WO2007020809A1 - Work transfer apparatus, image forming apparatus provided with such work transfer apparatus, and work transfer method - Google Patents

Abstract

A work transfer apparatus (30) is provided with a first suction unit (50) which sucks a work (200) placed on a carry-in section (32) by a plurality of suction apparatuses (54) and transfers the work to a stage (110); a second suction unit (52) which sucks the work (200) on the stage (110) by a plurality of suction apparatuses (56) and transfers the work to a carry-out section (34); and a fixing jig (10) which is set on the stage (110), seals the peripheral section of the work (200) and has an opening (12) formed to expose areas of the work (200) excluding the peripheral section. A first suction apparatus (54A) arranged on an end section side of the first suction unit (50) or a first suction apparatus (56A) arranged on a side of an end section side of a second suction unit (52) sucks the fixing jig (10), and second suction apparatuses (54B, 56B) arranged on a center side of the first suction unit (50) or the second suction unit (52) suck the work (200) exposed from the opening (12). Thus, the work (200) and the fixing jig (10) are placed on the stage (110) or removed from the stage (110).

Description

 Specification

 Technical field of work conveying apparatus, image forming apparatus including the same, and work conveying method

 TECHNICAL FIELD [0001] The present invention relates to a workpiece transfer apparatus and method for transferring a workpiece such as a printed wiring board, and moreover, by exposing a drawing area of a workpiece with a light beam modulated based on image information! The present invention relates to an image forming apparatus.

 Background art

 Conventionally, there has been known a laser exposure apparatus as an image forming apparatus for forming a wiring pattern on a printed wiring board (hereinafter sometimes referred to as “workpiece” or “substrate material”). This laser exposure apparatus is provided with a stage on which a printed wiring board to be subjected to image exposure is placed (loaded), and the stage is moved along a predetermined conveyance path.

 More specifically, first, the printed wiring board is positioned and placed on the upper surface of the stage, and air is also sucked into a large number of hole portions provided on the upper surface of the stage, so that the printed circuit board is placed on the stage. Adsorption 'retained. After being sucked and held on the printed wiring board force stage, the stage moves in the sub-scanning direction at a predetermined speed, and at a predetermined measurement position, an alignment hole (hereinafter referred to as an alignment hole) provided in the printed wiring board. "Alignment mark") is captured by the CCD camera. Then, the alignment processing for the image information is executed by coordinate-transforming the drawing target area in the drawing coordinate system in accordance with the position of the printed wiring board obtained by the imaging.

 [0004] After the alignment process, the printed wiring board on the stage is modulated on the upper surface by a laser beam that is modulated based on image information at a predetermined exposure position and deflected in the main scanning direction by a polygon mirror. The formed photosensitive coating film is scanned and exposed. As a result, an image (latent image) based on the image information (corresponding to the wiring pattern) is formed in a predetermined area (drawing area) on the printed wiring board.

[0005] Then, the printed wiring board on which the image (latent image) is formed, after the stage is moved back to the initial position, the force on the stage is also taken out (unloaded), and the printed wiring board is taken up. The removed stage shifts to a process of exposing the next printed wiring board (for example, see Patent Document 1).

 Patent Document 1: JP 2000-338432 A

 Disclosure of the invention

 Problems to be solved by the invention

 In such a laser exposure apparatus, there is a case where a printed wiring board having a relatively thin thickness (for example, a thickness of less than lmm) is exposed. In this case, if the suction force by air is strong, the substrate is adsorbed so as to wave on the stage, and the peripheral edge thereof is lifted. Therefore, in this case, for example, a jig or the like that supplementarily holds the peripheral edge of the printed wiring board is provided.

 However, even if such a jig is provided, it is necessary to efficiently carry in and out of the substrate from the stage. In other words, even if such a jig is provided, it is desirable that the manufacturing efficiency of the printed wiring board is not reduced as much as possible.

 [0008] Therefore, in view of the above circumstances, the present invention provides a jig that can fix the peripheral edge of a workpiece on the stage, a workpiece transfer device and method that can efficiently supply the workpiece onto the stage, and further, It is an object of the present invention to obtain an image forming apparatus provided with a work transfer device.

 Means for solving the problem

[0009] In order to achieve the above object, a workpiece transfer device according to a first aspect of the present invention includes a plurality of suction devices that suck a workpiece placed on a carry-in section, and transfers the workpiece to a stage. A first suction unit and a plurality of suction devices for sucking workpieces on the stage, a second suction unit for transporting the cake to the carry-out portion, and a peripheral portion of the cake are set on the stage. And a fixing jig formed with an opening that exposes an area excluding the peripheral edge of the workpiece, and the first suction unit and the second suction unit are for sucking the fixing jig. A first suction device disposed on the edge side thereof, and a second suction device disposed on the center portion side for sucking the workpiece exposed from the opening.

[0010] The work transfer device according to the first aspect of the present invention suppresses lifting of the peripheral edge of the work. The fixing jig can be efficiently supplied onto the stage by the first suction unit or the second suction unit.

 [0011] In the work transfer device according to the first aspect, a detection unit that can detect that the suction position by the first suction device has shifted may be formed in the fixing jig.

[0012] In the above configuration, when the fixing jig is sucked by the first suction device, the position shift can be detected. Therefore, it is possible to prevent a trouble caused by the fixing jig being transported while being displaced.

[0013] Furthermore, in the workpiece transfer device according to the first aspect, at least the first suction device may include a buffer mechanism.

[0014] In the above configuration, when the workpiece is sucked by the second suction device while the fixing jig is sucked by the first suction device, the height position difference corresponding to the thickness of the fixing jig is changed. Can be absorbed.

 [0015] The image forming apparatus according to the second aspect of the present invention includes a plurality of suction devices that suck a work placed on the carry-in portion, a first suction unit that transports the work to the stage, and a front A plurality of suction devices for sucking the workpiece on the stage, and a second suction unit that transports the workpiece to the unloading section; and a peripheral edge of the workpiece that is set on the stage and seals the peripheral edge of the workpiece A fixing jig formed with an opening that exposes an area excluding the portion, and the first suction unit and the second suction unit are arranged on an edge side of the fixing jig to suck the fixing jig. A first conveying device, and a second conveying device arranged on the center side for adsorbing the workpiece that is exposed to the opening force. Move along the transport path of Alignment processing according to the detection result of the measurement unit, a moving unit, a measurement unit that detects the alignment mark of the workpiece on the stage that is moved by the moving mechanism, and a region other than the peripheral part of the workpiece on the stage An exposure unit that exposes the light beam modulated based on the image information thus formed and forms an image in the region.

[0016] In the above configuration, since the above-described workpiece transfer device is provided, the workpiece and the fixing jig can be efficiently supplied to the stage. In addition, since the workpiece is securely fixed on the stage by the fixing jig, the workpiece can be accurately An image can be formed.

 [0017] The image forming apparatus according to the second aspect may further include a mode for switching the mode to the mode for sucking the fixing jig and the mode for not sucking the fixing jig.

 [0018] In the above configuration, the exposure process can be performed on both a work that requires a fixing jig and a work that does not require a fixing jig.

 [0019] Further, the work transfer method according to the third aspect of the present invention includes a step of sucking a work placed on the carry-in section with a first suction unit having a plurality of suction devices and transporting the work to the stage. And a step of sucking a workpiece on the stage by a second suction unit having a plurality of suction devices and transporting the workpiece to a carry-out portion, and a fixing jig formed with an opening that exposes an area excluding the peripheral portion of the workpiece. And a step of sealing the peripheral edge of the workpiece, the workpiece conveying method comprising: a first suction unit or a second suction unit disposed on the edge side of the second suction unit. 1 Adsorb the fixing jig with an adsorbing device, adsorb the workpiece exposed from the opening with a second adsorbing device arranged on the center side of the first adsorbing unit or the second adsorbing unit, The workpiece and the fixing jig are connected to the step. Or removing from the stage.

 [0020] In the above configuration, the fixing jig for suppressing the lifting of the peripheral edge of the workpiece can be efficiently supplied onto the stage by the first suction unit or the second suction unit.

 [0021] In the work transfer method according to the third aspect, the fixing jig on the stage is sucked by the first suction device of the second suction unit, and is transported by the second suction device of the first suction unit. Then, the first suction unit and the second suction unit move to the carry-out portion side, and the second suction device of the first suction unit releases the suction, so that the workpiece is picked up. Then, the first suction unit and the second suction unit move to the carrying-in portion side, and the first suction device of the second suction unit releases the suction, so that the fixed treatment is performed. A tool may be placed on the stage, and the periphery of the workpiece may be sealed with the fixing jig.

[0022] Then, in the work transfer method according to the third aspect, the first suction unit and the second suction unit are carried in after the fixing jig on the stage is sucked by the first suction device of the first suction unit. The second suction device of the first suction unit The upper workpiece is adsorbed, and then the first adsorbing unit and the second adsorbing unit are moved to the carry-out side, and the second adsorbing device of the first adsorbing unit releases the adsorbing so that the workpiece is removed. The fixing jig is placed on the stage when the first suction device of the first suction unit releases the suction while being placed on the stage, and the peripheral edge of the cake is fixed by the fixing jig. Even if the part is sealed.

 [0023] In the above configuration, the fixing jig can be efficiently supplied onto the stage by the first suction unit or the second suction unit.

 [0024] In the work transfer method according to the third aspect, the fixing jig is positioned and placed on the stage by a work positioning member, and then the first suction unit or the second suction unit. It may be adsorbed by the first adsorption device.

 In the above configuration, the workpiece positioning member can also be used as the fixing jig positioning member. Therefore, the fixing jig can be easily positioned. Further, since it is not necessary to prepare a positioning member for the fixing jig separately, an increase in cost can be prevented.

 [0026] As described above, according to the present invention, a jig that can fix the peripheral edge of a work on the stage, a work transfer device and method that can efficiently supply the work onto the stage, and further, An image forming apparatus provided with a work transfer device can be provided.

 Brief Description of Drawings

[0027] FIG. 1 is a schematic perspective view of a laser exposure apparatus.

 FIG. 2 is a schematic perspective view showing a substrate transfer apparatus and a laser exposure apparatus.

 FIG. 3 is a schematic plan view showing a substrate transfer apparatus and a laser exposure apparatus.

 [Fig. 4A] Schematic perspective view of fixture

 [Fig. 4B] Schematic sectional view taken along line X-X in Fig. 4A

 [Fig. 5] Schematic perspective view showing stage, substrate material, and fixture

 [Fig. 6] Schematic cross-sectional view showing substrate material and fixtures adsorbed on the stage

 [FIG. 7] Partially enlarged schematic perspective view showing substrate material and fixing jig adsorbed on the stage

[FIG. 8A] Schematic plan view showing the fixing jig positioned on the stage. 圆 8B] Schematic plan view showing the arrangement of the adsorption device attached to the adsorption unit 圆 9] Schematic side view of the adsorption device attached to the adsorption unit

FIG. 10A is a schematic plan view showing an exposure area by an exposure head,

FIG. 10B is a schematic plan view showing an array pattern of exposure heads

圆 11] Schematic side view showing the state in which the suction unit also excludes the upward force of the stage. 圆 12] Schematic plan view showing the state in which the suction unit also excludes the upward force of the stage.側面 13B] Schematic side view showing the process of sucking and transporting the fixture with the second suction unit 圆 14A] Schematic showing the process of sucking and transporting the fixture with the second suction unit Side view 圆 14B] Schematic side view showing the process of sucking and transporting the fixing jig by the second suction unit 圆 15A] Schematic side view showing the process of sucking and transporting the fixing jig by the second suction unit 圆 15B] No. 2 Schematic side view showing the process of sucking and transporting the fixture with the suction unit 圆 16A] Schematic side view showing the process of sucking and transporting the fixture with the second suction unit 圆 16B] Schematic side view showing the process of sucking and conveying the jig 圆 17A] Schematic side view showing the process of sucking and conveying the fixed jig by the first adsorption unit 圆 17B] Adsorption and conveyance of the fixed jig by the first adsorption unit圆 18A] Schematic side view showing the process of sucking and transporting the fixing jig by the first suction unit 圆 18B] Schematic side view showing the process of sucking and transporting the fixing jig by the first suction unit Fig. 圆 19A] Schematic side view showing the process of sucking and transporting the fixing jig by the first suction unit 圆 19B] Schematic side view showing the process of sucking and transporting the fixing jig by the first suction unit [Figure 20A] 1 Schematic side view showing the process of sucking and transporting the fixture with the suction unit 圆 20B] Schematic side view showing the process of sucking and transporting the fixture with the first suction unit [Figure 21] Modification of the fixture Schematic plan view showing

BEST MODE FOR CARRYING OUT THE INVENTION

The best mode for carrying out the present invention will be described in detail below based on the embodiments shown in the drawings. FIG. 1 is a schematic perspective view of a laser exposure apparatus showing an example of an image forming apparatus according to the present invention. FIG. 2 is a schematic perspective view showing a substrate (workpiece) transfer device and a laser exposure device, and FIG. 3 is a schematic plan view of the same. Figures 4A and 4B are fixed. FIG. 5 is a schematic perspective view and a schematic sectional view of the fixing jig, FIG. 5 is a schematic perspective view of the stage, the substrate material, and the fixing jig, and FIG. In FIG. 1, the arrow M is the width direction, the arrow S is the transport direction, and the direction opposite to the arrow S is the scanning direction.

 [0029] [Configuration of laser exposure apparatus]

 First, the laser exposure apparatus 100 will be described. As shown in FIG. 1, the laser exposure apparatus 100 includes a rectangular thick plate-shaped installation base 102 supported by six legs 104. Two guide rails 106 are arranged on the upper surface of the installation table 102 along the longitudinal direction (conveying direction), and a rectangular shape is provided on the two guide rails 106 via a guide portion 108. A flat stage 110 is provided.

 [0030] The stage 110 is arranged so that its longitudinal direction is in the extending direction (conveying direction) of the guide rail 106, and can be reciprocated on the installation base 102 by the guide rail 106 and the guide portion 108 by an arbitrary moving mechanism. It is supported by. In other words, the moving mechanism such as the motor 114 and the ball screw 112 is configured to reciprocate at a predetermined speed along the guide rail 106.

 [0031] On the upper surface of the stage 110, a rectangular flat substrate material 200 as an exposure object is placed in a state of being positioned at a predetermined position by a positioning member 26 as shown in FIG. 8A. Further, as shown in FIG. 5, a plurality of holes 110A are formed on the upper surface of the stage 110.

 Then, as shown in FIG. 6, the inside of the stage 110 is made negative by a negative pressure supply source (not shown), whereby air is sucked from the hole 110A, and the suction force causes the substrate material 200 to be sucked. Is held on the upper surface of the stage 110. A groove 110B is formed in a rectangular frame shape on the outer side of the hole 110A on the stage 110, and air is also sucked from a plurality of small holes formed in the groove 110B. And

[0033] Further, when the thickness of the substrate material 200 is less than, for example, lmm and is adsorbed on the stage 110 so as to be undulated by the suction force of air, the peripheral edge thereof is lifted. As shown in FIG. 7, a fixing jig 10 (described later) whose upper surface (non-contact surface) is black is set on the stage 110 to prevent the substrate material 200 from being lifted at the peripheral edge. Assist in ensuring that it is fixed to the upper surface of the stage 110. In addition, this At this time, the fixing jig 10 is sucked and held on the stage 110 by the hole 110A and the groove (small hole) 110B.

 Further, the substrate material 200 is provided with a plurality of alignment marks (not shown) indicating the reference of the exposure position in the drawing area on the exposed surface. The alignment marks are formed by circular through holes, for example, and four alignment marks are arranged in the vicinity of the four corners excluding the peripheral portion of the substrate material 200, one in total.

 A substantially “U” -shaped gate 116 is provided at the center of the installation table 102 so as to straddle the movement path of the stage 110. Both ends of the gate 116 are fixed to the installation table 102, and an exposure head (exposure part) 120 for exposing the substrate material 200 is provided on one side with the gate 116 in between, and the other side is provided. A plurality of (for example, four) CCD cameras (measuring units) 118 for photographing the alignment marks provided on the substrate material 200 are provided.

 Therefore, when the substrate material 200 passes below the CCD camera 118 as the stage 110 moves, the alignment mark is measured by the CCD camera 118. In other words, each CCD camera 118 causes the strobe light source to emit light at the timing when the alignment mark of the substrate material 200 reaches a predetermined shooting position, and the strobe light irradiated to the substrate material 200 is reflected on the upper surface of the substrate material 200. The alignment mark is photographed by inputting light into the camera body through the lens.

 [0037] Further, a moving mechanism (motor 114 and ball screw 112) for moving the stage 110, a CCD camera 118, an exposure head 120, and the like are connected to a controller 130 that controls them. The controller 130 controls the stage 110 to move at a predetermined speed, the CCD camera 118 controls to image the alignment mark of the substrate material 200 at a predetermined timing, and the exposure head 120 at a predetermined timing. The substrate material 200 is controlled to be exposed.

 The exposure heads 120 are arranged in a substantially matrix form of m rows and n columns (for example, 2 rows and 4 columns).

As shown in FIG. 10B, the exposure area 122 by the exposure head 120 is configured in a rectangular shape having a short side in the transport direction (scanning direction), for example. Accordingly, a strip-shaped exposed region 202 is formed in the scanning direction for each exposure head 120 in accordance with the movement operation in the transport direction of the substrate material 200 (see FIG. 10A). [0039] In addition, each of the exposure heads 120 in each row arranged in a line is arranged at a predetermined interval in the arrangement direction so that the strip-shaped exposed areas 202 are arranged without gaps in the width direction orthogonal to the transport direction (scanning direction). They are arranged so as to be shifted (natural number times the long side of the exposure area 122). Therefore, for example, a portion that cannot be exposed between the exposure areas 122 in the first row can be exposed in the exposure area 122 in the second row.

 Each exposure head 120 includes a digital micromirror device (DM D) (not shown) as a spatial light modulation element that modulates the incident laser beam for each pixel in accordance with image data. Yes. This DMD is connected to the controller 130 having a data processing unit and a mirror drive control unit.

 The data processing unit of the controller 130 generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD for each exposure head 120 based on the input image data. The mirror drive control unit controls the angle of the reflection surface of each micromirror in the DMD for each exposure head 120 based on the control signal generated by the data processing unit.

 A bundle-shaped optical fiber 124 drawn from an illumination device 126 that emits a multi-beam as a laser beam is connected to the light incident side of the DMD in each exposure head 120. The illuminating device 126 has a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber. Each optical module that extends the power of each optical module is an optical fiber that propagates the combined laser light. A plurality of optical fibers are bundled into one to form a bundle of optical fibers 124. And

 [0043] [Operation of laser exposure apparatus]

 Next, the operation of the laser exposure apparatus 100 configured as above will be described. The substrate material (workpiece) 200 on which image exposure is performed by the laser exposure apparatus 100 is a photosensitive material on the surface of a substrate or glass plate as a material for forming a pattern (image exposure) such as a printed wiring board or liquid crystal display element For example, a coated photo resist such as an epoxy resin or a dry film may be laminated.

First, the substrate material 200 is placed on the stage by the substrate transfer device 30 (described later) shown in FIGS. When positioned and mounted on the upper surface of 110, the substrate material 200 is sucked and held on the upper surface of the stage 110 by suction of air from the hole 110A.

 [0045] At this time, if the substrate material 200 is a thin substrate of, for example, less than lmm and the peripheral edge thereof is lifted by the air suction force, a fixing jig 10 described later is set on the stage 110, The peripheral part of the substrate material 200 is pressed by the fixing jig 10. At this time, the fixing jig 10 is sucked and held on the stage 110 by the suction force of air from the hole 110A and the groove (small hole) 110B.

 [0046] When the substrate material 200 (and the fixing jig 10) is sucked and held (fixed) on the upper surface of the stage 110 in this way, the stage 110 starts to move in the transport direction, and the substrate material 200 is detected by the CCD camera 118 for alignment detection. The process and the exposure process by the exposure head 120 are conveyed. In other words, the exposure operation of the laser exposure apparatus 100 is started when the operator performs the input operation of the instruction input means of the controller 130 to start the exposure.

 First, the moving mechanism (the motor 114 and the ball screw 112) is controlled by the controller 130, and the stage 110 holding the substrate material 200 (and the fixing jig 10) on the upper surface is held along the guide rail 106. Start moving at a constant speed in the transport direction. In synchronism with the start of movement of the stage 110 or at a timing just before the tip of the substrate material 200 reaches just below each CCD camera 118, each CCD camera 118 is controlled by the controller 130 and starts operating.

 That is, for example, two alignment marks provided in the vicinity of the corner on the downstream side (front end side) of the substrate material 200 in the movement direction are on the optical axis of the lens in each CCD camera 118 (CCD force lens 118). Each of the CCD cameras 118 emits a strobe light source at a predetermined timing and photographs each alignment mark. The captured image data (reference position data) is output to the data processing unit of the controller 130.

[0049] The data processing unit inputs the image data (reference position data) of each alignment mark. The position of the alignment mark in the image to be identified, the pitch between the alignment marks, etc., and the alignment mark From the position of the stage 110 and the position of the CCD camera 118 at the time of shooting, the positional displacement of the substrate material 200 on the stage 110, the inclination with respect to the moving direction, the dimensional accuracy error, etc. are ascertained by calculation processing. Exposure An appropriate exposure position for the surface is calculated.

 Here, the image data corresponding to the exposure pattern is temporarily stored in the memory in the controller 130. Therefore, at the time of image exposure by the exposure head 120, the control signal that is stored in the memory and generated based on the image data of the exposure pattern is adjusted to the appropriate exposure position as described above for image exposure. Execute correction control (alignment). This image data is data representing the density of each pixel constituting the image as binary values (whether or not dots are recorded).

 [0051] Thus, when the alignment mark measurement (photographing) by each CCD camera 118 is completed, the stage 110 is driven to the exposure position along the guide rail 106 by driving the moving mechanism (motor 114 and ball screw 112). Moving. Then, as the stage 110 moves, the substrate material 200 moves below the exposure head 120 toward the downstream side in the transport direction. When the drawing area on the exposed surface reaches the exposure start position, each exposure head 120 moves to the laser beam. To start image exposure on the exposed surface (drawing area) of the substrate material 200.

 That is, the image data stored in the memory of the controller 130 is sequentially read out for each of a plurality of lines, and controlled for each exposure head 120 based on the image data read out by the data processing unit. A signal is generated. This control signal is subjected to correction of exposure position deviation with respect to the substrate material 200 measured by alignment by correction control (alignment). Then, the mirror drive control unit performs on / off control of each DMD micromirror for each exposure head 120 based on the generated and corrected control signals.

 [0053] When the laser beam emitted from the optical fiber 124 of the illuminating device 126 is applied to the DMD, the laser beam reflected when the DMD micromirror is in the on state is reflected by the lens system and the substrate material 200 is covered. An image is formed on the exposure surface. That is, the laser light emitted from the illumination device 126 is turned on / off for each pixel, and the substrate material 200 is exposed in units of pixels that are approximately the same number as the number of pixels used in the DMD. At this time, even if the fixing jig 10 is provided, the upper surface thereof is black, so that reflection of the irradiated laser beam is prevented.

Then, when the substrate material 200 is moved at a constant speed together with the stage 110, the substrate material 200 is exposed by the exposure head 120 in a direction opposite to the moving direction (conveying direction) of the stage 110, that is, in the scanning direction. A strip-shaped exposed area 202 is formed for each exposure head 120. (See Figure 10A). When the image exposure onto the substrate material 200 by the exposure head 120 is completed, the stage 110 is moved in the direction opposite to the conveyance direction (scanning direction) by the moving mechanism (motor 114 and ball screw 112), and the substrate material 200 is moved. Return to the initial position.

 [0055] When the stage 110 returns to the initial position, the suction by the air suction (and the fixed state by the fixing jig 10) is released, and the stage is moved by the substrate transfer device 30 (described later) shown in FIGS. Substrate material 200 is removed from the top surface of 110. The substrate material 200 removed from the upper surface of the stage 110 is transported to a transport conveyor (not shown) and transported to the next process.

 [0056] [Configuration of fixing jig]

 Next, the fixing jig 10 used in the image forming apparatus such as the laser exposure apparatus 100 as described above will be described in detail. As shown in FIG. 4A, the fixing jig 10 is formed in a frame shape having an opening 12 formed in the center, and the drawing area force excluding the peripheral portion of the substrate material 200 can be exposed from the opening 12. It has become.

 [0057] The portion excluding the opening 12 of the fixing jig 10 is a pressing portion 14 that presses the peripheral portion (outside the desired drawing region) of the substrate material 200. The pressing portion 14 is made of a member made of a different material. A plurality of layers are stacked. That is, as shown in FIG. 4B, the pressing member 14 has a rigid member 16, an elastic member 18, and an easily peelable member (peeling member) 20 in order from the non-contact surface side (upper surface side) with the substrate material 200. It is worn and structured.

 An example of the rigid member 16 is a metal such as aluminum. An example of the elastic member 18 is rubber having a relatively low hardness. Furthermore, as an example of the easily peelable member 20, a plastic such as polyethylene terephthalate (PET) can be cited. The easily peelable member 20 is much thinner than the rigid member 16 and the elastic member 18, and is not shown except for FIG. 4B.

[0059] Further, as shown in FIG. 8A, the positioning member 26 is notched in a left-right symmetrical step shape on the side facing the center of the stage 110, so that each can cope with the size variation of the substrate material 200. It has become. In other words, the cutout 28 is the smallest in the innermost cutout 28A and can position the substrate material 200, and the cutouts 28B and 28C on the outer side are larger than the cutout 28A. The larger substrate material 200 can be positioned in order. It is.

 It should be noted that the outer size of the fixing jig 10 is a size that can be adsorbed by a groove (small hole) 110B formed in the stage 110. In other words, it is the same as the outer size of the maximum substrate material 200 placed on the stage 110. Accordingly, when positioning and mounting the fixing jig 10 on the stage 110, the positioning member 26 is moved to a predetermined position on the end side in the conveying direction of the stage 110, and the conveying direction of the fixing jig 10 is moved to the notch 28C. The fixing jig 10 can be easily positioned and set (set) on the stage 110 by positioning by bringing the short side of the side into contact (matching).

 In addition, as shown in the figure, as the fixing jig 10, one having a size of the opening 12 corresponding to the size variation of the substrate material 200 is used. In other words, a plurality of fixed jigs 10 having different sizes of the openings 12 are prepared so that the size variation of the substrate material 200 can be dealt with. Therefore, when performing the exposure process using the fixing jig 10, only the substrate material 200 having a size smaller than the maximum size substrate material 200 that can be placed on the stage 110 is targeted.

 Further, as described above, it is preferable that the upper surface (non-contact surface) of the pressing portion 14 (the rigid member 16) is black. With such a configuration, it is possible to prevent reflection of the laser light irradiated from the exposure head 120 to the exposed surface (drawing region) of the substrate material 200 exposed from the opening 12. Further, if the upper surface side (non-contact surface side) that does not contact the peripheral edge of the substrate material 200 is the rigid member 16, the handling property (handleability) of the fixing jig 10 is improved. That is, the work of positioning (setting) the fixing jig 10 on the stage 110 can be easily performed.

 In any case, when the substrate material 200 and the fixing jig 10 are positioned and placed on the stage 110 or while being placed on the stage 110, as shown in FIG. As a result, air is also sucked by a large number of holes 110A and grooves (small holes) 110B, so that the substrate material 200 and the fixture 10 are sucked and held on the stage 110.

[0064] As a result, the elastic member 18 of the holding portion 14 that holds the peripheral edge of the substrate material 200 is squeezed and deformed as shown in FIGS. 6 and 7, and the peripheral edge is suitably sealed (sealed). The degree is improved). Therefore, the substrate material 200 is a thin substrate, for example less than lmm, Even when the peripheral edge is lifted by the suction force, the peripheral edge (outside the drawing area) can be reliably pressed (fixed) by the fixing jig 10. Therefore, the substrate material

An image can be accurately formed in 200.

Note that, after positioning the fixing jig 10, the positioning member 26 is removed from the stage 110. Further, since the fixing jig 10 can be positioned and placed by the positioning member 26 for positioning the substrate material 200 in this way, a positioning member for positioning the fixing jig 10 is not required. Therefore, it is preferable in terms of cost (an increase in cost is prevented).

Further, after the image formation on the substrate material 200, when the fixing jig 10 is removed from the stage 110, it can be easily peeled off from the substrate material 200 by the easy peeling member 20. Accordingly, there is no problem that the substrate material 200 is picked up by the fixing jig 10 and removed together.

[0067] [Configuration of substrate transfer device]

 Next, the substrate transfer apparatus 30 that carries the substrate material 200 into the laser exposure apparatus 100 equipped with the fixing jig 10 as described above and carries out the exposed substrate material 200 from the laser exposure apparatus 100 will be described.

[0068] As shown in Figs. 2 and 3, on the left and right sides orthogonal to the transfer direction in which the stage 110 of the laser exposure apparatus 100 moves, and in the moving direction (transfer direction) of the stage 110 (load side)

• Unloading position) has loader (loading part) ₃₂ and unloader (unloading part) 34, respectively.

, Which is arranged adjacent to the stage 110. In FIGS. 2 and 3, assuming that the substrate material 200 is loaded from the right (indicated by arrow R) and unloaded from the left (indicated by arrow L), the right side becomes the loader 32 and the left side Becomes unloader 34.

 [0069] The loader 32 is provided with an endless belt 38 wound around a pair of rollers 36, so that the substrate material 200 that has been transported also by the external force is received on the endless belt 38. Yes. The substrate material 200 carried on the endless belt 38 is positioned on the endless belt 38 by positioning means (not shown).

[0070] Further, the unloader 34 is also provided with an endless belt 39 wound around a pair of rollers 37, and the exposed substrate material 200 placed on the endless belt 39 is unrolled. The conveyor 34 is configured to convey to a conveyor (not shown) outside the machine. The loader 32 and the unloader 34 are not limited to those shown in the figure, but may be configured by arranging a plurality of rollers in parallel instead of the endless belts 38 and 39, for example.

 [0071] Above the loader 32, the stage 110, and the unloader 34, a pair of guide rails 46 are installed via a frame 44 in a direction (width direction) perpendicular to the moving direction (conveyance direction) of the stage 110. The first traveling body 40 and the second traveling body 42 are supported by the guide rail 46 so as to be movable.

 [0072] Next to the guide rail 46, a ball screw 48 is installed in parallel with the guide rail 46. That is, a drive motor 47 for rotating the ball screw 48 in the forward and reverse directions is attached to one end of the ball screw 48, and the drive motor 47 is supported by the frame 44. The other end of the ball screw 48 is supported by a support stay 49 equipped with a bearing (not shown) such as a bearing.

 Further, a guide member 41 having a screw hole (not shown) is extended on the conveyance direction side of the first traveling body 40, and a ball screw 48 is inserted into the screw hole (not shown) of the guide member 41. Are screwed together. Accordingly, the first traveling body 40 is configured to be reciprocally movable in the width direction along the guide rail 46 via the guide member 41 when the ball screw 48 is rotated in the forward and reverse directions by the drive motor 47.

 [0074] It is sufficient if the ball screw 48 is extended to the stage 110! /. In other words, since the second traveling body 42 is connected to the first traveling body 40 by connecting means 60 described later, the ball screw 48 is moved by the distance that the first traveling body 40 is moved. If it is extended, it is enough. Needless to say, the means for moving the first traveling body 40 and the second traveling body 42 is not limited to such a configuration.

 A first suction unit 50 is attached to the first traveling body 40 so as to be movable up and down, and a second suction unit 52 is attached to the second traveling body 42 so as to be movable up and down. Each suction unit 50, 52 is configured by a plurality of suction devices 54, 56 suspended from the respective mounting plates 51, 53 so as to have the same height. Air suction tubes 55 and 57 (see Fig. 11) are connected.

[0076] Suction cups 84 and 86 made of synthetic resin at the tips (lower ends) of the suction devices 54 and 56 (see Fig. 9) (See below) has the same height when viewed from the side, and an opening (not shown) communicating with the tubes 55 and 57 is formed at the center when viewed from the bottom. Therefore, the air is also sucked by the tip force of the suction cups 84 and 86 through the tubes 55 and 57, so that the substrate material 200 and the fixing jig 10 can be sucked.

The mounting plates 51 and 53 can be moved up and down by elevating mechanisms 58 and 59 that also have an LM guide and a driving motor force (not shown). Therefore, it is possible to flexibly cope with a change in the thickness of the substrate material 200. The lifting mechanisms 58 and 59 are configured to be driven independently.

 Further, as shown in FIGS. 2, 3, 11, and 12, the first traveling body 40 and the second traveling body 42 are detachably connected by a connecting means 60. That is, the connected member 62 is provided on the upper surface of the first traveling body 40 so as to protrude toward the second traveling body 42, and the connecting member 64 is disposed on the upper surface of the second traveling body 42. It is provided to project to the side.

 [0079] At the tip of the connecting member 64, there is provided a rotating portion 66 that is pivotally supported so as to be able to rotate upward, and the lower surface of the connecting member 64 prevents the rotating portion 66 from rotating downward. A support plate (not shown) extending from the second traveling body 42 is provided. A handle 70 having a substantially “U” shape in front view is projected on the upper surface of the rotating portion 66, and an engaging portion 72 having a substantially T shape in plan view extends at the tip of the rotating portion 66. It is installed. This engaging portion 72 is fitted into / into a groove portion 74 (see FIG. 12) having a substantially T shape in a plan view formed at the tip of the connected member 62.

 Further, on the lower surface of the connected member 62, a support plate (not shown) that prevents the engaging portion 72 fitted in the groove portion 74 from dropping downwardly extends from the first traveling body 40. ing. The support plate is provided with a sensor (not shown) so that it can be detected that the engaging portion 72 is fitted into the groove portion 74 and that the engaging portion 72 is detached from the groove portion 74. .

Further, on the upper surface of the connected member 62, a substantially elliptical plate-like stopper 76 is provided which is fixed to the substantially cylindrical operation portion 68 and is rotatable in the horizontal direction. The stopper 76 is configured such that by rotating the operation portion 68, the other end protrudes to the upper surface of the engagement portion 72 fitted in the groove portion 74. The groove portion 74 is prevented from coming off and turning. Also shown for this stopper 76 No sensor is provided so that the rotation position of the stopper 76 can be determined.

 [0082] [Configuration of adsorption device]

 Next, the adsorption devices 54 and 56 provided in the first adsorption unit 50 and the second adsorption unit 52 will be described. For convenience of explanation, the adsorption device 54 will be described, but the same applies to the adsorption device 56. As shown in FIG. 8B, a plurality of adsorption devices 54 are attached to the attachment plate 51.

 [0083] Specifically, the suction devices 54 are attached to the edge of the mounting plate 51 so that the fixing jig 10 can be sucked, and are attached at equal intervals on the opposite sides, and 4 pieces on the center side of the mounting plate 51 so that the substrate material 200 can be adsorbed through the opening 12 of the fixing jig 10 (exposed from the opening 12 of the fixing jig 10). It is attached to become.

 In the following description, when these suction devices 54 are distinguished and described, the suction device 54 attached to the edge side of the mounting plate 51 is referred to as a “first suction device 54A”, and the mounting plate 51 The suction device 54 attached to the center side of this is referred to as a “second suction device 54B”. Therefore, the suction device 56 attached to the edge side of the mounting plate 53 is the “first suction device 56A”, and the suction device 56 attached to the central side of the mounting plate 53 is the “second suction device 56A”. Device 5 6B ".

 As shown in FIG. 9, the adsorption device 54 has a through-hole (not shown) for sucking air! And has a pipe 80, and the pipe 80 has an outer peripheral surface in the vicinity of the lower end thereof. Flange 82 is projecting. A suction cup 84 made of synthetic resin is attached to the lower end of the pipe below the flange 82, and an opening (not shown) communicating with the through hole of the pipe 80 is provided at the center of the suction cup 84. It has been drilled.

[0086] A connecting member 88 for connecting the tube 55 is provided at the upper end of the Neuve 80. Inside the connecting member 88, a conduction hole (not shown) communicating with the through hole of the pipe 80 is formed. Has been. Further, a connection member 78 having a conduction hole formed therein is attached to the end of the tube 55, and the connection member 78 is connected to the connection member 88 in communication. As a result, it is possible to suck air with an opening force formed in the suction cup 84. is there.

 [0087] Further, a stopper member 90 is fitted into the pipe 80! (Pipe 80 is passed through the stopper member 90). The stopper member 90 is formed in a cylindrical shape having an inner diameter substantially equal to the outer diameter of the pipe 80, and a disk-like shape integrally formed at the upper end of the cylindrical portion 92 and having a larger diameter than the outer diameter of the cylindrical portion 92. And a rectangular plate-like locking plate 96 that is fixedly attached to the lower end of the cylindrical portion 92 and is locked through the mounting hole (not shown) of the mounting plate 51.

 Furthermore, a pressing member 94 is inserted into the cylindrical portion 92 of the stopper member 90 (the cylindrical portion 92 is inserted through the pressing member 94). The holding member 94 is formed in a disk shape having a size such that it cannot be inserted into the mounting hole of the mounting plate 51. The diameter (inner diameter) of a through hole (not shown) drilled in the center of the pressing member 94 is The outer diameter of the cylindrical portion 92 is substantially the same.

 [0089] Further, a first coil spring 95 that constantly urges the pressing member 94 toward the locking plate 96 is inserted into the cylindrical portion 92 between the rotation operating portion 93 and the pressing member 94. The pipe 80 between the locking plate 96 and the flange 82 is fitted with a second coil spring 98 that urges the stopper member 90 (locking plate 96) to the connecting member 88 side (upward). And

 According to the suction device 54 configured as described above, the second coil spring 98 can allow the suction cup 84 to move in the height direction. That is, the suction device 54 includes a height-direction buffering mechanism. Therefore, even if the suction cup 84 of the first suction device 54A disposed on the edge end side sucks the fixing jig 10, the suction cup 84 of the second suction device 54B disposed on the center side causes the substrate material to be When adsorbing 200, the suction cup 84 of the first adsorption device 54A moves upward against the urging force of the second coil spring 98 (the difference in height position corresponding to the thickness of the fixture 10). And the adsorption of the substrate material 200 by the suction cup 84 of the second adsorption device 54B.

 [0091] [Operation of Fixing Jig, Substrate Transfer Device, and Suction Device]

Next, a series of operations of the fixing jig 10, the substrate transport device 30, and the suction devices 54 and 56 configured as described above will be described. First, the connection between the first traveling body 40 and the second traveling body 42 is released. That is, on the connected member 62 side, the operation portion 68 is rotated to retract the stopper 76 also from the upper surface force of the engaging portion 72, the grip 70 on the connecting member 64 side is gripped, and the rotating portion 66 is rotated upward. Then, the engaging part 72 is removed from the groove part 74. This state can be confirmed by displaying the detection result of the sensor on the display unit 128 of the controller 130. When the connection between the connecting member 64 and the connected member 62 is thus released, the first suction unit 50 (first traveling body 40) is moved to the loader 32 side, and the second suction unit 52 (second traveling body). Move 42) to the unloader 34 side. That is, the first suction unit 50 (first traveling body 40) is moved by rotating the ball screw 48 by the drive motor 47, and the second suction unit 52 (second traveling body 42) is manually moved. Move.

 [0093] When the connection between the first traveling body 40 and the first traveling body 40 is released, the second traveling body 42 can move freely along the guide rail 46, and thus can be easily moved manually. This state is shown in FIGS. If the first suction unit 50 (first traveling body 40) is already positioned above the loader 32 !, it is not possible to move only the second suction unit 52 (second traveling body 42). Needless to say.

 Thus, after the first suction unit 50 and the second suction unit 52 are moved, the fixing jig 10 is positioned and placed on the stage 110 manually. That is, as shown in FIG. 8A, the fixing jig 10 is positioned and placed on the stage 110 using the notch 28 (the notch 28C for the maximum size) formed in the positioning member 26 for the substrate material 200. . At this time, the first suction unit 50 and the second suction unit 52 do not exist above the stage 110, and the upper surface side (non-contact surface side) of the fixing jig 10 is the rigid member 16. Therefore, the work of setting the fixing jig 10 can be easily performed manually.

 [0095] After setting the fixing jig 10 on the stage 110, the first traveling body 40 and the second traveling body 42 are connected. That is, the handle 70 is gripped and the rotating portion 66 is rotated downward, and the engaging portion 72 is inserted into the groove 74. Then, the operation portion 68 is turned so that the stopper 76 is interposed on the upper surface of the engaging portion 72. In addition, since the detection result of each sensor can be grasped by displaying the detection result of each sensor on the display unit 128 of the controller 130, it is possible to avoid an erroneous operation in a state where a connection failure has occurred. be able to.

In this way, when the first traveling body 40 and the second traveling body are connected, the controller 130 controls the movement of the first traveling body 40 and the suction operation of each of the suction units 50 and 52. Here, when the fixing jig 10 is placed on the stage 110 or removed from the stage 110, the first suction unit 50 sucks and transports, and the second suction unit 52 sucks and transports. You can think of it. Therefore, first, the fixing jig 10 is moved by the second suction unit 52. The case of sucking and transporting will be described with reference to FIGS. 13A to 16B.

[0097] When the first substrate material 200 is loaded onto the endless belt 38 of the loader 32 and positioned by positioning means (not shown), the mounting plate 51 of the first suction unit 50 is lowered by the lifting mechanism 58, and its mounting The suction cup 84 of the second suction device 54B on the central portion side provided on the plate 51 sucks the substrate material 200 by sucking air at the tip opening force. At the same time, the mounting plate 53 of the second suction unit 52 is lowered by the elevating mechanism 59, and the suction cup 86 of the first suction device 56A on the edge side provided on the mounting plate 53 has a leading end opening force. The upper surface of the fixing jig 10 is adsorbed by sucking air.

[0098] When the second suction device 54B sucks and holds the substrate material 200, the mounting plate 51 is lifted by the lifting mechanism 58, and when the first suction device 56A sucks and holds the fixing jig 10, the mounting plate 51 5 3 is raised by the lifting mechanism 59. This state is shown in FIG. 13A. Thereafter, the ball screw 48 is rotated by the drive motor 47, so that the first traveling body 40 moves along the guide rail 46 to the stage 110 side (unloader 34 side). At this time, since the second traveling body 42 is connected to the first traveling body 40 by the connecting means 60, the second traveling body 42 moves together with the first traveling body 40 toward the unloader 34 side.

[0099] When the first suction unit 50 moves above the stage 110 and stops (when the rotation of the ball screw 48 stops), the mounting plate 51 is lowered by the lifting mechanism 58, and the substrate material 200 is placed on the stage 110. Place. Then, suction of air is stopped and suction on the substrate material 200 is released in the suction cup 84 of the second suction device 54B. This state is shown in Fig. 13B.

[0100] Thus, when the substrate material 200 is placed on the stage 110, the mounting plate 51 of the first suction unit 50 is raised to the predetermined height by the lifting mechanism 58, and then the first traveling body 40 is moved to the guard. Move to 32 side (return to initial position). At this time, the second suction unit 52 moves to the upper side of the stage 110 along the guide rail 46 while sucking the fixing jig 10.

[0101] When the second suction unit 52 moves above the stage 110 and stops (when the rotation of the ball screw 48 stops), the mounting plate 53 is lowered by the lifting mechanism 59 and placed on the stage 110. The fixing jig 10 is placed from above the substrate material 200 that is present. Then, at the suction cup 86 of the first suction device 56A, the suction of air is stopped and the suction to the fixing jig 10 is stopped. Is released. This state is shown in FIG. 14A.

 [0102] At this time, air is sucked from the hole 110A and the groove (small hole) 110B formed on the stage 110, so that the substrate material 200 and the fixing jig 10 are sucked and held on the stage 110. Is done. As a result, the peripheral edge portion of the substrate material 200 is sealed by the pressing portion 14 of the fixing jig 10 (see FIGS. 6 and 7). The mounting plate 51 with the fixing jig 10 released is raised to a predetermined height by the lifting mechanism 58.

 [0103] When the peripheral portion of the substrate material 200 placed on the stage 110 is sealed with the fixing jig 10, the stage 110 moves in the transport direction, and the alignment processing by the CCD camera 118 and the exposure head 120 are performed. An exposure process is executed. That is, as described above, the alignment mark of the substrate material 200 is detected by the CCD camera 118, the image based on the image information is exposed by the exposure head 120, and a latent image (image) such as a wiring pattern of the printed wiring board is formed on the substrate. Formed in the drawing area of material 200.

 When the exposure processing for the substrate material 200 is completed, the stage 110 returns to the initial position (loading / unloading position) where the substrate material 200 is placed. At this time, the next substrate material 200 is already placed on the endless belt 38 of the holder 32. This state is shown in Figure 14B. When the stage 110 returns to the initial position (loading / unloading position), the fixing jig 10 and the substrate material 200 on the stage 110 are moved by the first suction device 56A and the second suction device 56B of the second suction unit 52, respectively. Adsorbed.

 That is, the mounting plate 53 of the second suction unit 52 is lowered by the elevating mechanism 59, and the suction cup 86 of the first suction device 56A on the edge end side provided on the mounting plate 53 sucks the air even at the tip opening force. As a result, the fixing jig 10 on the stage 110 is sucked, and the suction cup 86 of the second suction device 56B on the center side is then sucked with air at the tip opening force, so that the exposed substrate on the stage 110 is exposed. Adsorb material 200.

At this time, the suction cup 86 of the first suction device 56A is moved in the height direction by the second coil spring 98, so that the substrate material 200 exposed from the opening 12 is reliably secured by the second suction device 56B. Can be adsorbed on. Thus, after the fixing jig 10 is adsorbed by the first adsorbing device 56A and the substrate material 200 is adsorbed by the second adsorbing device 56B, the mounting plate 53 is raised to a predetermined height by the lifting mechanism 59. [0107] As the elevating mechanism 59 is raised, air is blown upward from the hole 110A and the groove (small hole) 110B of the stage 110, and the fixing jig 10 is removed from the stage 110. It is good also as a structure which does. At the same time, the mounting plate 51 of the first suction unit 50 is lowered by the elevating mechanism 58, and the suction force of the second suction device 54B on the central side provided on the suction plate 84 force The tip opening force also sucks air As a result, the new unexposed substrate material 200 on the loader 32 is adsorbed and raised to a predetermined height. This state is shown in FIG. 15A.

 When the second suction unit 52 sucks and holds the exposed substrate material 200 and the fixture 10, and the first suction unit 50 sucks and holds the new unexposed substrate material 200, the first traveling body 40 When the ball screw 48 is rotated by the force drive motor 47, it moves to the stage 110 side (unloader 34 side). At this time, since the second traveling body 42 is connected to the first traveling body 40 by the connecting means 60, the second traveling body 42 moves together with the first traveling body 40 toward the unloader 34 side.

 [0109] When the first traveling body 40 moves above the stage 110 and stops (when the rotation of the ball screw 48 stops), the mounting plate 51 of the first suction unit 50 is moved by the lifting mechanism 58 as described above. Then, the substrate material 200 is placed on the stage 110. Then, in the suction cup 84 of the second suction device 54B, the suction of air is stopped, the suction to the substrate material 200 is released, and the predetermined height rises again.

 On the other hand, when the second traveling body 42, that is, the second suction unit 52 moves above the unloader 34, the mounting plate 53 is lowered by the lifting mechanism 59, and the substrate material 200 is placed on the endless belt 39. Put. That is, the suction of air is stopped only in the suction cup 86 of the second suction device 56B on the center side, and the suction to the substrate material 200 is released.

 Then, the mounting plate 53 of the second suction unit 52 that has released the substrate material 200 is raised to a predetermined height while holding the holding jig 10. This state is shown in FIG. 15B. The substrate material 200 placed on the endless belt 39 of the unloader 34 is transported to a transport conveyor outside the machine and transported to the next process, not shown.

On the other hand, the second suction unit 52 in a state in which the fixture 10 is suctioned / held moves again above the stage 110 when the ball screw 48 is rotated by the drive motor 47. . This state is shown in FIG. 16A. Thereafter, the mounting plate 53 is lowered by the lifting mechanism 59, and the fixing jig 10 is placed from above the substrate material 200 placed on the stage 110. Then, the suction of air to the suction cup 86 of the first suction device 56A is stopped, and the suction to the fixing jig 10 is released. This state is shown in FIG. 16B.

 [0113] At this time, air is sucked from the hole 110A and the groove (small hole) 110B formed on the stage 110, so that the substrate material 200 and the fixing jig 10 are adsorbed on the stage 110. Retained. As a result, the peripheral edge portion of the substrate material 200 is sealed by the pressing portion 14 of the fixing jig 10 (see FIGS. 6 and 7). Thus, when the fixing jig 10 is set on the stage 110, the alignment process and the exposure process are performed in the same manner as described above by moving the stage 110 in the transport direction, and thereafter the same operations as above are repeated. Thus, the substrate material 200 is sequentially processed.

 Next, the case where the first jig unit 50 sucks and conveys the fixing jig 10 will be described with reference to FIGS. 17A to 20B. First, when the ball screw 48 is rotated by the drive motor 47, the first traveling body 40 moves to the stage 110 side (unloader 34 side), and the first suction unit 50 moves above the stage 110.

 [0115] Then, the mounting plate 51 of the first suction unit 50 is lowered by the elevating mechanism 58, and the suction cup 84 of the first suction device 54A on the edge side provided on the mounting plate 51 is opened from the front end opening. When the key is sucked, the fixing jig 10 is sucked and raised to a predetermined height again. This state is shown in Fig. 17A.

 [0116] After that, the first traveling body 40 moves to the loader 32 side, and the fixing jig 10 is arranged above the loader 32. At this time, the first base 40 is already on the endless belt 38 of the loader 32. The plate material 200 is carried in and positioned by positioning means (not shown). Therefore, the mounting plate 51 of the first suction unit 50 is lowered by the elevating mechanism 58, and the suction cup 84 of the second suction device 54B on the center side provided on the mounting plate 51 has a tip opening force that causes air. The substrate material 200 is adsorbed by being sucked. This state is shown in FIG. 17B.

[0117] At this time, since the suction cup 84 of the first suction device 54A is moved in the height direction by the second coil spring 98, the substrate material 200 exposed from the opening 12 is transferred to the second suction device 54B. Can be reliably adsorbed. In this way, the first adsorption unit 50 When the tool 10 and the substrate material 200 are sucked and held, the mounting plate 51 is raised to a predetermined height by the lifting mechanism 58.

 [0118] Then, the ball screw 48 is rotated by the drive motor 47, whereby the first traveling body 40 moves along the guide rail 46 to the stage 110 side (unloader 34 side). At this time, since the second traveling body 42 is connected to the first traveling body 40 by the connecting means 60, the second traveling body 42 also moves together with the first traveling body 40 toward the unloader 34 side. This situation is shown in Figure 18A.

 [0119] When the first suction unit 50 moves above the stage 110 and stops (when the rotation of the ball screw 48 stops), the mounting plate 51 is lowered by the lifting mechanism 58, and the substrate material 200 is placed on the stage 110. At the same time, the fixing jig 10 is placed. This state is shown in Fig. 18B. Then, suction of air is stopped in the suction cups 84 of the second suction device 54B and the first suction device 54A, and suction to the substrate material 200 and the fixing jig 10 is released.

 [0120] At this time, the substrate material 200 and the fixture 10 are adsorbed and held on the stage 110 by sucking air from the hole 110A and the groove (small hole) 110B formed on the stage 110. Is done. As a result, the peripheral edge portion of the substrate material 200 is sealed by the pressing portion 14 of the fixing jig 10 (see FIGS. 6 and 7). The mounting plate 51 with the substrate material 200 and the fixing jig 10 released is raised by a lifting mechanism 58 to a predetermined height.

 [0121] When the peripheral portion of the substrate material 200 placed on the stage 110 is sealed by the fixing jig 10, the stage 110 moves in the transport direction, and alignment processing by the CCD camera 118 and exposure processing by the exposure head 120 are performed. Is executed. That is, as described above, the alignment mark of the substrate material 200 is detected by the CCD camera 118, the image based on the image information is exposed by the exposure head 120, and a latent image (image) such as a wiring pattern of the printed wiring board is formed on the substrate. Formed in the drawing area of material 200.

When the exposure process for the substrate material 200 is completed, the stage 110 moves back to the initial position (loading / unloading position) where the substrate material 200 is placed. Then, the mounting plate 51 of the first suction unit 50 is lowered by the elevating mechanism 58, and only the fixing jig 10 on the stage 110 is sucked by the first suction device 54A on the edge end side, and is again set to a predetermined height. Rise up to [0123] As the elevating mechanism 58 is raised, air is blown upward from the hole 110A and the groove (small hole) 110B of the stage 110 to remove the fixing jig 10 from the stage 110. It is good also as a structure which does. At this time, the next new unexposed substrate material 200 is already placed on the endless belt 38 of the loader 32. This state is shown in Fig. 19A.

 Thus, when the first suction unit 50 sucks and holds only the fixing jig 10, the ball screw 48 is rotated by the drive motor 47, so that the first traveling body 40 moves to the loader 32 side. Then, the mounting plate 51 of the first suction unit 50 is lowered by the elevating mechanism 58, and the suction cup 84 of the second suction device 54B on the center side provided on the first suction unit 50 is sucked by the tip opening force. Thus, the new unexposed substrate material 200 on the loader 32 is adsorbed.

 [0125] At this time, the suction cup 84 of the first suction device 54A is moved in the height direction by the second coil spring 98, so that the substrate material 200 exposed from the opening 12 is removed from the second suction device 54. B can be reliably adsorbed.

 [0126] At the same time, the mounting plate 53 of the second suction unit 52 is lowered by the lifting mechanism 59, and the suction cup 86 of the second suction device 56B provided on the center side is provided through the front end opening. As a result, the exposed substrate material 200 on the stage 110 is adsorbed. This state is shown in FIG. 19B. Thereafter, the mounting plate 51 of the first suction unit 50 and the mounting plate 53 of the second suction unit 52 are raised to a predetermined height by the lifting mechanisms 58 and 59, respectively.

 [0127] The second suction unit 52 sucks and holds the exposed substrate material 200, and the first suction unit 50 that already holds the holding fixture 10 sucks and holds the new unexposed substrate material 200. When held, the first traveling body 40 moves to the stage 110 side (unloader 34 side) as the ball screw 48 is rotated by the drive motor 47. At this time, since the second traveling body 42 is connected to the first traveling body 40 by the connecting means 60, the second traveling body 42 moves together with the first traveling body 40 toward the unloader 34 side. This state is shown in FIG. 20A.

[0128] When the first traveling body 40 moves above the stage 110 and stops (when the rotation of the ball screw 48 stops), the mounting plate 51 of the first suction unit 50 is lowered by the lifting mechanism 58, and the substrate The material 200 is placed on the stage 110, and the fixing jig 10 is placed on the stage 110. Then, suction of air is stopped in the suction cups 84 of the second suction device 54B and the first suction device 54A, and suction to the substrate material 200 is released.

 On the other hand, when the second suction unit 52 moves above the unloader 34, the mounting plate 53 is lowered by the lifting mechanism 59, and the substrate material 200 is placed on the endless belt 39. Then, suction of air is stopped in the suction cup 86 of the second suction device 56B on the center side to release the suction to the substrate material 200, and then the mounting plate 53 is raised to a predetermined height. This state is shown in Fig. 20B. The substrate material 200 placed on the endless belt 39 of the unloader 34 is transported to a transport conveyor (not shown) and transported to the next process.

 On the other hand, the stage 110 on which the substrate material 200 and the fixing jig 10 are set moves in the transport direction, and alignment processing and exposure processing are performed in the same manner as described above. Thereafter, the substrate material 200 is sequentially processed by repeating such an operation.

 [0131] Whether the first jig unit 50 sucks and conveys the fixing jig 10 or the second adsorption unit 52 sucks and conveys the fixing jig 10, all the substrate materials 200 After the processing is completed, in the same manner as described above, the connection between the first traveling body 40 and the second traveling body 42 is released, and the stage 110 upper force can be removed manually to remove the fixing jig 10.

 [0132] [Modification of fixture]

 Next, a modified example of the fixing jig 10 will be described. As shown in FIG. 21, at each edge of the fixing jig 10, a notch 22 (detection) is provided so that the hole 110A drilled on the outermost side on the stage 110 is exposed for approximately one row. Part) is formed. With this configuration, if the position of the fixture 10 deviates more than the allowable range, the air suction force (negative pressure) from the outermost hole 110A and groove (small hole) 110B Changes, and an adsorption failure occurs with respect to the substrate material 200, so that the displacement of the fixing jig 10 can be easily recognized (detected).

[0133] Further, in the fixing jig 10, the first suction devices 54A and 56A on the edge (corner) side of each suction unit 50 and 52 are slightly larger in diameter than the suction cups 84 and 86 at the site where they are sucked. A circular groove portion 24 (detection portion) may be formed. If such a groove 24 is formed, if the suction positions of the suction cups 84 and 86 with respect to the fixing jig 10 are shifted, the suction of the suction cups 84 and 86 is caused by the groove 24. Adhesion force (air suction force) becomes insufficient and poor adsorption to the substrate material 200 occurs, which makes it possible to easily recognize (detect) the displacement of the suction cups 84 and 86 with respect to the fixture 10. . Therefore, it is possible to prevent troubles caused by transporting the fixing jig 10 while being displaced.

 In addition, the controller 130 is provided with a mode switching switch 132 as switching means that can be switched between when the fixing jig 10 is used and when it is not used. Therefore, the laser exposure apparatus 100 can flexibly cope with the substrate materials 200 having different thicknesses. That is, in the case of the substrate material 200 that does not use the fixing jig 10, the laser exposure apparatus 100 can perform the exposure process without changing the processing tact (with the shortest tact time).

 Furthermore, in this laser exposure apparatus 100, the first suction unit 50 that automatically sucks the unexposed substrate material 200 and conveys it onto the stage 110 from the loader 32, and the exposed substrate material 200 are combined. Since the second suction unit 52 that automatically picks up and transports the upper force of the stage 110 to the unloader 34 can be moved integrally, both operations can be performed simultaneously. Therefore, the tact time for loading / unloading the substrate material 200 and the fixing jig 10 with respect to the stage 110 can be minimized.

 [0136] Also, if necessary, the connection between the first traveling body 40 that supports the first suction unit 50 and the second traveling body 42 that supports the second suction unit 52 is released, and both are separated. Therefore, the first suction unit 50 and the second suction unit 52 can be moved to the position without getting in the way when the fixing jig 10 is manually loaded onto and unloaded from the stage 110. Therefore, the loading and unloading work of the fixing jig 10 can be easily performed. The configuration of the connecting means 60 is not limited to that shown in the drawing, and any configuration can be adopted.

 [0137] The first traveling body 40 supports the first suction nut 50 for placing the substrate material 200 on the stage 110, and the second traveling body 42 also supports the substrate material 200 on the stage 110. Since the second suction unit 52 to be removed is supported, the driving means composed of the ball screw 48, the drive motor 47, etc. acts only on the first traveling body 40.

[0138] That is, the work that places the substrate material 200 on the stage 110 from the loader 32 requires a position accuracy. The substrate material 200 is placed on the unloader 34 from the stage 110. In some cases, the position accuracy may not be so high. In other words, the second traveling body 42 can move from the stage 110 to the unloader 34 even if there is a slight rattling between the connecting member 64 (the rotating portion 66) and the connected member 62. /!

 [0139] Therefore, only the first traveling body 40 is provided with the guide member 41 into which the ball screw 48 is screwed, so that the first suction unit 50 can be moved with high accuracy. That is, the substrate material 200 can be placed so that the center of the surface thereof coincides with the center of the surface of the stage 110 within a certain error range. In addition, such a configuration has an advantage that the disposition distance of the ball screw 48 can be shortened.

 [0140] As described above, in any case, according to the present invention, the substrate material is thin (for example, less than lmm) so that the peripheral edge is lifted when adsorbed on the stage 110 by the suction force of air. Even in the case of 200, the peripheral edge of the fixing jig 10 can be reliably pressed (fixed). Therefore, the alignment process by the CCD camera 118 can be suitably executed, and the exposure process by the exposure head 120 can also be suitably executed. That is, an image can be accurately formed on such a substrate material 200.

 [0141] Further, according to the present invention, the fixing jig 10 can be efficiently placed (supplied) on the stage 110 by the first suction unit 50 or the second suction unit 52. The force on stage 110 can also be removed. The substrate transfer device 30 and the laser one exposure device 100 according to the present invention can be appropriately modified within the scope without departing from the gist of the present invention, which is not limited to the above embodiments. Is.

 Industrial applicability

[0142] The present invention can be applied to an image forming apparatus such as a laser exposure apparatus that performs image formation by fixing a work on a stage with a fixing jig. According to the present invention, a work and a fixing jig for an image forming apparatus can be used. It is possible to efficiently carry and supply.

 Explanation of symbols

[0143] 10 Fixing jig

 12 opening

 14 Holding part

16 Rigid member Elastic member

 Easy peeling member

 Notch (detection means)

 Groove (detection means)

 Positioning member

 Notch

 Substrate transfer device (work transfer device) Loader (loading part)

 Unloader (unloading part)

 1st traveling body

 Second traveling body

 First adsorption unit

 Second adsorption unit

 Adsorption device

A First adsorber

B Second adsorber

 Adsorption device

A First adsorber

B Second adsorber

 Sucker

 Sucker

 1st coil spring

 Second coil spring (buffer mechanism) Laser exposure device (image forming device) Stage

 Ball screw (movement mechanism)

 Motor (movement mechanism)

CCD camera (measurement unit) 120 Exposure head (exposure section)

 130 controller

 132 Mode switching switch (switching means)

200 Substrate material (work)

Claims

The scope of the claims

 [1] A first suction unit that includes a plurality of suction devices for sucking the workpiece placed on the carry-in section and transports the workpiece to the stage;

 A second suction unit comprising a plurality of suction devices for sucking the workpiece on the stage, and transporting the workpiece to the unloading section;

 A fixing jig which is set on the stage, seals the peripheral edge of the workpiece, and has an opening for exposing a region excluding the peripheral edge of the workpiece;

 With

 The first suction unit and the second suction unit include a first suction device disposed on the edge side to suck the fixing jig, and the cake exposed from the opening. A second adsorbing device disposed on the center side for adsorbing,

 Work transfer device.

 [2] The workpiece transfer device according to [1], wherein the fixing jig is formed with a detection unit for detecting that the suction position is shifted during suction by the first suction device.

[3] The detection part includes a notch part formed in a fixing jig, and the notch part exposes a suction hole formed on the outermost side on the stage when placed on the fixing jig force stage. The work transfer device according to claim 2, wherein

[4] The workpiece transfer device according to claim 2, wherein the detection unit includes a circular groove formed in a fixing jig, and the groove is formed in a portion corresponding to the suction portion of the first suction device.

5. The workpiece transfer apparatus according to claim 1, wherein the fixing jig has a laminated structure including a rigid member layer, an elastic member layer, and a peeling member layer.

6. The workpiece transfer device according to claim 1, wherein at least the first suction device includes a buffer mechanism.

[7] Provided with a plurality of suction devices for sucking the workpiece placed on the carry-in section, and having a first suction unit for transporting the workpiece to the stage and a plurality of suction devices for sucking the workpiece on the stage. A second suction unit to be transported to the unloading unit; a fixing jig that is set on the stage, seals the peripheral edge of the work, and exposes an area excluding the peripheral edge of the work; The first suction unit and the second suction unit. The knit is arranged on the side of the central portion for adsorbing the workpiece exposed to the opening force and the first adsorbing device arranged on the edge side to adsorb the fixing jig. A work transfer device including a second suction device;

 A moving mechanism for moving the stage along a predetermined transport path;

 A measuring unit for detecting the alignment mark of the workpiece on the stage moved by the moving mechanism;

 An area on the stage excluding the peripheral edge is exposed with a light beam modulated based on the image information aligned by the detection result of the measuring section, and an image is formed in the area. And preparing

 Image forming apparatus.

 [8] The image forming apparatus according to [7], further including a mode for sucking the fixing jig and a switching unit for switching to the mode that does not suck the fixing jig.

[9] A step of sucking a workpiece placed on the carry-in section by a first suction unit including a plurality of suction devices and transporting it to the stage;

 A step of sucking a workpiece on the stage by a second suction unit having a plurality of suction devices and transporting the workpiece to the unloading unit;

 Setting a fixing jig formed with an opening that exposes a region excluding the peripheral edge of the work on the stage, and sealing the peripheral edge of the work,

 The fixing jig is adsorbed by a first adsorbing device arranged on the edge side of the first adsorbing unit or the second adsorbing unit, and is arranged on the central side of the first adsorbing unit or the second adsorbing unit. A workpiece transfer method, wherein the workpiece and the fixing jig are placed on or removed from the stage by sucking the workpiece exposed to the opening force with a second suction device arranged.

[10] The fixing device on the stage is adsorbed by the first adsorbing device of the second adsorbing unit, and the work on the loading portion is adsorbed by the second adsorbing device of the first adsorbing unit. (1) The suction unit and the second suction unit move to the carry-out side, and the second suction device of the first suction unit releases the suction, so that the workpiece is placed on the stage. Then, the first suction unit and the second suction unit move to the carry-in portion side, and the first suction device of the second suction unit releases the suction, so that the fixing jig is placed on the stage. The work conveying method according to claim 9, wherein a peripheral portion of the work is hermetically sealed by the fixing jig.

 [11] After the fixing device on the stage is adsorbed by the first adsorbing device of the first adsorbing unit, the first adsorbing unit and the second adsorbing unit move to the carry-in portion side, and the second adsorbing unit 2nd By sucking the workpiece on the carry-in part with the suction device, the first suction unit and the second suction unit move to the carry-out part side, and the second suction device of the first suction unit releases the suction. The work is placed on the stage, and the first suction device of the first suction unit releases the suction, whereby the fixing jig is placed on the stage, and the fixing jig is used to place the work on the work. The cake conveying method according to claim 9, wherein the peripheral portion is hermetically sealed.

 [12] The fixing jig is positioned and placed on the stage by a workpiece positioning member, and then sucked by the first suction device of the first suction unit or the second suction unit. The workpiece transfer method described in 1.