TWI620940B - Probe card and multi-signal transmission board - Google Patents

Abstract

A probe card includes: a printed circuit board, a probe, a probe holder through which the probe passes, an impedance matching signal line, and a multiple signal transmission board. The impedance matching signal line is electrically coupled to the contacts of the printed circuit board. The multiple signal transmission board includes: a flexible circuit board, signal wiring, and a grounding module. The signal trace is disposed on the flexible circuit board, one end is electrically coupled to the signal structure of the impedance matching signal line, and the other end is electrically coupled to the probe. The ground module is disposed on the flexible circuit board and includes: a first ground terminal, a second ground terminal, and a first isolation element. The first ground terminal is electrically coupled to the shielding structure of the impedance matching signal line. The second ground terminal is electrically coupled to the actual ground potential. The first isolation element is electrically coupled between the first ground terminal and the second ground terminal.

Description

Probe card and its multiple signal transmission board

The invention relates to a probe card, and in particular to a probe card and a multiple signal transmission board for preventing noise interference between probes.

The main purpose of the probe card is to directly contact the solder pads or bumps on the object to be tested (such as a chip) with its probes, and cooperate with the peripheral test machine and software control to achieve the purpose of automated measurement, and further Defective products are usually screened by sending a test signal through a test machine, and then the test card is sent to the test object, and then the test result signal is returned by the test object, which is then analyzed by the test card.

The signal transmission path of the probe card may have attenuation or interference problems. To solve this phenomenon, impedance matching signal lines (such as coaxial signal lines) are often used to reduce the coupling problem. Usually, the impedance matching signal line configuration method of the probe card is to connect a large number of different types of signal lines together to the ground plane. However, this configuration method is not only easy to increase the size of the current loop, but also easy to increase the ground bounce, which causes noise interference between each other and cannot be connected to the real ground.

Therefore, how to design a new probe card and its multiple signal transmission board to solve the above problems is an urgent problem in this industry.

Therefore, one aspect of the present invention is to provide a multiple signal transmission board, including: a flexible circuit board, a plurality of signal traces, and a plurality of grounding modules. The flexible circuit board includes a first side and a second side opposite to each other. The signal traces are disposed on the flexible circuit board and include a first terminal corresponding to the first side and a second terminal corresponding to the second side, respectively. The first terminal of each signal trace is electrically coupled to the impedance. The second terminal matches the signal structure of the first end of the signal line, and the second terminal is electrically coupled to one of the plurality of probes. The grounding module is disposed on the flexible circuit board and includes: a first ground terminal, a second ground terminal, and a first isolation element. The first ground terminal is electrically coupled to the shielding structure of the first end of the corresponding impedance matching signal line. The second ground terminal is electrically coupled to the actual ground potential. The first isolation element is electrically coupled between the first ground terminal and the second ground terminal.

Another aspect of the present invention is to provide a probe card including a printed circuit board, a plurality of probes, a probe fixing base, a plurality of impedance matching signal lines, and a multiple signal transmission board. The printed circuit board contains a plurality of contacts. The probe holder is fixed on the printed circuit board and is configured to pass the probe therethrough. The impedance matching signal line has a first end and a second end, respectively, and the second end is electrically coupled to one of the contacts of the printed circuit board. The multiple signal transmission board includes: a flexible circuit board, a plurality of signal traces, and a plurality of grounding modules. The flexible circuit board includes a first side and a second side opposite to each other. The signal traces are disposed on the flexible circuit board and include a first terminal corresponding to the first side and a second terminal corresponding to the second side, respectively. The first terminal of each signal trace is electrically coupled to the impedance Match the signal structure of the first end of one of the signal lines, and the second terminal is electrically coupled One of the plural probes. The grounding module is disposed on the flexible circuit board and includes: a first ground terminal, a second ground terminal, and a first isolation element. The first ground terminal is electrically coupled to the shielding structure of the first end of one of the corresponding impedance matching signal lines. The second ground terminal is electrically coupled to the actual ground potential. The first isolation element is electrically coupled between the first ground terminal and the second ground terminal.

Another aspect of the present invention is to provide a probe card including a printed circuit board, a jumper fixing base, at least one jumper, a multiple signal transmission board, and a probe head. The printed circuit board includes a test area and a contact area, wherein the test area includes a plurality of test contacts, and the contact area includes a plurality of contacts, the test contact, and the phase electrical coupling between the contacts. The jumper fixing base is disposed on the printed circuit board. The jumper fixing base includes a base body and an orifice plate. The base body and the orifice plate form a receiving space. The orifice plate includes a plurality of perforations, opposite upper and lower surfaces, and There are multiple contacts on the surface. The jumper includes an impedance-matched signal line and a general signal line. The impedance-matched signal line is electrically coupled to one of the contacts of the printed circuit board. The general signal line is disposed in the accommodation space. The general signal line passes through the upper surface of the orifice plate. The perforation of the perforated plate is penetrated to the lower surface of the perforated plate and is electrically coupled to the contact point of the coupled perforated plate. The multiple signal transmission board includes: a flexible circuit board, a plurality of signal traces, and a plurality of grounding modules. The flexible circuit board includes a first side and a second side opposite to each other. The signal traces are disposed on the flexible circuit board and include a first terminal corresponding to the first side and a second terminal corresponding to the second side, respectively. The first terminal of each signal trace is electrically coupled to the impedance. The second terminal is electrically coupled to the general signal line to match the signal structure of the signal line. The grounding module is disposed on the flexible circuit board and includes: a first ground terminal, a second ground terminal, and a first isolation element. The first ground terminal is electrically coupled to the corresponding impedance matching signal line Shield structure. The second ground terminal is electrically coupled to the actual ground potential. The first isolation element is electrically coupled between the first ground terminal and the second ground terminal. The probe head includes a plurality of probes, opposite upper guide plates and lower guide plates. The upper guide plates and the lower guide plates are coupled to form a hollow area. The upper guide plate includes a plurality of upper perforations, and the lower guide plate includes a plurality of lower perforations. Each probe includes a needle tip, a needle body, and a needle tail. The upper guide plate is perforated to allow the needle end of the probe to pass through it, and the lower guide plate is perforated to allow the needle point of each probe to pass through. The area holds the needle body of each probe in it.

The advantage of applying the present invention is that the probe card of the present invention can isolate the noise between the impedance matching signal line and the actual ground potential through the setting of the isolation components on the multiple signal transmission board to avoid the different impedance matching signal lines. Interference with each other due to noise influence of ground potential.

1‧‧‧ Probe Card

100‧‧‧printed circuit board

102, 102A-102C‧‧‧Impedance-matched signal line

104, 104A-104C‧‧‧Probe

106‧‧‧ Probe Holder

108‧‧‧Multi-signal transmission board

110‧‧‧Contact

200‧‧‧ flexible circuit board

201‧‧‧ the first side

202A-202C‧‧‧Signal routing

203‧‧‧Second side

204A-204C‧‧‧Grounding Module

205, 207‧‧‧Edge

206‧‧‧The first isolation element

208A, 208B‧‧‧ ground plane

212‧‧‧Second isolation element

3‧‧‧Multi-signal transmission board

300‧‧‧ flexible circuit board

302A-302E‧‧‧Signal routing

304A-304E‧‧‧Grounding Module

4‧‧‧Multi-signal transmission board

400‧‧‧ flexible circuit board

402A-402G‧‧‧Signal routing

404A-404G‧‧‧Grounding Module

5‧‧‧ Probe Card

500‧‧‧printed circuit board

501A‧‧‧Test Area

501B‧‧‧Contact Area

502‧‧‧ Jumper

504‧‧‧ Probe

506‧‧‧ Jumper Mount

508‧‧‧ Probe head

510‧‧‧Multi-signal transmission board

520‧‧‧test contact

522‧‧‧Contact

530‧‧‧ impedance matching signal line

532‧‧‧General signal line

540‧‧‧ seat

542‧‧‧ Orifice

550‧‧‧ Upper guide

552‧‧‧Lower guide

554‧‧‧Hollow area

560‧‧‧ Needle Tip

562‧‧‧ needle body

564‧‧‧ pin tail

570‧‧‧Contact

580‧‧‧ Jumper

G1‧‧‧First ground terminal

G2‧‧‧Second ground terminal

GND‧‧‧actual ground potential

A‧‧‧ direction

D1, D2‧‧‧length

FIG. 1 is a bottom view of a probe card according to an embodiment of the present invention; FIG. 2A is a perspective view of three impedance matching signal lines, three probes, and a multiple signal transmission board according to an embodiment of the present invention; FIG. 2B is a top view of the multiple signal transmission board of FIG. 2A along the direction A in an embodiment of the present invention; FIG. 3 is a top view of the multiple signal transmission board of another embodiment of the present invention; A top view of a multiple signal transmission board in another embodiment; and FIG. 5 is a side view of a probe card according to an embodiment of the present invention.

Please refer to Figure 1. FIG. 1 is a bottom view of a probe card 1 according to an embodiment of the present invention. The probe card 1 includes a printed circuit board 100, an impedance matching signal line 102, a probe 104, a probe fixing base 106, and a multiple signal transmission board 108.

The printed circuit board 100 has upper and lower surfaces. FIG. 1 illustrates the lower surface of the printed circuit board 100. The printed circuit board 100 has a test area on the outer periphery and a contact area and a test area on the inner periphery. The upper surface of the printed circuit board 100 has a plurality of test contacts (not shown) on the test area on the outer periphery. The printed circuit board The lower surface of 100 has contact points 110 in the inner and surrounding contact areas, and the contact points 110 are electrically coupled to the test contacts through the internal circuit wiring of the printed circuit board 100. In one embodiment, the contact 110 may include a signal contact and a ground contact.

In an embodiment, the impedance-matched signal line 102 is a coaxial signal line, and from the inside to the outside, for example, but is not limited to, a copper wire including a signal transmitting conductor, an insulator, a shielding layer for providing a shielding effect, and an insulating protective layer. Structure (not shown). The impedance matching signal line 102 has a first terminal and a second terminal. The signal structure of the first end of the impedance-matched signal line 102 is electrically coupled to the probe 104 through the multiple signal transmission board 108. The signal structure of the second end of the impedance-matched signal line 102 is electrically coupled to the contact 110 included in the printed circuit board 100 through, for example, but not limited to, soldering.

However, it should be noted that the above-mentioned impedance matching signal line 102 is not limited to the coaxial signal line, and a signal line may also be used and adjacent to the signal line. A ground wire is arranged nearby, and a fixed distance is maintained between the signal wire and the ground wire to achieve the effect of impedance matching. Alternatively, an insulating sleeve (not shown) with a metal layer is set on the outside of a signal line to form a structure of the coaxial signal line. The insulating sleeve is made of an insulator, and a metal layer is plated on the outer surface of the insulating sleeve. The metal layer acts as a shield that provides a shielding effect to ground. The above structures can be collectively referred to as impedance matching signal lines. Both the shield layer and the ground wire can be collectively referred to as a shield structure. The impedance matching structure of the second end of the impedance matching signal line 102 is electrically coupled to the contact 110 included in the printed circuit board 100. In more detail, the signal structure of the second end of the impedance matching signal line 102 is electrically coupled to the signal contacts included in the printed circuit board 100. The shielding structure at the second end of the impedance matching signal line 102 is electrically coupled to the ground contact included in the printed circuit board 100.

The probe fixing base 106 is fixed on the printed circuit board 100 and is configured to pass the probe 104 therethrough. Further, the probe fixing base 106 is fixed on the lower surface of the printed circuit board 100. In one embodiment, the probe fixing base 106 is formed by curing the black glue to achieve the effect of fixing the probe 104. In practical applications, the probe 104 is configured to contact a contact on an object to be measured (not shown). The probe fixing base 106 can place several layers of probes 104. Further, a row of probe needles 104 are arranged on one layer of the probe fixing base 106, and the probe fixing base 106 is coated with black glue. The black glue is cured, so that a row of probe pins 104 are arranged on the probe fixing base 106 on the same layer. A needle body having a plurality of probes 104 is disposed therein.

The probe card 1 of this embodiment is a cantilever probe card, that is, the probe 104 is a cantilever probe, and the probe 104 can be divided into a needle tip, a needle body and a needle tail (such as the probes 104A-104C in FIG. 2), The needle body extends in a cantilever manner between the needle tip and the needle tail. The end of the needle body that is connected to the needle tail toward the needle tip is extended from the outer direction of the probe card to the inner periphery of the probe card. The needle point of 104 is used to contact the contact point of the object to be measured. The needle body and the needle point have an included angle. The included angle is generally an obtuse angle greater than 90 degrees. A part of the needle body is set in the probe holder 106. Contact the multiple signal transmission board 108 or the contact 110.

In operation, the test contacts on the upper surface of the printed circuit board 100 are electrically coupled to the signal contacts of a test machine (not shown), and the signals of the test machine are transmitted to the printed circuit board via the test contacts and the internal circuit wiring of the printed circuit board 100. The contacts 110 on the lower surface of the circuit board 100 are transmitted to the probe 104 through the impedance matching signal line 102 and the multiple signal transmission board 108, and further transmitted to the contacts of the object to be tested for testing. On the contrary, the test result generated by the test object through the signal of the test machine will be returned to the test machine for analysis in the opposite direction to complete a test process. In an embodiment, what is transmitted by the probe 104 may be, for example, but not limited to, a signal to be transmitted to a signal contact of a DUT.

It should be noted that only one multi-signal transmission board 108 is shown in FIG. 1. However, in other embodiments, the probe card 1 may include multiple multiple signal transmission boards to achieve the effect of electrically coupling the impedance matching signal line 102 and the probe 104. In addition, the contact 110 of the probe card 1 for low-frequency signal transmission can be electrically coupled to the probe 104.

The structure of the multiple signal transmission board 108 will be described in more detail below.

Please refer to Figure 2A and Figure 2B at the same time. FIG. 2A is a perspective view of three impedance-matched signal lines 102A-102C, three probes 104A-104C, and a multiple signal transmission board 108 according to an embodiment of the present invention. It should be noted that, in FIG. 2A, the probe fixing base 106 for fixing the probes 104A-104C is not shown.

FIG. 2B is a top view of the multiple signal transmission board 108 of FIG. 2A along the A direction in an embodiment of the present invention.

The multiple signal transmission board 108 includes a flexible circuit board 200, signal traces 202A-202C, and ground modules 204A-204C.

The flexible circuit board 200 includes a first side 201 and a second side 203 opposite to each other. In one embodiment, the flexible circuit board 200 may be arranged to have a matched impedance with the impedance-matched signal lines 102A-102C. In one embodiment, the flexible circuit board 200 and the impedance matching signal lines 102A-102C each have an impedance of 50 ohms.

The signal traces 202A-202C are disposed on the flexible circuit board 200 and each include a first terminal corresponding to the first side 201 and a second terminal corresponding to the second side 203.

The first terminal of each signal trace 202A-202C is electrically coupled to the signal structure of the first end of one of the impedance-matched signal lines 102A-102C. In more detail, the first terminal of the signal trace 202A is electrically coupled to the signal structure of the first end of the impedance-matched signal line 102A. The first terminal of the signal trace 202B is electrically coupled to the signal at the first end of the impedance-matched signal line 102B. structure. The first terminal of the signal trace 202C is electrically coupled to the signal structure of the first end of the impedance-matched signal line 102C.

The second terminals of the signal traces 202A-202C are electrically coupled to one of the probes 104A-104C. In more detail, the second terminal of the signal trace 202A is electrically coupled to the probe 104A. The second terminal of the signal trace 202B is electrically coupled to the probe 104B. The second terminal of the signal trace 202C is electrically coupled to the probe 104C.

The ground modules 204A-204C are disposed on the flexible circuit board 200 and correspond to one of the signal traces 202A-202C, respectively, and are electrically isolated from the signal traces 202A-202C. In one embodiment, the ground modules 204A-204C are adjacent to the signal traces 202A-202C, and are located on the first side 201 of the flexible circuit board 200. In more detail, the ground module 204A is adjacent to the signal trace 202A. The grounding module 204B is adjacent to the signal trace 202B. The ground module 204C is adjacent to the signal trace 202C.

The ground modules 204A-204C respectively include a first ground terminal G1, a second ground terminal G2, and a first isolation element 206.

Taking the ground module 204A as an example, the first ground terminal G1 is electrically coupled to the shield layer of the first end of the corresponding impedance matching signal line 102A. The second ground terminal G2 is electrically coupled to the actual ground potential GND. In one embodiment, the second ground terminal G2 is connected to the actual ground potential GND through the ground layers 208A and 208B included in the multiple signal transmission board 108. Here, the method of coupling the actual ground potential GND can be performed as described below, but it is not limited to this method, and any embodiment that can achieve this purpose is applicable. First, the printed circuit board 100 provides an actual ground potential contact, and the actual ground potential contact can be electrically The actual ground potential GND provided by the testing machine is coupled. After that, the actual ground potential GND needs to be coupled. For example, the second ground terminal G2 can be electrically coupled to the actual ground potential contact of the printed circuit board 100.

As shown in FIG. 2B, the second ground terminal G2 and the ground layers 208A and 208B are shown in a dot pattern to indicate that the second ground terminal G2 and the ground layers 208A and 208B are electrically coupled. The ground layers 208A and 208B are respectively disposed on the flexible circuit board 200, such as, but not limited to, edges 205 and 207 between the first side 201 and the second side 203 of the flexible circuit board 200, and are electrically coupled to Actual ground potential GND. In different embodiments, the ground layers 208A and 208B may be disposed on a part of the edges 205 and 207, such as the corners shown in FIGS. 2A and 2B, or along all the edges 205 and 207.

In one embodiment, the signal traces 202A-202C are disposed on the first surface of the flexible circuit board 200, and the second ground terminal G2 and the ground layers 208A and 208B can be formed by, for example, but not limited to, the flexible circuit board 200 is electrically coupled to the second surface of the first surface.

The first isolation element 206 is electrically coupled between the first ground terminal G1 and the second ground terminal G2. In one embodiment, the first isolation element 206 is a 0 ohm resistor or inductor. Therefore, the shielding layer at the first end of the impedance matching signal line 102A can be electrically coupled to the actual ground potential GND through the first ground terminal G1, the first isolation element 206, and the second ground terminal G2.

The shielding layer of the first ends of the impedance matching signal lines 102B and 102C can be electrically coupled to the actual ground potential GND through the corresponding first ground terminal G1, the first isolation element 206, and the second ground terminal G2 in the same way. because This will not be repeated here. The actual ground potential GND is provided by the tester. Generally speaking, the actual ground potential GND is electrically coupled to the test contacts and contacts 110 of the printed circuit board 100. The above-mentioned ground layers 208A, 208B, and impedance matching signal lines The shielding layer of 102A-102C can be electrically coupled to the test contact and the contact 110 of the printed circuit board 100 so as to be electrically coupled to the actual ground potential GND.

When the first isolation element 206 is not provided, the shielding layer between the impedance matching signal lines 102A-102C will be directly grounded. Such an arrangement makes it easy for the impedance-matched signal lines 102A-102C to be affected by noise from each other and cannot be properly grounded. Therefore, the probe card 1 of the present invention can isolate the noise between the shielding layer of the impedance-matched signal lines 102A-102C and the actual ground potential GND through the arrangement of the first isolation element 206 on the multiple signal transmission board 108 to avoid Different impedance-matched signal lines 102A-102C interfere with each other due to the influence of noise from the ground potential.

Furthermore, in an embodiment, the length D1 of the first side 201 of the flexible circuit board 200 is greater than the length D2 of the second side 203. Therefore, the distance between the probes 104A-104C can be closer, without being affected by the size of the impedance matching signal lines 102A-102C. For extremely small objects to be measured, this design will make the settings of the probes 104A-104C more suitable for the needs. In addition, due to the thinner thickness of the flexible circuit board 200, the length of the probe tips 104A-104C can be designed to be shorter without being affected by the size of the back-end impedance matching signal lines 102A-102C. The shape of the flexible circuit board 200 is not limited to the foregoing, and may be rectangular or other shapes.

In an embodiment, the shielding layer at the second end of the impedance-matched signal lines 102A-102C may be electrically coupled to the actual ground potential GND through the second isolation element 212, as shown in FIG. 2A, to achieve similar isolation to the first isolation. Noise isolation effect of the element 206. In another embodiment, the shielding layer at the second end of the impedance matching signal lines 102A-102C may be directly and electrically coupled to the actual ground potential GND. In yet another embodiment, the shielding layer at the second end of the impedance matching signal lines 102A-102C may not be grounded.

Please refer to Figure 3 and Figure 4. FIG. 3 is a top view of the multiple signal transmission board 3 in another embodiment of the present invention. FIG. 4 is a top view of the multiple signal transmission board 4 in another embodiment of the present invention.

The multiple signal transmission board 3 includes: a flexible circuit board 300, signal traces 302A-302E, a probe fixing base 304, and a ground module 304A-304E. Therefore, the multiple signal transmission board 3 can be applied to electrically couple five impedance matching signal lines and five probes.

The multiple signal transmission board 4 includes: a flexible circuit board 400, signal traces 402A-402G, a probe fixing base 404, and a ground module 404A-404G. Therefore, the multiple signal transmission board 4 can be applied to electrically couple seven impedance matching signal lines and seven probes.

It should be noted that the number of signal traces and ground modules in the above embodiments is only an example. In other embodiments, the number of signal traces and grounding modules may be any number greater than two, corresponding to electrically coupling different numbers of impedance matching signal lines and probes.

The structure of the impedance matching signal line 102, the multiple signal transmission board 108, and the probe 104 is to connect the impedance matching signal line to the actual ground potential. Noise is isolated and the signal is shielded to avoid interference between different impedance matching signal lines due to the noise of the ground potential. When judging that the interference of different signal lines will not affect the test results, you only need to set a probe, and The probe tip is directly connected to the contact 110 of the printed circuit board 100, as shown in FIG.

In addition to the cantilever type probe card, the multiple signal transmission board of the present invention can also be applied to a vertical type probe card. Furthermore, it is a hand-wire vertical type probe card.

Please refer to Figure 5. FIG. 5 is a side view of a probe card 5 according to an embodiment of the present invention. The probe card 5 includes a printed circuit board 500, a jumper fixing base 506, a jumper 502, a probe head 508, and a multiple signal transmission board 510.

The printed circuit board 500 has a test area 501A and a contact area 501B. The test area 501A includes a plurality of test contacts 520, and the contact area 501B includes a plurality of contacts 522. In one embodiment, the contact 522 is electrically coupled to the test contact 520 through the internal circuit wiring of the printed circuit board 500. In one embodiment, the contact 522 may include a signal contact and a ground contact. The printed circuit board 500 has opposite upper and lower surfaces, and the test area 501A and the contact area 501B are both disposed on the upper surface of the printed circuit board 500. The probe head 508 is positioned below the lower surface of the printed circuit board 500.

The jumper fixing base 506 is disposed on the printed circuit board 500. The jumper fixing base 506 includes a base 540 and an orifice plate 542. The base 540 is used to connect and fix the hole plate 542 to the printed circuit board 500. More specifically, the base 540 is a through hole passing through the printed circuit board 500 and is disposed on the printed circuit board 500. The base 540 and the orifice plate 542 form an accommodation space. The orifice plate 542 includes a plurality of perforations, opposite upper and lower surfaces, and the lower surface of the orifice plate 542 is provided. Plural contacts 570. The contact 570 of the orifice plate 542 and the contact 522 of the printed circuit board 500 are electrically coupled through a jumper 502 or 580. The orifice plate 542 is disposed between the base 540 and the probe head 508.

The jumper 502 has a first end and a second end. The first end of the jumper 502 is electrically coupled to the contact 570. The second end of the jumper 502 is electrically coupled to the contact 522 included in the printed circuit board 500 by, for example, but not limited to, soldering. In one embodiment, the jumper 502 includes an impedance matching signal line 530 and a general signal line 532. The contact 522 may include a signal contact and a ground contact. The impedance matching signal line 530 and the general signal line 532 can be electrically coupled through the multiple signal transmission board 510. The general signal line 532 is disposed in the accommodation space composed of the base 540 and the orifice plate 542. The ordinary signal line 532 penetrates the perforation of the orifice plate 542 through the upper surface of the orifice plate 542 to the lower surface of the orifice plate 542 and is electrically connected to the contact 570. Coupling.

The structure of the multiple signal transmission board 510 is substantially the same as that of the multiple signal transmission board 108 shown in FIG. 2A and FIG. 2B. The shielding structure of the impedance matching signal line 530 and one end of the multiple signal transmission board 510 which is electrically coupled can pass through the first ground terminal G1 and the first isolation element 206 like the impedance matching signal lines 102A-102C in FIG. 2A. And the second ground terminal G2 is electrically coupled to the actual ground potential GND. In addition, the other end of the shielding structure of the impedance matching signal line 530 can be electrically coupled to the actual ground potential GND through the second isolation element 212 like the impedance matching signal lines 102A-102C in FIG. 2A. The signal structure of the impedance matching signal line 530 and the general signal line 532 can also be the same as the impedance matching signal lines 102A-102C in Figure 2A. The signal structure and probes 104A-104C are generally electrically coupled as a signal transmission path through signal traces 202A-202C.

It should be noted that the number of test contacts 520, 522, 570, and jumpers 502 shown in FIG. 5 is only an example. The number of test contacts 520, 522, 570, and jumpers 502 of the present invention is not limited thereto.

The probe head 508 includes a plurality of probes 504, an opposite upper guide plate 550, and a lower guide plate 552. The upper guide plate 550 and the lower guide plate 552 are connected to form a hollow region 554. The probe 504 includes a needle tip 560, a needle body 562, and a needle tail 564. The upper guide plate 550 includes a plurality of upper perforations, so that the needle tail 564 of the probe 504 is inserted into the upper perforations of the upper guide plate 550 and can protrude outside the upper surface of the upper guide plate 550 through the upper perforations of the upper guide plate 550. The lower guide plate 552 includes a plurality of lower perforations, so that the needle tip 560 of the probe 504 is inserted into the lower perforations of the lower guide plate 552 and can protrude outside the lower surface of the lower guide plate 552 through the lower perforations of the lower guide plate 552. The needle body 562 is received in the hollow area 544. With the arrangement of the upper guide plate 550 and the lower guide plate 552, the purpose of fixing the needle position of the probe 504 and avoiding lateral movement can be achieved. With the configuration of the hollow area 554, the probe 504 can flexibly expand and contract in the longitudinal direction relatively to the upper guide plate 550 and the lower guide plate 552.

Therefore, the probe card 5 in this embodiment is a vertical probe card. In an embodiment, when testing the object under test, the needle tip 560 contacts the contact point of the object under test, and the pin tail 564 contacts the contact point 570.

In operation, the test contact 520 of the printed circuit board 500 is electrically coupled to the signal contact of a test machine (not shown), and the signal of the test machine is transmitted to the print via the test contact 520 and the internal circuit wiring of the printed circuit board 500. Electric circuit The contact 522 of the board 500 is transmitted to the probe 504 through the impedance matching signal line 530, the multiple signal transmission board 510, and the general signal line 532, and further transmitted to the contact of the object to be tested for testing. On the contrary, the test result generated by the test object through the signal of the test machine will be returned to the test machine for analysis in the opposite direction to complete a test process. In an embodiment, what is transmitted by the probe 504 may be, for example, but not limited to, a signal to be transmitted to a signal contact of a DUT.

It should be noted that only one multi-signal transmission board 510 is shown in FIG. 5. However, in other embodiments, the probe card 5 may include multiple multiple signal transmission boards to achieve the effect of electrically coupling the impedance matching signal line 530 and the general signal line 532. In addition, not all traces extending from the printed circuit board 500 to the orifice plate 542 need to be connected through multiple signal transmission boards. For example, the jumper 580 is a signal line that is electrically connected between the printed circuit board 500 and the orifice plate 542 without being connected through the multiple signal transmission board.

Therefore, the probe card 5 of the present invention can isolate the noise between the impedance matching signal line 530 and the actual ground potential GND through the arrangement of the first isolation element 206 on the multiple signal transmission board 510 to avoid different impedance matching signals. The lines 530 interfere with each other due to the noise effect of the ground potential.

It should be noted that the term “electrical coupling” in the above embodiments may be a direct coupling between components, or an indirect coupling between components connected through other components.

Although the content of this case has been disclosed as above, it is not configured to limit the content of this case. Any person skilled in this art can make various modifications and retouches without departing from the spirit and scope of the content of this case. Therefore, the content of this case is protected. The scope shall be determined by the scope of the attached patent application.

Claims (18)

A multi-signal transmission board includes: a flexible circuit board including a first side and a second side opposite to each other; a plurality of signal traces are provided on the flexible circuit board and respectively include the first side A first terminal on the side and a second terminal corresponding to the second side, wherein the first terminal of each of the signal traces is electrically coupled to a first terminal of one of the complex impedance matching signal lines A signal structure, the second terminal is electrically coupled to one of the plurality of probes; and a plurality of grounding modules, which are disposed on the flexible circuit board, respectively include: a first grounding terminal, electrically coupled to the corresponding One of the impedance matching signal lines is a shielding structure of the first end; a second grounding end is electrically coupled to an actual ground potential; and a first isolation element is electrically coupled to the first Between a ground terminal and the second ground terminal. The multiple signal transmission board according to claim 1, further comprising at least one ground layer disposed on the flexible circuit board, and the second ground terminal is electrically coupled to the actual ground potential through the ground layer. The multiple signal transmission board according to claim 2, wherein the ground layer is disposed on an edge between the first side and the second side of the flexible circuit board. The multiple signal transmission board according to claim 1, wherein the first isolation element is a 0 ohm resistor or an inductor. The multiple signal transmission board according to claim 1, wherein each of the grounding modules is adjacent to one of the signal traces, and is located on the first side of the flexible circuit board. The multiple signal transmission board according to claim 1, wherein the flexible circuit board matches the impedance of the impedance matching signal line. The multiple signal transmission board according to claim 1, wherein a second end of each of the impedance matching signal lines is directly electrically coupled to the actual ground potential. The multiple signal transmission board according to claim 1, wherein a second end of each of the impedance matching signal lines is further electrically coupled to the actual ground potential through a second isolation element. A probe card, including: a printed circuit board, including a plurality of contacts; a plurality of probes; a probe fixing seat, fixed on the printed circuit board, and configured to allow the probes to pass therethrough; at least one The impedance matching signal line has a first end and a second end, wherein the second end is electrically coupled to one of the contacts of the printed circuit board; and a multiple signal transmission board, including: A flexible circuit board includes a first side and a second side opposite to each other; a plurality of signal traces are provided on the flexible circuit board, and each includes a first terminal corresponding to the first side and a corresponding A second terminal on the second side, wherein the first terminal of each of the signal traces is electrically coupled to a signal structure of the first end of the impedance matching signal line, and the second terminal is electrically Coupled to one of the probes; and a plurality of grounding modules, disposed on the flexible circuit board, each including: a first grounding terminal electrically coupled to the first of the impedance matching signal line A shielding structure at one end; a second grounding terminal, electrically coupled to an actual ground potential; and a first isolation element, electrically coupled between the first grounding terminal and the second grounding terminal. The probe card according to claim 9, wherein the multiple signal transmission board further includes at least one ground layer disposed on the flexible circuit board, and the second ground terminal is electrically coupled to the actual ground potential through the ground layer . The probe card according to claim 10, wherein the ground layer is disposed on an edge between the first side and the second side of the flexible circuit board. The probe card according to claim 9, wherein the first isolation element is a 0 ohm resistor or an inductor. The probe card according to claim 9, wherein each of the grounding modules is adjacent to one of the signal traces, and is located on the first side of the flexible circuit board. The probe card according to claim 9, wherein the flexible circuit board is impedance matched with the impedance matching signal line. The probe card according to claim 9, wherein the probe fixing seat is formed by curing a black glue. The probe card according to claim 9, wherein the second ends of the impedance matching signal lines are directly electrically coupled to the actual ground potential. The probe card as described in claim 9 further includes a plurality of second isolation elements, and the second ends of the impedance matching signal lines are electrically coupled to the actual through one of the second isolation elements Ground potential. A probe card includes: a printed circuit board, including a test area and a contact area, wherein the test area includes a plurality of test contacts, the contact area includes a plurality of contacts, the test contacts and the Phase-to-phase electrical coupling between the equal contacts; a jumper fixing seat is provided on the printed circuit board, the jumper fixing seat includes a body and an orifice plate, the seat body and the orifice plate form an accommodating space, The orifice plate includes a plurality of perforations, an opposite upper surface and a lower surface, the lower surface is provided with a plurality of contacts; at least one jumper includes an impedance matching signal line and a general signal line, wherein the impedance matching signal line is electrically coupled One of the contacts connected to the printed circuit board, the general signal line is disposed in the accommodating space, and the general signal line passes through the perforation of the orifice plate under the orifice plate through the upper surface of the orifice plate The surface is electrically coupled to the contacts of the orifice plate; a multi-signal transmission board, including: a flexible circuit board, including a first side and a second side opposite; a plurality of signal traces are provided on the The flexible circuit board includes a first terminal corresponding to the first side and a second terminal corresponding to the second side, wherein the first terminals of the signal traces are electrically coupled In a signal structure of the impedance matching signal line, the second terminal is electrically coupled to the general signal line; and a plurality of grounding modules, which are disposed on the flexible circuit board, respectively include: a first grounding terminal, electrical A shielding structure coupled to the corresponding impedance matching signal line; a second ground terminal, electrically coupled to an actual ground potential; and a first isolation element, electrically coupled to the first ground terminal and the Between the second ground terminal; and a probe head, including a plurality of probes, an opposite upper guide plate and a lower guide plate, the upper guide plate and the lower guide plate are coupled to form a hollow area, the upper guide The plate includes a plurality of upper perforations, the lower guide plate includes a plurality of lower perforations, and each of the probes includes a needle tip, a needle body, and a needle tail, wherein the upper perforations of the upper guide plate are configured so that the A needle tail is inserted therein, the lower perforations of the lower guide plate are configured to allow the needle tips of the probes to pass therethrough, and the hollow area allows the needle bodies of the probes to be received therein.