WO2007040181A1

WO2007040181A1 - Method and apparatus for controlling expanding apparatus

Info

Publication number: WO2007040181A1
Application number: PCT/JP2006/319472
Authority: WO
Inventors: Akinori Toma; Shuji Kurokawa
Original assignee: Lintec Corporation
Priority date: 2005-10-04
Filing date: 2006-09-29
Publication date: 2007-04-12
Also published as: JP2007103649A; TW200721287A; JP4793981B2

Abstract

[PROBLEMS] To provide a method and an apparatus suitable for controlling an expanding apparatus, by which pickup performance at the time of picking up each chip of a board-like member separated into chips can be improved. [MEANS FOR SOLVING PROBLEMS] At the time of expanding intervals between chips of a board-like member (semiconductor wafer (11)), which is supported by a ring frame (12) through a first sheet (13) and separated into chips, by stretching the first sheet (13) prior to transferring each chip (C) of the board-like member onto a second sheet, the first sheet (13) is stretched to a prescribed position at a first speed, the first sheet (13) is stretched at a second speed slower than the first speed, while measuring the chip intervals from an image of the semiconductor wafer (11) on the first sheet (13) taken by an image processing means (16), and the chip intervals are expanded by a prescribed quantity.

Description

Specification

EXPANDING DEVICE CONTROL METHOD AND CONTROL DEVICE THEREOF

Technical field

TECHNICAL FIELD [0001] The present invention relates to a method for controlling an expanding apparatus for expanding a chip interval of a plate-like member separated into chips, for example, a semiconductor wafer, and a control apparatus therefor.

Background art

[0002] Conventionally, this type of expanding apparatus is described in Patent Document 1, for example.

As shown in FIGS. 1 and 2, the expanding apparatus of the same document is a plate-like member that is supported by a first frame (4) via a first UV tape (3) and separated into chips. Before transferring each chip, that is, the chip of the diced semiconductor wafer (1), to the second UV tape (9), the first UV tape (3) is stretched in advance, so that the diced semiconductor wafer (1) is The chip interval is extended.

[0003] Then, each chip after extending the chip interval as described above is transferred from the first UV tape (3) to the second UV tape (9) and picked up by the pickup device in the next process. Note that the code in the box is the code used in Patent Document 1.

[0004] However, according to the expanding device of Patent Document 1, the chip interval is not measured when the chip interval of the semiconductor wafer (1) separated into chips is expanded. For this reason, when the chip is picked up, a recognition device of the pickup device, for example, when the position of the chip is confirmed by a camera, a process for recognizing the position of the chip or a correction process for adjusting the position of the collet for pickup to the recognized position If it takes time and processing capacity declines, there is a problem.

[0005] Patent Document 1: Japanese Patent No. 3064979

Disclosure of the invention

Problems to be solved by the invention

[0006] The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a pick-up processing capability when picking up each chip of a plate-like member separated into chips. Method for expanding apparatus suitable for improving Is to provide a place.

Means for solving the problem

[0007] In order to achieve the above object, a method for controlling an expanding device according to the present invention includes a plate member that is supported by a ring frame via a first sheet and is separated into chips. Before transferring the chip to the second sheet, the first sheet is stretched to expand the respective chip intervals of the plate-like member, and the control method is a first speed control method. The first sheet is stretched to a predetermined position with the image processing means, and the first sheet is stretched at a second speed slower than the first speed while the chip distance is measured by an image processing means. It is characterized by extending a predetermined amount.

[0008] In addition, the control method of the expanding device according to the present invention is such that each chip of the plate-like member that is supported by the ring frame via the first sheet and separated into a chip shape is transferred to the second sheet. Before the transfer to the expansion member, the first sheet is stretched to expand the respective chip intervals of the plate-like members, and the control method includes: expanding the first sheet; After stretching to a predetermined position, the process moves to an intermittent stretching operation, the chip interval is measured by the image processing means while the stretching operation is stopped, and the chip interval is expanded by a predetermined amount. .

[0009] According to the control method of the expanding apparatus according to the present invention, the measurement of the chip interval is performed at a plurality of locations, and the average value of the measurement data at the plurality of locations is compared with the set value. Also good.

[0010] In the method for controlling an expanding apparatus according to the present invention, the plate-like member may be a semiconductor wafer or a compound wafer.

[0011] In order to achieve the above object, a control device for an expanding device according to the present invention includes a plate member that is supported by a ring frame via a first sheet and is separated into chips. Before transferring the chips to the second sheet, the first sheet is stretched to expand the respective chip intervals of the plate-like member, and the control apparatus is connected to the expanding apparatus. On the other hand, a signal for stretching the first sheet to a predetermined position at the first speed, and a first speed after completion of the stretching at the first speed. An output unit that outputs a signal for stretching the first sheet at a slower second speed, and an image of a plate-like member on the first sheet are captured, and the chip interval is measured from the image. Image processing means for determining and determining means for determining whether or not the measured chip interval has reached a predetermined amount, and after stretching the first sheet to a predetermined position at the first speed, The image processing means captures an image of the plate-like member while starting the stretching operation of the first sheet at the second speed and performing the stretching operation at the second speed. Image force When the chip interval is measured and the determination means determines that the chip interval has reached a predetermined amount, the stretching operation at the second speed is terminated, and the chip interval reaches a predetermined amount. The determination means determined that it is not In this case, by repeating a series of processing operations such as capturing the image, measuring the chip interval, and determining the chip interval, the chip interval is expanded by a predetermined amount by the stretching operation at the second speed. It is characterized by doing.

Further, the control device of the expanding device according to the present invention transfers each chip of the plate-like member, which is supported by the ring frame via the first sheet and separated into chips, to the second sheet. Before, the first sheet is stretched to expand the respective chip intervals of the plate-like members, and the expanding apparatus controls the expanding apparatus with respect to the expanded apparatus at a predetermined position. Output means for outputting a signal for stretching the first sheet up to a point and a signal for stretching the bow intermittently after completion of the bow I stretching at the predetermined speed, and a plate-like shape on the first sheet Image processing means for capturing an image of a member and measuring the chip interval from the image; and determining means for determining whether or not the measured chip interval has reached a predetermined amount, at the predetermined speed After the sheet 1 is stretched to a predetermined position, an intermittent stretching operation is started, and the image processing means captures an image of the plate-shaped member while the intermittent bow I stretching operation is stopped. Then, the image force is measured, and when the determination means determines that the chip interval has reached a predetermined amount, the intermittent stretching operation is terminated, and the chip interval reaches the predetermined amount. When the determination unit determines that the image is captured, the chip interval is measured, and the chip interval is determined, a series of processing operations are repeated, so that the intermittent stretching operation causes the Extend tip spacing by a predetermined amount It is characterized by doing.

[0013] In the control device for an expanding apparatus according to the present invention, the measurement of the chip interval is performed at a plurality of locations, and an average value of the measurement data at the plurality of locations is compared with a set value. Also good.

[0014] In the control device for an expanding apparatus according to the present invention, the plate-like member may be a semiconductor wafer or a compound wafer.

The invention's effect

[0015] In the present invention, as described above, after the first sheet is stretched to a predetermined position at the first speed, each chip interval of the plate-like member separated into chips is set. A configuration is adopted in which the first sheet is stretched at a second speed slower than the first speed while being measured by an image processing means, and the chip interval is expanded by a predetermined amount. For this reason, when the chip is picked up, the distance between the chips is expanded by a predetermined amount of chip intervals set in advance. Therefore, when the chip is picked up, the position of the chip is confirmed by a recognition device of the pickup device, for example, a camera. It is possible to shorten the time required for the position recognition process and the correction process for aligning the position of the pick-up collet to the recognized position, and the effect of improving the pick-up processing capability can be obtained.

[0016] In addition, after the first sheet is stretched to a predetermined position at a predetermined speed, the process proceeds to an intermittent stretching operation, and the chip interval is measured by an image processing means while the stretching operation is stopped. By adopting a configuration in which the chip interval is expanded by a predetermined amount, even if it takes time to measure the chip interval, the stretching operation is not performed during the measurement process. While waiting for the determination result, the chip interval does not exceed a predetermined amount, so an accurate chip interval can be ensured. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an explanatory diagram of an expanding apparatus to which the present invention is applied and its control apparatus, FIG. 2 is a plan view of the expanding apparatus, FIG. 3 is a hardware configuration diagram of the control apparatus, and FIG. FIG. 5 is an explanatory diagram of the measurement position of the chip interval. An expand apparatus 1 shown in FIG. 1 has an expand table 3 mounted and fixed on a frame 2, and a pair of ring frame holding means 4 disposed on both sides of the expand table 3 serve as lifting means. It is structured to move up and down via the ball screw mechanism 5.

[0020] The ball screw mechanism 5 includes a screw shaft 6 disposed so as to penetrate the frame 2 in the vertical direction, a pulley 9A rotatably fixed to the lower surface of the frame 2, and a screw shaft that is rotated by the rotation of the pulley 9A. It is comprised with the bearing part 7 which supports 6 so that raising / lowering is possible. The pulley 9A is wound around a driving pulley 9 fixed to the output shaft of the pulse motor 8 by an endless belt 10. As a result, the screw shaft 6 and the ring frame holding means 4 attached to the tip of the screw shaft 6 move up and down together with the rotation of the pulse motor 8.

The semiconductor wafer 11 as a plate-like member is supported on the first ring frame 12 via the first sheet 13 and is placed on the upper surface of the expand table 3 in a state of being separated into chips. . At this time, as shown in FIG. 2, the first ring frame 12 is set in such a manner that it is inserted into the holding grooves 14 and 14 of the both-side flanges 12a and 12a force ring frame holding means 4. Note that the first sheet 13 includes an ultraviolet curable adhesive layer, and the semiconductor wafer 11 is adhered to the adhesive layer, and the adhesive force is already lowered by irradiation with ultraviolet rays.

An image processing means 16 including a camera 15 is installed above the expanding table 3, and the image processing means 16 is a camera for the semiconductor wafer 11 on the first sheet 13 placed on the expanding table 3. Take the image at 15, capture the image, and measure the chip interval G (see Fig. 5) from the captured image. The chip interval measurement data is output from the image processing means 16 to the control device 17.

In the present embodiment, the chip interval G is measured at a plurality of locations as indicated by arrows in FIG. 5, and the average value and the set value of the measurement data at the plurality of locations are compared. At this time, in order to increase the reliability of the average value, the measurement data (D1 to D9 in FIG. 5) related to the missing portion C1 of the chip C and the dropout portion C2 of the chip C are not adopted. The “set value” is a desired chip interval G to be actually expanded by the expanding device 1 from now on, and can be changed as necessary. As shown in FIG. 3, the control device 17 also has the power of a personal computer having various kinds of hardware resources such as the CPU 18, ROM 19, RAM 20, and signal output means 21, and performs the processing operation shown in the flowchart of FIG. Built-in program to be executed.

[0025] The signal output means 21 is a first signal for extending the first sheet 13 to the pulse motor 8 of the expanding device 1 at a first speed V1 to a predetermined position P1 (see FIG. 6). After the completion of the stretching at the first speed VI, the second signal S2 for stretching the first sheet 13 at the second speed V2 slower than the first speed VI is output. In the present embodiment, pulse signals are used as the first and second signals Sl and S2.

The CPU 18 performs, for example, a process of outputting the signals Sl and S2 via the signal output means 21.

Next, a control operation of the control device 17 will be described based on the flowchart of FIG.

[0028] First, in step Stl, the control device 17 outputs the first signal S1 to the pulse motor 8 of the expanding device 1. As a result, the ring frame holding means 4 and the first ring frame 12 descend at the first speed VI via the ball screw mechanism 5, and the first seat 13 moves at the predetermined position P1 in FIG. Stretched to.

[0029] When the stretching at the first speed VI as described above is completed (St2), the control device 17 then outputs the second signal S2 to the pulse motor 8 of the expanding device 1. As a result, the ring frame holding means 4 and the first ring frame 12 are lowered together at the second speed V2, and the first sheet 13 is stretched at the second speed V2 (St3). .

[0030] When the stretching operation at the second speed V2 starts as described above, the image processing means 16 captures an image from the camera 15 while performing the stretching operation (St4), and the captured image The force also measures the chip interval G (St5), and the measurement data is output from the image processing means 16 to the control device 17, and the control device 17 determines whether or not the chip interval G has reached a predetermined amount (St6). In this embodiment, the fact that the average value of the measurement data is within the allowable range of the set value is expressed as reaching a predetermined amount, and the allowable range can be changed as appropriate.

Here, when it is determined that the chip interval G has reached a predetermined amount, the purpose of setting the chip interval G to the predetermined amount has been achieved, and thus the stretching operation at the second speed V2 is terminated (St7). On the other hand, when it is determined that the chip interval G has not reached the predetermined amount, the process returns to Step St4 while performing the enlargement operation at the second speed V2, and captures an image (St4) and measures the chip interval. A series of processing operations (St5) and chip interval determination (St6) are performed. This series of processing operations is repeated until the chip interval G reaches a predetermined amount by the stretching operation at the second speed V2, and when this amount reaches the predetermined amount, the series of processing operations is completed. The stretching operation at speed 2 of V2 is also completed (St 7) (see Fig. 7).

[0032] After the stretching operation at the second speed V2 is completed, the second ring provided with the ultraviolet curable adhesive layer is formed from above the first ring frame 12 as shown in FIG. The second ring frame 23 to which the sheet 22 is attached is lowered, the second sheet 22 is bonded to the chip C of the semiconductor wafer 11 whose chip interval is expanded by a predetermined amount, and then the first sheet 13 is peeled off. Thus, chip C is transferred. The transferred chip C is picked up by a pickup device in the next process.

FIG. 8 is a graph showing the enlargement of the present embodiment. As shown in the figure, the bow I stretching operation at the first speed VI is performed from the starting position of XO stretching until the predetermined pulse XI, at which point the camera 15 starts, Until it is determined that the tip interval G has reached the predetermined amount, the bow I stretching operation is performed continuously at the second speed V2 which is slower than the first speed VI.

As can be understood from the above description, in the control device 17 of the present embodiment, after the first sheet 13 is stretched to the predetermined position P 1 at the first speed V 1, the image processing means is used. The first sheet 13 is stretched at a second speed V2 that is slower than the first speed VI while measuring the chip interval G from the image of the semiconductor wafer 11 on the first sheet 13 captured by the A control method is adopted in which the chip interval G is extended by a predetermined amount. For this reason, when the chip is picked up, the distance between the chips is expanded by a predetermined amount of chip interval set in advance. The time required for the position recognition process and the correction process for aligning the pick-up collet with the recognized position can be shortened, and the pick-up processing capability can be improved. In the control device 17 of the above-described embodiment, during the period from the image capture to the chip interval determination processing (during the processing time from St4 to St6 in FIG. 4), the control device 17 uniformly pulls at the same second speed V2. The stretching operation may be performed at a third speed that is slower than the second speed V2 only during the force chip interval measurement process (St5 in FIG. 4) employing a configuration in which the stretching operation is performed. According to such a configuration, even when time is required for the measurement processing of the chip interval, the stretching operation is performed at the third speed slower than the second speed during the measurement processing. It is possible to effectively prevent the chip interval G from exceeding the predetermined amount allowable range while waiting for the determination result of the quantity force.

[0036] In the control device 17 of the above-described embodiment, after the stretching operation at the first speed VI is completed, the force is set so as to shift to the continuous stretching operation at the second speed V2. Instead of this, a transition may be made to an intermittent stretching operation. In this case, an image of the plate-like member may be captured by the image processing means while the intermittent stretching operation is stopped, the chip interval may be measured from the image, and the chip interval may be expanded by a predetermined amount.

FIG. 9 is a flowchart showing the processing operation of the control device when the intermittent stretching operation is performed. Based on this flowchart, the processing operation of the control device 17 will be described.

. In the first step Stl, the control device 17 starts the stretching operation of the first sheet 13 at a predetermined speed. When this operation is completed (St2), the first sheet 13 is then intermittently stretched. Move to operation (St3). While this intermittent stretching operation is stopped (St4), the image processing means 16 captures an image from the camera 15 (St5), measures the captured image force chip interval G (St6), and this measurement data Is output from the image processing means 16 to the control device 17, and the control device 17 determines whether or not the chip interval G has reached a predetermined amount (St7). Here, when it is determined that the chip interval G has reached the predetermined amount, the intermittent stretching operation is not performed thereafter (St8). On the other hand, when it is determined that the chip interval G has not reached the predetermined amount, the process returns to step St3, and the processes from St3 to St7 are repeated until the chip interval G reaches a predetermined amount by the intermittent stretching operation. When the predetermined amount is reached, the intermittent stretching operation is terminated (St8).

[0038] FIG. 10 shows a case where the first sheet is intermittently stretched and the stretch amount is determined. FIG. As shown in the figure, the stretching operation at the predetermined speed VI is performed until the stretching starting position force of XO reaches the predetermined pulse XI. At that time, the camera 15 is started and the image is displayed while the stretching operation is stopped. And the chip interval determination process is performed, and intermittent stretching operation is performed until it is determined that the chip interval G has reached a predetermined amount.

In the embodiment, the configuration in which the chip interval is measured by the image processing unit 16 is adopted. However, the chip interval measurement process may be performed by the control device 17. In the case of this configuration, the image of the camera 15 is output from the image processing means 16 to the control device 17, and the control device 17 also measures the chip interval of the image force.

In the above embodiment, the case where the plate-like member is the semiconductor wafer 11 is shown, but a compound wafer typified by gallium nitride (GaN) forming a light-emitting diode may be used. easy explanation

[0041] FIG. 1 is an explanatory diagram of an expanding device to which the present invention is applied and its control device.

FIG. 2 is a plan view of the expanding device.

FIG. 3 is a hardware configuration diagram of the control device.

FIG. 4 is a flowchart showing the processing operation of the control device.

FIG. 5 is an explanatory diagram of a measurement position of a chip interval.

FIG. 6 is an explanatory diagram of the state of the expanding device when the stretching operation at the first speed is completed.

FIG. 7 is an explanatory diagram of the state of the expanding device when the stretching operation at the second speed is completed.

[FIG. 8] A graph in which the bow I is stretched while the first sheet is continuously stretched at a second speed that is slower than the first speed.

[Fig. 9] A flow chart showing the processing operation of the controller when intermittent stretching is performed.

FIG. 10 is a graph when the first sheet is intermittently stretched and the stretch amount is judged. Explanation of symbols

1 Expanding device

8 pulse motor

11 Semiconductor wafer (plate member)

12 Ring frame

13 First sheet

16 Image processing means

17 Control unit

22 Second sheet

Claims

The scope of the claims

[1] The first sheet is stretched before each chip of the plate-like member supported by the ring frame via the first sheet and separated into chips is transferred to the second sheet. A method for controlling an expanding device that expands the interval between tips of each of the members.

The control method is:

After stretching the first sheet to a predetermined position at a first speed, the first sheet is stretched at a second speed slower than the first speed while measuring the chip interval by an image processing unit, Extending the chip interval by a predetermined amount

A method of controlling an expanding device characterized by the above.

[2] The first sheet is stretched before each chip of the plate-like member supported by the ring frame via the first sheet and separated into chips is transferred to the second sheet. A method for controlling an expanding device that expands the interval between tips of each of the members.

The control method is:

After the first sheet is stretched to a predetermined position at a predetermined speed, the process proceeds to an intermittent stretching operation, and the chip interval is measured by the image processing means while the stretching operation is stopped, and the chip interval is Extending a predetermined amount

A method of controlling an expanding device characterized by the above.

[3] The chip interval is measured at multiple locations !, and the average value of the measurement data at the multiple locations is compared with the set value.

The method for controlling an expanding apparatus according to claim 1, wherein:

[4] The plate member is a semiconductor wafer or a compound wafer

The method for controlling an expanding apparatus according to any one of claims 1 to 3.

[5] The first sheet is stretched before each chip of the plate-like member supported by the ring frame via the first sheet and separated into chips is transferred to the second sheet. A control device for an expanding device that expands the distance between the tips of each member, The controller is

A signal for stretching the first sheet to a predetermined position at a first speed with respect to the expanding device, and the first speed at a second speed slower than the first speed after completion of stretching at the first speed. Output means for outputting a signal for stretching the sheet, image processing means for capturing an image of the plate-like member on the first sheet and measuring the chip interval from the image,

Determination means for determining whether or not the measured chip interval has reached a predetermined amount, and after the first sheet is stretched to a predetermined position at the first speed, at the second speed The first sheet bow I starts stretching operation,

While performing the stretching operation at the second speed, the image processing means captures an image of the plate-like member, measures the image force thereof, and determines that the chip interval has reached a predetermined amount. When the determination means ends the stretching operation at the second speed and the determination means determines that the chip interval has not reached a predetermined amount, the image is captured, the chip interval is measured, By repeating a series of processing operations of determining the chip interval, the chip interval is expanded by a predetermined amount by the stretching operation at the second speed.

A control device for an expanding device.

[6] The first sheet is stretched before each chip of the plate-like member supported by the ring frame via the first sheet and separated into chips is transferred to the second sheet. A control device for an expanding device that expands the distance between the tips of each member,

The controller is

Output to the expanding device for outputting a signal for stretching the first sheet to a predetermined position at a predetermined speed and a signal for intermittent stretching after the completion of the stretching at the predetermined speed Means,

Image processing means for capturing an image of the plate-like member on the first sheet and measuring the chip interval from the image;

Determining means for determining whether the measured chip interval has reached a predetermined amount, After the first sheet is stretched to a predetermined position at the predetermined speed, an intermittent stretching operation is started.

While the intermittent stretching operation is stopped, the image processing means captures an image of the plate-like member, measures its image force, the chip interval is measured, and the determination unit determines that the chip interval has reached a predetermined amount. When the determination means determines that the intermittent stretching operation is finished and the chip interval has not reached a predetermined amount, the above-described image capture, chip interval measurement, and chip interval determination are referred to. By repeating a series of processing operations, the chip interval is expanded by a predetermined amount by the intermittent stretching operation.

A control device for an expanding device.

[7] The measurement of the chip interval is performed at a plurality of locations !, and the average value of the measurement data at the plurality of locations is compared with the set value.

The control device for an expanding device according to any one of claims 5 and 6.

[8] The plate member is a semiconductor wafer or a compound wafer.

The control device for an expanding device according to any one of claims 5 to 7.