• the inside of the heating container 31 is maintained at a positive pressure with respect to the outside to prevent outside air from flowing into the heating container 31. Stop.
• the temperature inside the heating container 31 is raised by the heat generated by the heater 33 in a state where the silicon substrate 50 and the glass substrate 22 are close to each other.
• the glass substrate 22 in the container 23 is heated to about 1000 ° C., which is higher than the soft spot.
• the silicon substrate 50 and the punching die 80 are also heated to the same temperature as the glass substrate 22.
• the glass substrate 22 begins to melt (FIG. 9 (b)).
• the control unit 62 activates the elevating drive unit 60, and the holding member 41 is lowered to a predetermined position at a predetermined speed (FIG. 9 (c)).
• the punching die 80 of the silicon substrate 50 is inserted to a predetermined depth in the glass substrate 22.
• the heat generation by the heater 33 is stopped, and the glass substrate 22 is cooled and solidified in a state where the punching die 80 is inserted into the molten glass substrate 22.
• the cooling at this time is performed more slowly than the temperature fluctuation during heating. Further, this cooling is performed in a state where the holding member 41 holds the silicon substrate 50.
• the glass substrate 22 is taken out from the heating container 31 with the perforating mold 80 and the silicon substrate 50 attached thereto. Next, it is immersed in a chemical solution such as aqua regia, and the drilling die 80 is melted (FIG. 10 (b)). In this way, the punching die 80 and the silicon substrate 50 are removed from the glass substrate 22, and a hole 100 is formed on the upper surface of the glass substrate 22.
• a chemical solution such as aqua regia
• the lower surface of the glass substrate 22 is polished, and the hole 100 of the glass substrate 22 penetrates.
• the guide hole 5 shown in FIG. 3 is formed in the glass substrate 22 (FIG. 10 (c)).
• the upper surface of the glass substrate 22 is polished as necessary.
• a plurality of holes 50a having high positional accuracy and dimensional accuracy are formed in the silicon substrate 50 using photolithography technology, and the punching die 80 provided upright in the holes 50a is used. Since the hole 100 is formed in the glass substrate 22, the guide hole 5 having high positional accuracy and dimensional accuracy can be easily formed in the glass substrate 22 as the support plate 3.
• Carbon may be used for the punching die 80.
• the punching die 80 can be processed into the shape of the guide hole 5 by, for example, cutting.
• the punching die 80 when a metal such as tungsten, stainless steel, molybdenum, nickel, or a nickel alloy is used for the punching die 80, for example, when removing the punching die 80 from the solidified glass substrate 22, for example, Immerse it in chemical solution such as aqua regia and melt the drilling die 80.
• the punching die 80 when carbon is used for the punching die 80, the punching die 80 can be removed from the glass substrate 22 by burning the carbon.
• the combustion temperature of carbon is about 400 ° C or higher, and it is possible to burn only the punching die 80 without deforming the glass substrate 22 which is lower than 510 ° C, which is the strain point of the glass substrate 22.
• the perforating device 110 shown in FIG. 11 may be used as a glass substrate perforating device.
• the drilling device 110 is a device in which an oxygen supply pipe 76 for burning the drilled substrate 80 is added to the drilling device 21 according to the embodiment of the present invention.
• the oxygen supply pipe 76 is connected to the side surface of the heating container 31.
• the oxygen supply pipe 76 communicates with an oxygen supply source (not shown), and oxygen is supplied into the heating container 31 through the oxygen supply pipe 76.
• the step of removing the perforated substrate 80, which is carbon, using the perforating apparatus 110 is, for example, This is done.
• Oxygen is supplied from an oxygen supply pipe 76 into a heating vessel 31 cooled to about 500 ° C in order to solidify the glass substrate 22.
• the drilling die 80 which is carbon, is burned and removed.
• the glass substrate 22 is not deformed because the strain point is 510 ° C., and the shape is maintained as it is.
• the perforated substrate 80 can be removed in the heating container 31 of the perforating apparatus 110.
• the guide hole 5 formed in the support plate 3 of the probe card 1 according to the above embodiment is formed in the resin layer 200 formed so as to penetrate the support plate 3, as shown in FIG. .
• the resin layer 200 has a horizontal cross section larger than that of the guide hole 5, and the horizontal cross section is, for example, substantially circular. Note that the resin layer 200 has a rectangular horizontal cross section as shown in FIG. Good. If the distance between the guide holes 5 is relatively small, the plurality of guide holes 5 may be formed in one resin layer 200 as shown in FIG.
• the support plate 3 may be formed with a mixture of guide holes 5 and other guide holes 201 having, for example, a rectangular horizontal cross section.
• Another guide hole 201 is formed at a location where the distance between the probe pins 11 is relatively large, and one probe pin 11 is inserted into the other guide hole 201.
• the guide holes 5 and 201 are formed in the resin layer 200, respectively.
• the guide hole 5 formed in such a resin layer 200 can be formed as follows, for example.
• a temporary hole 210 having a horizontal cross section larger than the guide hole 5 is formed at a predetermined position of the support plate 3 by machining such as a drill cage. It is formed through.
• the temporary hole 210 is filled with the resin melted at about 400 ° C. Thereafter, as shown in FIG. 16 (b), the filled resin is cooled and solidified to form a resin layer 200.
• the guide hole 5 is formed through a predetermined position of the solidified resin layer 200 by, for example, mechanical processing.
• the temporary hole 210 is formed in the support plate 3, and the guide hole 5 is formed in the resin layer 200 provided in the temporary hole 210. Since the resin layer 200 has extremely good cutting workability as compared with the glass substrate on which the support plate 3 is formed, the extremely small guide holes 5 can be easily formed even by using, for example, machining. Therefore, the guide hole 5 having a predetermined dimension can be formed at a predetermined position of the support plate 3 with high position accuracy and dimensional accuracy. Although the thermal expansion coefficient of the resin layer 200 is larger than that of the glass substrate, the resin layer 200 is formed in the support plate 3 as in the present embodiment! ! / The other guide holes 201 formed in the resin layer 200 can also be formed by the above steps.
• the guide hole 5 formed in the resin layer 200 may be formed as follows. First, as shown in FIG. 17A, a temporary hole 210 identical to the temporary hole 210 of the above embodiment is formed.
• FIG. 17 (b) it has a cross-sectional shape adapted to the temporary hole 210, and the support plate 3 A dummy mold 220 having a length shorter than the thickness of the temporary hole 210 is inserted into the lower portion of the temporary hole 210.
• copper is used as the material of the dummy mold 220.
• the temporary hole 210 above the dummy mold 220 is filled with resin melted at about 400 ° C. Thereafter, as shown in FIG. 17 (c), the filled resin is cooled and solidified to form the resin layer 200.
• the dummy mold 220 is etched with a chemical solution and removed from the temporary holes 210. Then, as shown in FIG. 17 (d), the guide hole 5 is formed at a predetermined position of the solidified resin layer 200 by, for example, a mechanical cage.
• the temporary hole 210 is formed in the support plate 3, the dummy mold 220 is inserted into the lower portion of the temporary hole 10, and then melted in the temporary hole 10 above the dummy mold 220. After filling the resin, the dummy mold 220 is removed, and the guide hole 5 is formed in the solidified resin layer 200. Therefore, only the upper part of the temporary hole 10 is checked to guide the guide hole. If 5 is formed, the guide hole 5 can be formed more easily. Further, if the resin layer 200 is filled only in the upper portion of the temporary hole 210, the amount of the resin can be reduced. This method is effective when the probe pin 11 can be guided without forming the guide hole 5 in the entire thickness of the support plate 3.
• the other guide holes 201 formed in the resin layer 200 can also be formed by the above steps.
• the guide hole 5 formed in the resin layer 200 may be formed as follows. First, as shown in FIG. 18 (a), a temporary hole 210 identical to the temporary hole 210 of the above embodiment is formed.
• the standing tool 230 is placed in contact with the lower surface of the support plate 3.
• a groove 230 a having the same dimensions as the guide holes 5 is formed on the upper surface of the mold setting jig 230 at a predetermined position facing the guide holes 5 formed in the support plate 3.
• the groove 230a is a shallow groove that does not penetrate the support plate 3, and can be formed by etching, for example.
• the mold 231 suitable for the guide hole 5 is inserted into the temporary hole 210 with the groove 230a of the mold setting jig 230 as a target, and the tip of the mold 231 is pushed into the groove 230a to stand.
• a material having a coefficient of thermal expansion comparable to that of the support plate 3 is used for the mold setting jig 230, and for example, a silicon substrate is used.
• the material of mold 231 does not deform even at 400 ° C, the melting temperature of the resin described below.
• a metal such as nickel, nickel alloy, copper, copper alloy, aluminum or aluminum alloy is used.
• the gap between the temporary hole 210 and the mold 231 is filled with the molten resin at about 400 ° C. Thereafter, as shown in FIG. 18 (c), the filled resin is cooled and solidified to form a resin layer 200.
• the mold setting jig 230 is removed as shown in Fig. 18 (d). Then, the support plate 3 into which the mold 231 is inserted is immersed in a chemical solution such as aqua regia, and the mold 231 is melted as shown in FIG. 18 (e).
• the temporary hole 210 is formed in the support plate 3, and the mold 231 is inserted into the temporary hole 210 by using the standing jig 230, so that the position of the mold 231 relative to the support plate 3 is determined. Is determined accurately. Further, after that, the gap between the temporary hole 210 and the mold 231 is filled with resin, the mold 231 is removed, and the upper surface of the support plate 3 is polished, so that the guide hole 5 can be formed at the position where the mold 231 is removed. it can.
• the other guide holes 201 formed in the resin layer 200 can also be formed by the above steps.
• the mold 231 When the mold 231 is inserted into the temporary hole 210 using the mold setting jig 230, the mold 231 is set up in advance in all the grooves 230a of the mold setting jig 230. All the molds 231 may be inserted into the temporary holes 210 at the same time by bringing 230 closer to the lower surface side force of the support plate 3.
• the mold 231 may be longer than the temporary hole 210 and the mold 231 may pass through the temporary hole 210.
• the present invention is useful for a probe card for inspecting electrical characteristics of a highly integrated electronic device.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Measuring Leads Or Probes (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)

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Citations (8)

• 2007
  • 2007-04-18 WO PCT/JP2007/058420 patent/WO2007123150A1/ja not_active Ceased
  • 2007-04-18 TW TW96113702A patent/TW200809209A/zh not_active IP Right Cessation

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