CN102692528B - Cantilever type probe card - Google Patents
Cantilever type probe card Download PDFInfo
- Publication number
- CN102692528B CN102692528B CN201110075831.1A CN201110075831A CN102692528B CN 102692528 B CN102692528 B CN 102692528B CN 201110075831 A CN201110075831 A CN 201110075831A CN 102692528 B CN102692528 B CN 102692528B
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- pin
- grounding
- circuit board
- stilt
- signal
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Abstract
The invention discloses a cantilever type probe card. The cantilever type probe card comprises a circuit board, at least one signal pin, at least one grounding pin and at least one matching pin, wherein the signal pin is electrically connected to a signal circuit; the grounding pin is electrically connected to a grounding circuit; the matching pin is adjacently arranged in parallel with the signal pin, and the length of the matching pin extends to be close to the pinpoint of the signal pin; and the matching pin is also electrically connected with the grounding pin to form a grounding loop, so that the inductive load on the signal pin is reduced, and the high-frequency test signal transmission capacity of the signal pin is improved.
Description
Technical field
The present invention relates to the probe of test electronic loop, in more detail refer to a kind of cantalever type probe card.
Background technology
Known setting probe of reaching has with detection machine and measured electronic elements is consistent or mode close to impedance is many, such as, by the conductive bond pads magnitude setting that changes in probe or utilize replacing to have the electronic component etc. of different impedance.Though aforementioned various mode can promote the transmittability of high frequency test signals, only still have not attain and improve part.
For the cantalever type probe card 1 shown in Fig. 1, its with signal pin 2 coaxial arrange and metal outer pipe 3 length being electrically connected to earthing potential because resting within fixing glue 4, though be conducive to the elasticity maintaining signal pin 2 leading portion 2a, but because of this leading portion 2a length long (namely signal pin 2 is not by the section of metal outer pipe 3 impedance matching), cause the inductive load on signal pin 2 to increase and affect the transmission quality of high frequency test signals, therefore, preferably impedance matching position should be the needle point 2b extending to approach signal pin 2; Secondly, gap (pitch) between the signal pin 2 of aforementioned coaxial setting and metal outer pipe 3 is minimum only at about 120um, that is be limited by the impact of the size of structure own, the gap of aforementioned coaxial probe is difficult to reduce again, causes probe 1 cannot be applicable to detect exquisiter measured electronic elements.
Namely the impedance matching position of another known probe card 5 shown in Fig. 2 is the needle point 6a of approach signal pin 6, that is wire 7 extends the patten's design passing fixing glue 8, and wire 7 is electrically connected with contiguous grounding pin 9 by metal wire 7a.Though this structural form improves in Fig. 1 structure the problem that there is inductive load and increase, metal wire 7a so between its wire 7 and grounding pin 9 makes the beginning by wire bonding technologies to complete electric connection object one by one, not only need in manufacturing process depending on applying environment and carefully around folding or avoidance probe, more there is the disappearance easily fractureed.Therefore the structure of this known probe card 5 is also non-perfect.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of cantalever type probe card, not only has good impedance matching effect with the high frequency test signals transmittability of promotion signal pin, has more and apply easy advantage.
Edge is to reach above-mentioned purpose, and cantalever type probe card provided by the present invention, comprises a circuit board, and surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are made; At least one signal pin, one end is electrically connected to the signal circuit of this circuit board, and other end extension passes this stilt; At least one grounding pin, one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt; At least one coupling pin, is adjacent to this signal pin, and one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt; And a rigid conductor, be electrically connected this grounding pin and mate pin with this.
In one embodiment, stilt of the present invention has an end face; This signal pin has the whole body portion and passes this stilt and protrude from outside this end face, and body portion is coated with an insulation course; This rigid conductor is that conductive material coats this stilt end face and the layer structure solidify to form, its with this grounding pin, mate pin and this insulation course contacts.
In another embodiment, stilt of the present invention has an end face; This grounding pin has one and passes this stilt and the exposed body portion protruded from outside this end face; This rigid conductor is thin rod shape, and one end is connected to this end that this coupling pin passes stilt, and the other end contacts the exposed body portion of this grounding pin.
Accompanying drawing explanation
Fig. 1 is a kind of partial schematic diagram of known cantalever type probe card;
Fig. 2 is the partial schematic diagram of another kind of known cantalever type probe card;
Fig. 3 is the cantalever type probe card schematic diagram of the present invention first preferred embodiment;
Fig. 4 is the partial enlarged drawing of Fig. 3;
Fig. 5 is the partial enlarged drawing of the present invention second preferred embodiment;
Fig. 6 is the partial front elevation view of Fig. 5, and the conductive segment disclosing coupling pin does not contact grounding pin;
Fig. 7 is Fig. 6 roughly the same, discloses the conductive segment contact grounding pin of coupling pin;
Fig. 8 is the partial front elevation view of the present invention the 3rd preferred embodiment;
Fig. 9 is the partial front elevation view of the present invention the 4th preferred embodiment;
Figure 10 and Figure 11 is the partial schematic diagram of the present invention the 5th preferred embodiment;
Figure 12 is the partial front elevation view of the present invention the 6th preferred embodiment;
Figure 13 is the partial front elevation view of the present invention the 7th preferred embodiment;
Figure 14 is the partial front elevation view of the present invention the 8th preferred embodiment;
Figure 15 is the schematic diagram of the present invention the 9th preferred embodiment;
Figure 16 is the schematic diagram of the present invention the tenth preferred embodiment.
[main element symbol description]
100 probe
200 electronic loop contacts to be measured
10 circuit boards
Surperficial 16 signal contacts of 12 opening 14
18 ground contact 20 locating ring 22 fixing glue
22a end face
24 signal pins
24a body portion 24b backshank 24c needle point
First section 25 insulation course of 24d pin
26 grounding pins
26a tail end 26b needle point
28 coupling pins
30 rigid conductors
The first section 32b needle point of 32 signal pin 32a pins
34 grounding pin 36 fixing glue 36a end faces
38 coupling pin 38a impedance matching section 38b conductive segments
38c end 40 mates pin 42 conductive segment
42a hook part 44 grounding pin 46 conductive segment
Pin 49 conductive segment is mated in 46a hook part 48
49a circle is around portion 50 grounding pin 52 grounding pin
52a perforation 54 coupling pin 55 conductive segment
56 grounding pin 58 conducting block 58a side openings
60 coupling pin 61 conductive segments 62 mate pin
62a bending segment 64 Copper Foil 66 grounding pin
68 coupling pin 69 signal pin 69a backshanks
69b body portion 70 metal wire 71 insulation course
72 signal pin 74 grounding pins 76 mate pin
78 flexible circuit board 80 circuit boards
Embodiment
For can the present invention be illustrated more clearly in, hereby lifts preferred embodiment and coordinate diagram to be described in detail as follows.
Fig. 3 and cantalever type probe card 100 schematic diagram that Figure 4 shows that the present invention first preferred embodiment, disclose and comprise a circuit board 10, many signal pins 24, many grounding pins 26, many coupling pins 28 and rigid conductors 30; Wherein:
Circuit board 10 has an opening 12, and surface thereof 14 is provided with and comprises the signal circuit of multiple signal contact 16 and the grounding circuit of multiple ground contact 18 around this opening 12; And one the locating ring 20 with insulation characterisitic be arranged on the periphery of this opening 12, one sticky liquid shape and the fixing glue 22 with insulation characterisitic is coated on this locating ring 20, and forming a stilt after cured, the inner face defining the fixing glue 22 of having solidified in this forms an end face 22a.
Namely those signal pins 24 were put on locating ring 20 with skewed in advance before coating fixing glue 22.In the present embodiment, signal pin 24 includes the first section 24d of the whole body portion 24a, a backshank 24b, a needle point 24c and a pin.Wherein, body portion 24a puts in fixing glue 22, and outside is coated with an insulation course 25, backshank 24b welds with the signal contact 16 on circuit board 10, needle point 24c is bending and in order to contact measured electronic loop, as shown in Figure 4, it is coated that the signal pin 24 of part and insulation course 25 1 are all the institute of the fixing glue 22 after this solidification, in this definition, extend and pass this fixing glue 22 (i.e. stilt) end face 22a and to should the pin section of opening 12 be this pin elder generation section 24d, that is the first section 24d of pin possesses elasticity can in response to prepressing deformation during needle point 24c contact measured electronic loop.
Those grounding pins 26 were also put on locating ring 20 with skewed before coating fixing glue 22, and to be separated by a distance with signal pin 24, were firmly incorporated into circuit board 10 after glue 22 to be fixed solidifies.The tail end 26a of grounding pin 26 welds with the ground contact 18 on circuit board 10, and its needle point 26b is that extension passes this fixing glue 22 end face 22a, and for contact measured electronic loop.
Those coupling pins 28 are metal thin bar body, and distinctly put the side in each signal pin 24 contiguous abreast, and coupling pin 28 one end is welded with the ground contact 18 on circuit board 10, and the other end then slightly extends the end face 22a passing this fixing glue 22.
Rigid conductor 30 is that the material with satisfactory electrical conductivity imposes coating operations and the layer structure formed after solidification on the end face 22a of the fixing glue 22 of having solidified, as shown in Figure 4, with grounding pin 26 while of rigid conductor 30, coupling pin 28 and the coated insulation course 25 of this signal pin 24 body portion 24a contact, easy speech it, signal pin 24 is by insulation course 25 is isolated and be not electrically connected with rigid conductor 30, grounding pin 26 on the contrary and mate pin 28 and be subject to the contact of rigid conductor 30 and be electrically connected each other each other and be connected to earthing potential, furthermore, the two ends of coupling pin 28 are connected to earthing potential, and this two earth terminals distance is longer, represent that coupling pin 28 can be larger on the impedance matching impact of signal pin 24.
Above-mentioned probe 100 is because being be arranged on the fixing glue 22 end face 22a solidified as electric connection grounding pin 26 with the rigid conductor 30 mating pin 28, the length causing coupling pin 28 to be affected signal pin 24 impedance condition is close to approach signal pin 24 length, in other words, signal pin 24 does not shorten by the section of impedance matching, so by the inductive load effectively reduced on signal pin 24 to promote its high frequency test signals transmittability.Separately, rigid conductor 30, through being coated with and being solidified to form, processing operation has comprehensive and consistance, effectively can shorten Production Time, and hide without utilizing metal wire to be electrically connected wire and grounding pin shown in Fig. 2 the disappearance easily fractureed.
Below other feasible enforcement aspect that the present invention can reach above-mentioned purpose is described again, wherein:
Fig. 5 and Fig. 6 is the second preferred embodiment schematic diagram of probe of the present invention, announcement has and the mutually isostructural signal pin 32 of above-mentioned probe 100, grounding pin 34 and fixing glue 36, but does not have the rigid conductor being arranged on and solidifying on fixing glue 36 (i.e. stilt) end face 36a.The difference that the probe of this second preferred embodiment is maximum is:
Coupling pin 38 has the impedance matching section 38a and a conductive segment 38b that link into an integrated entity, wherein, this impedance matching section 38a reduces inductive load use in order to cause signal pin 32, its length is greater than or equal to the length in this signal pin 32 body portion, when the length of this impedance matching section 38a is greater than the length in this signal pin 32 body portion, representing that the length of this impedance matching section 38a extends to the first section 32a of pin of signal pin 32, is good to extend to the needle point 32b of approach signal pin 32 again.Said impedance matching section 38a one end is welded with the ground contact (not shown) on circuit board, and other end extension passes the end face 36a of this fixing glue 36 and connects this conductive segment 38b; The tapered thin bar body of this conductive segment 38b, and end 38c extends to the top of this grounding pin 34, be in the present embodiment with close to but the patten's design do not contacted, to reduce wearing and tearing situation to each other; Conductive segment 38b be grounding pin 34 for electrical detection and the contact 200 of contact measured electronic loop time begin to contact (Fig. 7 reference) with grounding pin 34, jointly form a closed ground loop according to this.Another explanation, the conductive segment 38b position that the present invention does not get rid of coupling pin 38 remains on grounding pin 34 state contacted above grounding pin 34.
Impedance matching position due to this impedance matching section 38a extends to the needle point 32b of approach signal pin 32, therefore falls the inductive load on earth signal pin 32 significantly, ensure that signal pin 32 has splendid electrical transmittability.
Fig. 8 is the present invention the 3rd preferred embodiment, the conductive segment 42 disclosing coupling pin 40 has a hook part 42a, this hook part 42a is before probe implements test electronic loop, be from upper double team grounding pin 44, but do not contact grounding pin 44, only begin when the contact 200 of electronic loop to be measured contacts with grounding pin 44 to form with it closed ground loop.Fig. 9 is the 4th preferred embodiment, and the hook part 46a of its conductive segment 46 is from lower double team grounding pin 44.Similarly, the hook part that the present invention does not get rid of conductive segment remains on grounding pin the state contacted.
Figure 10 and Figure 11 is the 5th preferred embodiment, the conductive segment 49 disclosing coupling pin 48 has a circle and is wrapped in grounding pin 50 outside around portion 49a, in the present embodiment, this circle was contact with grounding pin 50 around portion 49a before test electronic loop, only begin when the contact 200 of electronic loop to be measured contacts with grounding pin 50 and the closed ground loop of formation.Similarly, the circle that the present invention does not get rid of conductive segment remains on grounding pin 50 state contacted around portion 49a.
Figure 12 is the 6th preferred embodiment, disclose the nearly needle point position of grounding pin 52 and there is a perforation 52a, and conductive segment 55 front end of mating pin 54 is stretched in this perforation 52a, before test electronic loop, described conductive segment 55 front end remains on non-contact condition with perforation 52a hole wall, similarly, conductive segment 55 front end in the present embodiment only forms with it closed ground loop when the contact 200 of electronic loop to be measured contacts with grounding pin 52.Certainly, the present invention does not get rid of the state that conductive segment 55 front end can also remain on contact grounding pin 52.
Figure 13 is the 7th preferred embodiment, be disclosed in grounding pin 56 extend pass stilt section on a sheathed conducting block 58, conducting block 58 has a side opening 58a, and conductive segment 61 front end of the coupling pin 60 of the present embodiment to be stretched in this side opening 58a and do not contacted with side opening 58a hole wall.Similarly, the present invention does not get rid of the aspect that conductive segment 61 front end directly contacts with conducting block 58.
Figure 14 is the 8th preferred embodiment, disclose coupling pin 62 and there is a bending segment 62a down, and it for Copper Foil 64 but does not contact as electric-conductor one end of limit with coupling pin 62 by one, the other end contacts with grounding pin 66 and forms with it a closed ground loop.Should be noted that, the effect of aforementioned bending segment 62a is only to prevent the slippage of Copper Foil 64 relative match pin 62, and the present invention does not get rid of omission bending segment and Copper Foil 64 is directly fixed on the means of coupling pin 62, as welding.
Figure 15 is the 9th preferred embodiment, disclose coupling pin 68 length and reduce the first section of pin to respective signal pin and the coated place of fixing glue, coupling pin 68 is by connection one metal wire 70, and metal wire 70 one end is welded in the grounding circuit 18 of circuit board 10 and reaches electric connection object.More particularly, metal wire 70 laid parallel is in the side of contiguous signal pin 69, and metal wire 70 outside is coated with an insulation course 71, metal wire 70 and signal pin 69 is made to keep fixing spacing and electrical isolation, separately, the length of metal wire 70 is extended to the body portion 69b of signal pin 69 by the backshank 69a of signal pin 69, to make the backshank 69a of signal pin 69 reach the effect of impedance matching to body portion 69b, effectively to reduce inductive load on signal pin 69 to promote its high frequency test signals transmittability.In general, can be separated as Figure 15 between metal wire 70 with signal pin 69, also can be near, because metal wire 70 outside is coated with insulation course 71, metal wire 70 and signal pin 69 near structure under, the spacing that can control between metal wire 70 and signal pin 69 by the thickness of insulation course 71.The earthing mode of aforementioned coupling pin is also applicable to the various embodiments described above.
Figure 16 is the tenth preferred embodiment, discloses signal pin 72 of the present invention, grounding pin 74 and coupling pin 76 and is electrically connected with circuit board 80 by connection one flexible circuit board 78.Namely this flexible circuit board 78 one end is directly welded on circuit board 80, and the signal contact of multiple conducting wires (not shown) one end connecting circuit board 80 out of the ordinary of flexible circuit board 78 and ground contact, the wire other end is then more distinctly with signal pin 72, grounding pin 74 and mate pin 76 and be connected, to reach electric connection object.Aforementioned connected mode is also applicable to the various embodiments described above.
The foregoing is only the better possible embodiments of the present invention, such as apply equivalent structure and method for making change that instructions of the present invention and claim do, ought to be included in the scope of the claims of the present invention.
Claims (22)
1. a cantalever type probe card, is characterized in that comprising:
One circuit board, surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are made;
At least one signal pin, one end is electrically connected to the signal circuit of this circuit board, and other end extension passes this stilt;
At least one grounding pin, one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt;
At least one coupling pin, is adjacent to this signal pin, and one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt; And
One rigid conductor, is electrically connected this grounding pin and mates pin with this;
Wherein, this stilt has an end face; This signal pin has the whole body portion and passes this stilt and protrude from outside this end face, and body portion is coated with an insulation course; This rigid conductor is that conductive material coats this stilt end face and the layer structure solidify to form, its with this grounding pin, mate pin and this insulation course contacts.
2. cantalever type probe card as claimed in claim 1, is characterized in that, also comprise a flexible circuit board, and this flexible circuit board is in order to be electrically connected this circuit board with this signal pin, grounding pin and mate pin.
3. cantalever type probe card as claimed in claim 1, it is characterized in that, comprise a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
4. a cantalever type probe card, in order to test electronic loop, is characterized in that comprising:
One circuit board, surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are made, and this stilt has an end face;
At least one signal pin, one end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, one end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin, be adjacent to this signal pin, and one end is electrically connected to the grounding circuit of this circuit board, other end extension passes the end face of this stilt and is bent to form a conductive segment, and this conductive segment contacts with this grounding pin when grounding pin contacts above-mentioned electronic loop.
5. cantalever type probe card as claimed in claim 4, is characterized in that, the conductive segment of this coupling pin, before test electronic loop, is positioned at close to but does not contact the side of this grounding pin.
6. cantalever type probe card as claimed in claim 5, it is characterized in that, the conductive segment of this coupling pin has a hook part in the outside sandwiched in grounding pin.
7. cantalever type probe card as claimed in claim 4, is characterized in that, the conductive segment of this coupling pin, before test electronic loop, is wound around this grounding pin in the mode do not contacted.
8. cantalever type probe card as claimed in claim 4, it is characterized in that, this grounding pin has a perforation, and the conductive segment front end of this coupling pin is stretched in this perforation, and keeps non-contact condition with perforation hole wall before test electronic loop.
9. cantalever type probe card as claimed in claim 4, it is characterized in that, include a conducting block be sheathed on this grounding pin extend pass on the section of stilt, this conducting block has a side opening, the conductive segment front end of this coupling pin is stretched into, and keeps non-contact condition with side opening hole wall before test electronic loop.
10. cantalever type probe card as claimed in claim 4, is characterized in that, comprise a flexible circuit board, and this flexible circuit board is in order to be electrically connected this circuit board with this signal pin, grounding pin and mate pin.
11. cantalever type probe cards as claimed in claim 4, it is characterized in that, comprise a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
12. 1 kinds of cantalever type probe cards, in order to test electronic loop, is characterized in that comprising:
One circuit board, surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are made, and this stilt has an end face;
At least one signal pin, one end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, one end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin, is adjacent to this signal pin, and one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes the end face of this stilt and is bent to form a conductive segment, and this conductive segment contacts with this grounding pin.
13. cantalever type probe cards as claimed in claim 12, is characterized in that, the conductive segment of this coupling pin has a hook part and hooks to this grounding pin.
14. cantalever type probe cards as claimed in claim 12, is characterized in that, the conductive segment of this coupling pin has a circle and is wound around this grounding pin around portion.
15. cantalever type probe cards as claimed in claim 12, it is characterized in that, this grounding pin has a perforation, and the conductive segment front end of this coupling pin is inserted in this perforation.
16. cantalever type probe cards as claimed in claim 12, is characterized in that, include a conducting block and be sheathed on this grounding pin and extend and pass on the section of stilt, this conducting block has a side opening and stretches into for the conductive segment front end of this coupling pin.
17. cantalever type probe cards as claimed in claim 12, is characterized in that, comprise a flexible circuit board, and this flexible circuit board is in order to be electrically connected this circuit board with this signal pin, grounding pin and mate pin.
18. cantalever type probe cards as claimed in claim 12, it is characterized in that, comprise a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
19. 1 kinds of cantalever type probe cards, in order to test electronic loop, is characterized in that comprising:
One circuit board, surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are made, and this stilt has an end face;
At least one signal pin, one end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, one end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face passing this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin, is adjacent to this signal pin, and one end is electrically connected to the grounding circuit of this circuit board, and other end extension passes the end face of this stilt and has a bending segment; And
One electric-conductor, these electric-conductor two ends respectively with extend the grounding pin that passes stilt and mate pin and contact, this bending segment limits this coupling pin slippage relative of this electric-conductor.
20. cantalever type probe cards as claimed in claim 19, it is characterized in that, this electric-conductor is Copper Foil.
21. cantalever type probe cards as claimed in claim 19, is characterized in that, comprise a flexible circuit board, and this flexible circuit board is in order to be electrically connected this circuit board with this signal pin, grounding pin and mate pin.
22. cantalever type probe cards as claimed in claim 19, it is characterized in that, comprise a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075831.1A CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075831.1A CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102692528A CN102692528A (en) | 2012-09-26 |
| CN102692528B true CN102692528B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110075831.1A Expired - Fee Related CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI471570B (en) * | 2012-12-26 | 2015-02-01 | Mpi Corp | High frequency probe card |
| CN105403739B (en) * | 2015-10-28 | 2019-09-13 | 上海华力微电子有限公司 | A kind of WAT probe card |
| TWI620940B (en) * | 2016-11-14 | 2018-04-11 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board |
| IT201800001170A1 (en) * | 2018-01-17 | 2019-07-17 | Technoprobe Spa | Cantilever-type measuring head and relative contact probe |
| TW202035995A (en) * | 2019-03-18 | 2020-10-01 | 旺矽科技股份有限公司 | Probe device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
| CN101221194A (en) * | 2007-01-09 | 2008-07-16 | 旺矽科技股份有限公司 | High-frequency probe |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247459A (en) * | 2003-02-13 | 2004-09-02 | Seiko Epson Corp | Semiconductor device, manufacturing method therefor, probe card, probe device and probe testing method |
| US7595651B2 (en) * | 2007-02-13 | 2009-09-29 | Mpi Corporation | Cantilever-type probe card for high frequency application |
-
2011
- 2011-03-24 CN CN201110075831.1A patent/CN102692528B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
| CN101221194A (en) * | 2007-01-09 | 2008-07-16 | 旺矽科技股份有限公司 | High-frequency probe |
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| Publication number | Publication date |
|---|---|
| CN102692528A (en) | 2012-09-26 |
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