WO2007009296A1 - Panneau d’affichage lumineux - Google Patents

Panneau d’affichage lumineux Download PDF

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Publication number
WO2007009296A1
WO2007009296A1 PCT/CN2005/001103 CN2005001103W WO2007009296A1 WO 2007009296 A1 WO2007009296 A1 WO 2007009296A1 CN 2005001103 W CN2005001103 W CN 2005001103W WO 2007009296 A1 WO2007009296 A1 WO 2007009296A1
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WO
WIPO (PCT)
Prior art keywords
heat
light emitting
display panel
light
emitting display
Prior art date
Application number
PCT/CN2005/001103
Other languages
English (en)
French (fr)
Inventor
Jen-Shyan Chen
Original Assignee
Neobulb Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neobulb Technologies, Inc. filed Critical Neobulb Technologies, Inc.
Priority to US11/989,197 priority Critical patent/US7997766B2/en
Priority to EP05772528A priority patent/EP1916648A4/en
Publication of WO2007009296A1 publication Critical patent/WO2007009296A1/zh

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light-emitting display panel, and in particular, a light-emitting device in a light-emitting display panel according to the present invention is coupled to a high-efficiency heat conduction/heat dissipation device (Heat conducting/ Dissipating apparatus), in turn, allows individual illumination devices to operate at high power to enhance the illumination intensity of individual illumination devices.
  • a high-efficiency heat conduction/heat dissipation device Heat conducting/ Dissipating apparatus
  • LED Light emitting diode
  • the light-emitting display panel using the light-emitting diode as the light-emitting source mostly inserts the packaged light-emitting diode or is inserted on a front plate. Since the power is less than one watt, the heat dissipation problem is not serious.
  • the light-emitting display panel of the present invention is connected with a high-efficiency heat conduction/heat dissipation device, so that a high-power light-emitting diode or other high-power light-emitting device can be used as a light-emitting source, and the thermal energy can be guided to dissipate, thereby avoiding the junction temperature of the light-emitting chip often exceeding Damaged by the safe range.
  • the invention provides a light emitting display panel.
  • the light-emitting display panel according to the present invention comprises a front plate, N heat-dissipating/heat-dissipating devices, and N light-emitting devices, wherein N is a natural number.
  • the front panel defines a front side and a back side, and the front panel has N through holes.
  • Each of the N heat/heat sinks corresponds to one of the N holes, and each of the heat/heat sinks includes a heat conducting component and at least one heat sink fin.
  • the thermally conductive element is divided into a neck portion that fits the corresponding hole, a flat portion at the end of the neck portion, and a tail portion. The thermally conductive element passes through the corresponding aperture with its own neck such that its own tail is located on the back side of the front panel.
  • the at least one heat sink fin is disposed around a tail of the heat conducting element.
  • Each of the N illuminating devices corresponds to one of the N holes and is fixed to a flat portion of the heat conducting element passing through the corresponding hole.
  • each of the light-emitting devices is guided to the back side of the front plate by the heat-conducting elements corresponding to the light-emitting devices, and the heat conduction is performed by at least one heat-dissipating fin corresponding to the light-emitting device.
  • the heat energy transmitted by the component is diverged into the surrounding air.
  • the illuminating display panel provided by the invention comprises an independent and heat-dissipating light engine which effectively integrates N heat/heat dissipating devices and N illuminating devices.
  • the columnar heat conducting element can effectively guide the heat energy generated by the light emitting device, and the heat conducting element not only has a larger heat dissipation area than the prior art, but also can guide the heat energy away from the light emitting device, and at least one heat dissipation.
  • the fins immediately dissipate heat into the surrounding air, greatly increasing heat dissipation efficiency.
  • the light-emitting device in the light-emitting display panel of the present invention can effectively reduce the junction temperature by flattening the flat end surface of the heat-conducting component, so that the light-emitting display panel can display the text by using a high-efficiency light-emitting diode chip. Patterns and as a planar illumination source.
  • the light-emitting display panel of the invention can integrate the light-emitting device and the heat-dissipating/heat-dissipating device into a self-contained component, and can effectively conduct heat and have better heat dissipation efficiency.
  • Figure 1 is a partial perspective view showing a light-emitting display panel in accordance with a first preferred embodiment of the present invention.
  • FIG. 2 is a side view showing a light emitting display panel in accordance with a first preferred embodiment of the present invention. detailed description
  • the invention provides an illuminating display panel composed of N high-efficiency and high-power illuminating devices, which can prevent the high-power illuminating chip from lowering its luminous efficiency and life due to excessive temperature of the P-N junction.
  • the light-emitting display panel 1 includes a front plate 12 and N heat conducting/dissipating apparatuses 14 AN light-emitting apparatus 16 , N is a Natural number.
  • the front panel 12 defines a front side and a back side, and has N through holes 122 on which the aperture of each hole 122 is slightly larger than the corresponding light emitting device 122.
  • the front plate 12 is one selected from the group consisting of a cement material, a glass material, a metal material, a wood material, a polymer material, a cement/polymer composite material, and a ceramic/polymer composite material. Made of materials.
  • Each of the N heat/heat sinks 14 corresponds to a hole 122 in the N holes 122.
  • Each of the heat/heat dissipation devices 14 includes a heat-conducting device 142 and at least one heat-dissipating fin 144.
  • the heat conducting element 142 is divided into a neck portion 20 that fits the corresponding hole, a flat portion 22 at the end of the neck portion 20, and a tail portion 24.
  • the heat conducting element 142 passes through the corresponding hole 122 from its own neck 20 and is fixed to the back side of the front panel 12 by screws or other kits such that its own tail 24 is located on the front panel. On the back side of 12.
  • each of the heat conducting elements 142 is also sleeved thereon by a fastener device 17 for attachment to the back side of the front panel 12.
  • the at least one heat dissipation fin 144 is disposed around a tail portion 24 of the heat conduction element 142. The heat generated during the operation of the N light-emitting devices 16 is guided by the N heat-conducting elements 142 to the at least one heat-dissipating fins 144, and the heat is dissipated by the at least one heat-dissipating fins 144.
  • the light-emitting display panel 1 of the present invention has the N light-emitting devices 14 arranged in an array on the front panel 12.
  • Each of the N illumination devices 16 corresponds to one of the N holes 122 and is secured to the flat portion 22 of the thermally conductive element 142 that passes through the corresponding aperture 122.
  • the illuminating device 16 further includes at least two conducting wires 19 for electrically connecting at least one power source or ground. Please refer to FIG. 2.
  • FIG. 2 is a side view showing a light emitting display panel according to a first preferred embodiment of the present invention. As shown in FIG. 2, each of the heat conducting/heat dissipating devices 14 includes a thermally conductive element 142 that is generally cylindrical.
  • the heat conducting element 142 is a heat pipe, a heat column, or a cylinder formed of a material having a high thermal conductivity such as copper, aluminum, or the like, and the column
  • the length of the body exceeds twice the maximum width of at least one of its flat portions.
  • the flat portion 22 of the heat conducting element 142 is processed during the fabrication of the heat conductor of such a columnar structure.
  • the thermally conductive element 142 is passed through the corresponding aperture 122 by its own neck 20 and is secured to the back side of the front panel 12 by a securing kit 17 such that its own tail 24 is located on the back of the front panel 12. On the side.
  • the at least one heat dissipation fin 144 is disposed around a tail portion 24 of the heat conduction element 142.
  • the illuminating device 16 includes at least one semiconductor light emitting die, and the semiconductor light emitting die is a light emitting diode (LED) die or a laser diode die.
  • the bottom of the light-emitting device 16 is made of a polymer material, a metal material, a semiconductor material or a ceramic material, and is fixed on the flat portion 22 of the heat-conducting element 142 and is smoothly joined to the flat portion 22.
  • the light-emitting device 16 of the light-emitting display panel 1 When one of the light-emitting devices 16 of the light-emitting display panel 1 is connected to a power source, the light-emitting device
  • the heat generated by the light-emitting element 142 is guided from the at least one flat portion 22 of the heat-conducting element 142 to the at least one heat-dissipating fin 144, thereby being dissipated by the at least one heat-dissipating fin 144. Since the light-emitting device 16 according to the present invention is in close contact with the at least one flat portion 22 of the heat-conducting element 142 and is kept at a distance from the external power source or control unit, the power source or the control circuit unit can be prevented from directly receiving the light-emitting device. The heat energy generated by 16 is affected.
  • the invention effectively integrates the heat/heat dissipating device 14 and the illuminating device 16 into an independent optical engine with efficient heat dissipation.
  • the present invention utilizes the planar connection of the light-emitting device 16 to the flat end surface of the heat-conducting element 142, and the heat-conducting element 142 has a columnar structure to conduct heat, thereby effectively reducing the junction temperature of the semiconductor die in the light-emitting device 16.
  • the thermally conductive element 142 not only has a greater heat dissipation area than the prior art, but also directs thermal energy through the front panel 12 away from the illumination device 16.
  • the light emitting display panel of the present invention further includes a power supply/control unit for controlling the N light emitting devices.
  • Each of the N light emitting devices is electrically connected to the power supply/control unit with the at least two wires.
  • the control module can control the N illumination devices to emit different colors to display the text pattern, and can also control the N illumination devices to simultaneously emit light as the planar illumination source.
  • the illuminating display panel of the present invention firstly guides the thermal energy away from the illuminating device by the heat conducting element, and then radiates the heat energy transmitted by the heat conducting element to the surrounding air by at least one heat dissipating fin, thereby greatly improving the heat dissipating efficiency. By improving the heat dissipation efficiency, the problem of the efficiency of the semiconductor light-emitting die due to overheating is solved.
  • the illuminating display panel according to the present invention can effectively reduce the junction temperature of the semiconductor die by flattening the illuminating device to the flat end surface of the heat conducting element, and guiding the heat through the substantially columnar structure of the heat conducting element, thereby effectively reducing the junction temperature of the semiconductor die.
  • the illuminating device of the invention can be driven to a higher wattage (greater than 5 watts), so that the luminous efficiency of the illuminating display panel can be greatly improved, and can be used not only as a kanban but also as an illuminating light source.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Description

发光显示面板 技术领域
本发明关于一种发光显示面板 (Light-emitting display panel), 并且特别 地, 根据本发明的发光显示面板中个别的发光装置 (Light-emitting apparatus) 衔接高效率的导热 /散热装置 (Heat conducting/dissipating apparatus),进而让个 别的发光装置能在高功率下操作, 以提升个别的发光装置的发光强度。 背景技术
发光二极管 (Light emitting diode, LED)为一种新兴的照明光源, 具有省 电、 耐震、 反应快、 适合量产等许多优点。 现今的发光显示面板即有不少釆 用发光二极管作为发光装置中的发光源, 并且被广泛地运用在各种场合中, 例如, 交通标志、 广告招牌、 球场的看板等。
然而, 发光二极管本身的发光强度若要提升, 需使用较大的发光驱动芯 片(Emitter chip), 也相应地产生较高的热能。 发光二极管在持续发亮一段时 间后, 会有本身的接合温度 (Junction temperature)升高的问题, 使得发光二极 管本身的发光效率下降, 造成亮度无法提升。 因此, 若要提高发光二极管的 发光强度往往需要在高功率 (至少大于一瓦特)下操作 , 并且以发光二极管为 发光源的发光装置需要具备良好的散热机制, 才能维持亮度并且延长使用寿 命。
现今采用发光二极管作为发光源的发光显示面板,大多是将封装好的发 光二极管接着或是插于一前板上, 由于功率皆低于一瓦特, 因此散热问题并 不严重。本发明的发光显示面板衔接高效率的导热 /散热装置, 因此可使用高 功率的发光二极管, 或其他高功率的发光装置作为发光源, 并将热能引导消 散, 避免发光芯片的结点温度常超过安全范围而损坏。
因此,本发明的一范畴在于提供一种能够挂载多个高亮度发光装置同时 包含良好导热元件的发光显示面板。 于封装阶层内即降低热阻 (Thermal resistance), 达到部分解热效果,有效降低发光芯片的结点温度, 可有效解决 现有技术中的散热问题外, 并提供高强度的发光效果。 发明内容 本发明提供一种发光显示面板。 根据本发明的发光显示面板包含一前 板、 N个导热 /散热装置以及 N个发光装置, 其中 N为一自然数。
该前板其上定义一前侧以及一背侧, 并且该前板上具有 N个穿透的孔 洞。 该 N个导热 /散热装置中的每一个导热 /散热装置对应该 N个洞中的一个 孔洞,并且每一个导热 /散热装置皆包含一导热元件以及至少一散热鳍片。该 导热元件区分为一配合该对应的孔洞的颈部、一位于该颈部的末端的平坦部 以及一尾部。 该导热元件是以其本身的颈部穿过该对应的孔洞, 致使其本身 的尾部位于该前板的背侧。该至少一散热鳍片设置于该导热元件的尾部的一 周围。 该 N个发光装置中的每一个发光装置对应该 N个孔洞中的一个孔洞, 并且固定于穿过该对应的孔洞的导热元件的平坦部上。
藉此,于每一个发光装置运作过程中所产生的热能由对应该个发光装置 的导热元件导引至该前板的背侧, 并且由对应该个发光装置的至少一散热鰭 片将该导热元件所传导的热能发散至周围的空气中。
本发明所提供的发光显示面板, 其中包含将 N个导热 /散热装置与 N个 发光装置有效的整合在一起的独立且具散热效能的发光引擎 (Light engine)。 藉由该柱状的导热元件能将该发光装置所产生的热能有效导引,该导热元件 不但较现有技术具有较大散热面积, 并且能将热能导引远离该发光装置, 并 以至少一散热鳍片立即将热能发散至周围的空气中, 大幅提升散热效率。 相 较于现有技术, 本发明的发光显示面板中的发光装置, 因为整平接合导热元 件的平整端面, 能有效降低结点温度, 使得发光显示面板可运用高效率的发 光二极管芯片来显示文字图案以及作为平面照明光源。
本发明的发光显示面板, 能整合发光装置与导热 /散热装置成一独立式 元件, 并且能有效导热且具有更佳的散热效率。 关于本发明的优点与精神可 以藉由以下的发明详述及附图得到进一步的了解。 附图说明
图 1 是绘示根据本发明的第一优选具体实施例的发光显示面板的部分 外观视图。
图 2 是绘示根据本发明的第一优选具体实施例的发光显示面板的侧视 图。 具体实施方式
本发明提供一种由 N个高散热效率高功率的发光装置所組成的发光显 示面板, 能防止其中的高功率发光芯片因结点 (P-N junction)温度过高而降低 其发光效率及寿命。
请参阅图 1 , 图 1是绘示根据本发明的第一优选具体实施例的发光显示 面板的部分外观视图。 如图 1 所示, 该发光显示面板 1 包含一前板 (Front plate)12、 N个导热 /散热装置 (Heat conducting/dissipating apparatus) 14 A N 个发光装置 (Light-emitting apparatus) 16 , N为一自然数。
该前板 12 上定义一前侧以及一背侧, 并且具有 N 个穿透的孔洞 (Formed-through aperture)122于其上, 其中每一个孔洞 122的孔径略大于对 应该个孔洞 122的发光装置 16的直径。 该前板 12由选自由一水泥材料、 一 玻璃材料、 一金属材料、 一木质材料、一高分子材料、 一水泥 /高分子复合材 料以及一陶瓷 /高分子复合材料所组成的组中的一材料所制成。
该 N个导热 /散热装置中的每一个导热 /散热装置 14对应该 N个孔洞 122 中的一个孔洞 122。 每一个导热 /散热装置 14 皆包含一导热元件 (Heat-conducting device) 142以及至少一夂热鰭片(Heat-dissipating fin) 144。该 导热元件 142区分为一配合该对应的孔洞的颈部 20、 一位于该颈部 20的末 端的平坦部 22以及一尾部 24。该导热元件 142是以其本身的颈部 20穿过该 对应的孔洞 122, 并利用螺丝或是其他套件, 固定于该前板 12的背侧上, 致 使其本身的尾部 24是位于该前板 12的背侧上。 于此实施例中, 每一个导热 元件 142亦利用一固定元件 (Fastening device) 17套设于其上, 以固定于该前 板 12的背侧上。该至少一散热鳍片 144设置于该导热元件 142的尾部 24的 一周围。 藉此, 于该 N个发光装置 16运作过程中所产生的热是由该 N个导 热元件 142导引至该至少一散热鳍片 144, 进而由该至少一散热鳍片 144散 热。
于一实施例中, 本发明的发光显示面板 1, 该 N个发光装置 14是以一 阵列 (Array)形式排列于该前板 12上。
该 N个发光装置 16中的每一个发光装置 16对应该 N个孔洞 122中的 一个孔洞 122, 并且固定于穿过该对应的孔洞 122的导热元件 142的平坦部 22上。 该发光装置 16进一步包含至少两导线 (Conducting wire)19, 用以电连 接至少一电源或接地。 请参阅图 2, 图 2是绘示根据本发明的第一优选具体实施例的发光显示 面板的侧视图。如图 2所示,每一个导热 /散热装置 14所包含的导热元件 142 大体上呈柱状。 于一具体实施例中, 该导热元件 142是一热导管 (Heat pipe)、 热导柱 (Heat column)或由一高导热系数的材料,例如铜、铝等所成形的柱体, 并且该柱体的长度超过其至少一平坦部的最大宽度的两倍。 而该导热元件 142的平坦部 22是在此类柱状结构的导热体制作过程中加工处理而成。该导 热元件 142是以其本身的颈部 20穿过该对应的孔洞 122,并利用一固定套件 17固定于该前板 12的背侧上, 致使其本身的尾部 24位于该前板 12的背侧 上。 该至少一散热鳍片 144是设置于该导热元件 142的尾部 24的一周围。 该发光装置 16 包含至少一半导体发光管芯, 该半导体发光管芯为一发光二 极管 (Light emitting diode, LED)管芯或一激光二极管 (Laser diode)管芯。 该发 光装置 16的底部由一高分子材料、 一金属材料、 一半导体材料或一陶瓷材 料所制成, 固定于该导热元件 142的平坦部 22上, 并与该平坦部 22平整接 合。
当该发光显示面板 1中的一个发光装置 16连接至电源时, 该发光装置
16于发光时所产生的热是由该导热元件 142 自其本身的该至少一平坦部 22 导引至该至少一散热鰭片 144, 进而由该至少一散热鳍片 144散热。 由于根 据本发明中的发光装置 16与该导热元件 142的至少一平坦部 22紧密接合, 而与外接的电源或控制单元之间保持有一段距离,可避免电源或控制电路单 元直接受到该发光装置 16所产生的热能影响。
本发明将导热 /散热装置 14与发光装置 16有效的整合在一起而成为一 独立的具高效散热功能的光学引擎。 本发明利用将发光装置 16平整接合于 导热元件 142的平整端面,通过导热元件 142其 体呈柱状的结构将热引导 开, 而能有效降低发光装置 16内的半导体管芯的结点温度。该导热元件 142 不但较现有技术具有较大散热面积, 并且能将热能导引穿过前板 12而远离 该发光装置 16。
于一实施例中, 本发明的发光显示面板进一步包含一电源供应 /控制单 元控制该 N个发光装置。 该 N个发光装置中的每一个发光装置以该至少两 导线电连接至该电源供应 /控制单元。 该控制模组可控制该 N个发光装置发 出不同颜色来显示文字图案,也可以控制该 N个发光装置同时发光作为平面 照明光源。 本发明的发光显示面板先以导热元件将热能导引远离发光装置,再以至 少一散热鰭片立即将导热元件传导的热能发散至周围的空气中 , 而能大幅提 升散热效率。 藉着散热效率的改善, 解决了因过热造成半导体发光管芯效率 下降的问题。
因此,根据本发明的发光显示面板透过将发光装置平整接合导热元件的 平整端面, 通过导热元件其大体呈柱状的结构将热引导开, 而能有效降低半 导体管芯的结点温度,使得本发明的发光装置能驱动至较高瓦数 (大于 5瓦), 因而发光显示面板的发光效率能大幅提升 , 不仅可作为看板亦可作为照明光 源。
藉由以上优选具体实施例的详述,是希望能更加清楚描述本发明的特征 与精神, 而并非以上述所揭露的优选具体实施例来对本发明的范畴加以限 制。 相反地, 其目的是希望能涵盖各种改变及具相等性的安排于本发明所欲 申请的权利要求的范畴内。

Claims

权利要求书
1. 一种发光显示面板, 包含:
一前板, 该前板其上定义一前侧以及一背侧, 并且该前板上具有 N个 穿透的孔洞, N为一自然数;
N个导热 /散热装置,该 N个导热 /散热装置中的每一个导热 /散热装置对 应该 N个洞中的一个孔洞, 每一个导热 /散热装置皆包含:
一导热元件, 该导热元件区分为一配合该对应的孔洞的颈部、 一位于 该颈部的末端的平坦部以及一尾部, 该导热元件是以其本身的颈部穿过该 对应的孔洞, 致使其本身的尾部位于该前板的背侧; 以及
至少一散热鰭片, 该至少一散热鳍片设置于该导热元件的尾部的一周 围; 以及
N个发光装置, 该 N个发光装置中的每一个发光装置对应该 N个孔洞 中的一个孔洞, 并且固定于穿过该对应的孔洞的导热元件的平坦部上; 藉此,于每一个发光装置运作过程中所产生的热能由对应该个发光装置 的导热元件导引至该前板的背侧, 并且由对应该个发光装置的至少一散热鳍 片消散。
2. 如权利要求 1所述的发光显示面板, 其中该 N个发光装置以一阵列 形式排列于该前板的前侧。
3. 如权利要求 1所述的发光显示面板, 进一步包含一电源供应 /控制单 元,其中该 N个发光装置中的每一个发光装置具有至少两导线, 并且电连接 至该电源供应 /控制单元。
4. 如权利要求 1 所述的发光显示面板, 其中每一个导热元件为一热导 管、 一热导柱或一高导热系数的材料所成形的柱体。
5. 如权利要求 1 所述的发光显示面板, 其中该前板由选自由一水泥材 料、 一玻璃材料、 一金属材料、 一木质材料、 一高分子材料、 一水泥 /高分子 复合材料以及一陶瓷 /高分子复合材料所组成的组中的一材料所制成。
6. 如权利要求 1 所述的发光显示面板, 其中每一个发光装置包含至少 一半导体发光管芯,该半导体发光管芯为一发光二极管管芯或一激光二极管 管芯。
7. 如权利要求 1 所述的发光显示面板, 其中该前板上每一个孔洞的孔 径略大于对应该个孔洞的发光装置的直径。
8. 如权利要求 1所述的发光显示面板, 其中每一个导热 /散热装置进一 步包含一固定元件, 该固定元件套设于该导热 /散热装置的导热元件的尾部 上, 用以将该个导热 /散热装置固定于该前板的背侧上。
PCT/CN2005/001103 2005-07-21 2005-07-22 Panneau d’affichage lumineux WO2007009296A1 (fr)

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4620778B2 (ja) * 2005-08-19 2011-01-26 ネオバルブ テクノロジーズ,インコーポレイテッド 高出力と高熱拡散効率を備えるled照明装置
US7922360B2 (en) * 2007-02-14 2011-04-12 Cree, Inc. Thermal transfer in solid state light emitting apparatus and methods of manufacturing
TWM348981U (en) * 2008-06-12 2009-01-11 Acpa Energy Conversion Devices Co Ltd Heat dissipation module
CA2672629A1 (en) * 2009-01-06 2010-07-06 Jen-Shyan Chen Energy transducing apparatus and energy transducing equipment
TWM362362U (en) * 2009-03-06 2009-08-01 Acpa Energy Conversion Devices Co Ltd Heat conduction structure for heating element
EP2405194A1 (en) * 2010-07-05 2012-01-11 NeoBulb Technologies, Inc. Light-emitting diode illumination platform
JP5673705B2 (ja) * 2013-02-27 2015-02-18 三菱電機株式会社 照明装置
JP6340753B2 (ja) * 2013-03-18 2018-06-13 三菱電機株式会社 発光装置
JP5626432B2 (ja) * 2013-09-03 2014-11-19 三菱電機株式会社 照明装置
CN106652810A (zh) * 2016-11-17 2017-05-10 成都朵猫文化传播有限公司 一种可接入互联网的广告牌

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
US6249267B1 (en) * 1996-02-19 2001-06-19 Rohm Co., Ltd Display apparatus having heat dissipation
CN1560672A (zh) * 2004-02-17 2005-01-05 �Ѵ���ɷ����޹�˾ 背光模块及其散热结构
CN1585244A (zh) * 2004-06-15 2005-02-23 于波 永磁发电机半控整流桥的散热机构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366104U (zh) * 1986-10-20 1988-05-02
JPH0419583Y2 (zh) * 1986-12-28 1992-05-01
JPS63185257U (zh) * 1987-05-22 1988-11-29
JPH01135480U (zh) * 1988-03-07 1989-09-18
JP2001267773A (ja) * 2000-03-16 2001-09-28 Hitachi Ltd 電子部品の冷却装置
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
DE60137972D1 (de) * 2001-04-12 2009-04-23 Matsushita Electric Works Ltd Lichtquellenbauelement mit led und verfahren zu seiner herstellung
CN100373638C (zh) * 2001-12-29 2008-03-05 杭州富阳新颖电子有限公司 发光二极管及其发光二极管灯
US7234844B2 (en) 2002-12-11 2007-06-26 Charles Bolta Light emitting diode (L.E.D.) lighting fixtures with emergency back-up and scotopic enhancement
US6789921B1 (en) * 2003-03-25 2004-09-14 Rockwell Collins Method and apparatus for backlighting a dual mode liquid crystal display
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
JP4236544B2 (ja) 2003-09-12 2009-03-11 三洋電機株式会社 照明装置
CN1680749A (zh) 2004-04-08 2005-10-12 吴裕朝 发光二极管装置、发光二极管散热系统及含其的照明装置
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
CN1605795A (zh) 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
US7331691B2 (en) 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249267B1 (en) * 1996-02-19 2001-06-19 Rohm Co., Ltd Display apparatus having heat dissipation
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
CN1560672A (zh) * 2004-02-17 2005-01-05 �Ѵ���ɷ����޹�˾ 背光模块及其散热结构
CN1585244A (zh) * 2004-06-15 2005-02-23 于波 永磁发电机半控整流桥的散热机构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1916648A4 *

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