TW200714430A - Sheet cutting device and cutting method - Google Patents

Sheet cutting device and cutting method

Info

Publication number
TW200714430A
TW200714430A TW095128544A TW95128544A TW200714430A TW 200714430 A TW200714430 A TW 200714430A TW 095128544 A TW095128544 A TW 095128544A TW 95128544 A TW95128544 A TW 95128544A TW 200714430 A TW200714430 A TW 200714430A
Authority
TW
Taiwan
Prior art keywords
cutting
sheet
wafers
cutting device
adhesive sheet
Prior art date
Application number
TW095128544A
Other languages
Chinese (zh)
Inventor
Kenji Kobayashi
Hideaki Nonaka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200714430A publication Critical patent/TW200714430A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B25J11/0055—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
    • B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A sheet cutting device (15) for adhering an adhesive sheet (S) to wafers (W) that are supported on a table (13) and cutting the sheet (S) along the outer edges of the wafers (W). The cutting device (15) has a multi-joint robot for sequentially cutting the adhesive sheet (S) along the outer edges of the wafers (W), with the adhesive sheet (S) having a size that covers the wafers (W) adhered to the table (13).
TW095128544A 2005-08-08 2006-08-03 Sheet cutting device and cutting method TW200714430A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005229226A JP4739853B2 (en) 2005-08-08 2005-08-08 Sheet cutting device and cutting method

Publications (1)

Publication Number Publication Date
TW200714430A true TW200714430A (en) 2007-04-16

Family

ID=37727229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128544A TW200714430A (en) 2005-08-08 2006-08-03 Sheet cutting device and cutting method

Country Status (3)

Country Link
JP (1) JP4739853B2 (en)
TW (1) TW200714430A (en)
WO (1) WO2007018040A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007041423A1 (en) * 2007-08-31 2009-03-05 Abb Technology Ab Robot tool, robot system and method for machining workpieces
JP2020078837A (en) * 2018-11-12 2020-05-28 リンテック株式会社 Sheet cutting device and sheet cutting method
CN111673766B (en) * 2020-06-19 2021-12-10 江西联麓智能装备有限公司 Industrial cutting robot

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2919938B2 (en) * 1990-09-26 1999-07-19 日東電工株式会社 How to cut an adhesive tape attached to a thin plate
JP2002190457A (en) * 2000-12-20 2002-07-05 Fdk Corp Method for manufacturing and handling element having directivity
JP4311522B2 (en) * 2002-03-07 2009-08-12 日東電工株式会社 Adhesive sheet attaching method and apparatus, and semiconductor wafer processing method

Also Published As

Publication number Publication date
JP2007044774A (en) 2007-02-22
WO2007018040A1 (en) 2007-02-15
JP4739853B2 (en) 2011-08-03

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