WO2007045520A3 - Composant de circuit integre dote d'un systeme de refroidissement - Google Patents

Composant de circuit integre dote d'un systeme de refroidissement Download PDF

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Publication number
WO2007045520A3
WO2007045520A3 PCT/EP2006/065694 EP2006065694W WO2007045520A3 WO 2007045520 A3 WO2007045520 A3 WO 2007045520A3 EP 2006065694 W EP2006065694 W EP 2006065694W WO 2007045520 A3 WO2007045520 A3 WO 2007045520A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
cooling arrangement
cooling
electronic
cooling body
Prior art date
Application number
PCT/EP2006/065694
Other languages
German (de)
English (en)
Other versions
WO2007045520A2 (fr
Inventor
Christian Janisch
Karl Smirra
Original Assignee
Siemens Ag
Christian Janisch
Karl Smirra
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Christian Janisch, Karl Smirra filed Critical Siemens Ag
Priority to JP2008534954A priority Critical patent/JP2009512203A/ja
Priority to US12/089,668 priority patent/US20080253090A1/en
Priority to EP06793022A priority patent/EP1938373A2/fr
Publication of WO2007045520A2 publication Critical patent/WO2007045520A2/fr
Publication of WO2007045520A3 publication Critical patent/WO2007045520A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un composant de circuit intégré (2) doté d'un système de refroidissement (1) qui est réalisé sous la forme d'un boîtier électronique présentant un corps de refroidissement (7). Selon l'invention, le composant de circuit intégré (2) est directement placé sur le corps de refroidissement (7) dans le boîtier électronique. Le système de refroidissement (1) avantageusement créé selon l'invention, est destiné à des composants de circuit intégré (2) et permet un refroidissement efficace et direct du composant de circuit intégré (2) et un montage simple sans nécessiter de composants supplémentaires. Ce système de refroidissement est particulièrement adapté aux applications dans des boîtiers électroniques dans le domaine de l'automobile.
PCT/EP2006/065694 2005-10-18 2006-08-25 Composant de circuit integre dote d'un systeme de refroidissement WO2007045520A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008534954A JP2009512203A (ja) 2005-10-18 2006-08-25 冷却アッセンブリを備えたｉｃ構成素子
US12/089,668 US20080253090A1 (en) 2005-10-18 2006-08-25 Ic Component Comprising a Cooling Arrangement
EP06793022A EP1938373A2 (fr) 2005-10-18 2006-08-25 Composant de circuit integre dote d'un systeme de refroidissement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005049872.8 2005-10-18
DE102005049872A DE102005049872B4 (de) 2005-10-18 2005-10-18 IC-Bauelement mit Kühlanordnung

Publications (2)

Publication Number Publication Date
WO2007045520A2 WO2007045520A2 (fr) 2007-04-26
WO2007045520A3 true WO2007045520A3 (fr) 2007-10-18

Family

ID=37027005

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/065694 WO2007045520A2 (fr) 2005-10-18 2006-08-25 Composant de circuit integre dote d'un systeme de refroidissement

Country Status (6)

Country Link
US (1) US20080253090A1 (fr)
EP (1) EP1938373A2 (fr)
JP (1) JP2009512203A (fr)
CN (1) CN101305459A (fr)
DE (1) DE102005049872B4 (fr)
WO (1) WO2007045520A2 (fr)

Families Citing this family (17)

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DE102007019885B4 (de) * 2007-04-27 2010-11-25 Wieland-Werke Ag Kühlkörper mit matrixförmig strukturierter Oberfläche
US8072764B2 (en) * 2009-03-09 2011-12-06 Apple Inc. Multi-part substrate assemblies for low profile portable electronic devices
EP2247172B1 (fr) * 2009-04-27 2013-01-30 Siemens Aktiengesellschaft Système de refroidissement, plaque de refroidissement et composant doté d'un système de refroidissement
DE102011076227A1 (de) * 2011-05-20 2012-11-22 Robert Bosch Gmbh Thermische Anbindung induktiver Bauelemente
DE102011078460A1 (de) * 2011-06-30 2013-01-03 Robert Bosch Gmbh Elektronische Schaltungsanordnung zur Entwärmung von Verlustwärme abgebenden Komponenten
US8929077B2 (en) * 2012-01-02 2015-01-06 Tem Products Inc. Thermal connector
KR101330733B1 (ko) * 2012-04-30 2013-11-20 삼성전자주식회사 초음파 프로브
JP6048068B2 (ja) * 2012-10-25 2016-12-21 株式会社島津製作所 プラズマ用高周波電源及びそれを用いたｉｃｐ発光分光分析装置
DE202014006215U1 (de) 2014-07-31 2015-08-13 Kathrein-Werke Kg Leiterplatte mit gekühltem Baustein, insbesondere SMD-Baustein
US9807285B2 (en) * 2015-03-25 2017-10-31 Intel Corporation Apparatus, method and techniques for dissipating thermal energy
JP6501638B2 (ja) * 2015-06-11 2019-04-17 オムロンオートモーティブエレクトロニクス株式会社 電子装置
JP6558114B2 (ja) * 2015-07-16 2019-08-14 富士通株式会社 冷却部品の接合方法
DE102017110354A1 (de) * 2017-05-12 2018-11-15 Connaught Electronics Ltd. Gehäuse für eine Steuereinheit für eine Kamera eines Kraftfahrzeugs und mit einem Wärmeabfuhrelement, Kamera, Kraftfahrzeug sowie Verfahren
US10785864B2 (en) 2017-09-21 2020-09-22 Amazon Technologies, Inc. Printed circuit board with heat sink
US10476188B2 (en) 2017-11-14 2019-11-12 Amazon Technologies, Inc. Printed circuit board with embedded lateral connector
CN109644554A (zh) * 2018-10-31 2019-04-16 北京比特大陆科技有限公司 电路板以及超算设备
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899210A (en) * 1988-01-20 1990-02-06 Wakefield Engineering, Inc. Heat sink
US20020021553A1 (en) * 2000-05-12 2002-02-21 Akihiro Fukatsu Semiconductor device having heat radiating member
DE20204266U1 (de) * 2002-03-16 2002-06-27 Helbako Elektronik Baugruppen Vorrichtung zur Kühlung eines Leistungshalbleiters
US6437438B1 (en) * 2000-06-30 2002-08-20 Intel Corporation Eddy current limiting thermal plate
US20040124525A1 (en) * 2002-12-27 2004-07-01 Ibm Chip cooling
US20040233642A1 (en) * 2003-05-19 2004-11-25 Kazutoshi Ito Heat dissipation structure
WO2004112129A1 (fr) * 2003-06-16 2004-12-23 Hitachi, Ltd. Dispositif electronique

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899210A (en) * 1988-01-20 1990-02-06 Wakefield Engineering, Inc. Heat sink
US20020021553A1 (en) * 2000-05-12 2002-02-21 Akihiro Fukatsu Semiconductor device having heat radiating member
US6437438B1 (en) * 2000-06-30 2002-08-20 Intel Corporation Eddy current limiting thermal plate
DE20204266U1 (de) * 2002-03-16 2002-06-27 Helbako Elektronik Baugruppen Vorrichtung zur Kühlung eines Leistungshalbleiters
US20040124525A1 (en) * 2002-12-27 2004-07-01 Ibm Chip cooling
US20040233642A1 (en) * 2003-05-19 2004-11-25 Kazutoshi Ito Heat dissipation structure
WO2004112129A1 (fr) * 2003-06-16 2004-12-23 Hitachi, Ltd. Dispositif electronique

Also Published As

Publication number Publication date
JP2009512203A (ja) 2009-03-19
WO2007045520A2 (fr) 2007-04-26
CN101305459A (zh) 2008-11-12
US20080253090A1 (en) 2008-10-16
DE102005049872A1 (de) 2007-04-26
EP1938373A2 (fr) 2008-07-02
DE102005049872B4 (de) 2010-09-23

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