Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
  • H05K3/005—Punching of holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0147—Carriers and holders
  • H05K2203/0173—Template for holding a PCB having mounted components thereon
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/03—Metal processing
  • H05K2203/033—Punching metal foil, e.g. solder foil

Definitions

• Punching device in particular for printed circuit boards, and punching methods
• the invention relates to a punching device, in particular for printed circuit boards, as well as a punching method according to the preambles of the independent claims.
• thermal vias are designed as small holes or blind holes that can be used for heat conduction.
• the plated-through holes for electrical connection can be provided on the components of a circuit arrangement arranged on the upper side of the printed circuit board and a metallic printed conductor structure applied there to the underside thereof (so-called electrical vias).
• a punching device in particular for printed circuit boards, comprises an upper part with at least one punch and a lower part with a holding plate and at least one cutting bushing as a punching template, wherein the element to be punched is arranged between the upper part and the lower part, and wherein the cut bushing as a cut film is trained.
• the cutting bush instead of the cutting bush, the cut film is used, punch diameter and grid spacing in the required micrometer dimensions.
• the punching device is suitable for punching of ceramic hybrid printed circuit boards, in particular ceramic films (LTCC tapes or Low Temperature Cofired Ceramics), with which complex three-dimensional electrical circuits can be realized.
• cut film is made of metal or plastic.
• the cut film can be produced at a first punch stroke. This has the advantage that exactly the punching image of the stamp is displayed. Manufacturing tolerances between the upper part and the lower part can thus be conveniently eliminated.
• a cutting film is used instead of the cutting bushing, with which grid dimensions in the micrometer range can be produced, which is particularly relevant in printed circuit board production.
• the stamping image of the stamp can preferably be formed on the cut film, whereby stamped bushes are produced in the cut film.
• the punched cut film can then be used as a punching template for the ceramic film, whereby the actual punching of the ceramic films begins.
• FIG. 1a schematically a punching device according to the prior art in a sectional view (Fig. 1a) and in an exploded perspective view ( Figure 1 b).
• a punching device 10 according to the prior art is shown, wherein Fig. 1a shows a sectional view and Fig. 1 b is an exploded perspective view.
• the punching device 10 comprises an upper part 12 and a lower part 15, wherein between the upper part 12 and the lower part 15, the element to be punched is arranged, which is formed in FIG. 1 as a printed circuit board 11.
• the upper part 12 of the punching device 10 comprises a punch 13 with a stamping needle 14 formed as a punching tool along a Punching direction 20 is reciprocable.
• the punch 13 is arranged within a guide plate 21.
• the actual guidance of the punching needle 14 takes place within a stripper bushing 22 which is arranged in a stripper plate 23 connected to the guide plate 21.
• a lower part 15 of the punching device 10 comprises a holding plate 16 with at least one cutting bushing 17 as a punching template.
• a punching image predetermined by the cutting bushing 17 is transferred to the element 11 to be punched during the punching process. Punctured waste can be discharged via an outlet 25, whereby air can be blown into an outlet region 29 via a channel 28 to assist or accelerate the disposal, wherein a flow direction of the air is represented by an arrow.
• a diameter 27 of the cutting bush 17 is approximately at least 3000 microns. Due to the progressive miniaturization of components in printed circuit board technology, the conventional punching devices with such grid intervals are no longer applicable.
• a punched circuit board 11 is shown with punch holes 24, which corresponds to a predetermined cutting pattern of the cutting bushings 17 in the holding plate 16 and have been punched by means arranged in the upper part 12 punching needles 14.
• FIGS. 2a to 2d show individual working processes of a punching method according to the invention by means of a preferred embodiment of a punching device 10 in chronological order.
• the basic construction of the punching device according to the invention corresponds to that in FIG. 1, so that reference is made to avoid repetition.
• the same elements are provided with the same reference numerals.
• the cutting bush 17 is designed as a cut film 18, which predetermines the stamped image.
• hold-downs 26 avoids the so-called Hof formation around holes and slots, with a hold-down force is designed depending on the material of the elements to be punched. Puncture residues are disposed of via an outlet 25.
• FIG. 2 a shows a punching device 10 in an inactive position prior to the first punching operation, the cutting foil 18 still being arranged as an unprocessed blank between the upper part 12 and the lower part 15.
• FIG. 2 b shows a situation after a first punching stroke, wherein the cut film 18 is produced. In the first punching stroke, the stamped image of the punch 13 is imaged on the cut film 18.
• FIG. 2c The cut film 18 produced in this way is used in FIG. 2c as a punching template for the ceramic film 19.
• Fig. 2c the situation during a punching operation of the ceramic sheet 19 is shown, wherein the cut film 18 is used instead of the cutting bush 17 (Fig. 1).
• a module of the ceramic sheet 19 is punched according to the predetermined by the cut film 18 punch template and moved to a grid in the arrow direction.
• a second module of the ceramic film 19 between the upper part 12 and the lower part 15 of the punching device 10 and is prepared for the next punching operation.

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Citations (3)

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• 2005
  • 2005-12-30 DE DE200510063278 patent/DE102005063278A1/de not_active Withdrawn
• 2006
  • 2006-12-27 WO PCT/EP2006/070220 patent/WO2007077181A1/de active Application Filing

Patent Citations (3)

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