Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
  • H01L2224/491—Disposition
  • H01L2224/49105—Connecting at different heights
  • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/483—Containers
  • H01L33/486—Containers adapted for surface mounting
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
  • H05K2201/09645—Patterning on via walls; Plural lands around one hole
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
  • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
  • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
  • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
  • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Definitions

• the present invention relates to a method of fabricating a printed circuit board for mounting light emitting diode chips and a light emitting diode package using the same, and more particularly, to a method of fabricating a printed circuit board wherein top and bottom surfaces of the printed circuit board for mounting light emitting diode chips can be electrically connected without using through-holes by solving problems generated in a method of forming through-holes to connect the upper and lower electrodes of a conventional printed circuit board for mounting light emitting diode chips, and a light emitting diode package having the printed circuit board.
• a method of forming an electrode of a printed circuit board for mounting conventional LED chips may include a method using through-holes and a method of forming an electrode into a 'D' shape
• a plurality of electrodes should be formed at one side of the printed circuit board to individually drive the respective light emitting diode chips in a case where a plurality of light emitting diode chips is to be mounted on a printed circuit board.
• only a method of using through-holes can be applied in order to form a plurality of electrodes at one side of the printed circuit board.
• FIGs. 1 to 3 are sectional, top and bottom views illustrating examples of a printed circuit board for a conventional light emitting diode package, respectively.
• Examples of Figs. 1 to 3 show a substrate with four electrodes in which two electrodes are connected to the anode and cathode of a light emitting diode.
• electrode patterns 12 are formed at both ends of a printed circuit board 11, and through-holes 13 are formed in the electrode patterns 12, re- spectively.
• a light emitting chip (not shown) is mounted on the electrode patterns 12, and a resin portion 14 of epoxy or silicone resin is formed on the light emitting chip.
• the related art printed circuit board is configured in such a manner that a copper clad laminate (CCL) panel to which several tens to hundreds of chip substrates as shown in Fig. 2 can be mounted is first prepared, patterns for units are designed on a copper clad laminate, a plurality of through-holes 13 are processed at predetermined positions on the copper clad laminate through a drilling process, and electrode patterns 12 and inner walls of the through-holes 13 are plated through a pattern plating process to electrically connect top and bottom surfaces of the substrates.
• CCL copper clad laminate
• the CCL panel in which several tens to hundreds of substrate units are formed are cut along the through-holes 13 by a sawing process to form a printed circuit board unit for mounting light emitting diode chips as shown in Figs. 1, 2 and 3.
• the through-holes 13 formed on the electrode patterns 12 are cut into two semicircular halves by the sawing process as shown in Figs. 2 and 3.
• light emitting diode chips (not shown) are mounted onto a substrate and electrically connected to the substrate by a connection method such as wire bonding, and a resin portion 14 made of a material such as epoxy or silicone resin is then formed on the light emitting diode chips, as shown in Fig. 1. Therefore, a light emitting diode package is completed.
• the finished light emitting diode package is mounted onto a predetermined position of a main printed circuit board for use in a final finished product, and both ends of the package, i.e. portions of the package where electrode pads are formed, are soldered and connected to the main printed circuit board.
• the through-holes should be conventionally bored through the electrode patterns 12 to connect the circuits on the top and bottom sides to each other, as shown in Fig. 1.
• An object of the present invention is to provide a method of fabricating a printed circuit board for mounting light emitting diode chips in accordance with recent trends of miniaturization and high integration of electronic appliances, and a light emitting diode package having the printed circuit board.
• Another object of the present invention is to provide a method of fabricating a printed circuit board, which can eliminate possibility of defects generated due to through-holes during a process of fabricating a printed circuit board and can simplify the process, and a light emitting diode package having the printed circuit board.
• a further object of the present invention is to provide a method of fabricating a printed circuit board, which can solve a solderability problem generated due to through-holes in the printed circuit board when mounting a main printed circuit board, and a light emitting diode package having the printed circuit board.
• a method of fabricating a printed circuit board for mounting light emitting diode chips comprising the steps of preparing a substrate with a plurality of electrode pads formed in pairs on top and bottom surfaces thereof; cutting a selected region of the substrate to form a slot for allowing side surfaces of the respective electrode pads formed on the top and bottom surfaces of the substrate and side surfaces of the substrate placed between the respective electrode pads to be exposed; selectively plating the exposed side surfaces of the substrate to electrically connect the respective exposed electrode pads formed in pairs on the top and bottom surfaces of the substrate; and cutting the substrate into individual units for mounting light emitting diode chips.
• a method of fabricating a printed circuit board for mounting light emitting diode chips comprising the steps of preparing a substrate for mounting a plurality of light emitting diode chips; cutting a selected region of the substrate to form a slot for allowing side surfaces of the substrate to be exposed; forming a plurality of electrode pads in pairs on top and bottom surfaces of the substrate and selectively plating the top and bottom surfaces of and the side surfaces of the substrate to electrically connect the respective electrode pads formed in pairs on the top and bottom surfaces of the substrate; and cutting the substrate to a unit size enough to mount an individual light emitting diode chip.
• a light emitting diode package comprising a light emitting diode chip mounting substrate having straight sides; electrode patterns for covering both ends of the substrate in a 'D' shape and electrically connecting top and bottom surfaces of the substrate; a plurality of light emitting diode chips mounted on the substrate to be connected to the electrode patterns; and a resin portion for molding the plurality of light emitting diode chips. Furthermore, a half of four or more even-numbered electrode patterns are arranged on each of both ends of the substrate.
• a printed circuit board for mounting light emitting diode chips in accordance with recent trends of miniaturization and high integration of electronic appliances can be fabricated.
• possibility of defects generated due to through-holes during a process of fabricating a printed circuit board can be eliminated, and the process can also be simplified.
• a solderability problem generated due to through-holes on a related art printed circuit board when mounting a main printed circuit board can be solved.
• Figs. 1 to 3 show sectional, top and bottom views of a printed circuit board for a related art light emitting diode (LED) package, respectively.
• Figs. 4 to 10 illustrate a method of fabricating a printed circuit board according to an embodiment of the present invention.
• Fig. 11 illustrates a method of fabricating a printed circuit board according to another embodiment of the present invention.
• Fig. 12 illustrates perspective, plan, sectional and rear views of a light emitting diode package in which a plurality of light emitting diode chips are mounted on the printed circuit board according to the present invention.
• Figs. 13 and 14 illustrate a process of mounting a substrate for use in the light emitting diode package according to the present invention onto a main printed circuit board.
• Fig. 4 is a plan view illustrating a portion of a printed circuit board 21 on which electrode pads 22 are formed according to the present invention.
• Fig. 5 is a sectional view as seen from a direction of an arrow shown in Fig. 4.
• electrode pads 22 are patterned on a printed circuit board
• the electrode pads 22 can be formed by plating patterns on an insulating substrate and by forming an etching resist pattern on a substrate with copper foils formed thereon, e.g. a copper clad laminate, to perform an etching process.
• Fig. 4 it is illustrated that four electrode pads are formed into a unit substrate 23 and two light emitting chips are mounted on this unit substrate.
• the number of electrode pads included in the unit substrate 23 is not limited to four but may be greater than four.
• the number of light emitting chips to be mounted to the unit substrate may be greater than two.
• a portion of the substrate between the adjacent unit substrates is cut to include a lower portion of a unit substrate 23a and an upper portion of a unit substrate 23b as shown in Fig. 6, so that a slot 24 can be formed.
• a commercialized dicing machine can be used for forming the slot 24.
• Fig. 7 is a sectional view seen from a direction of an arrow shown in Fig. 6. Both side surfaces of the unit substrates are exposed through the above cutting process.
• a liquid plating resist may be coated on the remaining portion of the side surfaces of the substrate excluding a portion to be plated, before the plating process is conducted. After the plating process has been finished, the plating resist is removed.
• a printed circuit board with 4-electrodes for mounting light emitting chips, in which through-holes are not formed, can be obtained by cutting the substrate 21 along a dotted line as shown in Fig. 10.
• the electrode pads 22 on the top and bottom surfaces of the substrate 21 can be connected to each other on the side surfaces thereof by individually forming slots 26 on the electrode pads 22 and performing electroless plating as shown in Fig. 11. That is, the electrode pads 22 on the top and bottom surfaces of the substrate 21 can be connected to each other without using the through-holes by forming the slots 26 on the respective electrode pads 22 of the substrate and coating a film-type plating resist only on the surface of the substrate to plate the side surfaces of the substrate 21 without coating a liquid plating resist for selective plating onto the side surfaces of the substrate 21.
• the slots 26 are formed on the respective electrode pads on the top and bottom surfaces of the substrate 21, which in turn are connected through a plating layer 25, and the printed circuit board 21 can be cut into unit substrates. Therefore, a 4-electrode printed circuit board for mounting light emitting chips without through-holes is completed.
• Fig. 12 illustrates perspective, plan, sectional and rear views of a light emitting diode package in which a plurality of light emitting diode chips are mounted on a printed circuit board according to the present invention.
• electrode patterns 22a, 22b, 22c and 22d are formed into such a structure that the electrode patterns cover both sides of the substrate 21 in a 'D' shape. In this manner, the top and bottom surfaces of the substrate 21 can be electrically connected to each other without using the conventional through-holes.
• electrode pads for a 4-electrodes substrate have been explained in this embodiment by way of example, a substrate having various electrode pads such as 6-electrode substrate may be formed. Two or more light emitting chips can be mounted in accordance with the number of electrode pads. The even-numbered electrode pads, a half of which are arranged on each of both ends of the substrate, are provided.
• plating resist patterns are formed on the side surfaces of the substrate as well as on the top and bottom surfaces of the substrate, and a plating layer is then formed on the side surfaces of the substrate and the top and bottom surfaces of the substrate at the same time.
• a light emitting diode package is completed by mounting two light emitting chips
• the light emitting chips are mounted onto the substrate at predetermined positions thereof and are then electrically connected to the electrode pads 22 through wires.
• the resin portion 27 is formed through a molding process.
• epoxy or silicone resin may be used as the resin portion 27 for use in the molding process.
• the resin portion 27 can be formed using various molding methods such as transfer molding and injection molding according to a manufacturing method.
• phosphors can be contained in the resin portion 27 to disperse light from the light emitting chips, so that light with diverse wavelengths can be produced.
• top and bottom surfaces of a printed circuit board according to the present invention are connected in a state where through-holes are not formed in the printed circuit board, contrary to a related art light emitting diode package.
• Figs. 13 and 14 illustrate a method of mounting a light emitting diode package of the present invention onto a main printed circuit board for a finished product.
• the light emitting diode package is mounted on the main printed circuit board 29 such that the electrode patterns 22 on the bottom surface of the light emitting diode package are connected to electrodes 30 of the main printed circuit board 29.
• the light emitting diode package is connected to the main printed circuit board by solder 31 as shown in Fig. 14.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Led Device Packages (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=38228407

Family Applications (1)

Country Status (3)

Cited By (1)

Families Citing this family (1)

Citations (4)

• 2005
  • 2005-12-30 KR KR1020050135436A patent/KR100715457B1/ko not_active IP Right Cessation
• 2006
  • 2006-12-28 WO PCT/KR2006/005809 patent/WO2007078104A1/en active Application Filing
  • 2006-12-29 TW TW95150038A patent/TWI303538B/zh not_active IP Right Cessation

Patent Citations (4)

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