JP2008233924A - 発光表示パネル - Google Patents
発光表示パネル Download PDFInfo
- Publication number
- JP2008233924A JP2008233924A JP2008111697A JP2008111697A JP2008233924A JP 2008233924 A JP2008233924 A JP 2008233924A JP 2008111697 A JP2008111697 A JP 2008111697A JP 2008111697 A JP2008111697 A JP 2008111697A JP 2008233924 A JP2008233924 A JP 2008233924A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- heat
- display panel
- heat conducting
- front plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000005286 illumination Methods 0.000 description 3
- 239000003570 air Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
【解決手段】前プレート12は、その上にN個の貫通孔122を有する。N個の貫通孔122のうちの1つおよびN個の発光装置16のうちの1つに対応する、N個の熱伝導/放散装置14の各々が、その頸部分20を通して対応する孔の中に挿入される。N個の発光装置16の各々が、対応する熱伝導/放散装置14の平坦部分22に取り付けられる。それによって、N個の発光装置16の各々の動作中に生成される熱が、対応する熱伝導/放散装置14によって前プレート12の背面に伝導され、そして次に、それが対応する熱伝導/放散装置14によって放散される。
【選択図】図1
Description
12前プレート
14熱伝導/放散装置
16発光装置
17固定素子
19導線
20頸部分
22平坦部分
24テール部分
122貫通孔
142熱伝導素子
144熱放散フィン
Claims (8)
- 発光表示パネルであって、
前面および背面をその上に画成する前プレートであって、かつその上にN個の貫通孔を設け、Nが自然数である、前プレートと、
各々が前記N個の貫通孔のうちの1つに対応するN個の熱伝導/放散装置であって、前記N個の熱伝導/放散装置の各々が、
前記対応する孔に適合する頸部分、前記頸部分の遠位端の平坦部分およびテール部分に分けられる熱伝導素子であって、前記熱伝導素子の前記テール部分が前記前プレートの前記背面に配置されるように、その前記頸部分を通して前記対応する孔に挿入される、熱伝導素子と、
前記熱伝導素子の前記テール部分の周縁に取り付けられる少なくとも1つの熱放散フィンと、を備える、装置と、
前記対応する前記孔に挿入される前記熱伝導素子の前記平坦な部分に取り付けられる、各々が前記N個の孔のうちの1つに対応するN個の発光装置と、を備え、
それによって、前記N個の発光装置の各々の動作中に生成される熱が、前記前プレートの前記背面まで前記1つの発光装置に対応する前記熱伝導素子によって伝導され、そして次に、前記1つの発光装置に対応する前記少なくとも1つの熱放散フィンによって放散される、パネル。 - 前記N個の発光装置が、前記前プレートの前記前面上にアレイの形態で配置される、ことを特徴とする請求項1に記載の発光表示パネル。
- さらに、動力供給/制御ユニット、を備え、前記N個の発光装置の各々が、前記動力供給/制御ユニットに電気的に接続される少なくとも2本の導線を有する、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記N個の熱伝導素子の各々が、ヒートパイプ、熱柱または高熱伝導率を有する材料から作られる円筒形の素子である、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記前プレートが、セメント材、ガラス材料、金属材料、木製材料、重合物質、セメント/高分子複合材料およびセラミック/高分子複合材料からなる群から選択されるものから作られる、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記N個の発光装置の各々が、各々が発光ダイオードダイまたはレーザダイオードダイである少なくとも1つの半導体発光ダイを備える、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記前プレート内の前記孔の各々の内径が、前記対応する発光装置の外径よりわずかに大きい、ことを特徴とする請求項1に記載の発光表示パネル。
- 前記N個の熱伝導/放散装置の各々が、前記熱伝導/放散装置を前記前プレートの前記背面に固定するために、前記対応する熱伝導/放散装置の前記熱伝導素子の前記テール部分を取り付ける固定素子を更に備える、ことを特徴とする請求項1に記載の発光表示パネル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005201131143U CN2821749Y (zh) | 2005-07-21 | 2005-07-21 | 发光显示面板 |
CN200520113114.3 | 2005-07-21 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008600015 Continuation | 2005-07-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008233924A true JP2008233924A (ja) | 2008-10-02 |
JP4750821B2 JP4750821B2 (ja) | 2011-08-17 |
Family
ID=37018303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008111697A Expired - Fee Related JP4750821B2 (ja) | 2005-07-21 | 2008-04-22 | 発光表示パネル |
Country Status (5)
Country | Link |
---|---|
US (1) | US7997766B2 (ja) |
EP (1) | EP1916648A4 (ja) |
JP (1) | JP4750821B2 (ja) |
CN (1) | CN2821749Y (ja) |
WO (1) | WO2007009296A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009505359A (ja) * | 2005-08-19 | 2009-02-05 | ネオバルブ テクノロジーズ,インコーポレイテッド | 高出力と高熱拡散効率を備えるled照明装置 |
JP2014086416A (ja) * | 2013-09-03 | 2014-05-12 | Mitsubishi Electric Corp | 照明装置 |
JP2014165127A (ja) * | 2013-02-27 | 2014-09-08 | Mitsubishi Electric Corp | 照明装置 |
JP2014182878A (ja) * | 2013-03-18 | 2014-09-29 | Mitsubishi Electric Corp | 発光装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7922360B2 (en) * | 2007-02-14 | 2011-04-12 | Cree, Inc. | Thermal transfer in solid state light emitting apparatus and methods of manufacturing |
TWM348981U (en) * | 2008-06-12 | 2009-01-11 | Acpa Energy Conversion Devices Co Ltd | Heat dissipation module |
EA200970511A1 (ru) * | 2009-01-06 | 2010-12-30 | Необульб Текнолоджиз, Инк. | Устройство для преобразования энергии и оборудование для преобразования энергии |
TWM362362U (en) * | 2009-03-06 | 2009-08-01 | Acpa Energy Conversion Devices Co Ltd | Heat conduction structure for heating element |
EP2405194A1 (en) * | 2010-07-05 | 2012-01-11 | NeoBulb Technologies, Inc. | Light-emitting diode illumination platform |
CN106652810A (zh) * | 2016-11-17 | 2017-05-10 | 成都朵猫文化传播有限公司 | 一种可接入互联网的广告牌 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366104U (ja) * | 1986-10-20 | 1988-05-02 | ||
JPS63107486U (ja) * | 1986-12-28 | 1988-07-11 | ||
JPS63185257U (ja) * | 1987-05-22 | 1988-11-29 | ||
JPH01135480U (ja) * | 1988-03-07 | 1989-09-18 | ||
JP2001267773A (ja) * | 2000-03-16 | 2001-09-28 | Hitachi Ltd | 電子部品の冷却装置 |
CN1605795A (zh) * | 2004-10-19 | 2005-04-13 | 陈振贤 | 具高散热效率的照明装置 |
JP2005101014A (ja) * | 2004-10-11 | 2005-04-14 | Shinken Chin | 高い放熱効率の照明装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3713088B2 (ja) * | 1996-02-19 | 2005-11-02 | ローム株式会社 | 表示装置 |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
US6874910B2 (en) * | 2001-04-12 | 2005-04-05 | Matsushita Electric Works, Ltd. | Light source device using LED, and method of producing same |
EP1467414A4 (en) * | 2001-12-29 | 2007-07-11 | Hangzhou Fuyang Xinying Dianzi | LED AND LED LAMP |
WO2004053385A2 (en) * | 2002-12-11 | 2004-06-24 | Charles Bolta | Light emitting diode (l.e.d.) lighting fixtures with emergency back-up and scotopic enhancement |
US6789921B1 (en) * | 2003-03-25 | 2004-09-14 | Rockwell Collins | Method and apparatus for backlighting a dual mode liquid crystal display |
US6910794B2 (en) * | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
JP4236544B2 (ja) | 2003-09-12 | 2009-03-11 | 三洋電機株式会社 | 照明装置 |
US6966674B2 (en) * | 2004-02-17 | 2005-11-22 | Au Optronics Corp. | Backlight module and heat dissipation structure thereof |
CN1680749A (zh) | 2004-04-08 | 2005-10-12 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及含其的照明装置 |
CN1585244A (zh) * | 2004-06-15 | 2005-02-23 | 于波 | 永磁发电机半控整流桥的散热机构 |
US7331691B2 (en) * | 2004-10-29 | 2008-02-19 | Goldeneye, Inc. | Light emitting diode light source with heat transfer means |
-
2005
- 2005-07-21 CN CNU2005201131143U patent/CN2821749Y/zh not_active Expired - Lifetime
- 2005-07-22 EP EP05772528A patent/EP1916648A4/en not_active Withdrawn
- 2005-07-22 US US11/989,197 patent/US7997766B2/en not_active Expired - Fee Related
- 2005-07-22 WO PCT/CN2005/001103 patent/WO2007009296A1/zh not_active Application Discontinuation
-
2008
- 2008-04-22 JP JP2008111697A patent/JP4750821B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6366104U (ja) * | 1986-10-20 | 1988-05-02 | ||
JPS63107486U (ja) * | 1986-12-28 | 1988-07-11 | ||
JPS63185257U (ja) * | 1987-05-22 | 1988-11-29 | ||
JPH01135480U (ja) * | 1988-03-07 | 1989-09-18 | ||
JP2001267773A (ja) * | 2000-03-16 | 2001-09-28 | Hitachi Ltd | 電子部品の冷却装置 |
JP2005101014A (ja) * | 2004-10-11 | 2005-04-14 | Shinken Chin | 高い放熱効率の照明装置 |
CN1605795A (zh) * | 2004-10-19 | 2005-04-13 | 陈振贤 | 具高散热效率的照明装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009505359A (ja) * | 2005-08-19 | 2009-02-05 | ネオバルブ テクノロジーズ,インコーポレイテッド | 高出力と高熱拡散効率を備えるled照明装置 |
JP2014165127A (ja) * | 2013-02-27 | 2014-09-08 | Mitsubishi Electric Corp | 照明装置 |
JP2014182878A (ja) * | 2013-03-18 | 2014-09-29 | Mitsubishi Electric Corp | 発光装置 |
JP2014086416A (ja) * | 2013-09-03 | 2014-05-12 | Mitsubishi Electric Corp | 照明装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090262534A1 (en) | 2009-10-22 |
CN2821749Y (zh) | 2006-09-27 |
US7997766B2 (en) | 2011-08-16 |
EP1916648A1 (en) | 2008-04-30 |
JP4750821B2 (ja) | 2011-08-17 |
WO2007009296A1 (fr) | 2007-01-25 |
EP1916648A4 (en) | 2009-05-27 |
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