WO2007059797A1 - Procede de soudage de pistes conductrices entre elles - Google Patents

Procede de soudage de pistes conductrices entre elles Download PDF

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Publication number
WO2007059797A1
WO2007059797A1 PCT/EP2005/014193 EP2005014193W WO2007059797A1 WO 2007059797 A1 WO2007059797 A1 WO 2007059797A1 EP 2005014193 W EP2005014193 W EP 2005014193W WO 2007059797 A1 WO2007059797 A1 WO 2007059797A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
strap
conductive
insulating layer
welding
Prior art date
Application number
PCT/EP2005/014193
Other languages
English (en)
Inventor
Jean-Jacques Mischler
Original Assignee
Fci
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci filed Critical Fci
Priority to PCT/EP2005/014193 priority Critical patent/WO2007059797A1/fr
Publication of WO2007059797A1 publication Critical patent/WO2007059797A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Definitions

  • the present invention generally relates to welding methods, and more specifically to methods to weld together conductive tracks extending on insulating material.
  • the tag With no self source of energy, the tag comprises an antenna and an integrated circuit (IC) chip that includes a memory. It uses electromagnetic field produced by an RFID reader. If such a tag enters the magnetic field, the RFlD antenna will become energized and the electronic circuit can transmit a coded signal towards the reader or a separate receiving antenna.
  • IC integrated circuit
  • FIG. 1a to 1c An example of RFID layout is shown on Figs. 1a to 1c.
  • This layout includes an antenna 1.
  • An integrated circuit (IC) chip (not shown on Figs. 1a to 1c) is connected to this antenna.
  • the antenna loop 1 also called later on antenna tracks, generally comprises a plurality of turns that spiral around on a planar dielectric substrate.
  • the antenna tracks 1 may be either formed before being laid on the substrate or formed directly upon it (by printing and/or etching techniques for example), among known techniques.
  • the antenna terminals 2 and 2' as seen in Figs. 1a to 1c are separated by the plurality of turns, and an electrical bridge must be formed over these spiral turns to close the antenna loop.
  • Different techniques are known to form and connect this bridge, also called later on a conductive strap or strap, to the antenna, while keeping this bridge electrically isolated from the tracks.
  • the present invention provides an assembly method according to claim 1.
  • the present invention further provides an antenna circuit according to claim 13.
  • the invention takes advantage of the local electric discharge and/or heating generated by the passage of the current in the vicinity of said joint, i.e. through the contact or joint between the tracks and/or between the conductive bridge and at least one track and/or through the resistance of the tracks and /or the conductive bridge, in the joint region. Consequently, the metals of the tracks and/or of the conductive bridge melt in the region of welding so that they locally fuse and a weld is formed between them. Thus a good electrical connection is established between the tracks.
  • Such a welding technique is also known as resistive welding.
  • the method according to the invention is effective thought simple and straightforward.
  • the first and second conductive tracks are arranged so that the joint comprises the insulating material placed between the conductive tracks, and the current is then supplied in one of the conductive tracks in the region of welding so that the heat generated in this conductive track melts the insulating material.
  • the invention takes advantage of the applicant's observation that when using a current supplied in the joint and/or in at least one track and/or in the conductive bridge, the heat generated from the resistance of the conductor is sufficient to melt and/or destroy locally the insulating material between the tracks and fuse at least one of the conductive tracks and/or bridge. With this implementation, a simplified welding method is thus provided, as a selective printing or deposition of the insulating material is no longer needed.
  • FIG. 1a - 1c illustrate different configurations of antenna terminals when a bridge or strap is required
  • FIG. 2 illustrates a 3D view of a bridge that is welded to antenna terminals in an RFID antenna according to a the first exemplary implementation of the method according to the present invention
  • FIG. 3 illustrates a cross section view of the RFID antenna from FIG. 2;
  • FIG. 4 illustrates a view of a bridge or strap with its welded pads that is soldered to the antenna circuit in the first exemplary implementation of the method according to the present invention
  • FIG. 5 illustrates a view of a carrier with straps used in the antenna circuit according to the invention
  • FIG. 6 illustrates a cross section view of an RFID antenna, after welding of a strap underneath the dielectric substrate carrying the tracks
  • FIG. 7 illustrates the example of a double sided antenna, with antenna terminals provided on opposite side of the dielectric substrate carrying the antenna tracks
  • FIG. 8 illustrates another example of implementation of the method according to the invention.
  • the invention is an antenna circuit.
  • Such a circuit generally comprises a dielectric substrate (not shown in FIGs. 1a to 1c) that carries at least one turn 1 forming the antenna loop in the example of a spiral antenna, and first and second antenna terminals 2 and 2'.
  • a chip (not shown in FIGs. 1a to 1c) is generally attached to the antenna tracks, so as to form a RFID antenna.
  • the chip is either attached in the region inside the turns 1 to the chip terminals 3 and 3' (FIG. 1b), or outside the turns 1 to the chip terminals 3 and 3' (FIG. 1c).
  • the chip may also be provided on the bridge (not shown in FIGs.
  • one of the conductive tracks carries an insulating material on at least one side thereof.
  • the bridge or strap on the one hand, as well as the antenna terminals on the other hand, are conductive tracks that are to be welded to each others.
  • the antenna terminals are carried by the dielectric substrate of the antenna.
  • This dielectric substrate may be made for example from a polyester film, such as a PET film (polyethylene terephthalate) or a PEN film (polyethylene naphthalate), from polyimides, from epoxy-glass, from PVC. Substrates such as paper may also be used.
  • the substrate may be rigid as well as flexible. For instance, the substrate is less than 200 microns thick.
  • the antenna turns may be printed and/or etched over the dielectric substrate.
  • the turns may be made of copper, gold, platinum, aluminum, brass, tin, silver or any other suitable conductive metal or alloy for a printed circuit.
  • the turns may also be laminated over the dielectric substrate using an adhesive laid over the substrate beforehand if necessary.
  • the thickness of the tracks is generally in the 9 to 35 microns range, but may also be thinner or thicker depending on the antenna circuit specifications.
  • the bridge or strap may also be formed using the same manufacturing techniques used for the antenna, i.e. formed on a dielectric reel tape as seen in FIG. 5. It may also be formed through stamping of a thin metal sheet that is rolled as a reel for example.
  • the strap may also carry or comprise an insulating material as seen later on.
  • the conductive tracks of the antenna and the strap are pressed on top of each other in the region of welding so as to form a joint.
  • FIG. 2 illustrates a 3D view of the antenna terminal regions of an antenna, here an RFID antenna, according to the invention.
  • the antenna circuit corresponds to the antenna of Fig. 1a with the chip 20 provided on the conductive strap 10 formed of two strap conductors 12 and 12'. Antenna turns
  • antenna terminals 2 and 2' are spaced apart from each other with turns 1 in between, so that a bridge or conductive strap 10 is necessary to electrically link these terminals together.
  • the two strap conductors 12 and 12' are attached to antenna terminals
  • the strap 10 would be formed of one conductor.
  • FIG. 3 is a sectional view of the conductive strap 10 and the antenna circuit 1 after welding of the strap 10 with the method according to the invention.
  • the conductive tracks are arranged so that the resistive joint comprises an insulating material 30 placed between the conductive tracks.
  • the insulating layer 30 (see FIGs. 2 and 3) is laid over the bridge 10 on one side so that the strap conductors 12 and 12' do not come into contact with the antenna turns 1 when the strap 10 is laid over the antenna terminals 2 and
  • the insulating layer 30 is laid over the strap 10, regardless of the areas which are to come into contact with the antenna terminals 2 and 2'.
  • the conductive tracks are welded to each other or fused together by supplying a current in the resistive joint formed in the previous step.
  • the conductive tracks here the antenna terminals and the conductor to be welded, are held together to form a joint, through which a current, e.g. generated through a capacitor, passes and generates heat beyond the fusion point of either the terminals and/or the conductor to fuse them together.
  • the current may be supplied through electrodes that are pressed against the conductive strap laid on top of the antenna terminals. As can be seen on FIG.
  • the conductive strap 10 here formed with strap conductors 12 and 12', is pressed respectively over the antenna terminals 2 and 2' in the region of welding. A local bending of strap 10 can be seen in the welded region of the strap over the antenna terminals 2 and 2'.
  • the current is supplied in one of the conductive tracks in the region of welding so that the heat generated melts at least the insulating material in the joint.
  • the current comprises a first charge, preferably of low intensity, and a second charge of higher intensity.
  • the first charge is to melt the insulating layer, while the second high intensity charge is the welding charge, i.e. an intensity charge high enough to fuse and weld locally the conductive tracks with each others.
  • parallel gap welding is used.
  • a pair of electrodes is placed in contact with one of the conductive tracks.
  • the electrodes are pressed on the conductive strap 10, on locations 25 and 26 for the welding region over antenna terminal 2, and on locations 25' and 26' for the welding region over antenna terminal 2', as seen in FIG. 3.
  • Parallel gap welding is a specific form of resistance welding, and consists in pressing a pair of parallel electrodes against one of the elements of a joint to weld, here a conductive track, and supplying this pair of electrodes with a high intensity current. The resulting local heat from the resistance of the conductive track will result in welding the conductive tracks forming the joint, as can be seen in FIG. 3.
  • the insulating layer 30, after the welding process is left between the main body of the strap overlaying the antenna turns 1 , while the insulating layer in the welding region has melted or fused away.
  • Locations 25, 26 on a first end of the strap 10, and locations 25', 26' on the other end, are thus welded to the antenna terminals 2 and 2' respectively.
  • applying a pair of electrodes in the region of welding has caused a local bending of the strap 10. This results actually from the combination of the pressing in the first step of the method, as well as the local melting of the insulating layer in the region of welding in the second step.
  • the strap 10 is made of a mere conductive strip that is applied directly opposite the antenna terminals 2 and 2' on the face of the dielectric substrate free of the antenna terminals and, the dielectric substrate 5 forming thus the insulating layer of said antenna terminals. In this case, applying an insulating layer on the strap is no longer needed.
  • parallel gap welding is used, local bending of the strap occurs around welding locations 25, 26, 25' and 26' as seen in FIG. 6.
  • the insulating material is spread on the conductive antenna turns and the strap is a mere conductive tape without any insulating layer. Then, the strap is welded on the terminal portions of the antenna, with the insulating material in between. The welding is implemented through the insulating material applied on the antenna.
  • the conductive strap may be stamped on a metal foil, or printed or etched on a dielectric substrate.
  • An example of embodiment of the strap is shown in FIG. 4.
  • the strap 10 comprises a first and a second enlarged terminal portions 115 and 115', which are to be welded to the antenna terminals 2 and 2' respectively.
  • the strap 10 further comprises a central narrow portion 110 which helps reduce the stray capacity of the strap when welded to the antenna circuit.
  • the visual aspect of the antenna circuit for instance when embedded in a contactless card is also improved.
  • the welding region on the strap 10 is represented by the doted lines defined regions 116 and 116', respectively on terminal portions 115 and 115'.
  • the welding regions are preferably of a few mm 2 in surface, depending on the size of the antenna and the strap, e.g. 1.2 x 1 mm 2 .
  • Each trace resulting from the parallel gap welding is preferably of a few mm 2 as well, preferably higher than 1 x 0.5 mm 2 , so that a solid and strain resistant weld can be formed.
  • the current intensity passing between the electrodes and through the strap terminal portions is of a few dozens to a few hundreds of amperes, e.g. 500 A.
  • the first charge is of a lesser intensity, from a few amperes to a few dozens, while the second charge is a few to 50 fold.
  • the two successive charges, as well as their respective durations, depend upon various paremeters.
  • the first charge intensity depends notably upon the nature and the thickness of the insulating layer, as well as the nature of the track upon which the electrodes are applied.
  • the second charge intensity notably depends upon the nature of the metal or alloys of tracks as well as their respective thicknesses.
  • the first charge to melt the insulating layer is of about 100 A applied for 60 to 100 miliseconds.
  • the second charge for the welding itself is about 400 A applied for 6 miliseconds.
  • These numbers are for Tungsten electrodes of 0.5 x 1.0 mm, spaced 0.5 mm apart.
  • the same conductive tracks, with no tin layer, require a second intensity charge of approximately 700 A applied for 8 ms.
  • the strap is tin plated on at least one side with a few ⁇ m of tin; e.g. 5 ⁇ m, as less heat is needed to weld the strap to the antenna terminals, which results in a better resistance of the dielectric material of the antenna.
  • the strap may be formed on a carrier 200, whether it is stamped or else. If the straps are printed or etched, or laminated, the carrier may comprise a dielectric band 60 carrying the straps. If straps 10 on carrier 200 are to be welded on top of antenna terminals 2 and 2', the straps may be cut out with a portion of the band 60 to be used as the insulating layer that is welded through.
  • An insulating layer is needed when the straps of FIG. 5 are flipped over the antenna turns so as to isolate said turns from the strap.
  • the insulating layer may be laid, e.g. printed, over the central portion 110 of the straps, in a continuous manner, e.g. in the form of a continuous band 70 also laid over dielectric band 60.
  • a mask may be used to leave the terminal portions 115 and 115' free of insulating material.
  • the two enlarged terminal portions 115 and 115' of strap 10 may be welded either simultaneously or successively.
  • the insulating material laid over the strap may be similar to the dielectric substrate over which the antenna is formed.
  • the insulating material may also be a resin, a non conductive ink, or any suitable non conductive material that can be applied in a thin layer on the strap. Examples are polyester, polyurethane or acrylic resins.
  • the dielectric substrate may act as the insulating material.
  • the insulating material may be a non plastics material such as paper.
  • the insulating material is burnt at the welding location, during the welding process.
  • FIG. 7 is an illustration of another implementation of the method according to the invention, with the example of a double face or sided antenna.
  • Antenna terminals 2 and 2' are provided on opposite side of dielectric substrate 5. Electrodes may be applied on locations 25 and 26 of antenna terminal 2.
  • a first intensity charge may be supplied to first melt the insulating layer formed by dielectric substrate 5 followed by the second charge to weld antenna terminals 2 and 2' together.
  • the method according to the invention may be used for providing electrical paths through one or several insulating layers. For instance, several insulating layers each one of which having a conductive track on it may be stacked one on the other. A conductive path may be created between at least two of them using the welding method according to the invention.
  • the method according to the invention may be also used for welding flex interconnection systems 200, 201 , also called flat flex cables or Flexible Laminated Cables, together.
  • Each one of these flex cables 200, 201 comprises a metallic conductive track 12 embedded in an insulating cover 30 or sandwiched between two insulating layers.
  • one 200 of the flex cables 200, 201 has an end with the insulating cover 30 removed.
  • the conductive tracks 12 of this flex cable 200 has been welded to the underlying flex cable 201 with the method according to the invention.
  • An electric path connects the conductive tracks 12 for the three joint locations shown on FIG.8.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

La présente invention concerne un procédé de soudage d’une première piste conductrice (2, 2’) à une seconde piste conductrice (12), l'une ou l'autre desdites première et seconde pistes conductrices supportant sur au moins un côté un matériau isolant (30), ledit procédé comprenant les étapes consistant à comprimer lesdites première et seconde pistes conductrices l’une sur l’autre dans la zone de soudage de façon à former un joint et à souder ladite première piste conductrice à ladite seconde piste conductrice en amenant un courant à proximité dudit joint. La présente invention concerne également un procédé de fabrication d’un circuit d’antenne construit à l’aide du procédé de soudage et un circuit d’antenne.
PCT/EP2005/014193 2005-11-25 2005-11-25 Procede de soudage de pistes conductrices entre elles WO2007059797A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/014193 WO2007059797A1 (fr) 2005-11-25 2005-11-25 Procede de soudage de pistes conductrices entre elles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/014193 WO2007059797A1 (fr) 2005-11-25 2005-11-25 Procede de soudage de pistes conductrices entre elles

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WO2007059797A1 true WO2007059797A1 (fr) 2007-05-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007050102A1 (de) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul
EP2380238A1 (fr) * 2008-12-17 2011-10-26 Fci Procédé de fabrication de dispositifs ci de communication sans contact

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1197407A (en) * 1967-06-21 1970-07-01 Siemens Ag Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies
DE19531970A1 (de) * 1995-08-30 1997-03-06 Siemens Ag Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist
DE19618100A1 (de) * 1996-05-06 1997-11-13 Siemens Ag Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen
WO1999049708A1 (fr) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Procede de realisation de connexions electriques entre des conducteurs separes par un dielectrique
EP1103331A2 (fr) * 1999-08-23 2001-05-30 Miyachi Technos Corporation Appareil d'assemblage par fusion
US20020053735A1 (en) * 2000-09-19 2002-05-09 Neuhaus Herbert J. Method for assembling components and antennae in radio frequency identification devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1197407A (en) * 1967-06-21 1970-07-01 Siemens Ag Improvements in or relating to Methods of Producing External Connections on Electrical Component Assemblies
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WO1999049708A1 (fr) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Procede de realisation de connexions electriques entre des conducteurs separes par un dielectrique
EP1103331A2 (fr) * 1999-08-23 2001-05-30 Miyachi Technos Corporation Appareil d'assemblage par fusion
US20020053735A1 (en) * 2000-09-19 2002-05-09 Neuhaus Herbert J. Method for assembling components and antennae in radio frequency identification devices

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DE102007050102A1 (de) * 2007-10-16 2009-04-23 Smartrac Ip B.V. Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul
EP2380238A1 (fr) * 2008-12-17 2011-10-26 Fci Procédé de fabrication de dispositifs ci de communication sans contact

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