WO2007074765A1

WO2007074765A1 - Probe card

Info

Publication number: WO2007074765A1
Application number: PCT/JP2006/325756
Authority: WO
Inventors: Shigeki Ishikawa; Takashi Nidaira
Original assignee: Nhk Spring Co., Ltd.
Priority date: 2005-12-28
Filing date: 2006-12-25
Publication date: 2007-07-05
Also published as: CN101346632A; JP2007178406A; TW200734650A; KR20080083020A; CN101346632B; JP4757630B2; KR101021253B1; TWI324256B

Abstract

An influence of cross talk between neighboring test subjects is suppressed. A probe card comprises a plurality of probes in contact with test subjects for carrying out at least either the input or output of an electric signal; a board having a wiring pattern corresponding to a circuit structure to generate a test signal; a plurality of input leads for transmitting an input signal to the test subjects, wherein one end terminals of the leads are electrically connected to either one of the plurality of the probes; a plurality of coaxial cables, one end terminals of which are electrically connected to the board and the other end terminals of which are electrically connected to either one of the plurality of the input leads or either one of the plurality of the probes; a plurality of output leads for transmitting an output signal from the test subjects, wherein one end terminals of the output leads are electrically connected to either one of the plurality of the probes; and a shielding plate provided at a region adjacent to places where the output leads connected to one of neighboring two test subjects cross with the input leads connected to the other test subject.

Description

Probe card

Technical field

[0001] The present invention relates to a probe card used when a predetermined inspection is simultaneously performed on a plurality of inspection objects.

Background art

Conventionally, for example, an IC package called TCP (Tape Learner Package) such as TAB (Tape Automated Bondmg) A CuF (and hip On Film) is used for a driver circuit of a liquid crystal panel constituting a liquid crystal display, for example. This TCP is formed by mounting a semiconductor chip such as an LSI (Large Scale Integrated Circuit) on a thin film-like substrate with a predetermined wiring pattern formed on the surface. .

[0003] When manufacturing a TCP, an inspection relating to electrical characteristics is performed in order to detect defective products, as in the case of other semiconductor integrated circuits. More specifically, the wiring pattern formed on the film substrate is inspected for electrical shorts and breaks (continuity inspection), and after mounting the semiconductor chip, a predetermined pattern is applied to the semiconductor chip via the wiring pattern. Operation characteristic inspection etc. that inputs and outputs inspection signals are performed.

By the way, recent semiconductor integrated circuits have come to have a structure that operates using high-frequency electrical signals in order to realize high-speed arithmetic processing. If the wiring structure for inputting / outputting high-frequency electrical signals to / from the inspection target is configured with conductive wires such as enameled wires, the waveform of the inspection signal tends to become dull, and high-frequency measurement performance is likely to be disturbed. There's a problem. Therefore, as a countermeasure against such a problem, an inspection system that realizes a wiring structure for transmitting an inspection signal using a coaxial cable has been proposed (for example, see Patent Documents 1 and 2).

[0005] Patent Document 1: Japanese Patent No. 2971706

Patent Document 2: Japanese Patent No. 3357294

Disclosure of the invention

Problems to be solved by the invention [0006] However, in the case where the inspection is performed simultaneously by transmitting high-frequency electrical signals to a plurality of inspection objects, one of the inspection objects is input to the adjacent inspection object. In some cases, crosstalk occurred near the wiring between the force side and the output side of the other inspection target. More specifically, when transmitting high-frequency electrical signals, a voltage of 3 V or more is applied as the power supply voltage, so a large electromagnetic wave is generated during inspection, and the influence of crosstalk on other wiring cannot be ignored. There was a case. In this case, the other output wiring to be inspected may be affected by noise, etc. due to electromagnetic induction, making the inspection itself impossible.

[0007] The present invention has been made in view of the above, and an object of the present invention is to provide a probe card that can suppress the influence of crosstalk between adjacent inspection objects.

Means for solving the problem

In order to solve the above-described problems and achieve the object, the invention according to claim 1 is configured to electrically connect between a plurality of test targets and a circuit structure that generates a test signal. A probe card capable of simultaneously inputting / outputting the inspection signal to / from at least a part of the plurality of inspection objects, and is made of a conductive material, and is in contact with the inspection object to input or output an electric signal. A plurality of probes that perform at least one of them, a substrate having a wiring pattern corresponding to the circuit structure, and one end of each of the plurality of probes are electrically connected to each other, and input to the inspection object A plurality of input conductors for transmitting a signal, one end of which is electrically connected to the substrate, and the other end is electrically connected to either of the plurality of input conductors or the plurality of probes! / Multiple connected to the same One end of the cable is electrically connected to one of the plurality of probes, a plurality of output conductors for transmitting an output signal from the inspection target, and two adjacent conductors made of a conductive material. A shield plate provided in the vicinity of a region where the output conducting wire connected to one of the inspection objects and the input conducting wire connected to the other inspection object intersect. Features.

[0009] The invention according to claim 2 is the invention according to claim 1, wherein the substrate is formed by supplying a ground potential to the plurality of inspection objects and separating each of the inspection objects into different regions of the substrate. And a ground layer. [0010] The invention according to claim 3 is the invention according to claim 1, wherein the output lead connected to one of the two inspection objects adjacent to each other and the connection to the other inspection object. In the vicinity of a region where the input conductor intersects, the output conductor connected to the one inspection object is bundled, and a shield member made of a conductive material is further provided.

The invention according to claim 4 is the invention according to claim 3, wherein the substrate supplies a ground potential to the plurality of inspection objects and is separated into different regions of the substrate for each inspection object. And a ground layer formed.

[0012] The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the substrate includes an input terminal group and an output terminal group for the plurality of inspection objects, and the same The input terminal group and the output terminal group for the inspection object are formed separately in different regions of the substrate.

The invention's effect

According to the probe card of the present invention, a plurality of probes that are made of a conductive material and that contact at least one of input and output of an electric signal in contact with an object to be inspected and an inspection signal are generated A substrate having a wiring pattern corresponding to a circuit structure, a plurality of input conductors electrically connected at one end to any of the plurality of probes, and transmitting an input signal to the inspection object; and the substrate A plurality of coaxial cables, one end of which is electrically connected to the other end and the other end is electrically connected to the plurality of input conductors! /, Or the plurality of probes! / One of the plurality of probes, one end of which is electrically connected, and is composed of a plurality of output conductors that transmit an output signal from the inspection target, and a conductive material, One A shield plate provided in the vicinity of a region where the output conductor connected to the inspection object and the input conductor connected to the other inspection object intersect each other. It is possible to suppress the influence of crosstalk.

Brief Description of Drawings

FIG. 1 is a plan view schematically showing a schematic configuration of a probe card according to an embodiment of the present invention. [FIG. 2] FIG. 2 is a diagram schematically showing a side surface viewed from the direction of arrow A in FIG. 1 and a state at the time of inspection.

FIG. 3 is a plan view schematically showing a schematic configuration of TAB.

Explanation of symbols

1 Probe card

2 Probe

3 Probe holder

3A, 3B contact area

4 Lead wire for input

5 Coaxial Cape Nore

6 Output lead

7 Board

7A, 7B Ground layer

8 Shield plate

9 Sino-red materials

21 Input terminal

21G input terminals

22, 24, 27, 29 Ground line

23, 25, 28 Ground terminal

26 Output terminal

26G output terminals

31 Probe head

32 Relay board

33 Interposer

45 Solder

51 core wire

52 Cover shield

71 Connection terminal 100 TAB

100 A, 100B inspection target

101 electrode pads

102A, 102B input pads

103A, 103B output pad group

104A, 104B Semiconductor chip

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, best modes for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. Note that the drawings are schematic, and it should be noted that the relationship between the thickness and width of each part, the ratio of the thickness of each part, etc. may differ from the actual ones. Of course, there may be portions where the dimensional relationships and ratios differ from one another.

FIG. 1 is a plan view schematically showing a schematic configuration of a probe card according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing the side surface viewed from the direction of arrow A in FIG. 1 and the state at the time of inspection. The probe card 1 shown in these figures is applied when conducting a continuity test and an operation characteristic test of a TAB in which a semiconductor chip is mounted on a thin film base.

[0018] The probe card 1 includes a plurality of probes 2 that are in contact with the electrode pads 101 of the TAB 100, a probe holder 3 that accommodates and holds the plurality of probes 2 in a pattern that matches the wiring pattern of the TAB 100, and a plurality of probes 2. Among them, one input terminal 4 is connected to one of the probes 2 for signal input to the TAB 100, and one end is connected to the other end of the input conductor 4. A plurality of coaxial cables 5, a plurality of output conductors 6 whose one ends are electrically connected to the probe 2 for signal output from the TAB 100 among the plurality of probes 2, and the other ends of the coaxial cables 5 and A substrate 7 to which the other end of the output conductor 6 is connected and fixed, a shield plate 8 for shielding electromagnetic waves provided between the adjacent input conductor 4 and the output conductor 6, and a plurality of output conductors Pipe-shaped shield member 9 that bundles 6 together Equipped with a.

[0019] The probe 2 corresponds to the arrangement pattern of the electrode pads 101 of the TAB 100, The tip is protruded and held in the probe holder 3, and the tip of each probe 2 (the bottom side in FIG. 2) has a predetermined pressure from the direction perpendicular to the surface of the plurality of electrode pads 101 of the TAB 100. Contact with. The probe 2 is urged and urged so that it can expand and contract in the longitudinal direction. As such a probe 2, any conventionally known probe can be applied. When the probe 2 is a needle type, the coaxial cable 5 and the probe 2 may be directly connected without using the input lead wire 4.

[0020] The probe holder 3 has a hole corresponding to the position of the probe 2, and spatially converts the probe head 31 that accommodates and holds the plurality of probes 2, and the wiring structure that is electrically connected to the probe 2. Then, a relay board (space transformer) 32 that relays to the board 7 and an interposer 33 that relays the wiring and is provided between the relay board 32 and the board 7 are sequentially stacked. The probe 2 may be configured to realize electrical connection by directly contacting the probe 2 with the input conductor 4 and the output conductor 6 without passing through the relay substrate 32 or the interposer 33.

The probe card 1 is capable of simultaneously inspecting two inspection objects. Generally, a plurality of inspection objects can be inspected simultaneously. In FIG. 1, the contact areas 3A and 3B are the areas in contact with the individual inspection objects.

FIG. 3 is a plan view schematically showing a schematic configuration of the TAB 100. The TAB100 shown in the figure has a long film-like substrate with a thickness of several tens / zm (micrometers) and a plurality of inspection objects along the longitudinal direction. It is regularly arranged. In FIG. 3, two inspection objects 100A and 100B formed continuously on one TAB 100 are shown.

[0023] The inspection target 100A includes an input pad group 102A that transmits an input signal from an inspection apparatus (electrical inspection tester, not shown), an output pad group 103A that transmits an output signal to the inspection apparatus, and a semiconductor chip 104A. Have Similarly, the test object 100B includes an input pad group 102B, an output pad group 103B, and a semiconductor chip 104B. The arrangement pattern of the plurality of electrode pads 101 constituting the input pad groups 102A and 102B and the output pad groups 103A and 103B matches the arrangement pattern of the plurality of probes 2 in the probe holder 3. In Fig. 3, the output pad group 103A of the inspection target 100A and the inspection target 100B The distance to the input pad group 102B is less than 4.75 mm and is very close.

[0024] Input signals to the test objects 100A and 100B are a power supply voltage, a high-frequency electric signal, and the like that drive the semiconductor chips 104A and 104B. Therefore, the input pad groups 102A and 102B include a signal input terminal for the signal and a ground terminal for supplying a ground potential.

When inspecting the TAB 100 having the above-described configuration, the electrode pad 101 of the inspection object 100A comes into contact with the tip of the probe 2 held by the contact region 3A of the probe holder 3, while the electrode pad 101 of the inspection object 100B Is in contact with the tip of the probe 2 held in the contact region 3B of the probe holder 3.

[0026] Next, the configuration of the probe card 1 will be described. One end of the input lead wire 4 is electrically connected to one end of the probe 2 provided in the probe holder 3, while the other end is electrically connected to one of the coaxial cables 5. Are electrically connected. The input lead wire 4 is formed of a single wire or a stranded wire such as an enamel wire or a lead wire. The output conductor 6 is also formed of an enameled wire or the like, like the input conductor 4. In FIGS. 1 and 2, only a part of each of the input conductor 4, the coaxial cable 5, and the output conductor 6 is shown to avoid complexity, and FIG. 1 shows the input conductor. Wiring between 4th grade and ground electrode is omitted. For a transmission line that does not transmit a high-frequency signal (for example, a transmission line for supplying power supply voltage), the input conductor 4 may be directly connected to the substrate 7 without using the coaxial cable 5.

The substrate 7 has a function of outputting an inspection signal to the coaxial cable 5 and outputting an output signal from the output conductor 6 to the inspection device, and is a printed board (PCB) having a predetermined circuit structure. ). The substrate 7 is formed using an insulating material such as bakelite or epoxy resin, and electrically connects the plurality of probes 2 and the inspection device. The board 7 has a plurality of input terminals 21, output terminals 26, and a plurality of connection terminals 71 for the inspection device. Each of the input terminals 21, the output terminals 26 and the connection terminals 71 Are connected via a wiring layer (wiring pattern) formed in three dimensions by via holes or the like. In FIG. 1, only a part of each of the input terminal 21, the output terminal 26, and the connection terminal 71 is shown in order to simplify the description. [0028] In the substrate 7, a ground layer 7A that supplies a ground potential to the inspection target 100A that contacts the probe 2 in the contact region 3A, and a ground that supplies a ground potential to the inspection target 100B that contacts the probe 2 in the contact region 3B. Separated from layer 7B. As a result, the ground layer can be separated to the performance boat level of the inspection device, and the influence of crosstalk between the ground layers can be minimized for the two inspection objects 100A and 100B.

[0029] Further, on the substrate 7, the input terminal group 21G and the output terminal group 26G for the same inspection object are arranged in a separated area. As a result, the wiring can be laid out so that the input signal and output signal of each inspection target do not interfere with each other.

[0030] The shield plate 8 is realized using a conductive material such as aluminum, and is in the vicinity of a region where the output conductor 6 of the adjacent inspection target 100A and the input conductor 4 of the inspection target 100B intersect, that is, the contact region. It is provided near the boundary between 3A and contact area 3B, and is connected to ground terminal 28 via ground line 27. By providing this shield plate 8, it is possible to suppress the effects of crosstalk that may be caused by the output conductor 6 of the inspection object 1 OOA and the input conductor 4 of the inspection object 1 OOB. If the shield plate 8 is made of a flexible material such as a thin film metal or a mesh, the attachment becomes easy.

[0031] Similar to the shield plate 8, the shield member 9 is formed of a conductive material such as aluminum in the shape of a pipe, and the adjacent output conductor 6 of the inspection object 100A and input conductor 4 of the inspection object 100B. At least a part of the output conductor 6 of the inspection object 100A is bundled in the vicinity of the region where the crossing and the region including the upper portion of the shield plate 8 are included. The shield member 9 functions to suppress the influence of external force noise by electrostatically shielding the output conductor 6. In addition, since the output conductor 6 can be easily bundled by providing the shield member 9, the coaxial cable 5 and the input conductor 4 can be connected without providing a special relay board. Become. Note that a shield member 9 may be formed by winding a thin film-like aluminum around a bundle of output conductors 6 of the inspection object 100A.

Next, referring to FIG. 2, a connection mode of the input conductor 4, the coaxial cable 5, and the output conductor 6 will be described. The input conductor 4 is electrically connected to the probe 2 via its one-end force interposer 33 and relay board 32, while the other end is connected to the core 51 of the coaxial cable 5. Continued. The input lead wire 4 and the core wire 51 are connected by solder 45.

Of the ends of the coaxial cable 5, the core wire 51 is connected to the input terminal 21 formed on the substrate 7 at the end opposite to the side connected to the input conductor 4. The input terminal 21 is electrically connected to the inspection device, and the coaxial cable 5 can transmit an inspection signal, a power supply voltage, and the like by connecting one end of the coaxial cable 5 to the input terminal 21. Also, at one end of the coaxial cable 5, the sheath shield 52 is connected to the ground wire 22, and this ground wire 22 is connected to the ground terminal 23 formed on the substrate 7, and the ground potential is supplied to the sheath shield 52. Is done.

At the other end of the coaxial cable 5, the core wire 51 is connected to the input conductor 4, and the covering shield 52 is connected to the ground terminal 25 via the ground wire 24, so that a ground potential is supplied. As described above, the covering shield 52 has a structure in which the force at both ends is also supplied with the ground potential, thereby maintaining a stable ground potential, and suppressing external noise from being transmitted to the core wire 51. The connection between the sheath shield 52 and the ground wires 22 and 24 may be made by solder or the like.

One end of the output conductor 6 is electrically connected to the probe 2 via the relay substrate 32, and the other end is connected to an output terminal 26 provided on the substrate 7.

The shield member 9 that bundles the plurality of output conducting wires 6 is connected to the ground terminal 28 via the ground wire 29. Thereby, the electrostatic shielding effect by the shield member 9 can be further improved.

[0037] According to the probe card according to the embodiment of the present invention described above, there are a plurality of probes that are made of a conductive material and that perform at least one of input and output of an electrical signal in contact with an inspection target. And a substrate having a wiring pattern corresponding to a circuit structure for generating a signal for inspection and one of the plurality of probes is electrically connected to transmit an input signal to the inspection object A plurality of input conductors, one end of which is electrically connected to the substrate, and the other end of which is electrically connected to any one of the plurality of input conductors or one of the plurality of probes! One end of the coaxial cable and one of the plurality of probes is electrically connected, and is composed of a plurality of output conductors for transmitting an output signal from the inspection target and a conductive material, and two adjacent conductors. Horn Serial A shield plate provided in the vicinity of a region where the output conducting wire connected to one of the inspection objects and the input conducting wire connected to the other inspection object intersect, It is possible to suppress the influence of crosstalk between adjacent inspection objects.

[0038] Further, according to the present embodiment, the crosstalk between the input conductor and the output conductor between adjacent inspection objects, which is the main problem when simultaneously inspecting a plurality of inspection objects, is performed. It is possible to minimize the impact.

Furthermore, according to the present embodiment, the influence on the inspection object from the ground side can be minimized by forming the ground layer separately in different regions of the substrate for each inspection object. .

[0040] According to the present embodiment, the input terminal group and the output terminal group for the same inspection object are separately formed in different regions of the substrate, so that the input signal of each inspection object The output signal can be prevented from interfering.

[0041] Further, according to the present embodiment, since the shield member is provided, it is configured without using a relay member or the like that relays the signal wiring in the middle. Therefore, it is possible to realize a wiring that is easy and excellent in shielding effect.

[0042] (Other Embodiments)

Although the best mode for carrying out the present invention has been described in detail above, the present invention should not be limited only by the above-described embodiment. For example, in the embodiment described above, the power supply line that supplies the power supply voltage may be shielded on the force input side in which the output conductor is bundled by the shield member.

[0043] Also, in the above embodiment, RSD is assumed on the premise of the single-ended transmission method.

It is also possible to correspond to a differential transmission system such as ¾ (Reduced bwing Dilferential; signaling) or LVD; 5 (Low Voltage Differential Signaling). In this case, the inspection object and the inspection apparatus may be connected by using a pair of conductive wires.

[0044] Note that the probe card according to the present invention can also be applied to multiple simultaneous detection of various devices other than TAB. [0045] As described above, the present invention can include various embodiments and the like not described herein, and V, V, within the scope not deviating from the technical idea specified by the claims. It is possible to make various design changes.

Industrial applicability

[0046] As described above, the probe card according to the present invention is useful when performing a predetermined inspection on a plurality of inspection objects at the same time, and is particularly suitable for inspection of TCP such as TAB and COF.

Claims

The scope of the claims

[1] Electrical connection between a plurality of inspection objects and a circuit structure for generating inspection signals, and simultaneous input / output of the inspection signals to at least a part of the plurality of inspection objects Capable probe card,

A plurality of probes made of a conductive material and in contact with the inspection object to perform at least one of input and output of an electrical signal;

A substrate having a wiring pattern corresponding to the circuit structure;

A plurality of input conductors, one end of which is electrically connected to any of the plurality of probes, and transmits an input signal to the inspection target;

A plurality of coaxial cables, one end of which is electrically connected to the substrate and the other end of which is electrically connected to one of the plurality of input conductors or one of the plurality of probes! ,

A plurality of output conductors, one end of which is electrically connected to any of the plurality of probes, and transmits an output signal from the inspection target;

It is made of a conductive material and is provided in the vicinity of a region where the output conductor connected to one of the two adjacent inspection objects intersects with the input conductor connected to the other inspection object. A shield plate,

A probe card characterized by comprising:

[2] The probe according to [1], wherein the substrate has a ground layer that supplies a ground potential to the plurality of inspection objects and is separated into different regions of the substrate for each inspection object. card.

[3] In the vicinity of a region where the output conductor connected to one of the two adjacent inspection objects intersects with the input conductor connected to the other inspection object, 2. The probe card according to claim 1, further comprising a shield member made of a conductive material by bundling the output conductors connected to the inspection target.

4. The probe according to claim 3, wherein the substrate includes a ground layer that supplies a ground potential to the plurality of inspection objects and is separated into different regions of the substrate for each inspection object. card. The substrate includes an input terminal group and an output terminal group for the plurality of inspection objects, and the input terminal group and the output terminal group for the same inspection object are separately formed in different regions of the substrate. The probe card according to any one of claims 1 to 4, wherein the probe card is characterized in that: