JPH06171814A - Thin plate laminating device - Google Patents

Abstract

PURPOSE:To rapidly laminate a plate, a copper foil, an insulation plate and a copper foil in this order. CONSTITUTION:A first shuttle conveyor is provided right under a first mounting portion 15, a second mounting portion 16 and a third mounting portion 17, and a second shuttle conveyor is provided right under a fourth mounting portion 51, a fifth mounting portion 52 and a sixth mounting portion 53 with a stocking portion 10 interposed. At the upper direction of the stocking portion 10, a third shuttle conveyor is provided, and these and driven up and down and right and left with predetermined timing according to an oblong locus, and each accumulation matter Q of a plate (p) and a copper foil Cu and each accumulation matter R of an insulation plate (s) and a copper foil Cu mounted on each mounting portion are efficiently laminated on the stocking portion 10 in sychronization with the up and down and right and left movements of the third shuttle conveyor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optimum thin plate laminating apparatus used for manufacturing printed circuit boards.

[0002]

2. Description of the Related Art In recent years, with the development of electronic equipment, production equipment for printed circuit boards is required to have higher speed, higher reliability and higher quality. Conventionally, in the manufacture of a printed circuit board, stainless steel is used as a pre-process and has a thickness of 1.5 to 2.0 mm and a width of 900 to 145.
Laminating process of plates with 0 mm and length of 1050 to 1280 mm, thickness of 12 to 70 μm and width of 92
0 to 1470 mm and length of 1080 to 130
Lamination process of 0mm copper foil and thickness 0.1 to 2.0
mm, width 900 to 1450 mm and length 105
The stacking process of a copper foil having the same thickness and the same dimensions as the above copper foil on an insulating material of 0 to 1280 mm is repeated in this order.
Although the process is performed over the entire process, further speeding up is desired by shortening the stacking process.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a thin plate laminating apparatus capable of further reducing the number of laminating steps and achieving high speed.

[0004]

[Means for Solving the Problems] The above object is to provide a first conveying means for conveying a first thin plate material to a first placing portion, and the first conveying means.
Second conveying means for conveying the second thin plate material to the second placing portion provided at a first predetermined distance on the placing portion, and a straight line connecting the first placing portion and the second placing portion On the extension line of the third mounting portion provided at a distance equal to the first predetermined distance from the second mounting portion, the first mounting portion, the second mounting portion, and the third mounting portion. Third conveying means for conveying the third thin plate material to a fourth placing portion, which is on an extension of a straight line connecting the placing portion and is provided at a third predetermined distance from the third placing portion; Fourth transporting means for transporting the fourth thin plate member to a fifth loading portion which is on a straight line and is provided at a second predetermined distance from the fourth loading portion toward the third loading portion. And a sixth mounting portion provided on the straight line from the fifth mounting portion toward the third mounting portion at a distance equal to the second predetermined distance from the fifth mounting portion. A rectangular locus having a thin plate stacking portion provided between the third mounting portion and the sixth mounting portion and a pair of first thin plate supporting portions at a distance equal to the first predetermined distance. A first shuttle conveyor which is vertically and horizontally driven at a predetermined timing along a line, and a pair of second thin plate supporting portions at a distance equal to the second predetermined distance. A distance equal to the distance between the second shuttle conveyor, which is driven up and down, and left and right at the timing, and the thin plate stacking portion and the third placing portion, and also equal to the distance between the sixth placing portion. And a third shuttle conveyor that has a pair of thin plate holders and is vertically and horizontally driven at a predetermined timing along a rectangular locus. The first placing part, the second placing part, and A pair of the first thin plate supporting portions is provided on the third mounting portion, and A notch is formed to allow the vertical movement of the conveyor and the movement along the upper side of the rectangle, and the pair of the fourth mounting portion, the fifth mounting portion, and the sixth mounting portion also have the pair of the first and second mounting portions. 2 thin plate support
A thin plate laminating apparatus is characterized in that a notch is formed which allows the vertical movement of the second shuttle conveyor and the movement along the upper side of the rectangle.

[0005]

The first shuttle conveyor moves the notch of the first placing portion upward so as to support the first thin plate member already placed on the first placing portion by the first transporting means, and then to the predetermined position. By moving in the direction, it reaches the second mounting portion, where it moves downward to mount the first thin plate member on the second mounting portion. The first shuttle conveyor then moves in a direction opposite to the predetermined direction. During this time, the operation of placing the next first thin plate material on the first thin plate material by the second transport means on the first placing portion by the first conveying means and the second placing means on the second placing portion Is done. The first shuttle conveyor moves upward again to support the first thin plate material placed on the first placing portion side and the stacked first and second thin sheet members on the second placing portion side. Two
The thin plate material is supported and conveyed in a predetermined direction. The first shuttle conveyor moves downward again from the first and second placement section positions to the second and third placement section positions, and then moves in the direction opposite to the predetermined direction. In the meantime, the above-described operation is repeated in the first and second placing parts, and in the third placing part, the laminated first and second thin plate members are held by the thin plate holding part of the third shuttle conveyor to be The sheet is conveyed to the thin plate stacking section in the middle of the placing section and the sixth placing section. On the other hand, while the above-mentioned operation is being performed in the first shuttle conveyor, the second shuttle conveyor is moved to the upper side of the notch of the fourth placing portion, so that it is already placed on the fourth placing portion by the third conveying means. The placed third thin plate member is supported, and then, the third thin plate member is placed on the fifth placing part by moving in the direction opposite to the predetermined direction to reach the fifth placing portion and moving downward. Place it on the section. The second shuttle conveyor then moves in the predetermined direction. During this period, the operation of placing the next third thin plate material on the third thin plate material by the fourth transport means on the fourth mounting portion by the third transport means and on the fifth mounting portion Is done. The second shuttle conveyor moves upward again to support the third thin plate member placed on the fourth placing portion side and to stack the third and third stacked thin sheet members on the fifth placing portion side. 4 The thin plate material is supported and conveyed in a direction opposite to the predetermined direction. The second shuttle conveyor moves downward again from the fourth and fifth placement section positions to the fifth and sixth placement section positions, and then moves in the predetermined direction. During this time, the above-described operation is repeated in the fourth and fifth loading sections, and in the sixth loading section, the stacked third and fourth thin plate members are held by the other thin plate holding section of the third shuttle conveyor. And moves in the direction opposite to the predetermined direction and conveys to the thin plate laminating unit. As described above, the movement of the first shuttle conveyor and the second shuttle conveyor at the predetermined timing along the above-described rectangular trajectory is performed in parallel, and the third shuttle conveyor moves the third mounting portion and the sixth mounting portion. By alternately transporting the stacked thin plate materials on the placing section to the thin plate stacking section, the first, second, third, and fourth thin plate materials are sequentially stacked in the thin plate stacking section, and the thin plate stacking section has a conventional structure. It can be stacked at a stacking speed almost doubled.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A printed circuit board laminating apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

1 and 2 show the whole of the printed circuit board laminating apparatus according to the present embodiment, in which a charging portion (also referred to as a laminating portion, hereinafter referred to as a charging portion in the embodiments) 1 is provided at the center.
0 is provided, and the first overlapping portion 11 and the second overlapping portion 12 are provided substantially symmetrically on both sides thereof. A pit 13 is formed in the charging section 10, and a charging device 14 is arranged in the pit 13. The first overlapping portion 11 is mainly composed of a first placing portion 15, a second placing portion 16 and a third placing portion 17, but the distances between the centers thereof are the same. The second stacking unit 12 mainly includes the fourth mounting unit 51 and the fifth mounting unit 52.
And the sixth mounting portion 53, the distances between these centers are also equal.

In the first placing portion 15, the belt 18
A belt conveyor device 18 consisting of a, 18b, 18c and 18d is provided, which is driven by a motor 20 which is shown in FIG. 4 and is driven by a drive roller 19a (corresponding to each belt 18a to 18d, respectively). )
Each of the belts 18a to 18d is wound around the driven roller 19b (each belt 18a
To 18d), the upper running portion of each belt 18a to 18d wound around the
The motor 20 operates intermittently. With the belt conveyor device 18,
Although the plate p made of stainless steel is transferred from the left side in the figure, the plate p is accurately positioned and stopped because the sensor and the stopper are provided in the first mounting portion 15 even though they are not shown. Is configured to.

In the second mounting portion 16, the belt plates 16a, 16 are provided on the extension lines on both sides of the belt conveyor device 18 in the driving direction of the belts 18a through 18d.
b, 16c and 16d (in the drawing, 16a, 16d
Is not drawn, but actually 16a, 16b, 16c
And 16d are arranged in parallel at a predetermined interval), on which the plate p and the copper foil C are attached.
The polymer Q of u can be placed. The first suction belt conveyor device 21 is aligned with the second mounting portion 16
Although a large number of small holes 21a are formed in this, the first suction belt conveyor device 21 has a closed structure, and a blower (not shown) is provided through a flexible pipe 22 to the first suction belt conveyor device 21. Thus, the air is sucked from the small hole 21a. Further, a solenoid valve is connected to this, and by opening and closing the solenoid valve, the adsorption and separation of the copper foil Cu on the first adsorption belt conveyor device 21 is controlled. First suction belt conveyor device 21
Is supported on the pedestal 23 as clearly shown in FIG. 3, but the frame 23a mounted on the pedestal 23 is
Is equipped with a first copper foil conveyor 24, which
The motor 28 attached to the frame 23a on the frame 23
The chain belt 29 wound around is driven to the left and right as indicated by an arrow a. This operation is represented by a chain line in FIG. The first copper foil conveyor 24 includes a pair of air cylinders 30 on the main body 25 as shown in FIG.
a, 30b are attached, and a pair of pipes 27a, 27b having a rectangular cross section are attached thereto, and between the main body 25 and the pipes 27a, 27b, centering around the air cylinders 30a, 30b, respectively. By attaching flexible canvases 26a and 26b on both sides, as shown by an arrow b in FIG. 4, the canvases can be moved up and down by a predetermined stroke. Further, the main body 25 is configured to accurately position and stop the copper foil Cu right and left by the guide members 31a and 31b attached to both side edges thereof. A large number of small holes are formed on the bottom wall surfaces of the pipes 27a and 27b, and a blower is connected to the pipes 27a and 27b (not shown), and a copper valve is opened and closed by opening and closing an electromagnetic valve provided therebetween. The adsorption / desorption of the foil Cu is controlled.

In the third mounting portion 17, as clearly shown in FIG. 3, the strip plates 41a, 41b, 41c and 41d are the strip plates 16a, 16b, 16c and 16d of the second mounting portion 16.
Corresponding to each of the above, they are arranged on their extension lines, and the plate p with the copper foil Cu superposed thereon is placed thereon as shown by the alternate long and short dash line and as will be described later.

In the other second superimposing section 12 which is symmetrically provided around the charging section 10, the fourth placing section 5 is provided.
Like the first, second and third mounting portions 15, 16 and 17, the first, fifth mounting portion 52 and sixth mounting portion 53 are arranged so as to be on an extension line of a straight line connecting them. The fourth, fifth, and sixth placement sections 51, 52, and 53 have the same distance between the centers, and the sixth placement section 53 and the charging section 1 are provided.
The distance between 0 and 0 is equal to the distance between the third placing section 17 and the charging section 10.

As clearly shown in FIG. 2, a flat plate 54 is arranged in common on the fourth, fifth and sixth mounting portions 51, 52 and 53, and a large number of them are arranged in parallel on the straight line. A central cutout 55b having a fin-shaped cutout 55a is formed. It should be noted that the fin-shaped notch portion 55a includes the fourth, fifth and sixth portions.
The mounting portions are divided into three groups and formed respectively. Although not shown in the drawing, the fourth mounting portion supplies an insulating plate s, which is one of the constituent materials of the printed circuit board, from the right side in this figure by a belt conveyor, and accurately positions it on this by a sensor and a stopper (not shown). Configured to stop. In the fifth mounting portion 52,
Aligned with this, a second adsorption belt conveyor device 61 is provided, which has the same configuration as the first adsorption belt conveyor device 21 provided in the first superposition section 11, and has a small hole 6
1a is provided with a pipe 62 corresponding to the flexible pipe 22, to which a blower and a solenoid valve (not shown) are connected. Further, a second copper foil conveyor 63 is arranged immediately above the second adsorption belt conveyor device 61 so as to correspond to the first copper foil conveyor 24 in the first stacking section 11, and the first copper foil conveyor 63 is provided. The same drive as 24 is performed.

The first shuttle conveyor 70 will now be described with particular reference to FIGS. The first shuttle conveyor 70 has a pair of supports 71a, 71b, which have five support members 7 as shown in FIG.
2a, 72b, 72c, 72d and 72e are vertically planted in the base 73, and their heights are at the same level.
The mounting surfaces 72as, 72bs, 72c are respectively provided on the upper end portions.
s, 72ds, and 72es are formed horizontally.
Further, the base 73 is driven by the motor 75 to the left and right at a predetermined timing as shown by an arrow c in FIG.
Equal to the distance between the centers of b. Further, the base portion 73 is configured to be vertically driven by a thin plate type cylinder 80 with a predetermined stroke. Further, the base 82 to which the cylinder 80 is attached is accurately positioned by the drive of the above-mentioned motor 75 by the guide members 83a and 83b provided at the left and right ends thereof, and is driven left and right with a predetermined stroke, or It is configured to stop.

The second shuttle conveyor 85 is disposed immediately below the second superimposing section 12, and its details are shown in FIG. The pair of thin plate supporting portions 88a and 88b are provided at a distance equal to the distance between the mounting portions or between the fifth and sixth mounting portions, and in the vertical direction with respect to the base 90 in FIG. On strip 9
The mounting surfaces 91as and 91bs are formed by 1a and 91b, and are configured so as to vertically pass through the notches 55 formed in the flat plate 54 in FIG.
Further, the mounting members 89a and 89b supporting the thin plate supporting portions 88a and 88b are configured so that the central cutout portion 55b of the cutout 55 in FIG. 2 can be moved left and right in FIG. The second shuttle conveyor 85 is driven to the left and right in FIG. 5 by the rotation of the pulley 87 that is driven by the motor 86, but is driven vertically by the pair of cylinders 90a and 90b attached to the base 90. Is configured to.

Next, with reference to FIG. 6 in particular, the third shuttle conveyor 100 disposed above the intermediate portion between the first overlapping portion 11 and the second overlapping portion 12 will be described. A pair of holding portions 101A and 10A on the left and right ends
1B is attached, and these have almost the same configuration as each other, but the driving timings thereof are different as follows. That is, the pair of holding portions 101A
And 101B have thin plate holding portions 105a and 105a at their lower ends.
05b, one thin plate holding portion 105a,
A pair of grips 106a and 106b is formed, and a pair of grips 107a and 107b is also formed on the other thin plate holding portion 105b. Further, in FIG. 6, the cylinders 108a, 10
8b, the drive rods 109a, 109b of this are
As shown by the alternate long and short dash line, it is configured to perform up-and-down drive so that it can take an upper position and a lower position, and a thin plate holding operation and a thin plate opening operation are performed at each position.
Further, the distance between the holding portions 101A and 101B is the distance between the third placing portion 17 and the charging portion 10 and the sixth placing portion 53.
6 is equal to the distance between the charging section 10 and the charging section 10, and this is driven by the motor 103 to drive the pulley 104, and the chain belt 105 wound around the pulley 104 is driven to reciprocate left and right in FIG. But this stroke is
It is equivalent to the above distance. The third shuttle conveyor 100 is guided and supported on the frame 102 via rails 99.

The details of the charging section 10 will be described with reference to FIG. The above-mentioned third shuttle conveyor 100 is arranged immediately above the pit 13, and the carrier support base 1 is provided in the pit 13 opposite to this.
30 is provided, which is a pair of cylinders 131.
It is configured to be able to move up and down by a and 131b. In the figure, the lowermost position is shown by a lower dashed line and the initial state is shown by an upper dashed line. Carrier support 130
Plate p, copper foil Cu, insulating plate s, copper foil C periodically on top
u is set as one set and stacked one after another. This preparation section 10
Then, the plate p and the copper foil Cu are overlapped in the first overlap portion 11, and the insulating plate s and the copper foil C are overlapped in the second overlap portion 12.
The operation of alternately stacking u's is performed smoothly without any problem.

The printed circuit board laminating apparatus according to the embodiment of the present invention is constructed as described above. Next, its operation will be described.

The copper foil Cu is very thin as described above, but this is on the upstream side (not shown) of the first suction belt conveyor device 21 and the second suction belt conveyor device 61 in FIG. After cutting into a predetermined size by the provided copper foil cutter, these copper foil Cu
Are the first suction belt conveyor device 21 and the second suction belt conveyor device 21, respectively.
It is supplied to the suction belt conveyor device 61.
Now, since these actions are the same, the action on the copper foil Cu supplied to the first suction belt conveyor device 21 which is one of the conveyors will be described in order to make the explanation easy to understand.

The copper foil Cu cut into a predetermined size has a plurality of small holes 2 formed in the first adsorption belt conveyor device 21.
In order to stop the suction action of the blower communicating with the small hole 21a, when the blower communicating with the small hole 21a receives the suction action, is adsorbed by the blower, is transferred to the right in FIG. 3, and stops at a predetermined position. By closing the solenoid valve and opening the solenoid valve connected to the pipe 22 connected to the first copper foil conveyor 24 arranged above the solenoid valve, the bottom wall surface of the pipes 27a and 27b is formed by the action of the blower. A suction action by a blower is applied to the small holes, and the copper foil Cu positioned at a predetermined position by the first suction belt conveyor device 21 is sucked upward and moved to the right in FIG. 3 by a predetermined distance. After that, the electromagnetic valves connected to the pipes 27a and 27b are closed to eliminate the action of the blower, so that the pipes are placed on the plate p that has already arrived at the second placing portion.

Next, FIGS. 8 to 9, 10 and 11
Referring to, the plate p and the copper foil C in the first overlapping portion 11
The polymerization action of u will be described.

In FIG. 8, the plate p has already been positioned and placed on the first placing portion 15, but from this state, the first shuttle conveyor 70 is located a predetermined stroke above the illustrated position. Move to. As a result, the belt conveyor device 18 is composed of the thin belts as described above, so that the belt conveyor device 18 passes between them and moves upward to move the plate p to the mounting surfaces 72as, 72bs of the first shuttle conveyor 70. , 72cs, 72ds and 72
It is supported by es and is detached from the belt conveyor device 18. Next, the first shuttle conveyor 70 moves a predetermined stroke to the right in FIG. 8 and stops at the position shown in FIG. After that, the first shuttle conveyor 70 moves downward, so that the strip plate 1 formed on the second mounting portion 16 is moved.
The plate p is placed on 6a, 16b, 16c and 16d, and the placing surface 72a of the first shuttle conveyor 70 is placed.
After leaving s, 72bs, 72cs, 72ds, and 72es, the first shuttle conveyor 70 further moves a predetermined stroke to the left in the figure, and stops at the position shown in FIG. During this time, the copper foil Cu is the first copper foil conveyor 2
It is adsorbed by 4 and is brought to the second mounting portion 16. Here, the first copper foil conveyer 24 moves its suction portion downward by a predetermined stroke toward the second mounting portion 16, and then closes the solenoid valves connected to the pipes 27a and 27b, whereby the copper foil Cu Is placed on the plate p already placed on the second placing portion 16.

Next, the first shuttle conveyor 70 moves upward again, and mounts the next plate p, which has already been placed on the first mounting portion 15, on the one support portion 71a and the second mounting portion 71a. Plate p and copper foil C laminated on the portion 16
The polymerized product Q of u is placed on the other support portion 71b, moved to the right by a predetermined stroke, and stopped at the position shown in FIG. After that, the first shuttle conveyor 70 moves downward so that the plate p on one of the supporting portions 71a is placed on the second placing portion 16 and, at the same time, is placed on the other supporting portion 71b. The plate p and the polymerized product Q of the copper foil Cu are placed on the third placing portion 17. During this time, the holding portions 101A, 101 of the upper third shuttle conveyor 100
B moves to the left and takes the position shown in FIG. 8 to FIG. 10, but when the first shuttle conveyor 70 moves a predetermined stroke from the position shown to the right, the third shuttle conveyor 70 It reaches directly below the one holding portion 101A of 100. That is, the position directly above the third placing portion 17 is reached, and
As shown in FIG. 2, the polymer Q, which is the plate p and the copper foil Cu already placed, is placed on the third shuttle conveyor 1 as shown in FIG.
00 holding unit 101A moves upward and then moves to the right by a predetermined stroke.
Reaches immediately above the charging section 10 as shown in FIG.

The first shuttle conveyor 70 repeats the series of operations described with reference to FIGS. 8, 9, 10 and 11.

The third shuttle conveyor 100 moves to the right and takes the position shown in FIG.
The shuttle conveyor 85 will be described. The insulating plate s is
As is well known, glass powder is used as a component, and when it is impacted, powder of glass or glass wool is generated, which not only makes this insulating plate s useless, but also disperses powder that adversely affects the surroundings. . But here, the second
On the thin plate supporting portions 88a, 88b of the shuttle conveyor 85, mounting surfaces 91as, 91 composed of strips 91a, 91b are provided.
By supporting the insulating plate s by bs, it is possible to carry it while reducing the surface pressure, and therefore the drag force received by the mounting surfaces 91as, 91bs of the strips 91a, 91b becomes small, and the second shuttle conveyor 85 is The insulating plate s can be transported without generating the glass powder and glass wool as described above.

The insulating plate s is carried on the fourth mounting portion 51 by the conveyor indicated by the alternate long and short dash line in FIG. 5, positioned and stopped. In this state, the thin plate support portion 8 on the right side of the second shuttle conveyor 85, which is indicated by a dashed line,
8b moves upward, and a notch 55 formed in the flat plate 54
The insulating plate s is mounted on the fifth mounting portion 52 by passing through the central cutout portion 55b, supporting the insulating plate s on the mounting surface 91bs, and moving the insulating plate s on the fifth mounting portion 52 by a predetermined stroke in the order of left and lower. . After that, the copper foil Cu adsorbed on the second copper foil conveyor 63 is laminated thereon. During this time, the second shuttle conveyor 85 moves a predetermined stroke to the right, and the next insulating plate s already mounted on the fourth mounting part 51 and the insulating plate mounted on the fifth mounting part 52. The second shuttle conveyor 8 is moved by moving the polymer R of s and the copper foil Cu upward.
It is supported by the thin plate supporting portions 88a and 88b which 5 has. Next, the second shuttle conveyor 85 moves to the left by a predetermined stroke, and the second shuttle conveyor 85 is mounted on the fourth and fifth mounting portions 51 and 52, and the fifth and sixth mounting portions 52 and 52, respectively. Place on top of 53. The second shuttle conveyor 85 repeats the above operation.

Here, the holding portion 101B on the right side of the third shuttle conveyor 100 reaches immediately above the sixth placing portion 53,
As shown in FIG. 14, the holding portion 101B moves downward, and the polymerized product R placed on the sixth placing portion 53 is held by the grip portions 107a and 107b and moved to the left side, and the charging It reaches directly above the portion 10, and here the holding portion 101B
When is moved by a predetermined stroke downward, the polymer R of the insulating plate s and the copper foil Cu is placed on the polymer already laminated, as shown in FIG.

As described above, the first shuttle conveyor 70 and the second shuttle conveyor 85 independently perform the movement along the rectangular locus at predetermined timings. 3 shuttle conveyor 1
00 is one of the holding portions 101A, which is the first overlapping portion 11A.
The polymerization product Q of the plate p and the copper foil Cu from the
To the insulating plate s and the copper foil C at the second overlapping portion 12 by the other holding portion 101B while being supplied to the first overlapping portion 11 again.
By holding the polymer R with u and stacking them in the charging section 10, the left and right and up and down movements can be performed without breaks, so that the stacking action can be greatly speeded up as compared with the conventional case.

As described above, the plate p, the copper foil Cu,
The insulating plate s and the copper foil Cu are sequentially laminated in the charging section 10. The details will be described below with reference to FIG.

That is, in the charging section 10, a carrier plate 42 made of stainless steel which is slightly larger than the above-mentioned thin plate.
Has already been placed in the charging section 10, and the plate p, the copper foil Cu, the insulating plate s, and the copper foil Cu are sequentially placed on the charging section 10 by the reciprocating motion and the vertical motion of the third shuttle conveyor 100.
As shown in FIG. 6, the layers are sequentially stacked, and the stacking height is a predetermined height, that is, as described above,
The reciprocating movement of the third shuttle conveyor 100 is counted by a limit switch arranged at a predetermined position, and when the counted number reaches a predetermined number, the cylinders 131a, 131b arranged in the charging section 10 are driven to make a predetermined movement. Height decreases. By repeating this, the carrier plate 4 will definitely
16 can be piled up orderly as shown in FIG. 16, but if a predetermined number of sheets are piled up (the above-mentioned position indicated by the alternate long and short dash line), the above-mentioned first, second and third shuttle conveyors Stop driving, plate 4 made of stainless steel
3 was placed on the uppermost copper foil Cu, and a top plate 44 made of stainless steel was further laminated on this, and it was raised to the level of the conveyor 125 by the cylinders 131a and 131b in order to send it to the next step. Then, it is placed on the rollers of this conveyor 125 by a pusher (not shown), and the stacked carrier plates 42 are conveyed to a predetermined position. When pressure is applied from above to the top plate 44 at this position, the plate p,
The copper foil Cu, the insulating plate s, and the copper foil Cu are in close contact with each other and are in an adhered state. In this state, the top plate 44 and the uppermost plate 43 are removed, and the copper foil Cu is attached to the upper and lower surfaces. The insulating plate s to which is attached is set as one set, and the set is conveyed to the next step. That is, the plate p interposed between one set of polymer is removed and then supplied again to the above-mentioned first mounting portion 15.

Next, the above-mentioned first copper foil conveyor 24 and the second copper foil conveyor 24
The drive principle of the copper foil conveyor 63 is shown in FIGS.
Will be described with reference to. Although the driving principle and the supporting mechanism are slightly different from those in the above embodiment,
It is assumed that the operation is the same, and henceforth, the name will be described as the suction conveyance device 230.

In FIG. 17, the suction conveyance device is indicated by 230 as a whole, and as shown in FIG. 18, a pair of bellows 239a, 239a are provided on both side edges of the rectangular hollow frame 231.
239a, 239b, 239b are attached, and the lower end portion is also attached with band-shaped suction pipe bodies 222a, 222b having a rectangular cross section. Hollow frame 2
The inner space 232 of the suction pipes 222 a, 222 b
The inner space 240 is communicated with each other via bellows 239a and 239b. Here, the copper foil Cu to be adsorbed is shown by a one-dot chain line.

In the central portion of both side edges of the hollow frame 231,
A cylinder 220 is attached to the drive rod 2
21 is attached to the above-mentioned adsorption pipe bodies 222a and 222b. Furthermore, on both sides of this, guide bushes 237
a, 237a, 237b, 237b are attached to the center holes of the guide rods 238a, 238a, 2 and
38b and 238b are slidably guided, and the lower ends thereof are attached to suction pipe bodies 222a and 222b.
In FIG. 17, G is a seal ring.

The inner space 232 of the hollow frame 231 is connected to a blower 234 via a pipe 233 so that air is taken in. The upper wall surface of the hollow frame body 231 is slidably mounted on the guide rail 250 by mounting members 236a, 236a, 236b, 236b, and the hollow frame body 231 can be driven in the direction of arrow g by a drive unit (not shown). I am trying.

The adsorption tubes 222a and 222b are shown in FIG.
As shown in FIG. 5, a large number of small holes h are formed on the bottom wall surface thereof, which communicate with the inner space 240 .

The suction transfer device is constructed as described above,
Next, this operation will be described.

Now, as shown in FIG. 17, a case will be described in which the copper foil Cu laminated on the mounting table H is sucked and conveyed.

When the blower 234 is driven, the hollow frame 23
The inner space 232 in 1 is sucked in, which is a bellows 239a,
Adsorption tube 2 via 239a, 239b, 239b
The inner space 240 of 22a, 222b is inhaled. The entire suction conveyance device 230 is brought to the position shown in the drawing by a drive unit (not shown). Here, by driving the cylinder 220,
The drive rod 221 extends downward. This makes the bellows 23
9a, 239a, 239b, 239b also extend, and this downward movement is caused by the guide bushes 237a, 237a, 237.
b, 237b guide rod 238 guided
a, 238a, 238b, 238b, and accurately moved downward, and the adsorption pipes 222a, 222
22b abuts. Since these are at the same level, they come into contact with the copper foil Cu which is precisely laminated horizontally. At this time, the blower 234 causes the inner space 240 to move into the bellows 239a, 2
39a, 239b, 239b, the hollow frame body 2
Since the air is sucked through the inner space 232 of 31, the copper foil Cu is densely adsorbed by the vacuum adsorption action. When the cylinder 220 is driven upward in this state, the drive rod 2
21 is shortened, whereby the copper foil Cu is adsorbed and conveyed upward to the illustrated position. After that, the hollow frame 231 is driven in the direction g by a driving unit (not shown). An electromagnetic valve (not shown) is provided in the pipe 233 connecting the blower 234 and the hollow frame 231. By closing the electromagnetic valve at a predetermined position, the inner space 232 of the hollow frame 231 is closed. The inspiratory effect disappears. If the cylinder 220 is driven downward at a predetermined position before this, the drive rod 2
The copper foil Cu can be placed at a predetermined position by extending 21 downward.

In the above-described adsorption and conveyance operation, since the bottom wall surfaces of the adsorption tubes 222a and 222b are flat and a large number of small holes h are formed in this, even the copper foil Cu having an extremely thin thickness, It is possible to suck and convey it to a predetermined position without causing any wrinkles and without damaging it.

Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

For example, in the above embodiments, the first polymerized portion 1
Although the distances between the first, second, third, fourth, fifth, and sixth mounting portions are made equal to each other through the first and second overlapping portions 12, this is the same in each of the first overlapping portion 11 It suffices if the distances between the mounting portions or the distances between the mounting portions in the second overlapping portion 12 are equal. That is, the polymerization sections 11 and 12 may be different. However, the pair of holding portions 10 of the third shuttle conveyor 100
The distance between 1A and 101B is the distance between the charging section 10 and the third placing section 17
And the distance between the charging section 10 and the sixth placing section 53 must be the same.

In the above embodiments, the so-called printed circuit board laminating work has been described, but the present invention is not limited to this, and the present invention can be applied to the case where some thin plate materials are sequentially stacked.

[0042]

As described above, according to the thin plate laminating apparatus of the present invention, four kinds of thin plate materials can be laminated at a predetermined position by significantly increasing the laminating speed as compared with the prior art.

[Brief description of drawings]

FIG. 1 is a front view of a printed circuit board laminating apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line [2]-[2] in FIG.

3 is a sectional view taken along line [3]-[3] in FIG.

4 is a cross-sectional view taken along line [4]-[4] in FIG.

5 is a cross-sectional view taken along line [5]-[5] in FIG.

FIG. 6 is an enlarged front view of the vicinity of the charging unit in the same device.

7] [7]-[7] in the charging section of the same apparatus in FIG.
It is sectional drawing of a line direction.

FIG. 8 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 9 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 10 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 11 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 12 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 13 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 14 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 15 is a schematic front view for explaining the operation of the first, second, and third shuttle conveyors in the same device.

FIG. 16 is a side view of a laminate in the charging section of the device.

FIG. 17 is a partially cutaway front view of the suction conveyance device (first and second copper foil conveyors).

FIG. 18 is a partially cutaway rear view of the suction conveyance device (first and second copper foil conveyors).

[Explanation of symbols]

 70 First Shuttle Conveyor 85 Second Shuttle Conveyor 100 Third Shuttle Conveyor

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Mitsuo Maehara 150 Motoyashiki, Miyaya-cho, Toyohashi-shi, Aichi Shinko Electric Co., Ltd. Toyohashi Works

Claims (3)

[Claims] 1. A first transporting means for transporting a first thin plate material to a first placing part.
Conveying means, second conveying means for conveying a second thin plate material to a second placing portion provided at a first predetermined distance from the first placing portion, the first placing portion and the second A third placement part provided at a distance equal to the first predetermined distance from the second placement part on an extension of a straight line connecting the placement part, the first placement part, and the second placement part. The third thin plate material is conveyed to a fourth placing portion which is on an extension line of a straight line connecting the placing portion and the third placing portion and which is provided at a third predetermined distance from the third placing portion. A fourth thin plate member is provided on the third conveying means and on a fifth placement portion which is on the extension of the straight line and is provided at a second predetermined distance from the fourth placement portion toward the third placement portion. And a fourth transporting means for transporting the sheet, and a distance equal to the second predetermined distance from the fifth mounting part toward the third mounting part from the fifth mounting part on the straight line. A sixth mounting portion, a thin plate stacking portion provided between the third mounting portion and the sixth mounting portion, and a pair of first thin plates at a distance equal to the first predetermined distance. A first shuttle conveyor which has a support part and is vertically and horizontally driven at a predetermined timing along a rectangular path; and a pair of second thin plate support parts at a distance equal to the second predetermined distance. Then, the second shuttle conveyor, which is vertically and horizontally driven at a predetermined timing along a rectangular locus, has a distance equal to the distance between the thin plate stacking portion and the third placing portion, and the sixth placing portion. And a pair of thin plate holding portions at an equal distance from each other, and a third shuttle conveyor that is vertically and horizontally driven at a predetermined timing along a rectangular trajectory. Mounting part, second mounting part and third
The pair of first thin plate supporting portions is formed in the mounting portion with a notch which allows the vertical movement of the first shuttle conveyor and the movement along the upper side of the rectangle, and the fourth mounting portion. The pair of second thin plate supporting portions also form notches that allow the vertical movement of the second shuttle conveyor and the movement along the upper side of the rectangle also in the portion, the fifth mounting portion, and the sixth mounting portion. A thin plate laminating device characterized in that 2. The first thin plate member is a metal plate, the second thin plate member is a metal foil, the third thin plate member is a flat plate made of an insulating material, and the fourth thin plate member is a metal foil. The thin plate laminating apparatus described. 3. The second transfer means and the fourth transfer means each have at least two rows of pipes having flat bottom wall surfaces arranged side by side on a frame body, and a large number of small holes are formed on the bottom wall surface. The thin plate laminating apparatus according to claim 1, wherein the tubular body is connected to a blower to suck air, and the frame body is movable.