WO2007018040A1

WO2007018040A1 - Sheet cutting device and cutting method

Info

Publication number: WO2007018040A1
Application number: PCT/JP2006/314851
Authority: WO
Inventors: Kenji Kobayashi; Hideaki Nonaka
Original assignee: Lintec Corporation
Priority date: 2005-08-08
Filing date: 2006-07-27
Publication date: 2007-02-15
Also published as: TW200714430A; JP4739853B2; JP2007044774A

Abstract

A sheet cutting device (15) for adhering an adhesive sheet (S) to wafers (W) that are supported on a table (13) and cutting the sheet (S) along the outer edges of the wafers (W). The cutting device (15) has a multi-joint robot for sequentially cutting the adhesive sheet (S) along the outer edges of the wafers (W), with the adhesive sheet (S) having a size that covers the wafers (W) adhered to the table (13).

Description

Specification

Sheet cutting device and cutting method

Technical field

[0001] The present invention relates to a sheet cutting apparatus and a cutting method, and more specifically, in a state where a sheet is attached to a plurality of plate-like members supported by a table so as to straddle each plate-like member. The present invention relates to a sheet cutting apparatus and a cutting method that can sequentially cut a sheet along the outer edge of each plate-like member.

Background art

Conventionally, a protective sheet for protecting the circuit surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) is pasted, or a heat-sensitive adhesive sheet is pasted on the back surface or the front surface. To be done.

[0003] As a method for attaching such a sheet, a raw material in which a belt-like sheet is temporarily attached to a belt-like release sheet is used, the sheet is peeled off from the release sheet and attached to the wafer, and then along the wafer outer periphery. A method of attaching a sheet on a wafer by cutting is known (for example, see Patent Document 1).

[0004] Patent Document 1: Japanese Patent No. 2919938

Disclosure of the invention

Problems to be solved by the invention

However, the cutting apparatus disclosed in Patent Document 1 is intended for a case where the wafer supported by the table is one, and a plurality of wafers are placed on the same plane. It is inconvenient that it cannot be placed and cut sequentially.

Further, since the cutting device is configured to include a force cutter blade at the tip of an arm having a rotation center on the center line of the wafer, the movement trajectory of the cutter blade is in the circumferential direction, and has various planar shapes. When a sheet is attached to a plate-like member, the sheet cannot be cut along the outer edge of the plate-like member.

[0006] [Object of invention]

The present invention has been devised by paying attention to such inconveniences. It is an object of the present invention to provide a sheet cutting apparatus and a cutting method capable of sequentially cutting a sheet affixed across a plate member along the outer edge of the plate member.

[0007] Another object of the present invention is to perform heating for each region supporting a plate-like member whose sheet has been cut when performing sheet cutting on a plurality of plate-like members. It is an object of the present invention to provide a sheet cutting apparatus and a cutting method capable of securing the heating time for a sheet-shaped plate-shaped member, which is necessary for adhesion, while the sheet-shaped member is being cut.

Means for solving the problem

[0008] In order to achieve the above object, the present invention provides a sheet cutting apparatus for cutting a sheet along an outer edge of the plate member after the sheet is attached to a plate member supported by a table.

In the sheet cutting device, a plurality of plate-like members are arranged on the table, and sheets having a size straddling each plate-like member are attached, and sheets are sequentially placed along the outer edge of each plate-like member. It is configured to cut.

[0009] In the present invention, it is preferable that the sheet cutting device is constituted by an articulated robot.

[0010] The table can be heated for each plate-like member from which the sheet is cut.

Furthermore, the plate-like member is a semiconductor wafer, and the sheet is a protective sheet that protects the circuit surface of the wafer.

[0012] The plate-like member is a semiconductor wafer, and the sheet is a heat-sensitive adhesive sheet.

[0013] Further, the plate-like member may be a compound wafer, and the sheet may be a protective sheet that protects the surface of the wafer.

[0014] Further, the articulated robot is configured to include a cutter blade provided with a blade at the tip of a blade holder on the free end side, and the blade is heated according to the property of the sheet and / or is subjected to vibration. It is good to adopt the configuration of being given.

[0015] Further, the present invention provides a sheet cutting method for cutting the sheet along an outer edge of the plate-like member after sticking the sheet to the plate-like member supported by the table. After arranging a plurality of plate-like members on the table, a sheet having a size straddling each plate-like member is affixed to the plate-like member, and in this state, sheets are sequentially placed along the outer edge of each plate-like member. The method of cutting is used.

The invention's effect

[0016] According to the present invention, a plurality of plate-like members are arranged on the table, and the sheets attached to these plate-like members are sequentially cut along the outer edges of the plate-like members. And cutting can be performed very efficiently.

In addition, since each plate-like member is heated on the table, when the adhesive sheet is a heat-sensitive adhesive sheet, when cutting the sheet of another plate-like member, the outer edge sheet has already been cut. By heating the wafer that has been completed, sufficient heating can be performed to bond the adhesive sheet to the wafer.

Furthermore, the blade of the cutter blade is heated according to the properties of the sheet and / or given vibration, so that the cutting performance can be exhibited well.

Brief Description of Drawings

FIG. 1 is a schematic front view of a sheet sticking device according to the present embodiment.

FIG. 2 is a schematic perspective view of the sheet sticking apparatus.

FIG. 3 is an enlarged perspective view showing a distal end side region of the cutting device.

FIG. 4 is an enlarged perspective view of the cutter blade.

FIG. 5 is a partial cross-sectional view of a table and a cutting device.

Explanation of symbols

[0018] 10 sheet sticking device

13 tables

15 Cutting device

62 Robot body

63 Cutter blade

63A blade holder

63B blade

S adhesive sheet w Wafer (plate member)

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic front view of a sheet sticking device to which a cutting device according to the present invention is applied, and FIG. 2 shows a schematic perspective view thereof. In these drawings, the sheet affixing device 10 is fed to the upper side of the sheet feeding unit 12 arranged on the upper part of the base 11, the table 13 supporting the UENO and W as the plate-like members, and the UENO and W. A pressing roller 14 that applies a pressing force to the bonded sheet S and affixes the adhesive sheet S to the wafer W, and affixes the adhesive sheet S to the wafer W and then cuts the adhesive sheet S along the outer edge of the wafer W The cutting device 15 includes a peeling device 18 that peels the unnecessary adhesive sheet S1 outside the wafer W from the upper surface force of the table 13, and a scraping device 19 that winds up the unnecessary adhesive sheet S1.

[0021] The sheet feeding unit 12 includes a support roller 20 that supports a roll-shaped raw sheet L in which a strip-shaped adhesive sheet S is temporarily attached to one surface of a strip-shaped release sheet PS, and the support roller 20 The peeled-out sheet L is abruptly reversed to peel the adhesive sheet S from the release sheet PS, the peel plate 22 that winds up and collects the release sheet PS, the support roller 20 and the recovery roller 23 A plurality of guide rollers 25 to 31 arranged between the guide rollers 25 and 26, a buffer roller 33 arranged between the guide rollers 25 and 26, and arranged between the guide rollers 27 and 28, and supported by the load cell 39 and the load cell 39 The tension measuring means 35 including the tension measuring roller 40 positioned on the base side of the peel plate 22, and the peel plate 22, guide rollers 27, 28, 29, and the tension measuring means 35 are integrally supported and pressed. B It is configured to include a sticking angle maintaining means 37 that interacts with the roller 14 and keeps the sticking angle Θ of the adhesive sheet S to the wafer W constant. The guide rollers 27 and 29 are provided with brake shoes 32 and 42. These brake shoes 32 and 42 correspond to the cylinders 38 and 48 when the adhesive sheet S is attached to the wafer W, respectively. By advancing and retreating with respect to the guide rollers 27 and 29, the adhesive sheet S is sandwiched and its feeding is suppressed.

[0022] The sheet feeding unit 12 and the tension measuring means constituting the unit 35 and the sticking angle maintaining means 37 are the same as those disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and detailed description thereof is omitted here.

[0023] As shown in FIGS. 2 and 5, the table 13 is arranged in four locations so as to be adjacent to each other in the region of the outer table 51 and the outer table 51 having a substantially square shape in plan view. The inner table 52 is substantially circular in plan view. The outer table 51 is provided with four recesses that can receive the inner table 52 in a state where gaps C are formed between the outer table 51 and the outer edge of each inner table 52. It can be moved up and down with respect to the machine 11. On the other hand, each inner table 52 is provided so as to be movable up and down with respect to the outer table 51 via a single-axis robot 56. Accordingly, the outer table 51 and each inner table 52 can be moved up and down integrally, and can be moved up and down independently of each other, so that depending on the thickness of the adhesive sheet S and the thickness of the wafer W, It can be adjusted to a fixed height position. In the present embodiment, each inner table 51 can be heated via heating means (not shown). Therefore, when a heat-sensitive adhesive sheet is adopted as the adhesive sheet S, the wafer W can be heated and bonded.

The pressing roller 14 is supported via a portal frame 57. Cylinders 59, 59 are provided on the upper surface side of the portal frame 57, and the pressure roller 14 is provided so that it can be moved up and down by the operation of these cylinders 59. The portal frame 57 is provided so as to be movable in the X direction in FIG. 1 via a single-axis robot 60 and a guide rail 61 as shown in FIG.

[0025] The cutting device 15 is constituted by an articulated robot. That is, as shown in FIGS. 3 to 5, the cutting device 15 includes a robot main body 62 and a cutter blade 63 supported on the free end side of the robot main body 62. As shown in FIG. 5, the robot body 62 includes a base portion 64 and first arm 65A to sixth arm 65F arranged on the upper surface side of the base 64 portion and provided to be rotatable in the directions of arrows A to F. And a tool holding chuck 69 attached to the distal end side of the sixth arm 65F, that is, the free end side of the robot body 52. The second, third, and fifth arms 65B, 65C, and 65E are rotatably provided in the YXZ plane in FIG. 5, and the first, fourth, and sixth arms 65A, 65D, and 65F have their axes. Around It is provided rotatably. The robot body 62 as the cutting device 15 in this embodiment is NC-controlled, and the cutter blade 63 is moved to the outside position where the upper region force of the table 13 is out of the table 13 during the non-cutting operation, that is, the table 13. It is provided to retreat to the side position.

[0026] As shown in FIG. 3, the tool holding chuck 69 is disposed in a substantially cylindrical cutter blade receptacle 70 and at a position spaced apart by approximately 120 degrees in the circumferential direction of the cutter blade receptacle 70. And three chuck claws 71 for detachably holding the cutter blade 63. Each chuck claw 71 is a pointed portion 71A having an acute inner end, and can advance and retreat in the radial direction with respect to the center of the cutter blade receiver 70 by pneumatic pressure.

As shown in FIG. 4, the cutter blade 63 includes a blade holder 63A that forms a base region, and a blade 63B that is inserted and fixed to the distal end side of the blade holder 63A. The blade holder 63A has a substantially cylindrical shape, and grooves 72 having a length extending from the base end to the intermediate portion are formed along the axial direction at positions at intervals of about 120 degrees in the circumferential direction on the outer peripheral surface. By engaging the tip-shaped portion 71A of the chuck claw 71, the position of the cutter blade 63 with respect to the tool holding chuck 69 can be kept constant! /.

[0028] The blade holder 63A incorporates a heater (not shown) and a vibration device. The blade 63B can be heated by the heater and the blade 63B can be vibrated by the vibration device. ing. In addition, a coil heater can be illustrated as a heater, and an ultrasonic vibration apparatus can be illustrated as a vibration apparatus.

[0029] As shown in FIGS. 1 and 2, the peeling device 18 includes a small-diameter roller 80 and a large-diameter roller 81. The small diameter roller 80 and the large diameter roller 81 are supported by the moving frame F. This moving frame F is composed of a front frame F1 relatively disposed along the Y direction in FIG. 2 and a rear frame F2 connected to the front frame F1 via a connecting member 83. The rear frame F2 is While supported by the single-axis robot 85, the front frame F1 is supported by the guide rail 61, so that the moving frame F can move in the X direction in FIG. As shown in FIG. 1, the large-diameter roller 81 is supported by an arm member 84, and the arm member 84 is moved in a direction in which the large-diameter roller 81 is separated from and approaches the small-diameter roller 80 by a cylinder 88. Displaceable. [0030] The scraping device 19 is supported on the driving roller 90 supported by the moving frame F and the free end side of the rotating arm 91, and is in contact with the outer peripheral surface of the driving roller 90 via the spring 92. It is constituted by a take-off roller 93 that pulls up S1. A drive motor M is disposed at the shaft end of the drive roller 90. The drive roller 90 rotates by driving the motor M, and the take-off roller 93 rotates following the rotation of the drive roller 90. It is getting rolled up. Note that the scraping roller 93 rotates to the right in FIG. 1 against the force of the spring 92 as the scraping amount increases.

[0031] Next, a method for cutting the adhesive sheet S in the present embodiment will be described. Note that the bonding method of the adhesive sheet S is substantially the same except that the wafer W is supported on each inner table 52 of the table 13 and the adhesive sheet S is applied almost simultaneously so as to straddle the wafer W. Furthermore, this is the same as Japanese Patent Application No. 2005-198806, and therefore the description of the sheet sticking method is omitted here.

As an initial setting, the external dimensions of the wafer, the cutting angle of the cutter blade 63, the orientation of the cutter blade 63, and the like are input to an input device (not shown).

[0033] Next, based on the data input to the input device, not shown in the figure, the movement trajectory data stored in the storage unit of the control device is read, and the blade 63B is on each inner table 52 For each wafer W, the adhesive sheet S is cut along the wafer outline. At this time, if it is difficult to cut the sheet S at room temperature, the blade 63B may be heated by a coil heater, or may be vibrated by an ultrasonic vibration device. As a result, the adhesive sheet S can be cut in a state where the adhesive sheet coincides with the outer edge of the wafer W and the cutting resistance is very small.

[0034] When the cutting of the adhesive sheet S is completed along the outer edge of the wafer W to be cut first, the cutting device 15 causes the cutting device 15 to remove the adhesive sheet S on the next wafer W according to a preset order. Transition to cutting operation. At this time, if the adhesive sheet S is a heat-sensitive adhesive sheet, the inner table 52 that supports the wafer W is heated to heat the adhesive sheet S to the wafer W that has been cut. It is supposed to adhere.

[0035] In this way, when the cutting of the adhesive sheet S is completed along the outer edges of the four wafers W on the table 13, according to the order in which the adhesive sheets S were cut through the transfer device (not shown). Each wafer W is transferred to the next process. Here, the adhesive sheet S is cut. The reason why the wafers W are transferred according to the order in which they are cut is to secure a sufficient heating time for each of the wafers W when the table 13 is heated. For this reason, since the wafer W that was last cut of the adhesive sheet S is also transferred last, the heating time is relative to the wafer W that was first cut of the adhesive sheet S. It will never go away. The transfer device can also be performed using the cutting device 15. In this case, the tool holding chuck 69 can be dealt with by attaching a suction arm (not shown) instead of the cutter blade 63.

[0036] When each wafer W is removed from the inner table 52, the scraping device 19 winds up the unnecessary adhesive sheet S1. Since this torsion is the same as the action disclosed in Japanese Patent Application No. 2005-198806, detailed explanation is omitted here.

Therefore, according to such an embodiment, a plurality of wafers W can be adhered to the same table 13 substantially simultaneously, and the adhesive sheet S is sequentially adhered along the outer edge of the wafer by the cutting device 15. Since the sheet can be cut, it is possible to perform extremely efficient sheet sticking and cutting.

As described above, the best configuration, method, and the like for carrying out the present invention are the forces disclosed in the above description. The present invention is not limited to this.

That is, although the present invention has been illustrated and described with particular reference to particular embodiments, the shape, position, or arrangement of the embodiments described above without departing from the scope of the technical idea and purpose of the present invention. With regard to the above, etc., various changes can be made by those skilled in the art as needed.

[0039] For example, in the above-described embodiment, the wafer W is targeted as the plate-shaped member. Can also be applied. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.

Claims

The scope of the claims

[1] In a sheet cutting device that cuts the sheet along the outer edge of the plate-like member after sticking the sheet to the plate-like member supported by the table,

In the sheet cutting device, a plurality of plate-like members are arranged on the table, and sheets having a size straddling each plate-like member are attached, and sheets are sequentially placed along the outer edge of each plate-like member. A sheet cutting device for cutting.

2. The sheet cutting device according to claim 1, wherein the sheet cutting device is configured by an articulated robot.

3. The sheet cutting apparatus according to claim 1, wherein the table is heated for each plate member from which the sheet is cut.

4. The sheet cutting apparatus according to claim 1, wherein the plate-like member is a semiconductor wafer, and the sheet is a protective sheet that protects a circuit surface of the wafer.

5. The sheet cutting apparatus according to claim 1, wherein the plate-like member is a semiconductor wafer, and the sheet is a heat-sensitive adhesive sheet.

6. The sheet cutting device according to claim 1, wherein the plate-like member is a compound wafer, and the sheet is a protective sheet that protects the surface of the wafer.

[7] The articulated robot is configured to include a cutter blade provided with a blade at a tip of a blade holder on a free end side, and the blade is heated according to the property of the sheet and / or is subjected to vibration. The sheet cutting device according to any one of claims 2 to 6, wherein

[8] According to a sheet cutting method of cutting a sheet along an outer edge of the plate member after the sheet is attached to the plate member supported by the table,

After arranging a plurality of plate-like members on the table, a sheet having a size straddling each plate-like member is affixed to the plate-like member, and in this state, sheets are sequentially placed along the outer edge of each plate-like member. A sheet cutting method characterized by cutting.