JP3765193B2 - Thin plate laminator - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to an optimum thin plate laminating apparatus used for printed circuit board manufacture.
[0002]
[Prior art]
  In recent years, with the development of electronic equipment, higher speed, higher reliability, and higher quality are required for production facilities for printed circuit boards. Conventionally, in the production of a printed circuit board, as a pre-process, the step of laminating a plate made of stainless steel, having a thickness of 1.5 to 2.0 mm, a width of 900 to 1450 mm, and a length of 1050 to 1280 mm; Lamination process of copper foil having a thickness of 12 to 70 μm, a width of 920 to 1470 mm and a length of 1080 to 1300 mm, and an insulating material having a thickness of 0.1 to 2.0 mm, a width of 900 to 1450 mm and a length of 1050 to 1280 mm The stacking process of the copper foil of the same thickness and the same size as the above copper foil is performed over 3 processes in this order. However, by shortening the stacking process, the speed is further increased. Is desired.
[0003]
  The applicant has been made in view of the above-mentioned problems, and in order to provide a thin plate laminating apparatus that can further reduce the number of laminating steps and increase the speed, the first thin plate material is used as the first mounting portion. First conveying means for conveying, second conveying means for conveying a second thin plate material to a second placing portion provided at a first predetermined distance in the first placing portion, and the first placing A third mounting portion provided on a straight line extending between the second mounting portion and the second mounting portion at a distance equal to the first predetermined distance from the second mounting portion; and the first mounting The third mounting portion is located on a straight line connecting the first mounting portion, the second mounting portion, and the third mounting portion, and the third mounting portion is provided at a third predetermined distance from the third mounting portion. A third conveying means for conveying the plate material and a second predetermined distance from the fourth mounting portion toward the third mounting portion, which is on the straight extension line; A fourth conveying means for conveying the fourth thin plate member to the fifth placement portion; and the second placement portion from the fifth placement portion toward the third placement portion from the fifth placement portion on the straight line. A sixth mounting portion provided at a distance equal to a predetermined distance, a thin plate stacking portion provided between the third mounting portion and the sixth mounting portion, and equal to the first predetermined distance A first shuttle conveyor having a pair of first thin plate support portions at a distance and driven up and down and left and right at a predetermined timing along a rectangular trajectory and a distance equal to the second predetermined distance A distance between a second shuttle conveyor having a pair of second thin plate support portions and driven up and down and left and right at a predetermined timing along a rectangular trajectory, and the thin plate stack portion and the third placement portion And having a pair of thin plate holding portions at a distance equal to the distance from the sixth mounting portion. A third shuttle conveyor which is driven up and down and left and right at a predetermined timing along a rectangular trajectory, and the first mounting unit, the second mounting unit, and the third mounting unit have a pair of first 1 thin plate support part forms the notch which can accept the movement of the up-and-down direction of the 1st shuttle conveyor, and the movement along the upper side of the rectangle, and the 4th mounting part, the 5th mounting part, and the A pair of the second thin plate supporting portions is also formed on the six mounting portions so as to form notches that allow the vertical movement of the second shuttle conveyor and the movement along the upper side of the rectangle. A laminating apparatus was developed (Japanese Patent Application No. 4-351026).
  However, the apparatus has been improved since then, but since a thin plate, particularly a thin thin plate such as a copper foil, is processed, it is desired that supply efficiency and processing efficiency be further improved in each part.
[0004]
[Problems to be solved by the invention]
  The present invention has been made in view of the above problems,To provide a thin plate laminating apparatus capable of producing a thin laminate of high quality by increasing the processing speed without damaging the thin plate.Is an issue.
[0005]
[Means for Solving the Problems]
  The above-described problem is a thin plate laminating apparatus in which at least two kinds of thin plates are superposed, transported to a laminating unit, and sequentially laminated on the laminating unit, and the first thin plate is positioned and placed on the positioning unit And transport while adsorbing the front end to the vacuum pad, sliding the rear end along the chute,Overlapping partIn the thin plate laminating apparatus which is superposed on the second thin plate positioned and placed on the lower end of the chute and theOverlapping partWhen the first thin plate is adsorbed by the vacuum pad and the rear end is slid along the chute, the first thin plate is slid along the chute. Before the rear end of the thin plate passes through the lower end of the chute, the runway forming member is advanced and conveyed along the runway forming member, and the rear end of the first thin plate is the runway forming member. This is solved by a thin plate laminating apparatus characterized in that the runway forming member is retracted when passing the tip or immediately before passing.
[0006]
  With the above configurationLaminatedThe processing of the parts is performed smoothlyTherefore, a high-quality laminate can be obtained without damaging the thin plate. Therefore,The production capacity of the entire apparatus can be greatly improved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
  1 and 2 show the entire thin plate laminating apparatus 1 according to an embodiment of the present invention, but a laminating portion 2 which will be described in detail later is disposed almost at the center, and a plate p made of stainless steel is supplied to the left in the figure. The plate supply section 3 is disposed above, the plate side-copper foil supply section 4 is disposed above, and the insulating plate supply section 5 is disposed on the right side of the laminated section 2, and the insulating plate side-copper foil supply is disposed on the left side. Part 6 is arranged. On the laminated part 2 side of the copper foil supply parts 4 and 6, the plate side-copper foil positioning part 7, the insulating plate side-copper foil positioning part 13 according to the present invention, and further on the laminated part 2 side, copper- The plate overlapping portion 8, the copper-insulating plate overlapping portion 12, the transport standby portions 10a and 10b, and the plate side shuttle device 9 and the insulating plate side shuttle device 14 are disposed below them.
[0008]
  One above the stack 2ChuckHas a positioning part,ChuckA first chuck device 11A and a second chuck device 11B each having a positioning portion are disposed. These first and second chuck devices 11A and 11B will also be described in detail later. On both sides of the laminated portion 2, a copper-plate overlapping portion 8 and a copper-insulating plate overlapping portion 12 and transport standby portions 10a and 10b are disposed apart from these by a predetermined pitch. First, the thin plates stacked on the overlapping portions 8 and 12 at the timing described later by the second chuck devices 11A and 11B are transferred to the transfer standby portions 10a and 10b, and then transferred onto the stacking portion 2. Here, the stacked body of the copper foil m and the plate p held by the chuck devices 11A and 11B or the stacked body of the copper foil m and the insulating plate z is detached from the stacked portion 2.
[0009]
  As clearly shown in FIG. 1, strips 22 arranged at predetermined intervals are provided on both sides of the laminated portion 2, and the plate placement portions 9 a, 9 b, 14 a of the shuttle devices 9, 14 are provided therebetween. When the shuttle devices 9 and 14 are lowered through the passage 14b, the plate p or the insulating plate z and the laminated body of the copper foil m and the plate p and the copper foil m and the insulating plate z are placed on the strip 22. The stacked body is placed.
[0010]
  A plate p made of stainless steel is conveyed by a pair of rollers 21 from below in FIG. 1, positioned close to the end of the strip 22 and stopped oppositely. In the copper foil supply unit 4, a large number of copper foils m stacked by a supply device (not shown) is placed on the platform HA, and is then transferred to the plate-side copper foil positioning unit 7 according to the present invention. The sheets are conveyed one by one to the plate overlap portion 8 and placed on the plate p already positioned below the plate overlap portion 8. The plate-side shuttle 9 and the insulating plate-side shuttle 14 move left and right and up and down at the timing described later. At this time, the copper-plate stack or the copper-insulating plate overlapped by the overlapping portions 8 and 12 respectively. The stacked body is transferred to the transport standby units 10a and 10b, and then held on both sides by the chuck devices 11A and 11B and positioned and transported above the stacking unit 2, where the holding is released and the stacking unit 2 is already stacked. It is positioned and superposed on a copper plate stack or a copper insulating plate stack.
[0011]
  The thin plate laminating apparatus 1 according to the embodiment of the present invention is generally configured as described above. Next, the details of each part according to the present invention will be described.
[0012]
  The configuration of the copper foil positioning portion 7 will be described with reference to FIGS. This is disposed on the right side of the copper foil supply unit 4, and a rear vacuum pad 32 and a front vacuum pad 33 are attached to both ends of the connecting member 31 as a pair. Pad portions 32a and 33a are respectively attached to the lower ends thereof in a vertical positional relationship as shown in the figure, and a positioning surface 35 is provided below the connecting member 31, and this is provided with a copper foil supply portion 4 on the left side. Between them, a chute portion 36 of about 45 degrees is formed. Further, a chute 37 having the same angle as the chute 36 is provided at the right end portion of the positioning surface 35, and the runway forming member according to the present invention can be moved forward and backward between the lower end and the copper foil-plate overlapping portion 8. 140 is arranged as shown. This is an inclination angle that is almost horizontal. The positioning unit 7 alternately takes the position shown in FIG. 2 and the position directly above the overlapping unit 8 (FIGS. 8 and 9).
[0013]
  Next, the detail of the lamination | stacking part 2 is demonstrated with reference to FIG. 2, FIG. As clearly shown in FIG. 12, the laminated portion 2 includes a support base 41 supported on the upper end portion of the lifter 40 via a roller 20 b, and a cushion material is attached on the support base 41 without being clearly shown. Further, a pair of dust collectors 42 </ b> A and 42 </ b> B are configured to move up and down in conjunction with the vertical movement of the support base 41 on both sides. As will be described later, the support base 41 is formed by sequentially holding a stack Q of the plate p and the copper foil m and a stack S of the copper foil m and the insulating plate z by alternately holding and releasing the chuck devices 11A and 11B. In accordance with this stacking height, it moves up and down to align with the chuck devices 11A and 11B, and accordingly, the dust collectors 42A and 42B reach the level of the cushion material at the initial stage of stacking. It is positioned so as to face each other, and is driven to move downward as the height increases and to face both sides of the uppermost laminated body.
[0014]
  Here, the stacking unit 20 and the chuck device 11A will be described with reference to FIGS. Since the chuck devices 11A and 11B have the same configuration, only one device 11A will be described. As shown in FIG. 12 on both sides of the connecting member 11a.6The chuck portions 11b and 11b are provided. The chuck portions 11b and 11b are rotatably provided around a shaft 11c. The cylinders 11d and 11d allow the rods 11g and 11g to be connected to the lower end portion of the chuck portion 11b. Both edges of the overlap body Q of the copper foil m and the plate p are clamped as shown in FIG. In addition, the rod 11f is supported by the cylinder 11e at the center portion of the laminated portion 20.41When the stacked body Q is brought into contact with and stopped, the rod 11f is configured to press the intermediate portion of the stacked body Q. The support plate 41 is stably placed on the roller 20b, and after laminating thin plates to a predetermined height, the chuck devices 11A and 11B are moved to positions that do not interfere with each other, and then the rollers 20b The laminated body is transported to the next process by rolling.
[0015]
  In the laminated portion 20, the dust collectors 42A and 42B are disposed on both sides as described above, and the duct d is attached to the upper end portion, and these upper end portions are clearly shown in FIG. A slit-shaped opening 42a is formed. The opening 42a is elongated and faces both edges of the stacked body Q. The duct d is provided at two places as clearly shown in FIGS. 11 and 12, and a guide member f is attached to the duct d, and the duct d moves up and down by driving the cylinder device h. e (FIG. 13) is configured so as to be guided linearly in the vertical direction accurately. The guide body e is configured to restrict the upper limit position and the lower limit position of the duct.
[0016]
  Next, referring to FIG. 2 and FIGS.Embodiment of the present inventionThe insulating plate separation, that is, the peeling apparatus 100 according to the above will be described. On the right side of the copper foil supply unit 6 on the insulating plate side, a large number of insulating plates z are stacked and stored on the table 101. This is shown in FIGS. Are stacked and shifted by a. The insulating plate z is formed by integrating five pieces of 0.2 mm foil bodies by pressing and integrating them, and these are stacked as shown in FIGS. 2 to 5, the peeling device is generally indicated by 100, but as shown in FIG. 15, a drive mechanism 70 incorporating various guide members and a drive unit is provided on the bases 51 a and 51 b. A motor 52 is attached to the right gantry 51a, and each member to be described later is driven left and right via a belt and a pulley.
[0017]
  A pair of pressing devices 53A and 53B are disposed on both sides of the insulating plate, and a pair of gripping portions 54a and 54b can be opened and closed and moved back and forth by cylinders 55a and 55b at the tip. In FIG. 16, a peeling member 56a is disposed below these presser devices 53A and 53B, and this can be moved left and right by a guide device 71, but in FIG. Foil presser / carry-out devices 57A and 57B are provided between the right and left positions, and a pair of foil presser pads 58a and 58b are provided at the tip as shown in FIGS. ing. Further, an engaging portion 59 for pushing the peeled uppermost insulating plate z leftward in FIGS. 25 and 26 is provided behind this. As clearly shown in FIG. 21, the peeling member 56 is further provided with a peeling plate 56 a having a flat plate shape and a tip bent downward.
[0018]
  The configuration according to the embodiment of the present invention has been described above. Next, this operation will be described.
[0019]
  As shown in FIGS. 1, 2, and 7 to 10, in the left plate supply unit 3, a plate made of stainless steel is carried in one by one from a laminated unit (not shown) by a roller 21, and at a predetermined position. Positions and stops. In the upper copper foil supply unit 4, a large number of copper foils m are stacked, but from now on, the front end is adsorbed by the pad portion 32 a of the rear vacuum pad 32 in the positioning unit 7, and only one sheet is on the right side in the figure. It is transferred to. The copper foil m slides along the chute 36, is positioned by the positioning surface 35, and stops.
[0020]
  On the other hand, the fork portion 9a, which is a placement portion of the shuttle device 9, scoops from the lower side a single plate p that is positioned and stopped on the roller 21 when the shuttle device 9 moves to the left in the figure by a predetermined pitch. When the shuttle device 9 moves downward as much as possible, the shuttle device 9 is lifted from the roller 21 by a predetermined pitch, placed on the fork portion 9a, and then moved rightward by the predetermined pitch. As a result, it is brought directly above the plate positioning portion, and is further placed here by the downward movement of the shuttle device 9 (FIG. 5).
[0021]
  At this time, the plate p previously transferred by the rightward movement of the shuttle device 9 is transferred to and placed on the overlapping portion 8 (FIGS. 2 and 3). Here, the copper foil m positioned by the positioning portion 7 is attracted to the front end portion by the pad portion 33a of the front vacuum pad 33, and the copper foil m is moved when the positioning portion 7 moves to the right and downward by a predetermined pitch. The rear end portion slides on the chute 37 (FIG. 8), and is positioned and superimposed on the plate p that has already been positioned and stopped (FIG. 9).
[0022]
  According to the present invention, the runway forming member 140 having a very small inclination is provided between the lower end of the chute 37 and the overlapping portion 8 so as to be movable back and forth. Advance before passing the lower end of 37. Therefore, the rear end slides on the runway forming member 140 after sliding on the chute 37. Therefore, it is slid over and brought to the overlap portion 8, but conventionally there is no runway forming member 140 as shown in FIG.endThe rear end ma is rounded due to the pressure difference due to the air gap between the chute 37 and the overlapping portion 8 and the airflow between the chute 37 and the overlapped portion 8 when passing through the plate p. It is positioned accurately while sliding on the top. After this, the positioning unit 7 is7As shown by, it moves a predetermined pitch to the position shown by the solid line.
[0023]
  The shuttle device 9 receives the stack by moving upward, moves to the right by a predetermined pitch, and reaches the standby unit 10a. Here, the chuck device 11A is brought directly above, and the chuck portions at both ends thereof are closed to hold the stacked body Q of the copper foil m and the plate p. Thereafter, the chuck device 11A moves rightward by a predetermined pitch, and reaches just above the stacked portion 2. Next, the stacked body Q of copper and plate is placed on the support plate 40 supported by the lifter 40 that is positioned just below the chuck portion 11b and adjusted at a predetermined height. At this time, the center presser rod 11f moves downward to press the central portion of the stacked body Q against the cushion material (assuming that the stacked body Q is now placed at the bottom), and then the chuck portion 11b is opened. Since it moves, it is stably held on the cushioning material. Further, since the dust collectors 42A and 42B are positioned and held on both sides, both ends of the overlapped body Q abut against the cushion material when detached from the chuck device 11A, but the suction of the dust collectors 42A and 42B. Therefore, it is placed on the cushion material without causing small dust or dust.
[0024]
  1 and 2, the overlapping mechanism of the left copper foil m and the plate p has been described. Next, the operation of the overlapping mechanism of the insulating plate z and the copper foil m positioned on the right side of the laminated portion 2 is described. Will be described.
[0025]
  A large number of insulating plates z are deposited on the insulating plate supply unit 5, but the uppermost insulating plate z is peeled from the lower insulating plate z one by one by the peeling device 100 and supplied to the next process. The 15 and 21, first, the presser claws 54a and 54b and the presser rod 54c of the presser device 53A move downward, and the edge of the second-stage insulating plate z is pressed by the presser rod 54c (FIG. 22). Thereafter, the cylinder 55b is driven to advance the claw portions 54a and 54b as shown in FIG. 22 to take a position (FIG. 23) that sandwiches the left end portion of the insulating plate z. The rising position is taken with the end of z being sandwiched (FIGS. 23 and 24). Thereafter, the peeling member 56a moves to the right as shown in FIG. As a result, the uppermost insulating plate z and the second insulating plate z are in close contact with each other.
[0026]
  In this process, the pressing devices 57A and 57B press the long side portion of the second-stage insulating plate z. The peeling member 56a moves to the right position in FIG. 14. On the way, however, the peeling mechanism 56a moves from the position of FIG. 25 to the position of FIG. As shown in FIGS. 27 and 28, the long side portion of the insulating plate z is pushed by the claw portion 59 as the V-shaped engaging portion as shown in FIGS. Thus, as shown in FIG. 28, only the uppermost insulating plate z is positioned and carried into the first standby portion A in FIG.
[0027]
  Although not shown, a transfer means is provided between the insulating plate supply unit 5 and the positioning unit 6 in FIGS. 1 and 2, and this is provided with a pair of claw portions and is peeled off as described above. The left end edge portion of the uppermost insulating plate z pushed out from the device 100 by a predetermined distance is sandwiched, and the sandwiched insulating plate z is transported to the left by a predetermined distance in FIGS. 1 and 2 and placed on the standby portion A. .
[0028]
  On the other hand, a single copper foil m is supplied from the copper foil supply unit 6 to the positioning unit 13 in the same manner as the left plate-copper foil stacking mechanism, and is positioned and waiting. Transfer the insulating plate z placed on the first standby section A to the position immediately below the positioning section 13, and further move the shuttle device 14 to the left at this time by a predetermined pitch, The insulating plate z previously placed is positioned on the overlapping portion 12 and waits for the overlapping of the copper foil m. As described above, one copper foil m is accurately positioned and overlapped on the waiting insulating plate z from the positioning portion 13. Also in this case, the curling phenomenon at the rear end, which has been conventionally observed, is eliminated by the advancement of the runway forming member between the chute and the overlapping portion. Therefore, as described above, the copper foil m is superimposed on the insulating plate z with accurate positioning.
[0029]
  Next, the chuck device 11B reaches from the position shown in FIG. 2 directly above the standby unit 10b as shown in FIG. In other words, the shuttle device 14 comes directly above the stack S of the copper foil m and the insulating plate z transferred to the standby unit 10b by the movement of the predetermined pitch to the left. The chuck portion 11b is held and held at both ends of the stacked body S of the copper foil m and the insulating plate z (FIG. 5). Next, it moves a predetermined pitch directly above the laminated portion 2 (FIG. 6). The laminated part 2 already has a stack P of copper foil and plate placed on the base 20a from the left side, and further a stack S of insulating plate z and copper foil m is placed thereon. Is done. At this time as well, the dust collectors 42A and 42B of the dust collectors 42A and 42B are positioned and disposed on both sides, so that the chuck device 11B also collects dust and dirt when the both ends of the stacked body S are detached from the chuck portion 11b. This occurs when a good quality laminate is produced by immediately sucking this. In the same manner, the stacked body P of the copper foil and the plate is overlapped in the same manner from the left, and then the stacked body S of the insulating portion and the copper foil is stacked on the stacked portion 2 from the right. The dust collectors 42 </ b> A and 42 </ b> B are lowered according to the stacking height, so that dust and dirt that are accumulated every time the stacked bodies P and Q are supplied to the stacking unit 2 are not generated.
[0030]
  14 to 28 show details of the peeling device 100. FIG. 16 shows a partially enlarged view of FIG. 14, and the pressing device 53A includes the pair of claw portions 54a and 54b as described above. (See also FIGS. 21 to 24), and a peeling member 56a is provided on the side. FIG. 17 shows the details of the guide device 70, and a guide rail 71 having a square cross section is fixed to the gantry 51a, 51b.
[0031]
  In FIG. 17, the lower part of the mounting plate g is linearly guided left and right as shown in FIG. 16 through a member slidably fitted to the protrusion 71a of the guide rail 71. The mounting plate f ′ is fixed, and the peeling body 56 is fixed to the vertical wall portion, and the peeling member 56a is formed at the end portion. Further, the pressing device 53A described above is configured to be movable rightward in FIG. 17 as indicated by a one-dot chain line along the guide rod n.
[0032]
  FIG. 21 shows details of the claws 54a and 54b of the presser device 53A, but a spherical presser portion 54c is provided below the lower claw 54b. This is the uppermost insulating plate z in the insulating plate supply section.₁ And second-stage insulating plate z₂ Is shifted by a length a, but this first moves downward, and as shown in FIG.₂ Press down and the third and subsequent insulation plates z_Three , Z_Four ..., and after this, only the claws 54a, 54b move to the right, so that the uppermost insulating plate z₁ And the second-stage insulating plate z with the tip pressed₂ Are separated as shown. Thereafter, the peeling member 56a advances to the right as shown in FIG. 24, but before this, the claw portions 54a and 54b are closed, and the uppermost insulating plate z as shown in FIG.₁ Is inserted. In this state, the peeling member 56a further advances to the right. Therefore insulating plate z₁ The long edge of is surely the second stage insulation plate z₂ Peel from. In this state, as described above, the presser devices 57A and 57B are connected to the second-stage insulating plate z.₂ 27, 28, the push-engagement engagement member 59 advances, and the uppermost insulating plate z₁ Push only. In FIG. 27, the cylinder 101 as the conveying means moves the pushing engagement member 59 to the left in the figure, but a V-shaped groove 59a is formed at the tip of the member 59, and the upper surface of the member 59 The thin plates 59b and 59c are fixed to the lower surface, and as shown in FIGS. 27 and 28, the uppermost insulating plate z is held by these, that is, pushed in a positioned state. After this, although not shown in FIG. 1, the uppermost insulating plate z whose pair of grips is pushed out by the drawing device₁ And is transported to a standby unit located above the right-side mounting unit of the shuttle device 14. In the same manner, the second and third insulating plates z₂ , Z_Three Are sequentially pushed to the standby unit at a predetermined tact time.
[0033]
  18 to 28 show the details of the operation of the peeling device 100. In FIGS. 18 and 19, the pressure conveying device 57A (which is the same as 57B and will be described only by one) has a pair of pressing members 59c at the tip. 59c, a guide plate 59b, and a push engagement member 59 having a V-shaped groove between them, which are integrally driven by a cylinder 101. FIG. 25 shows the uppermost insulating plate z.₁ Indicates that the peeling member 56a has been peeled off as shown in FIG. 26 as described above, the cylinder 101 is advanced, and then the cylinder 96 is driven and pushed as shown in FIG. The dynamic engagement member 59 moves downward and the second stage insulating plate z₂ Press down. Next, as shown in FIG. 28, when the cylinder 101 is further driven, the V groove 59a of the pushing member 59 is changed to the uppermost insulating plate z.₁ Is pushed to the left in the figure as shown in FIG. Therefore, it is positioned and stopped at the standby portion as described above.
[0034]
  As described above, according to the thin plate laminating apparatus 1 according to the embodiment of the present invention,Without curling the rear end of the copper foil mA stack of copper foil m and stainless steel plate p and a stack S of copper foil m and insulating plate z are alternately dusted and dusted with a larger throughput (production efficiency) than before. We will pile up
[0035]
  The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.
[0036]
  For example, in the above-described embodiment, the stacked body P of the plate and the copper foil and the stacked body Q of the insulating plate and the copper foil are sequentially stacked from both sides of the stacked portion 2. Without being limited, for example, it is also applicable to stacking only the stacked body of the plate and the copper foil in the stacking portion 2 from the left side. Further, the thin plate is not limited to a copper foil, an insulating plate, or a plate, and may be a thin plate of another material. Further, in the present embodiment, the respective stacked bodies are sequentially laminated from both sides of the laminated portion. However, it is also possible to laminate the laminated body 2 from the both sides in the direction perpendicular to the laminated portion 2 at about twice as fast. The present invention is applicable.
[0037]
【The invention's effect】
  As described above, according to the thin plate laminating apparatus of the present invention,Without curling one end of the sheetA high-quality laminate of thin plates can be obtained with a larger throughput than before.
[Brief description of the drawings]
FIG. 1 is a plan view showing an entire thin plate laminating apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of the same.
FIG. 3 is a diagram showing the same operation.
FIG. 4 is a diagram showing the same operation.
FIG. 5 is a diagram showing the same operation.
FIG. 6 is a diagram showing the same operation.
7 is a side view showing details of a copper foil positioning portion in FIGS. 1 and 2. FIG.
FIG. 8 is a diagram showing the same operation.
FIG. 9 is a diagram showing the same operation.
FIG. 10 is a side view showing details of a conventional copper foil positioning portion.
FIG. 11 is a front view showing details of a stacked portion located at the center of the apparatus.
FIG. 12 is a side view of the same.
13 is an enlarged cross-sectional view taken along line [13]-[13] in FIG.
14 is a plan view showing the entire peeling apparatus in FIGS. 1 and 2. FIG.
FIG. 15 is a side view of the same.
16 is an enlarged plan view of a part of FIG.
17 is a cross-sectional view in the [17]-[17] line direction in FIG. 16;
FIG. 18 is an enlarged plan view showing another main part of the peeling apparatus.
FIG. 19 is an enlarged plan view showing the same operation.
FIG. 20 is an enlarged plan view showing the same operation.
FIG. 21 is an enlarged cross-sectional view of a main part in the peeling apparatus.
FIG. 22 is an enlarged sectional view showing the same operation.
FIG. 23 is an enlarged side view showing the same operation.
FIG. 24 is an enlarged sectional view showing the same operation.
FIG. 25 is an enlarged cross-sectional view of still another main part in the peeling apparatus.
FIG. 26 is an enlarged sectional view showing the same operation.
FIG. 27 is an enlarged sectional view showing the same operation.
FIG. 28 is an enlarged sectional view showing the same action.
[Explanation of symbols]
1 Thin plate laminating equipment
2 Stacking part
7 Plate side-Copper foil positioning part
13 Insulating plate side-copper foil positioning part
33 Vacuum pad
40 Lifter
42A, 42B Dust collector
53A, 53B Presser device
56a Peeling member
59 Pushing engagement member
100 Peeling device
140 Runway forming member

Claims (3)

A thin plate laminating apparatus that superimposes at least two types of thin plates, conveys them to a laminating unit, and sequentially laminates them on the laminating unit, positioning and placing the first thin plate on the positioning unit, In the thin plate laminating apparatus, the rear end portion is slid along the chute and is superposed on the second thin plate that is positioned and placed on the overlapping portion . A runway forming member having a small inclination is provided between the lower end portion and the overlapped portion so as to be able to advance and retreat, and the first thin plate is adsorbed by the vacuum pad and the rear end portion is slid along the chute. When the rear end of the first thin plate passes through the lower end of the chute, the runway forming member is advanced and conveyed along the runway forming member, and the rear end of the first thin plate is When passing the tip of the runway forming member, Sheet stacking device being characterized in that so as to retract the 該滑 runway forming member immediately before the passing.   The thin plate laminating apparatus according to claim 1, wherein the first thin plate is a copper foil, and the second thin plate is a steel plate or an insulating plate.   3. The positioning unit according to claim 1, wherein a front end portion of the first thin plate is sucked and supplied by a second vacuum pad on the rear side. Thin plate laminating equipment.

Images