JP2000159430A - Thin plate stacking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To qualitatively secure a laminated product, being securable in alternately superposing a lapping product with a plate consisting of copper foil and a stainless, steel plate on another lapping product consisting of an insulator and this copper foil, through a high throughput. SOLUTION: This is a thin plate stacking device which superposes at least two types of thin plates on each other, conveying them to a stacking part in which they are successively stacked in this stacking part, wherein a first thin plate (m) (copper) is located and mounted on a positioning part 7, and the front end is conveyed along a chute 37 as sucking it to a vacuum pad 32a, then it is made so as to be superposed on a second thin plate P being located and mounted on a standby part, it is provided with a runway forming member 140 being small in inclination and capable of both forward and backward movements in space between a lower end of the chute 37 and the standby part, and the first thin plate (m) is sucked by the vacuum pad 32a, and when it is conveyed along the chute 37, the runway forming member 140 is advanced forward before a front part of the first thin plate (m) passes through the lower end of the chute 37 and thus it is conveyed along this runway forming member 140, and when a rear end of the first thin plate (m) has passed through a tip of the runway forming member 140, or at a time just before passing through, this runway forming member 140 is made so as to go backward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin sheet laminating apparatus most suitable for manufacturing a printed circuit board.

[0002]

2. Description of the Related Art In recent years, with the development of electronic equipment, printed circuit board production equipment has been required to have higher speed, higher reliability and higher quality. Conventionally, in the manufacture of printed circuit boards,
A lamination process of a plate made of stainless steel and having a thickness of 1.5 to 2.0 mm, a width of 900 to 1450 mm, and a length of 1050 to 1280 mm,
12-70 μm thickness and 920-1470 width
a copper foil having a length of 1080 to 1300 mm and a thickness of 0.1 to 2.0 mm and a width of 900 mm.
~ 1450mm and length 1050 ~ 1280
The lamination process of a copper foil having the same thickness and the same dimensions as the above-mentioned copper foil on an insulating material of mm is performed in three steps in this order, but by shortening the lamination process, Even higher speeds are desired.

In view of the above-mentioned problems, the applicant has first made the first loading of the first sheet material to provide a thin sheet laminating apparatus capable of further reducing the number of laminating steps and increasing the speed. A first transport unit that transports the sheet to the mounting unit; and a second transport unit that is provided at the first mounting unit at a first predetermined distance.
A second transport unit that transports the thin plate material, and a distance equal to the first predetermined distance from the second placement unit on an extension of a straight line connecting the first placement unit and the second placement unit. The third mounting portion is located on an extension of a straight line connecting the first mounting portion, the second mounting portion, and the third mounting portion, and is located at a third predetermined position from the third mounting portion. The third mounting part provided at a distance
A third conveying means for conveying the thin plate material, and a fifth mounting portion provided on the linear extension and provided at a second predetermined distance from the fourth mounting portion toward the third mounting portion. A fourth transport means for transporting the fourth thin plate member, and a distance equal to the second predetermined distance from the fifth mounting portion toward the third mounting portion from the fifth mounting portion on the straight line. A sixth mounting portion provided at a distance between the third mounting portion and the thin mounting portion provided between the third mounting portion and the sixth mounting portion; and a thin plate laminated portion provided at a distance equal to the first predetermined distance. A first shuttle conveyor driven up and down, left and right at predetermined timing along a rectangular locus, and a pair of second thin plates at a distance equal to the second predetermined distance A second shuttle conveyor having a support portion and driven up and down and left and right at predetermined timing along a rectangular locus. And a pair of thin plate holding portions at a distance equal to the distance between the thin plate stacking portion and the third mounting portion and also equal to the distance between the sixth mounting portion. A third shuttle conveyor that is driven up and down and left and right at predetermined timings along the trajectory, and the first mounting portion, the second mounting portion and the third mounting portion have a pair of the first thin plate supports. A notch allowing vertical movement of the first shuttle conveyor and movement along the upper side of the rectangle, and the fourth mounting portion, the fifth mounting portion, and the sixth mounting portion. Wherein the pair of second thin plate supporting portions form notches that allow the second shuttle conveyor to move vertically and to move along the upper side of the rectangle. Developed (Japanese Patent Application No. 4-3)
No. 51036). Although the above apparatus has been improved thereafter, since thin sheets, particularly thin sheets such as copper foil, are processed, it is desired that the supply efficiency and the processing efficiency in each part be further improved.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described problems, and has as its object to provide a thin plate laminating apparatus capable of improving the efficiency and efficiency of each unit and increasing the throughput of the entire apparatus.

[0005]

An object of the present invention is to provide a thin sheet laminating apparatus in which at least two kinds of thin sheets are stacked, conveyed to a stacking section, and sequentially stacked on the stacking section. Is positioned on the positioning portion, and is transported while adsorbing the front end portion to the vacuum pad, and the rear end portion is slid along the chute to position the second thin plate positioned and mounted on the standby portion. In the thin plate laminating apparatus that is to be superimposed on, advance between the lower end portion of the chute and the standby portion,
A runway forming member having a small inclination is provided so as to be able to retreat, and when the first thin plate is sucked by the vacuum pad and the rear end is slid along the chute, the rear end of the first thin plate is Before passing the lower end of the chute, the runway forming member is advanced and transported along the runway forming member, and when the rear end of the first thin plate passes the tip of the runway forming member, Alternatively, the problem is solved by a thin plate laminating apparatus characterized in that the runway forming member is retracted immediately before passing.

[0006] Alternatively, there is provided a thin plate laminating apparatus in which at least two kinds of thin plates are stacked, conveyed to a laminating section, and sequentially laminated on the laminating section. The present invention is solved by a thin plate laminating apparatus, wherein the two dust collection ports are movably provided, and the dust collecting ports are also lowered in accordance with the amount of the lowering when the laminating portion is lowered according to the lamination height of the thin plates. You.

[0007] Alternatively, there is provided a thin sheet laminating apparatus in which at least two kinds of thin sheets are stacked, conveyed to a stacking section, and sequentially stacked on the stacking section, wherein the first thin sheet is positioned and placed on a positioning section. A thin plate laminating apparatus in which a front end portion is conveyed while being sucked by a vacuum pad, and a rear end portion is slid along a chute and positioned on a second thin plate positioned and placed on a standby portion. In the above, the second thin plate has a rectangular shape, and the second thin plate is alternately shifted by a predetermined length on a short side or a long side parallel to the conveying direction to the standby section, and is deposited. While pressing the short side or the long side of the second thin plate downward by the first pressing means, the peeling means is moved to the long side or the short side between the uppermost stage and the second stage of the second thin plate. To move the uppermost second sheet from the second step of the second sheet. Peeled across the sides or short sides,
The transport means holds the long side or the short side of the peeled uppermost second thin plate, and pushes out the second thin plate of the second stage in the standby state. When the sheet is extruded by the conveying means, the second pressing means located at a position facing the first pressing means,
While pushing down the short side or the long side of the second thin plate of the stage, the peeling means is moved along the long side or the short side of the second thin plate, and the second stage The second thin plate is separated from the second thin plate of the third stage over the entire long side or short side, and the separated long side or short side is held by the transfer means and extruded to the standby unit. As described above, the present invention solves the above problem by sequentially extruding the second thin plate to the standby section.

With the above arrangement, the processing of each section is performed smoothly, so that the production capacity of the entire apparatus can be greatly improved.

[0009]

1 and 2 show the whole of a thin plate laminating apparatus 1 according to an embodiment of the present invention. A laminating section 2 which will be described in detail later is disposed substantially at the center, and is shown on the left in the figure. A plate supply unit 3 for supplying a plate p made of stainless steel, a plate side-copper foil supply unit 4 is disposed above the plate supply unit 3, and an insulating plate supply unit 5 is provided on the right side of the laminated unit 2 and on the left side thereof. The insulating plate side-copper foil supply section 6 is provided. Copper foil supply unit 4,
6, the plate side-copper foil positioning part 7 and the insulating plate side-copper foil positioning part 1 according to the present invention
3. Further, on the side of the lamination part 2, the copper-plate overlapping part 8, the copper-insulating plate overlapping part 12, and the transport standby parts 10a, 10a
b and a plate-side shuttle device 9 and an insulating-plate-side shuttle device 14 are disposed below these components.

A first chuck device 11A and a second chuck device 11B having one positioning portion above the laminating portion 2 and having second positioning portions on the left and right sides thereof are provided. These first and second chuck devices 11A, 1A
1B will be described later in detail. On both sides of the laminating unit 2, there are further provided a copper-plate overlapping unit 8, a copper-insulating plate overlapping unit 12, and transfer standby units 10a and 10b separated from each other by a predetermined pitch. First, the thin plates superimposed on the overlapping portions 8 and 12 by the second chuck devices 11A and 11B are transferred to the transport standby portions 10a and 10b and then conveyed onto the laminating portion 2 at a timing described later. Here, the stacking unit 2 is provided with the main chuck devices 11A,
The stacked body of the copper foil m and the plate p or the stacked body of the copper foil m and the insulating plate z held by 1B is detached.

As clearly shown in FIG. 1, strip members 22 are provided at both sides of the laminating portion 2 at predetermined intervals, and the plate mounting portions 9a, 9b of the shuttle devices 9, 14 are interposed therebetween. , 14
a, 14b, and these shuttle devices 9, 14
Is lowered, a plate p or an insulating plate z, a stacked body of a copper foil m and a plate p, and a stacked body of a copper foil m and an insulating plate z are placed on the strip 22.

A plate p made of stainless steel is conveyed from below by a pair of rollers 21 in FIG.
2 is positioned close to the end and stopped oppositely.
In the copper foil supply unit 4, a large number of laminated copper foils m are placed on a platform HA by a supply device (not shown), and are then transferred to the plate-side copper foil positioning unit 7 according to the present invention. The sheets are conveyed one by one to the plate stacking section 8 and placed on the plate p which has been positioned below the sheet p. The plate-side shuttle 9 and the insulating-plate-side shuttle 14 move left and right and up and down at the timings described below. At this time, the copper-plate stacked body or the copper-insulated plate that are stacked in the overlapping portions 8 and 12, respectively. After the stacked body is transferred to the transfer standby units 10a and 10b, the chuck device 1
1A and 11B, are held on both sides and positioned and transported above the stacking unit 2, where the holding is released and the stacking unit 2
Is positioned and stacked on a stack of copper plates or a stack of copper insulating plates already stacked.

The thin-film laminating apparatus 1 according to the embodiment of the present invention is generally constructed as described above. Next, each part relating to the present invention will be described in detail.

The structure of the copper foil positioning portion 7 will be described with reference to FIGS. The rear vacuum pad 32 and the front vacuum pad 33 are attached to both ends of the connecting member 31 as a pair. Pad portions 32a and 33a are provided at the lower ends thereof, respectively.
Are mounted in a vertical position relationship as shown in the figure,
A positioning surface 35 is provided below the connecting member 31, and a chute 36 of about 45 degrees is formed between the positioning surface 35 and the copper foil supply unit 4 on the left. Further, the positioning surface 35
A chute 37 having the same angle as the chute 36
The lower end and the copper foil-plate overlapping portion 8
Runway forming member 1 according to the present invention, which can move forward and backward between
40 are provided as shown. This is a nearly horizontal inclination angle. The positioning portion 7 alternately takes the position shown in FIG. 2 and the position (FIGS. 8 and 9) immediately above the overlapping portion 8.

Next, the details of the laminated portion 2 will be described with reference to FIGS.
This will be described with reference to FIGS. As clearly shown in FIG. 12, the main laminating section 2 is provided with a support table 41 supported at the upper end of a lifter 40 via a roller 20b, and a cushion material is attached thereon without being specified. Further, on both sides, a pair of dust collecting devices 42A and 42B are configured to move up and down in conjunction with the up and down movement of the support base 41. Support table 41
As described later, a stacked body Q of a plate p and a copper foil m and a stacked body S of a copper foil m and an insulating plate z are alternately stacked by repeating the holding and detaching of the chuck devices 11A and 11B. However, the dust collectors 42A and 42B move up and down in order to match the chuck devices 11A and 11B according to the stacking height, and accordingly, the dust collectors 42A and 42B face the cushion material level at the beginning of the stacking. , And moves down as the height increases, and is driven so as to be opposed to both sides of the uppermost stacked body.

Here, the laminating section 20 and the chuck device 11A
This will be described with reference to FIGS. Since the chuck devices 11A and 11B have the same configuration, only one device 11A will be described.
As shown in FIG. 12, eight chuck portions 11b, 11b are provided on both sides of the connecting member 11a.
c so as to be rotatable around the cylinder 11
As shown in FIG. 11, the rods 11g and 11g press the both edges of the stacked body Q of the copper foil m and the plate p between the rods 11g and 11g and the lower end of the chuck portion 11b by d and 11d. In the central portion, the rod 11f is pressed against an intermediate portion of the stacked body Q when the rod 11f is stopped by bringing the stacked body Q into contact with the support plate 20a of the stacked portion 20 by the cylinder 11e. The support plate 41 is stably mounted on the roller 20b, and after laminating thin plates to a predetermined height, the chuck devices 11A and 11B
Are moved to a position where they do not interfere with each other.
And transport the laminate to the next step by these rolling.

As described above, the dust collecting devices 42A and 42B are disposed on both sides of the laminating portion 20, but a duct d is attached to the upper end thereof, and these upper ends are clearly shown in FIG. A slit-shaped opening 42a is formed in such a manner as to form a slit. The opening 42a is elongated and opposes both edges of the stacked body Q. The duct d is shown in FIGS.
The guide member f is attached to this, and the duct d moves up and down by the driving of the cylinder device h.
3) It is configured so as to be guided linearly and accurately in the vertical direction. The guide body e is configured to regulate the upper and lower positions of the duct.

Next, referring to FIG. 2 and FIGS. 14 to 28,
Insulating plate separation, ie, peeling device 10 according to still another invention.
0 will be described. On the right side of the copper foil supply unit 6 on the side of the insulating plate, a large number of insulating plates z are stacked and stored on the table 101. As shown in FIGS. Are stacked one by one by shifting a. The insulating plate z is formed by laminating five 0.2 mm foils and pressing and integrating them, which are stacked as shown in FIGS. 21 and 22. 2 to 5, the peeling device is generally indicated by 100, but as shown in FIG.
A drive mechanism 70 incorporating various guide members and a drive unit is provided on 1a, 51b, and a motor 52 is mounted on a right base 51a, and each member to be described later is connected thereto via a belt and a pulley. Are driven left and right.

A pair of holding devices 53A and 53B are provided on both sides of the insulating plate, and a pair of gripping portions 54a and 54b can be opened and closed and moved back and forth by cylinders 55a and 55b at the ends. ing. In FIG. 16, a peeling member 56 is provided below these pressing devices 53A and 53B.
a is provided, which can be moved left and right by the guide device 71. In FIG. In the middle of these right and left positions,
The carry-out devices 57A and 57B are provided, and a pair of foil press pads 58a and 58b are provided at the distal end thereof, as shown in FIGS. Further, an engaging portion 59 for pushing the peeled uppermost insulating plate z to the left in FIGS. 25 and 26 is provided behind this. As clearly shown in FIG. 21, the peeling member 56 further includes a flat plate-shaped peeling plate 56a whose tip is bent downward.

The configuration according to the embodiment of the present invention has been described above. Next, this operation will be described.

As shown in FIGS. 1 and 2 and FIGS. 7 to 10, in the left plate supply section 3, a plate made of stainless steel is loaded one by one from a laminating section (not shown) by a roller 21 and is supplied to a predetermined position. Is stopped at the position of. In the upper copper foil supply section 4, a large number of copper foils m are stacked, but the front end is adsorbed by the pad section 32a of the rear vacuum pad 32 in the positioning section 7, so that only one sheet is on the right side in the drawing. Transferred to. Copper foil m
Slides along the chute 36, is positioned on the positioning surface 35, and stops.

On the other hand, the fork portion 9a, which is the mounting portion of the shuttle device 9, moves the plate p positioned and stopped on the roller 21 when the shuttle device 9 moves to the left by a predetermined pitch in the drawing. When the shuttle device 9 is lifted up from below and enters the lower portion, the shuttle device 9 is lifted up by a predetermined pitch, detached from the roller 21, placed on the fork 9a, and then moved rightward by a predetermined pitch. As a result, the shuttle device 9 is brought to a position immediately above the plate positioning portion, and further placed here by the downward movement of the shuttle device 9 (FIG. 5).

At this time, the plate p which has been transferred earlier by the rightward movement of the shuttle device 9 is transferred to and placed on the overlapping portion 8 (FIGS. 2 and 3). Here, the front end of the copper foil m positioned by the positioning section 7 is adsorbed by the pad section 33a of the front vacuum pad 33,
When the positioning part 7 moves to the right and downward by a predetermined pitch, the rear end of the copper foil m slides on the chute 37 (FIG. 8), and is positioned on the already positioned and stopped plate p. And stops (FIG. 9).

According to the present invention, the runway forming member 1 having a very small inclination is provided between the lower end of the chute 37 and the overlapping portion 8.
Although 40 is provided so as to be able to move back and forth, it moves forward before the rear end of the copper foil m passes through the lower end of the chute 37.
Therefore, after the rear end slides on the chute 37, it slides on the runway forming member 140. Therefore, the slideway is slid thereon and brought to the overlapping portion 8. However, since the runway forming member 140 is not provided as shown in FIG.
mm and a thin copper foil m
The rear end ma was rounded due to the air gap between the air gap between the air gap and the overlapping portion 8 and the air flow above the air gap. Positioned. Thereafter, the positioning unit 7
Moves by a predetermined pitch to the position shown by the solid line as shown in FIG.

The shuttle device 9 receives the stacked body by upward movement, moves to the right by a predetermined pitch, and reaches the standby unit 10a. Here, the chuck device 11A is brought directly above this, and the chuck portions at both ends perform a closing motion to hold the stacked body Q of the copper foil m and the plate p. Thereafter, the chuck device 11A moves rightward at a predetermined pitch to reach a position directly above the stacked unit 2. Next, the chuck portion 11b is opened and the stack Q of the copper and the plate is placed on the support plate 40 supported by the lifter 40 which is positioned immediately below and adjusted at a predetermined height. At this time, the pressing rod 11f at the center moves downward, and after pressing the center of the stacked body Q against the cushioning material (the stacked body Q is now positioned at the bottom), the chuck 11b is opened. As it exercises, it is stably held on the cushioning material. Further, since the dust collecting devices 42A and 42B are positioned and fixed on both sides, both ends of the stacked body Q are held by the chuck devices 11A and 42B.
When it comes off from A, it comes into contact with the cushion material, but is placed on the cushion material without suction of small dust or dirt due to suction of dust collectors 42A and 42B.

The above is the copper foil m on the left in FIGS.
The mechanism of stacking the plate and the plate p has been described.
The function of the mechanism for superimposing the insulating plate z and the copper foil m located on the right side of FIG.

Although a large number of insulating plates z are deposited on the insulating plate supply section 5, the uppermost insulating plate z is peeled one by one from the lower insulating plate z one by one by the peeling device 100, and the process proceeds to the next step. Is supplied. 15 and 21, first, the holding claws 54a and 54b and the holding rod 54c of the holding device 53A move downward, and the edge of the second-stage insulating plate z is pressed by the holding rod 54c (FIG. 22). Thereafter, the cylinder 55
b to advance the claws 54a and 54b as shown in FIG. 22 to take a position (FIG. 23) sandwiching the left end of the insulating plate z, and then the end of the insulating plate z by the action of the cylinder 55a. Take the ascending position while holding
4). Thereafter, the peeling member 56a moves rightward as shown in FIG. As a result, the space between the uppermost insulating plate z and the second insulating plate z was in close contact, but this was peeled off.

During this process, the holding devices 57A and 57B hold down the long sides of the second-stage insulating plate z. The peeling member 56a moves to the right position in FIG.
26 is moved from the position shown in FIG. 25 to the position shown in FIG. 26 by the transport mechanism 101 incorporated in the holding devices 57A and 57B.
26a moves downward after passing through as shown in FIG. 26,
Thereafter, as shown in FIGS. 27 and 28, the long side portion of the insulating plate z is pushed by the claw portion 59 as the V-shaped engaging portion, whereby the uppermost insulating portion is pressed as shown in FIG. Only the plate z is positioned and carried into the first standby portion A in FIG.

Although not shown, a transfer means is provided between the insulating plate supply section 5 and the positioning section 6 in FIGS. 1 and 2, which is provided with a pair of claws, and As described above, the left edge of the uppermost insulating plate z extruded by a predetermined distance from the peeling device 100 is sandwiched, and the sandwiched insulating plate z is transported to the left by a predetermined distance in FIGS. 1 and 2,
It is placed on the standby unit A.

On the other hand, one copper foil m is supplied from the copper foil supply unit 6 to the positioning unit 13 in the same manner as the left-side plate-copper foil stacking mechanism, and is positioned and waiting. By moving the predetermined pitch to the left, the insulating plate z placed on the first standby unit A is transferred directly below the positioning unit 13, and the shuttle device 14 further moves the predetermined pitch to the left at this time. By the movement, the insulating plate z placed earlier
Are positioned in the overlapping portion 12 and wait for the overlapping of the copper foil m. As described above, one piece of copper foil m is accurately positioned on the standby insulating plate z from the positioning portion 13 and is superposed. In this case as well, the runway forming member moves forward between the chute and the overlapping portion, thereby eliminating the curl phenomenon at the rear end, which has been conventionally seen. Therefore, as described above, the copper foil m is overlapped with being accurately positioned on the insulating plate z.

Next, the chuck device 11B moves from the position shown in FIG. 2 to a position immediately above the standby portion 10b as shown in FIG. In other words, the shuttle device 14 is located immediately above the stacked body S of the copper foil m and the insulating plate z transferred to the standby unit 10b by moving the shuttle device 14 to the left at a predetermined pitch. The chuck portion 11b is held by gripping both ends of the stacked body S of the copper foil m and the insulating plate z (FIG. 5). Next, it moves by a predetermined pitch directly above the laminated portion 2 (FIG. 6). A stacked body P of a copper foil and a plate is already placed on the base 20a from the left side in the laminated portion 2, and a stacked body S of an insulating plate z and a copper foil m is further placed thereon. Is done. Also at this time, the dust collecting ports 42a of the dust collectors 42A and 42B are positioned and arranged on both sides, so that when the chuck device 11B separates both ends of the stacked body S from the chuck portion 11b, dust and dirt are removed. Occurs.
This is immediately sucked to produce a high-quality laminate. Hereinafter, similarly, the stacked body P of the copper foil and the plate is stacked on the stacked portion 2 from the left, and then the stacked body S of the insulating portion and the copper foil is stacked on the stacked portion 2 from the right. The dust collectors 42A and 42B descend according to the stacking height, so that the stacked bodies P and Q are stacked.
The dust and garbage that had accumulated each time it was supplied no longer occurred.

14 to 28 show details of the peeling device 100. FIG. 16 shows an enlarged view of a part of FIG. 14, and the holding device 53A has a pair of claw portions 54 as described above.
a and 54b (see also FIGS. 21 to 24),
A peeling member 56a is provided on this side. FIG. 17 shows details of the guide device 70, and the guide rail 71 having a rectangular cross section is fixed to the gantry 51a, 51b.

In FIG. 17, the lower part of the mounting plate g is linearly guided left and right through a member slidably fitted to the projection 71a of the guide rail 71 as shown in FIG. A peeling body mounting plate f 'is fixed to the vertical wall portion, and the peeling body 56 is further fixed to the vertical wall portion, and a peeling member 56a is formed at this end. The pressing device 53A is configured to be movable rightward in FIG. 17 along the guide rod n as indicated by a dashed line.

In FIG. 21, the claw 5 of the pressing device 53A is
4a and 54b are shown in detail, but the lower claw 54b
Is provided with a spherical holding portion 54c below. This have been stacked being shifted by length a and the insulating plate z ₂ of the uppermost insulating plate z ₁ and the second stage in the insulating plate supply unit, which is initially moved downwardly, 2 as shown in Figure 22 press insulating plate z ₂ of stage downward, subsequent third stage the insulating plate z _3, z ₄ · ·
- the holding down, thereafter, by pawls 54a, only 54b is moved to the right illustrates an insulating plate z ₁ of the uppermost, and an insulating plate z ₂ of the second stage being held down a tip To separate. Thereafter, as shown in FIG.
Although but is advanced to the right, the claw portion 54a to the front, 54b is closed and sandwich the insulating plate z ₁ uppermost as shown in Figure 23. In this state, the peeling member 56a further advances rightward. Thus long-side edge portion of the insulating plate z ₁ is peeled off reliably in the second stage from the insulating plate z _2. Pressing as described above apparatus 57A in this state, 57B is the hold-down edge of the insulating plate z ₂ of the second stage, Figure 27, it moved forward to push the engagement member 59 as shown in Figure 28, the insulating top of to push only the plate z _1. In FIG. 27, a cylinder 101 as a transporting means moves the push engagement member 59 to the left in the figure. A V-shaped groove 59a is formed at the tip of the member 59. On the lower surface, thin plates 59b and 59c are fixed, and as shown in FIGS. 27 and 28, the uppermost insulating plate z is held by these components, that is, is pushed while being positioned. Then, gripping the edge of the insulating plate z ₁ the uppermost is not shown that extrusion is the pair of gripping the drawer device in FIG. 1, the standby unit located above the right mounting portion of the shuttle device 14 And transport. Less than,
Similarly, the second and third insulating plates z ₂ , z _3, ... Are sequentially pushed to the standby unit at a predetermined tact.

FIGS. 18 to 28 show the details of the operation of the peeling apparatus 100. FIGS.
7A (Since it is the same as 57B, only one will be described.)
Is a pair of holding members 59c, 59c, guide plate 5
9b, a push engagement member 59 having a V-shaped groove therebetween is provided, and these are integrally driven by the cylinder 101. Figure 25 shows a state in which insulating plate z ₁ the uppermost is not yet peeled off, the peeling as described above member 5
When 6a comes off as shown in FIG.
01, and then, as shown in FIG. 27, the cylinder 96 is driven to move the push engagement member 59 downward,
The second stage of the insulating plate z ₂ hold down. Next, as shown in FIG.
An insulating plate z ₁ V groove 59a of the uppermost 9 as shown in FIG. 28, is pushed to the left as viewed in FIG. Therefore, as described above, it is positioned and stopped at the standby unit.

As described above, according to the thin plate laminating apparatus 1 according to the embodiment of the present invention, a stack of the copper foil m and the plate p made of stainless steel and further over this with a higher throughput (production efficiency) than before. The stacked body S composed of the copper foil m and the insulating plate z is alternately stacked without dust or dust.

Although the embodiments of the present invention have been described above, the present invention is, of course, not limited thereto, and various modifications can be made based on the technical concept of the present invention.

For example, in the above embodiment, the laminated body P of the plate and the copper foil and the laminated body Q of the insulating plate and the copper foil are used to sequentially laminate the laminated body 2 from both sides of the laminated portion 2. The present invention is not limited to this, and can be applied to laminating only the laminated body of the plate and the copper foil in the laminating section 2 from one side, for example, from the left side. Further, the thin plate is not limited to a copper foil, an insulating plate or a plate, and may be a thin plate of another material. Further, in the present embodiment, the respective stacked bodies are sequentially laminated from both sides of the laminated portion. However, it is also possible to laminate the laminated body 2 to the laminated portion 2 from both sides in a direction perpendicular to this at approximately twice the speed. The present invention is applicable.

[0039]

As described above, according to the thin plate laminating apparatus of the present invention, a high quality laminated body of thin plates can be obtained with a larger throughput than in the past.

[Brief description of the drawings]

FIG. 1 is a plan view showing an entire thin plate laminating apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a view showing the same operation.

FIG. 4 is a view showing the same operation.

FIG. 5 is a view showing the same operation.

FIG. 6 is a view showing the same operation.

FIG. 7 is a side view showing details of a positioning portion of the copper foil in FIGS. 1 and 2;

FIG. 8 is a view showing the same operation.

FIG. 9 is a view showing the same operation.

FIG. 10 is a side view showing details of a conventional copper foil positioning section.

FIG. 11 is a front view showing details of a laminated portion located at a central portion in the apparatus.

FIG. 12 is a side view of the same.

13 is an enlarged sectional view taken along the line [13]-[13] in FIG.

FIG. 14 is a plan view showing the entire peeling device shown in FIGS. 1 and 2;

FIG. 15 is a side view of the same.

FIG. 16 is a partially enlarged plan view of FIG. 14;

FIG. 17 is a sectional view taken along the line [17]-[17] in FIG. 16;

FIG. 18 is an enlarged plan view showing another main part of the peeling device.

FIG. 19 is an enlarged plan view showing the same operation.

FIG. 20 is an enlarged plan view showing the same operation.

FIG. 21 is an enlarged sectional view of a main part of the peeling device.

FIG. 22 is an enlarged sectional view showing the same operation.

FIG. 23 is an enlarged side view showing the same operation.

FIG. 24 is an enlarged sectional view showing the same operation.

FIG. 25 is an enlarged sectional view of still another main part of the peeling apparatus.

FIG. 26 is an enlarged sectional view showing the same operation.

FIG. 27 is an enlarged sectional view showing the same operation.

FIG. 28 is an enlarged sectional view showing the same operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thin-plate laminating apparatus 2 Laminating part 7 Plate side-copper foil positioning part 13 Insulating plate side-copper foil positioning part 33 Vacuum pad 40 Lifter 42A, 42B Dust collector 53A, 53B Pressing device 56a Peeling member 59 Pushing member Joint member 100 Peeling device 140 Runway forming member

Claims (7)

[Claims] 1. At least two kinds of thin plates are superimposed,
A thin sheet laminating apparatus which conveys a sheet to a stacking section and sequentially stacks the sheet on the stacking section, wherein the first thin sheet is positioned and placed on a positioning section, and is conveyed while adsorbing a front end to a vacuum pad. In the thin plate laminating apparatus in which the end is slid along the chute and positioned on the second thin plate positioned and placed on the standby portion, the end portion is positioned between the lower end of the chute and the standby portion. A runway forming member having a small inclination is provided so as to be able to move forward and backward, and when the first thin plate is sucked by the vacuum pad and the rear end is slid along the chute, the rear end of the first thin plate The runway forming member is advanced and conveyed along the runway forming member before the section passes the lower end of the chute, and the rear end of the first thin plate has passed the tip of the runway forming member. At or immediately before passing the runway forming member Sheet stacking device which is characterized in that as cause retraction. 2. The method according to claim 1, wherein the first thin plate is a copper foil, and the second thin plate is a copper foil.
The thin plate laminating apparatus according to claim 1, wherein the thin plate is a steel plate or an insulating plate. 3. The position of the first thin plate is supplied to the positioning portion by suctioning a front end portion of the first thin plate by a second vacuum pad on a rear side. The thin plate laminating apparatus according to claim 2. 4. Laminating at least two kinds of thin plates,
A thin sheet laminating apparatus which conveys to a laminating section and sequentially laminates the laminating section, wherein a dust collecting port of a dust collector is vertically movably provided on both sides of the laminating section, and the laminating section has a laminating height of the thin plates. Wherein the two dust collection ports are also lowered in accordance with the amount of the descent when the sheet is lowered in accordance with (1). 5. The laminate according to claim 4, wherein the laminated portion has a flat support bottom surface, and a cushion material is placed thereon, and the thin plate is laminated on the cushion material. Thin sheet laminating equipment. 6. At least two kinds of thin plates are superimposed,
A thin sheet laminating apparatus which conveys a sheet to a stacking section and sequentially stacks the sheet on the stacking section, wherein the first thin sheet is positioned and placed on a positioning section, and is conveyed while adsorbing a front end to a vacuum pad. In a sheet laminating apparatus in which an end is slid along a chute and is superimposed on a second thin plate positioned and placed on a standby portion, the second thin plate has a square shape. The second thin plate is alternately shifted by a predetermined length on a short side or a long side parallel to the conveying direction to the standby unit, and is deposited. While pressing downward by the first pressing means, the peeling means is moved along the long side or the short side between the uppermost step and the second step of the second sheet, and the uppermost second sheet is moved. Peeling from the second thin plate in the second stage over the entire long side or short side, Holding the long side or the short side of the uppermost second thin plate, and extruding the second thin plate to the standby unit, and then transferring the second thin plate of the second stage to the standby unit by the transfer means. In the case of extruding, the second pressing means located at a position opposed to the first pressing means presses the short side or the long side of the second thin plate of the third stage downward, and peels off. Moving the means along the long side or short side of the second thin plate, and moving the second thin plate of the second stage from the second thin plate of the third stage over the entire long side or short side Peeling, holding the peeled long side or short side by the transporting means, and extruding the second thin plate to the standby section in the same manner. A thin plate laminating apparatus characterized in that: 7. The first thin plate is a copper foil, and the second thin plate is a copper foil.
7. The thin plate laminating apparatus according to claim 6, wherein the thin plate is an insulating plate.