CN103579010A - 一种侧壁金属化封装产品的制作方法 - Google Patents
一种侧壁金属化封装产品的制作方法 Download PDFInfo
- Publication number
- CN103579010A CN103579010A CN201210280573.5A CN201210280573A CN103579010A CN 103579010 A CN103579010 A CN 103579010A CN 201210280573 A CN201210280573 A CN 201210280573A CN 103579010 A CN103579010 A CN 103579010A
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- China
- Prior art keywords
- substrate
- back side
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- packaging
- base plate
- Prior art date
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- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000012858 packaging process Methods 0.000 claims abstract description 8
- 239000011241 protective layer Substances 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000005336 cracking Methods 0.000 abstract description 5
- 238000001465 metallisation Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 37
- 238000012536 packaging technology Methods 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011265 semifinished product Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 3
- 238000012356 Product development Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210280573.5A CN103579010B (zh) | 2012-08-08 | 2012-08-08 | 一种侧壁金属化封装产品的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210280573.5A CN103579010B (zh) | 2012-08-08 | 2012-08-08 | 一种侧壁金属化封装产品的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103579010A true CN103579010A (zh) | 2014-02-12 |
CN103579010B CN103579010B (zh) | 2016-12-21 |
Family
ID=50050516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210280573.5A Active CN103579010B (zh) | 2012-08-08 | 2012-08-08 | 一种侧壁金属化封装产品的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103579010B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111243964A (zh) * | 2020-01-15 | 2020-06-05 | 中国电子科技集团公司第五十四研究所 | 一种具有大面积侧壁金属图形的薄膜电路及其制备方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811799A (en) * | 1997-07-31 | 1998-09-22 | Wu; Liang-Chung | Image sensor package having a wall with a sealed cover |
CN1288256A (zh) * | 1999-09-13 | 2001-03-21 | 维谢伊因特泰克诺洛吉公司 | 半导体器件的芯片规模表面安装封装及其制造方法 |
CN1812004A (zh) * | 2005-01-28 | 2006-08-02 | 大毅科技股份有限公司 | 具凸出端电极多电路元件晶片的制造方法 |
WO2007078104A1 (en) * | 2005-12-30 | 2007-07-12 | Seoul Semiconductor Co., Ltd. | Method of fabricating printed circuit board for mounting light emitting diode chip and light emitting diode package having the circuit board |
JP2007208025A (ja) * | 2006-02-02 | 2007-08-16 | New Japan Radio Co Ltd | 半導体装置およびその製造方法 |
CN101567411A (zh) * | 2009-05-26 | 2009-10-28 | 晶科电子(广州)有限公司 | 发光二极管倒装焊集成封装结构及制作方法 |
CN101587925A (zh) * | 2008-05-23 | 2009-11-25 | 精材科技股份有限公司 | 发光元件的封装结构及其制造方法 |
US20100252852A1 (en) * | 2009-04-06 | 2010-10-07 | Chih-Hung Wei | Cooling block assembly and led including the cooling block |
CN102130071A (zh) * | 2010-01-14 | 2011-07-20 | 精材科技股份有限公司 | 芯片封装体及其形成方法 |
CN102244057A (zh) * | 2011-03-15 | 2011-11-16 | 日月光半导体制造股份有限公司 | 半导体封装及其制造方法 |
-
2012
- 2012-08-08 CN CN201210280573.5A patent/CN103579010B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811799A (en) * | 1997-07-31 | 1998-09-22 | Wu; Liang-Chung | Image sensor package having a wall with a sealed cover |
CN1288256A (zh) * | 1999-09-13 | 2001-03-21 | 维谢伊因特泰克诺洛吉公司 | 半导体器件的芯片规模表面安装封装及其制造方法 |
CN1812004A (zh) * | 2005-01-28 | 2006-08-02 | 大毅科技股份有限公司 | 具凸出端电极多电路元件晶片的制造方法 |
WO2007078104A1 (en) * | 2005-12-30 | 2007-07-12 | Seoul Semiconductor Co., Ltd. | Method of fabricating printed circuit board for mounting light emitting diode chip and light emitting diode package having the circuit board |
JP2007208025A (ja) * | 2006-02-02 | 2007-08-16 | New Japan Radio Co Ltd | 半導体装置およびその製造方法 |
CN101587925A (zh) * | 2008-05-23 | 2009-11-25 | 精材科技股份有限公司 | 发光元件的封装结构及其制造方法 |
US20100252852A1 (en) * | 2009-04-06 | 2010-10-07 | Chih-Hung Wei | Cooling block assembly and led including the cooling block |
CN101567411A (zh) * | 2009-05-26 | 2009-10-28 | 晶科电子(广州)有限公司 | 发光二极管倒装焊集成封装结构及制作方法 |
CN102130071A (zh) * | 2010-01-14 | 2011-07-20 | 精材科技股份有限公司 | 芯片封装体及其形成方法 |
CN102244057A (zh) * | 2011-03-15 | 2011-11-16 | 日月光半导体制造股份有限公司 | 半导体封装及其制造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111243964A (zh) * | 2020-01-15 | 2020-06-05 | 中国电子科技集团公司第五十四研究所 | 一种具有大面积侧壁金属图形的薄膜电路及其制备方法 |
CN111243964B (zh) * | 2020-01-15 | 2021-06-08 | 中国电子科技集团公司第五十四研究所 | 一种具有大面积侧壁金属图形的薄膜电路的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103579010B (zh) | 2016-12-21 |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211202 Address after: 518000 101, No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Tianxin Internet Technology Co., Ltd Address before: 518000 No. 99 Qiaocheng East Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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TR01 | Transfer of patent right |