TW202343000A - Electrical connection device - Google Patents

Abstract

The present invention provides an electrical connection device capable of inhibiting signal interference in conductive wires. The electrical connection device has probes, a holding part for holding the probes, a mounting plate arranged on a surface at a second direction side of the holding part, a printed substrate arranged on a surface at the second direction side of the mounting plate, a first conductive wire, and a second conductive wire. The holding part has a first connection portion electrically connected to one of the probes, and a second connection portion electrically connected to one of the probes different from the probe connected to the first connection portion. The printed substrate has a first wiring pattern formed on a surface at the first direction side, and a second wiring pattern formed on a surface at the second direction side. The first conductive wire extends along the surface at the first direction side of the mounting plate and connects the first connection portion and the first wiring pattern. The second conductive wire extends across the surface at the second direction side of the mounting plate and connects the second connection portion and the second wiring pattern.

Description

Electrical connection device

The present invention relates to an electrical connection device used for inspecting characteristics of an object to be inspected.

In order to inspect the electrical characteristics of a subject such as a semiconductor integrated circuit without being separated from the wafer, an electrical connection device is used that holds a probe in contact with the subject. In inspection using an electrical connection device, the tip of the probe is brought into contact with the signal pad of the object under inspection, and the base end of the probe is electrically connected to an inspection device such as an IC tester. Electrical signals are transmitted between the subject and the inspection device via the electrical connection device.

[Prior technical literature]

[Patent Document]

Patent Document 1: Japanese Patent Application Publication No. 2016-99337

Since the conductive lines that transmit electrical signals are densely parallel, signal interference between the conductive lines may occur. Signal interference can cause the waveform quality of electrical signals transmitted in conductive lines to deteriorate. An object of the present invention is to provide an electrical connection device capable of suppressing signal interference in conductive lines.

According to one aspect of the present invention, there is provided an electrical connection device including a probe, a holding portion for holding the probe, a mounting plate disposed on the holding portion, a printed circuit board provided on the mounting plate, a first conductive line, and a second conductive line. . The holding part holds the probe with the front end of the probe exposed, and has a first connection part electrically connected to one of the probes, and a second connection part. The portion is electrically connected to one of the other probes different from the probe connected to the first connection portion. The mounting plate is arranged on the surface of the holding portion on the second direction side opposite to the first direction side where the tip of the probe is located when viewed from the holding portion. The printed circuit board is provided on the surface on the second direction side of the mounting board, and has a first wiring pattern formed on the surface on the first direction side and a second wiring pattern formed on the surface on the second direction side. The first conductive line extends along the surface of the mounting board on the first direction side to connect the first connection portion and the first wiring pattern. The second conductive line extends across the surface of the mounting board on the second direction side to connect the second connection portion and the second wiring pattern.

According to the present invention, it is possible to provide an electrical connection device capable of suppressing signal interference in a conductive line.

1: Electrical connection device

10: Probe

20:Maintenance Department

20M: Maintenance department

21:Probe head

21M: Probe head

22: Interval converter

22M: interval converter

30:Mounting plate

30M:Mounting plate

40:Printed substrate

40M: Printed substrate

41: Side 1

42: Side 2

50: Conductive thread

51: 1st conductive wire

52: 2nd conductive wire

61:Joining materials

62: Cushioning material

100: Wiring trough

200:Connection part

201: 1st connection part

202: 2nd connection part

210: Spacer

211:Guide film

220: Upper surface wiring trough

221:Resin

300: Lower surface wiring trough

400: Wiring pattern

401: 1st wiring pattern

402: 2nd wiring pattern

500:FPC

500A: 1st FPC

500B: 2nd FPC

501: Conductive thread

501A: 1st end

501B: 2nd end

512:FPC wiring

511:Single wire wiring

513: Coaxial cabling

A:Region

FIG. 1 is a schematic diagram showing the structure of the electrical connection device according to the first embodiment.

FIG. 2 is a schematic cross-sectional view of FIG. 1 .

3 is an enlarged schematic cross-sectional view of area A of FIG. 2 showing a state in which a first conductive wire passes through a groove formed in a mounting plate of the electrical connection device according to the first embodiment.

FIG. 4 shows the first conductive wire passing through the probe guide formed in the electrical connection device of the first embodiment; The internal state of the groove is an enlarged schematic cross-sectional view of area A in FIG. 2 .

FIG. 5 is a schematic top view showing an example of the FPC.

FIG. 6A is a schematic cross-sectional view showing an example in which FPCs are overlapped in the up-and-down direction.

FIG. 6B is a schematic plan view showing an example in which FPCs are stacked in the vertical direction.

7 is a schematic diagram showing an example of the structure of the probe guide of the electrical connection device according to the first embodiment.

8 is a schematic diagram showing the structure of an electrical connection device of a comparative example.

9 is a schematic plan view showing an example of the structure of the electrical connection device according to the first embodiment.

FIG. 10 is a schematic diagram showing the structure of the electrical connection device according to the second embodiment.

Next, embodiments of the present invention will be described with reference to the drawings. In the description of the following drawings, the same or similar symbols are assigned to the same or similar parts. However, the drawings are schematic, and the proportions of lengths and thicknesses of each part may differ from reality. In addition, the drawings also include parts with different dimensional relationships and proportions.

(First implementation type)

The electrical connection device 1 according to the first embodiment of the present invention shown in FIG. 1 is used for inspecting the characteristics of an object to be inspected. The electrical connection device 1 includes a plurality of probes 10 , a holding part 20 holding the probes 10 , a mounting plate 30 arranged on the holding part 20 , and a printed circuit board 40 provided on the mounting plate 30 . The holding part 20 holds the probe 10 with the tip of the probe 10 exposed. During the examination of the subject, the tip of the probe 10 comes into contact with the subject. The mounting plate 30 is opposite to the side facing the first direction (hereinafter also referred to as the “first direction side”) facing the front end of the probe 10 when viewed from the holding part 20 , and the side facing the second direction (the lower side). Also referred to as "the second direction side" in this article) The surface is arranged on the holding part 20 . The printed circuit board 40 is provided on the surface of the mounting plate 30 on the second direction side.

The holding part 20 has at least one first connection part 201 electrically connected to at least one probe 10 respectively. The holding part 20 further has at least one second connection part 202 electrically connected to at least one of the other probes 10 different from the probe 10 connected to the first connection part 201 . Although FIG. 1 shows a structure in which the first connection part 201 is arranged outside the second connection part 202 , the first connection part 201 may also be arranged inside the second connection part 202 .

The printed circuit board 40 has a first wiring pattern 401 formed on the surface on the first direction side and a second wiring pattern 402 formed on the surface on the second direction side. The surface on the first direction side of the printed circuit board 40 is also described as a first surface 41, and the surface on the second direction side is also described as a second surface 42. That is, the first wiring pattern 401 is arranged on the first surface 41 , and the second wiring pattern 402 is arranged on the second surface 42 .

The electrical connection device 1 further includes a first conductive wire 51 and a second conductive wire 52 . The first conductive line 51 extends along the first direction side surface of the mounting plate 30 to connect the first connection portion 201 and the first wiring pattern 401 . The second conductive line 52 extends across the surface of the mounting plate 30 on the second direction side, and connects the second connection portion 202 and the second wiring pattern 402 .

When the first connection part 201 and the second connection part 202 are not respectively limited, they are described as the connection part 200. In addition, when the first wiring pattern 401 and the second wiring pattern 402 are not respectively limited, they are described as wiring patterns 400. The first conductive line 51 and the second conductive line 52 electrically connect the wiring pattern 400 of the printed circuit board 40 and the connection portion 200 of the holding portion 20 . Hereinafter, unless the first conductive line 51 and the second conductive line 52 are respectively limited, they will be described as conductive lines 50 . The conductive wire 50 is a space conversion wire (ST-Wire) that connects the probe 10 and the wiring pattern 400 of the printed circuit board 40 . The space between the ST-Wire and the wiring pattern 400 is wider than the space between the ST-Wire and the probe 10 .

In the description of the embodiment, the holding portion 20, the mounting plate 30, and the printed circuit board 40 are laminated. The direction is defined as the "up and down direction", and the direction perpendicular to the up and down direction is defined as the "plane direction". For example, the surface normal direction of the second surface 42 of the printed circuit board 40 is the up-down direction, and the direction in which the second surface 42 expands is the planar direction. In addition, in the vertical direction, the side where the tip of the probe 10 is located when viewed from the holding part 20 is defined as the lower side, and the side where the printed circuit board 40 is located when viewed from the holding part 20 is defined as the upper side. That is, the surface on the first direction side is a surface facing the lower side in the up-down direction. The surface on the second direction side is a surface facing the upper side in the vertical direction. Hereinafter, the "surface on the first direction side" is also called the "lower surface" and the "surface on the second direction side" is also called the "upper surface".

In a plan view, the mounting plate 30 is arranged inside the opening provided in the central portion of the printed circuit board 40 , and the holding portion 20 is arranged inside the mounting plate 30 . For example, fixing screws may be used for the connection between the holding part 20 and the mounting plate 30 and the connection between the mounting plate 30 and the printed circuit board 40 .

The holding part 20 has a probe head 21 through which the probe 10 penetrates, and a space converter 22 arranged above the probe head 21 . A guide hole is formed in the probe head 21 and penetrates the probe head 21 in the up-down direction. The probe head 21 holds the probe 10 inserted into the guide hole.

The base end of the probe 10 located inside the holding part 20 and the end of the conductive wire 50 passing through the spacer 22 are connected at the interface between the probe head 21 and the spacer 22 . That is, the base end portion of the probe 10 is exposed to the surface of the probe head 21 that faces the interval converter 22 . The end of the conductive wire 50 is exposed to the surface of the spacer 22 opposite to the probe head 21 . As mentioned above, the connection part 200 is located at the interface between the probe head 21 and the interval converter 22 .

The holding portion 20 that holds the probe 10 in contact with the subject needs to be kept in a flat state. By joining the holding part 20 to the mounting plate 30 fixed to the printed circuit board 40, the holding part 20 can be mounted on the printed circuit board 40 in a flat state. In addition, the mounting plate 30 can be used to maintain the structure of the electrical connection device 1 . Therefore, the mounting plate 30 requires a certain mechanical strength to ensure the flatness of the holding portion 20 and maintain the structure of the electrical connection device 1 . In order to obtain mechanical strength, the material of the mounting plate 30 is suitably made of metal. In addition, by making the mounting plate 30 metal, the heat generated by the probe 10 when inspecting the subject can be dissipated upward through the mounting plate 30 . For example, stainless steel (SUS) may be used as the material of the mounting plate 30 . In addition, by making the lower surface of the mounting plate 30 larger, even if the size of the holding portion 20 mounted on the printed circuit board 40 is changed, the mounting plate 30 does not need to be replaced.

When an object under inspection is inspected using the electrical connection device 1 , the tip of the probe 10 extending below the holder 20 comes into contact with the signal pad of the object under inspection. The wiring pattern 400 of the printed circuit board 40 is electrically connected to an inspection device such as an IC tester (not shown). Therefore, when the subject is inspected, the subject and the tester are electrically connected via the probe 10 , the conductive wire 50 , and the wiring pattern 400 .

The first conductive wire 51 can pass through a groove formed on the lower surface of the mounting plate 30 and extend along the lower surface of the mounting plate 30 on the lower side of the mounting plate 30 . Alternatively, the first conductive wire 51 may pass through the inside of a groove formed on the upper surface of the holding part 20 that faces the lower surface of the mounting plate 30 . The details of the groove through which the first conductive wire 51 passes will be described later.

Due to the integration and miniaturization of semiconductor integrated circuits, the distance between the signal pads of the subject is gradually becoming smaller. The coordinates of the signal pads are the same as the layout of the probe 10 . Therefore, the probe 10 and the wiring pattern 400 of the printed circuit board 40 are electrically connected via the fan out at the space converter 22 .

Due to the increase in the number of pins of the probe 10 and the narrowing of the intervals between the signal pads, the conductive lines 50 are densely arranged in parallel. This increases the possibility that the waveform quality of the electrical signal transmitted through the conductive lines 50 will be deteriorated due to signal interference. high. In the following, the degradation of waveform quality caused by signal interference is referred to as "signal degradation". Due to signal degradation, the accuracy of inspection of the subject decreases. Causes of signal degradation include crosstalk between signal lines that transmit electrical signals, and changes in the waveform of signals transmitted through signal lines due to the influence of changes in the potential of power lines that occur when inspecting subjects. wait.

In order to suppress signal degradation, care should be taken to prevent the conductive wire 50 from causing signal interference. causing signal degradation. In the following, the conductive line 50 requiring attention is also referred to as a "caution line".

In the electrical connection device 1 , for example, the caution line is the first conductive line 51 and the conductive lines 50 other than the caution line are the second conductive line 52 , thereby suppressing signal degradation. Specifically, the second conductive line 52 extends upward from the printed circuit board 40 , while the first conductive line 51 extends from the printed circuit board 40 in the planar direction. That is, the first conductive lines 51 and the second conductive lines 52 are not densely parallel. In this manner, by not arranging the caution line and the conductive lines 50 other than the caution line in parallel, the electrical connection device 1 can suppress the occurrence of signal degradation. The first conductive line 51 may be any of a signal line, a power line, a ground (GND) line, and other wiring that transmits electrical signals.

The first conductive line 51 may include a wiring portion formed on a flexible printed wiring board (hereinafter referred to as “FPC”) disposed on the lower surface of the mounting board 30 . Hereinafter, the wiring portion formed in the FPC is referred to as "FPC wiring".

The first conductive line 51 shown in FIG. 2 has a structure that connects the single wire wiring 511, the FPC wiring 512, and the coaxial wiring 513. That is, one end of the single wire wiring 511 is connected to the first connection part 201 , and the other end is connected to one end of the FPC wiring 512 formed in the FPC 500 . The other end of the FPC wiring 512 is connected to one end of the coaxial wiring 513 . The other end of the coaxial wiring 513 is connected to the first wiring pattern 401 .

In FIG. 2 , the case where the first conductive line 51 includes a single wire wiring, an FPC wiring, and a coaxial wiring is exemplified. However, the structure of the first conductive line 51 may vary depending on the type of signal transmitted through the first conductive line 51 , etc. And choose arbitrarily. The first conductive line 51 may be any one of a single wire wiring, a twisted wiring, a coaxial wiring, a PCB wiring formed on a printed circuit board (PCB), and an FPC wiring, or may be a plurality of types of wiring selected from these wirings. Wiring that is grouped and connected.

For example, the first conductive line 51 may be composed of a single wire. By using only single-wire wiring, the first conductive line 51 can be easily configured. In addition, the first conductive wire 51 may be a signal wire and a connection Stranded wiring formed by stranding ground wires. Compared with the first conductive line 51 using only single-wire wiring, the first conductive line 51 using this twisted wiring can suppress signal interference more effectively. Alternatively, the first conductive line 51 may be covered with an insulating film or the like. The covered first conductive wire 51 can reduce the wire resistance. In addition, when the first conductive line 51 is a power line, a ground line, or the like, a wiring thicker than the first conductive line 51 of the signal line may be used. By using thick wiring, line resistance can be reduced.

Coaxial wiring may also be used for the first conductive line 51, the core wire of the coaxial wiring may be a signal line, and the outer sheath of the coaxial wiring may be grounded. By using the first conductive line 51 as a coaxial wiring, the effect of preventing signal interference can be improved. Alternatively, a PCB may be disposed on the lower surface of the mounting plate 30 and the PCB wiring may be used for a part of the first conductive line 51 .

The groove through which the first conductive wire 51 passes will be described below. In the electrical connection device 1 shown in FIGS. 2 and 3 , the first conductive wire 51 passes through the inside of the lower surface wiring groove 300 formed on the lower surface of the mounting plate 30 . As shown in FIGS. 2 and 3 , the FPC 500 forming the FPC wiring 512 may be disposed inside the lower surface wiring groove 300 .

In the above description, an example is shown in which the first conductive wire 51 passes through the inside of the groove formed on the lower surface of the mounting plate 30 . However, the first conductive wire 51 may also pass through the inside of the groove formed on the upper surface of the holding part 20 . In the example shown in FIG. 4 , the first conductive line 51 passes through the inside of the upper surface wiring groove 220 formed on the upper surface of the holding part 20 . As shown in FIG. 4 , the FPC 500 forming the FPC wiring 512 may be disposed inside the upper surface wiring groove 220 . Hereinafter, when the lower surface wiring groove 300 formed in the mounting plate 30 and the upper surface wiring groove 220 formed in the holding part 20 are not respectively limited, they are described as wiring grooves 100 . The electrical connection device 1 may have both the upper surface wiring groove 220 and the lower surface wiring groove 300 .

In the example shown in FIGS. 2 to 4 , the FPC 500 is fixed inside the wiring trench 100 using the bonding material 61 . The joining material 61 may be, for example, a double-sided tape or an adhesive. By using joining material 61 Fixing the FPC 500 to the mounting plate 30 or the holding part 20 can prevent the FPC 500 from rubbing against surrounding components due to vibrations such as when transporting the electrical connection device 1 , and can prevent the FPC 500 from being damaged. In addition, the FPC 500 may be disposed inside the wiring trench 100 together with the buffer material 62 . The buffer material 62 may be disposed at least either between the FPC 500 and the joining material 61 and the mounting plate 30 and between the FPC 500 and the joining material 61 and the holding part 20 . The position of the FPC 500 inside the wiring trench 100 is stabilized by the buffer material 62 arranged around the FPC 500 . In this way, by filling the space of the wiring trench 100 with the buffer material 62, it is possible to prevent the FPC 500 from being damaged due to contact with the surroundings inside the wiring trench 100 when the electrical connection device 1 is moved. In addition, when the FPC 500 is fixed inside the wiring trough 100 using the bonding material 61, it is considered that when the electrical connection device 1 vibrates, stress is concentrated on the joint portion and the FPC 500 is damaged. By arranging the buffer material 62 inside the wiring trough 100, the posture of the FPC 500 is stabilized and damage to the FPC 500 can be prevented. An elastic member such as elastomer may be used as the cushioning material 62 . The bonding material 61 and the buffering material 62 may be selected in consideration of workability, etc., on the premise that the position of the first conductive line 51 does not deviate inside the wiring trough 100 or the first conductive line 51 does not peel off from the wiring trough 100 .

An example of FPC 500 in which FPC wiring 512 is formed is shown in FIG. 5 . FIG. 5 is a top view of the FPC500 viewed from the up and down direction. The FPC 500 is formed with a plurality of conductive lines 501 arranged in parallel in a plan view. The wiring portion (for example, the single wire wiring 511 ) of the first conductive line 51 that is connected to the first connection portion 201 is connected to the first end portion 501A of the conductive line 501 . Furthermore, the wiring portion (for example, the coaxial wiring 513 ) of the first conductive line 51 that is connected to the first wiring pattern 401 is connected to the second end portion 501B of the conductive line 501 . Through the above-mentioned connection, the FPC wiring 512 is used for a part of the conductive line 501. In addition, in the FPC 500 , the distance between the second end portions 501B is larger than the distance between the first end portions 501A, thereby increasing the distance between the first conductive lines 51 .

As shown in FIG. 5 , FPC 500 has a plurality of conductive lines 501 . Therefore, by using the FPC 500 in the electrical connection device 1 , the plurality of first conductive wires 51 can be easily connected between the mounting plate 30 and the holding part 20 passed between. In the electrical connection device 1 using the FPC 500 , the FPC wiring 512 , which is the wiring portion of the plurality of first conductive lines 51 , extends in parallel along the lower surface of the mounting plate 30 on the lower side of the mounting plate 30 .

By using a part of the first conductive line 51 as an FPC wiring, the wiring interval of the first conductive line 51 can be enlarged in the FPC 500 . In addition, by arranging the FPC 500 inside the wiring trough 100 , it is possible to suppress variations in the connection operation between the wiring passing through the inside of the wiring trough 100 and the wirings before and after it.

When the first conductive line 51 includes the FPC wiring 512, a plurality of FPCs 500 each forming the FPC wiring 512 may be stacked in the vertical direction. That is, a plurality of FPCs may be stacked on the lower side of the mounting board 30 , and wiring portions constituting a part of the first conductive lines 51 may be formed on the plurality of FPCs. By stacking a plurality of FPCs in the vertical direction, a plurality of first conductive lines 51 extend along the lower surface of the mounting board 30 in a multi-layered manner.

For example, as shown in FIG. 6A , two FPCs 500 each having an FPC wiring 512 may be overlapped in the vertical direction. In the structure shown in FIG. 6A , the first FPC 500A and the second FPC 500B overlap in the vertical direction. The FPC wiring 512 formed in the first FPC 500A is connected to the single wire wiring 511 and the coaxial wiring 513 to form one first conductive line 51 . The FPC wiring 512 formed in the second FPC 500B is connected to the single wire wiring 511 and the coaxial wiring 513 to form a first conductive line 51 . In FIG. 6A , in order to connect the FPC wiring 512 and the coaxial wiring 513 of the second FPC 500B, the end of the first FPC 500A where the FPC wiring 512 and the coaxial wiring 513 are connected is inclined toward the printed circuit board 40 . However, the end portion of the first FPC 500A can be extended in the horizontal direction by staggering the regions connecting the FPC wiring 512 and the coaxial wiring 513 of the first FPC500A and the second FPC500B in the horizontal direction. As shown in FIG. 6A , the laminate of the first FPC 500A and the second FPC 500B may be fixed inside the wiring trench 100 using the bonding material 61 . In addition, the buffer material 62 may be used to stabilize the position of the laminated body of the first FPC 500A and the second FPC 500B inside the wiring trench 100 .

FIG. 6B shows a top view of an example of a structure in which the first FPC 500A and the second FPC 500B are overlapped in the vertical direction. The structure shown in FIG. 6B is such that the first FPC 500A and the second FPC 500B are stacked and staggered in the horizontal direction. By being shifted in the horizontal direction, the first end portion 501A and the second end portion 501B of the first FPC 500A and the second FPC 500B are exposed when viewed from above. Therefore, the FPC wiring 512 of the first FPC 500A and the second FPC 500B can be easily connected to the wiring portion of the first conductive line 51 connected to the first connection portion 201 and the portion of the first conductive line 51 connected to the first wiring pattern 401 wiring part.

As described above, by providing the FPC 500 with multiple layers in the vertical direction, the number of the first conductive wires 51 passing through one wiring trench can be increased. Therefore, by providing the FPC 500 with multiple layers, signal interference on more attention lines can be suppressed compared to the case where the FPC 500 has one layer. In addition, by overlapping a plurality of FPCs 500 in the vertical direction, it is possible to suppress an increase in the number of wiring trenches 100 and the size in the planar direction. The shape of the FPC 500 , the length of the FPC wiring 512 , and the number of FPC wirings 512 formed in the FPC 500 may be the same in the FPC 500 that overlap in the vertical direction, or they may be different in each FPC 500 . The number of stacked FPC500 pieces may be 3 or more.

FIG. 7 shows an example of the structure of the holding part 20. In the recess provided on the upper surface of the space converter 22 and through which the conductive wire 50 passes, the conductive wire 50 may be extended not only in the up-and-down direction but also in the plane direction. By extending the conductive lines 50 in the plane direction, the intervals between the conductive lines 50 become larger. As shown in FIG. 7 , the recessed portion of the interval transformer 22 may be filled with resin 221 . By filling the recessed portion with the resin 221, the conductive wire 50 can be stably fixed to the holding portion 20. The resin 221 may also be an epoxy resin, for example.

The probe head 21 shown in FIG. 7 has a spacer 210 as a cavity formed inside. The holding part 20 holds the probe 10 with a certain degree of flexibility in a state where it is bent inside the spacer 210 . The probe 10 penetrates the guide film 211 arranged inside the spacer 210 . Under the action of the guide film 211, the position of the probe 10 is stabilized.

In the electrical connection device 1 having the holding portion 20 shown in FIG. 7 , when the probe 10 is pressed against the subject during inspection, the probe 10 is bent inside the spacer 210 . By flexing the probe 10 and applying overdrive to press the probe 10 against the subject, the electrical connection between the subject and the probe 10 can be ensured.

In addition, the type of probe 10 and the structure of the probe head 21 are not limited to the structure shown in FIG. 7 . For example, the probe 10 may have a spring structure that expands and contracts in the axial direction.

Alternatively, the probe head 21 may be formed by laminating a probe guide having a guide hole through which the probe 10 passes and a wiring board having an electrode (land) connected to the base end of the probe 10 in the vertical direction. formed structure. Furthermore, the space converter 22 is arranged above the wiring board. At this time, the space converter 22 is disposed on the wiring board so that the connection pads of the wiring board are electrically connected to the internal wiring formed in the space converter 22 . Furthermore, the external terminals of the space transformer 22 electrically connected to the internal wiring are connected to the conductive wire 50 . In the holding part 20 of the above-mentioned structure, the external terminal of the interval converter 22 is the connection part 200.

Figure 8 shows an example of the electrical connection device of the comparative example. Comparative example 1M shown in FIG. 8 includes a holding portion 20M that holds the probe 10, a mounting plate 30M arranged on the outer edge of the holding portion 20M, and a printed circuit board 40M connected to the outer edge of the mounting plate 30M. The holding part 20M has a structure in which the interval converter 22M is arranged above the probe head 21M, and has a connection part 200 . A wiring pattern 400 is arranged on the printed circuit board 40 .

In Comparative Example 1M shown in FIG. 8 , all the conductive lines 50 including the first conductive line 51 and the second conductive line 52 pass above the upper surface of the mounting board 30M to connect the connection portion 200 and the wiring pattern 400 . In Comparative Example 1M, since attention lines and other wirings are densely parallel, signal degradation easily occurs.

On the other hand, in the electrical connection device 1 shown in FIG. 1 , the first conductive wire 51 extends along the lower surface of the mounting plate 30 and the second conductive wire 52 extends beyond the upper surface of the mounting plate 30 . That is, lead 1 The electric wire 51 and the second conductive wire 52 are not parallel. Therefore, the attention line can be arranged separately from other wirings. As a result, in the electrical connection device 1, the occurrence of signal degradation can be suppressed.

As described above, in the electrical connection device 1 , the attention wire passes between the holding part 20 and the mounting plate 30 , so that the first conductive wire 51 of the attention wire and the second conductive wire 52 other than the attention wire are spatially spaced. separation. As a result, according to the electrical connection device 1 , test failures due to signal degradation can be prevented in advance, and the operation time of the electrical connection device 1 can be increased.

In addition, the electrical connection device 1 can easily cope with the situation where a caution line parallel to the second conductive line 52 is newly discovered. That is, the holding part 20 and the mounting plate 30 are separated, and the newly discovered attention is paid to the lower side of the mounting plate 30 . Then, the holding part 20 and the mounting plate 30 are joined.

According to the inventor's research, in the electrical connection device 1, the crosstalk between signal lines, signal lines and power lines, signal lines and ground lines, and power lines and power lines is lower than the general allowable 3% of the value and less than 1%. Therefore, during the inspection of the object to be inspected, it is possible to prevent test defects such as over-kill in which a good product is mistakenly determined to be a defective product, and the yield can be improved.

The position and number of the wiring grooves 100 through which the first conductive wires 51 pass can be set arbitrarily based on the position, number, etc. of the first conductive wires 51 . For example, as shown in FIG. 9 , the outer edge of the printed circuit board 40 is circular in plan view, and the electrical connection device 1 with the holding portion 20 is disposed inside a circular opening formed in the center of the printed circuit board 40 . In this case, a plurality of wiring grooves 100 may also be provided along the outer edge of the holding part 20 . In FIG. 9 , illustration of the conductive line 50 , the connection portion 200 , the wiring pattern 400 and the like is omitted. In the electrical connection device 1 shown in FIG. 9 , the wiring grooves 100 are arranged at four positions on the lower side of the mounting plate 30 at substantially equal intervals. As mentioned above, the annular mounting plate 30 may be arranged along the outer edge of the holding part 20, and a plurality of wiring grooves 100 may be arranged radially.

The plurality of areas through which the first conductive wire 51 can pass is preferably along the outer surface of the holding part 20 edge configuration. For example, by arranging a plurality of wiring grooves 100 , the first conductive line 51 can pass through the wiring grooves 100 at appropriate positions depending on the positions of the first connection portion 201 and the first wiring pattern 401 . For example, the wiring trench 100 may be selected at a position where the first conductive line 51 is the shortest. On the other hand, when the area where the holding portion 20 and the mounting plate 30 are joined is small, it is difficult to ensure the flatness of the holding portion 20 . Therefore, the total area of the wiring trench 100 is set to an extent that ensures the flatness of the holding portion 20 .

(Second implementation type)

In the electrical connection device 1 of the first embodiment described above, the first conductive wire 51 passes through the inside of the lower surface wiring groove 300 formed in the mounting plate 30 and the inside of the upper surface wiring groove 220 formed in the holding part 20 At least any one of. In the electrical connection device 1 of the second embodiment shown in FIG. 10 , the first conductive wire 51 passes through the inside of the groove extending at the boundary between the mounting plate 30 and the printed circuit board 40 . In addition, in the electrical connection device 1 shown in FIG. 10 , a part of the first conductive wire 51 passes through the inside of the mounting board 30 until it reaches the boundary between the mounting board 30 and the printed circuit board 40 .

In the electrical connection device 1 shown in FIG. 10 , the position of the groove through which the first conductive wire 51 passes is different from the electrical connection device 1 of the first embodiment. Regarding other structures, the electrical connection device 1 of the second embodiment is the same as the electrical connection device 1 of the first embodiment.

The groove extending at the interface between the mounting plate 30 and the printed circuit board 40 may be formed in the mounting plate 30 or the printed circuit board 40 . Alternatively, they may be formed on both sides of the mounting board 30 and the printed circuit board 40 .

According to the electrical connection device 1 of the second embodiment, the first conductive wire 51 passes through the groove formed at the interface between the mounting plate 30 and the printed circuit board 40. Therefore, the first conductive wire 51 of the attention line and the second line other than the attention line are connected. 2. The conductive lines 52 are spatially separated. As a result, signal interference in the conductive line can be suppressed. In addition, the groove through which the first conductive wire 51 of the electrical connection device 1 passes may be any one of the lower surface wiring groove 300 , the upper surface wiring groove 220 , or a groove formed at the interface between the mounting board 30 and the printed circuit board 40 .

The electrical connection device 1 of the second embodiment is actually the same as the first embodiment except that a groove for the first conductive wire 51 to pass is formed at the interface between the mounting board 30 and the printed circuit board 40, and repeated descriptions are omitted. For example, the FPC 500 may be disposed inside a groove formed at the interface between the mounting board 30 and the printed circuit board 40 .

(Other implementation types)

As mentioned above, the present invention has been described by the embodiments, but it should not be understood that the description and drawings forming a part of this disclosure limit the present invention. Based on this disclosure, those skilled in the art will be able to clarify various alternative embodiments, examples, and application techniques. That is, it goes without saying that the present invention also includes various embodiments not described here. Therefore, the technical scope of the present invention is determined only by the specific matters of the invention that are appropriate patent claims based on the above description.

1: Electrical connection device

10: Probe

20:Maintenance Department

21:Probe head

22: Interval converter

30:Mounting plate

40:Printed substrate

41: Side 1

42: Side 2

51: 1st conductive wire

52: 2nd conductive wire

201: 1st connection part

202: 2nd connection part

401: 1st wiring pattern

402: 2nd wiring pattern

Claims (8)

An electrical connection device used for inspection of characteristics of a subject, wherein, The electrical connection device has: multiple probes; A holding part that holds the probe in a state in which the front end of the probe is exposed, and has a first connection part and a second connection part, and the first connection part is electrically connected to one of the probes. Connection, the second connection part is electrically connected to one of the other probes that is different from the probe connected to the first connection part; a mounting plate disposed on the holding portion on a surface on the second direction side opposite to the first direction side where the front end of the probe is located when viewed from the holding portion; A printed circuit board provided on the surface of the mounting board on the second direction side and having a first wiring pattern formed on the surface on the first direction side and a second wiring pattern formed on the surface on the second direction side. Pattern; a first conductive line extending along the surface of the mounting plate on the first direction side to connect the first connecting portion and the first wiring pattern; and A second conductive line extends across the surface of the mounting plate on the second direction side and connects the second connection portion and the second wiring pattern. The electrical connection device according to claim 1, wherein, The first conductive line passes through the inside of the groove formed on the surface of the mounting plate on the first direction side, the inside of the groove formed on the surface of the holding portion on the second direction side, and between the mounting plate and the printing At least one of the grooves extends across the interface of the substrate. The electrical connection device according to claim 1 or 2, wherein, The first conductive line includes a wiring portion formed on a flexible printed wiring board disposed on the surface of the mounting board on the first direction side. The electrical connection device according to claim 3, wherein, The wiring portions of each of the plurality of first conductive lines are formed on the flexible printed wiring board in parallel along the surface on the first direction side of the mounting board. The electrical connection device according to claim 3, wherein, A plurality of the flexible printed wiring boards are laminated, the wiring portions constituting a part of the first conductive lines are respectively formed on the plurality of flexible printed wiring boards, and the plurality of the first conductive lines are formed in multiple layers along the mounting board. The surface on the first direction side extends. The electrical connection device according to claim 3, wherein, The flexible printed wiring board is disposed inside at least one of a groove formed on the surface of the mounting plate on the first direction side and a groove formed on the surface of the holding portion on the second direction side, The flexible printed wiring board is fixed inside the groove using a bonding material, An elastic member for stabilizing the position of the flexible printed wiring board inside the groove is arranged around the flexible printed wiring board. The electrical connection device according to claim 1 or 2, wherein, The annular mounting plate is arranged along the outer edge of the holding portion. The electrical connection device according to claim 1 or 2, wherein, The plurality of areas through which the first conductive wire can pass are arranged along the outer edge of the holding portion.

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