Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J113/00—Adhesives based on rubbers containing carboxyl groups
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
  • C08L9/02—Copolymers with acrylonitrile
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
  • C09J109/02—Copolymers with acrylonitrile
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J115/00—Adhesives based on rubber derivatives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L13/00—Compositions of rubbers containing carboxyl groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L15/00—Compositions of rubber derivatives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
  • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
  • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
  • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
  • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof

Definitions

• the invention relates to a mixture of at least one nitrile rubber and at least one nitrile butadiene rubber and at least one reactive resin, in particular for an adhesive film for bonding metal parts to plastics in portable consumer electronics articles.
• the mixture has, after bonding, even at low temperatures below - 15 0 C, a high bond strength and shock resistance on.
• double-sided pressure-sensitive adhesive tapes are usually used.
• the adhesive forces required for this purpose are sufficient for fixing and fastening the metal components on the plastics.
• the metals used are preferably steel, stainless steel and aluminum.
• plastics e.g. PVC, ABS, PC or blends based on these plastics.
• requirements are constantly increasing for portable consumer electronics products. On the one hand, these articles are getting smaller and smaller, so that also the bonding surfaces are getting smaller.
• the bonding must meet additional requirements, since portable articles are used in a wider temperature range and can also be exposed to mechanical stress (impacts, falls, etc.). These requirements are particularly problematic for metal bonding on plastics.
• the plastic can absorb part of the energy in a fall, while metals do not deform at all. In this case, the tape needs to absorb much of the energy. This can be done in a particularly efficient manner by the use of heat-activatable films that can form a particularly high bond strength after activation.
• Heat-activatable adhesives can be divided into two categories: a) thermoplastic heat-activatable films
• thermoplastic heat-activated films have been known for a long time and are based, for example, on polyesters or copolyamides. Commercial examples are available from 3M (products 615, 615S) or tesa (product 8440). However, these thermoplastic heat-activatable films also have disadvantages for use in portable consumer goods electronic articles. This applies in particular to the "oozing behavior" under application of pressure under temperature, since in the application mainly diecuts are processed, which then change their shape.
• the nitrile rubber gives the heat-activatable film high dimensional stability and, as a result of the crosslinking reaction, enables high bond strengths on metals and plastics.
• the high dimensional stability and the low fluidity also have disadvantages: Due to the high strength, the heat-activatable film hardens very quickly at low temperatures and becomes brittle, with the result that the bond becomes shock-sensitive at very low temperatures and rises.
• the invention is based on the object of this prior art, a heat-activatable adhesive film for attaching metal parts to plastics for to provide portable consumer electronics products that are ready for use over a wide temperature range.
• the film should be at - 20 0 C to withstand a cold shock test and a high bonding strength in a temperature range from - 50 0 C have 20 ° C to +.
• an adhesive film comprising at least one heat-activatable adhesive based on a mixture of at least one nitrile rubber S1 and at least one carboxy, amine, epoxy or methacrylate-nitrated butylbutadiene rubber S2 having a molecular weight of M w less than or equal to 20,000 g / mol and at least one reactive resin which is capable of crosslinking with itself, with other reactive resins and / or with S1 and / or S2.
• the inventive mixture of nitrile rubber S1 and functionalized terminated nitrile butadiene rubber S2 and at least one reactive resin is one such mixture which has one, preferably several or very preferably all of the following properties: a) at least one glass transition temperature is greater than 10 ° C. and at least one glass transition temperature of less than - 20 ° C, b) a measured by test method a drop height of more than 1 m at room temperature (RT) and greater than 25 cm at a temperature of - 20 0 C, c) according to test method B bond strength of greater 3 N / mm 2 at room temperature (RT) and greater than 6 N / mm 2 at a temperature of - 20 0 C.
• the mixture is microphase-separated (as a blend), characterized by at least two different glass transition temperatures in the DSC (differential or dynamic scanning calorimeter),
• the mixture according to the invention improves the adhesive properties of the adhesive film.
• an improvement in the adhesive properties in particular by the microphase separation and by the formation of two glass transition temperatures at very low temperatures (less - 2O 0 C) and at high temperatures (> 10 0 C) (combi nation of adhesive properties at low and high temperatures) can be achieved.
• thermodynamically incompatible polymer chain regions By chemically coupling thermodynamically incompatible polymer chain regions, corresponding polymers have a microphase separation, i. H. thermodynamically compatible regions, while segregating thermodynamically incompatible into spatially separate domains, but without macroscopic phase separation occurs. Depending on the composition, phases of different structure result ("domain formation"). For the invention, it is not necessary for the microphase separation corresponding to be observed or measured to be “ideal” or to give “incomplete” structures.
• Typical methods for determining a present microphase separation include, for example
• Atomic force microscopy on the surface topology, a hardness or adhesion contrast
• the low glass transition temperature domain increases the cold impact strength and the low temperature adhesion, the high temperature bonding strength and the dimensional stability of the diecuts under pressure and temperature are obtained by the domain at high temperatures.
• the glass transition temperatures given here correspond to those obtained from quasistationary experiments, such as, for example, DSC (differential or dynamic scanning calorimetry).
• the weight fraction of the nitrile rubbers S1 and S2 is in total preferably between 25 and 70% by weight, particularly preferably between 30 and 60% by weight, of the total composition of the reactive heat-activatable film.
• heat-activatable films having a layer thickness between 25 and 300 ⁇ m, in a particularly preferred design having a layer thickness of 50 to 250 ⁇ m, are used for the bonding of the metal parts to the plastics.
• the heat-activatable adhesive according to the invention is based on a mixture of nitrile rubber S1 and a carboxy, amine, epoxy or methacrylate-terminated nithlbutadiene rubber S2 having a molecular weight of M w ⁇ 20,000 g / mol.
• Nithlbutadiene rubbers are available as Europrene TM from Eni Chem, or as Krynac TM and Perbunan TM from Bayer, or as Breon TM and Nipol N TM from Zeon. Hydrogenated nitrile-butadiene rubbers are available under Therban TM from Bayer and Zetpol TM from Zeon. Nitrile butadiene rubbers are polymerized either hot or cold.
• the nitrile rubbers S1 advantageously have, in particular, an acrylonitrile content of 15 to 45% by weight.
• the acrylonitrile fraction should advantageously be greater than 15% by weight, based on the total amount of S1.
• Mooney viscosity Another criterion for the nitrile rubber S1 is the Mooney viscosity. Since a high flexibility can be ensured at low temperatures has the Mooney visco sity should preferably be below 100 (Mooney ML 1 + 4 at 100 0 C). Commercial examples of such nitrile rubbers are, for example, Nipol TM N917 from Zeon Chemicals.
• the carboxyl-, amine-, epoxy- or methacrylate-terminated nitrile-butadiene rubbers S2 having a molecular weight of M w ⁇ 20,000 g / mol preferably have an acrylonitrile content of 5 to 30% by weight.
• the acrylonitrile content should preferably be at least greater than 5% by weight, again based on the total amount of S2.
• the static glass transition temperature in DSC should preferably the static glass transition temperature in DSC at less - 30 0 C, more preferably less than - 35 ° C.
• nitric rubbers S2 are, for example, Hycar TM from Noveon
• carboxy-terminated nitium butadiene rubbers preference is given to using rubbers having a carboxylic acid number of from 15 to 45, very preferably from 20 to 40.
• the carboxylic acid number is given as the value in milligrams of KOH required to completely neutralize the carboxylic acid
• amine-terminated nitium butadiene rubbers particular preference is given to using rubbers having an amine value of from 25 to 150, more preferably from 30 to 125.
• the amine value refers to the amine equivalents which are determined by titration against HCl in ethanolic solution The amine value is based on amine equivalents per 100 grams of rubber, but ultimately divided by 100
• Nitrogen rubbers S1 and S2 are very preferably used in such a way that the weight ratio between 30% nitric rubber S1 to 70% nitric rubber S2 and 95% nitric rubber S1 to 5% nitric rubber S2 is more preferably the weight ratio of nitric rubber S1 to nitric rubber S2 is between 40 to 60 and 70 to 30 It has turned out to be particularly advantageous to choose a balanced weight ratio, ie essentially 50 to 50
• the proportion of reactive resins in the heat-activatable adhesive is between 75 and 30% by weight.
• a very preferred group comprises epoxy resins.
• the weight-average molecular weight M w of the epoxy resins varies from 100 g / mol up to a maximum of 10,000 g / mol for polymers epoxy resins
• the epoxy resins include, for example, the reaction product of bisphenol A and epichlorohydrin, Epichlorhyd ⁇ n, glycidyl esters, the reaction product of Epichlorhyd ⁇ n and p-Am ⁇ no phenol
• Preferred commercial examples are for example Araldite TM 6010, CY-281 TM, ECN TM 1273,
• Examples of commercial aliphatic epoxy resins are, for example, vinylcyclohexanedioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
• novolac resins for example, Epi-Rez TM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN TM 431, DEN TM 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon can be used Kayaku, Epiclon TM N673 from DaiNippon Ink Chemistry or Epikote TM 152 from Shell Chemical
• melamine resins such as Cymel TM 327 and 323 from Cytec can also be used as reactive resins
• terpene phenolic resins such as NIREZ TM 2019 from Arizona Chemical can be used.
• phenol resins such as YP 50 from Toto Kasei, PKHC from Union Carbide Corp. and BKR 2620 from Showa Union Gosei Corp. can also be used as reactive resins in a further preferred procedure.
• Reactive resins also include phenolic resole resins in combination with others Use phenolic resins
• polyisocyanates such as Coronate TM L from Nippon Polyurethane Ind, Desmodur TM N3300 or Mondur TM 489 from Bayer
• adhesives (tackifying) resins are also added to the blend, very advantageously up to 30% by weight, based on the total mixture of the heat-activable adhesive.
• the tackifying resins to be added are, without exception, all those known in the art and US Pat Reference may be made vicariously to the pinene, indene and rosin resins, their disproportionated, hydrogenated, polymerized, esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene phenolic resins and C5, C9 and other hydrocarbon resins. Any combination thereof and other resins can be used to suit the properties of the resulting adhesive as desired adjust.
• crosslinkers and accelerators can also be optionally added to the mixture.
• Suitable accelerators are e.g. Imidazoles, commercially available as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, L07N from Shikoku Chem. or Curezoi 2MZ from Air Products.
• Further suitable crosslinkers are HMTA (hexamethylenetetramine) additives.
• amines in particular tert. -Amine use for acceleration.
• plasticizers can also be used.
• plasticizers based on polyglycol ethers, polyethylene oxides, phosphate esters, aliphatic carboxylic acid esters and benzoic acid esters can be used.
• aromatic carboxylic esters, relatively high molecular weight diols, sulfonamides and adipic esters can be used.
• fillers e.g., fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres of other materials, silicic acid, silicates
• nucleating agents e.g., fibers, carbon black, zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres of other materials, silicic acid, silicates
• blowing agents e.g., tackifying additives and thermoplastics
• compounding agents and / or anti-aging agents e.g. be added in the form of primary and secondary antioxidants or in the form of sunscreens.
• additives are added to the blend, such as polyvinylformal, polyacrylate rubbers, chloroprene rubbers, ethylene-propylene-diene rubbers, methyl-vinyl-silicone rubbers, fluorosilicone rubbers, tetrafluoroethylene-propylene copolymer rubbers, butyl rubbers , Styrene-butadiene rubbers.
• Polyvinyl butyrals are available as Butvar TM from Solutia, under Pioloform TM from Wacker and under Mowital TM from Kuraray.
• Polyacrylate Rubbers are available from Nipol AR TM from Zeon. Chloroprene rubbers are available under Baypren TM from Bayer.
• Ethylene-propylene-diene rubbers are available on Keltan TM from DSM, Vistalon TM from Exxon Mobil, and Buna EP TM from Bayer.
• Methyl vinyl silicone rubbers are available from Silastic TM from Dow Corning and Silopren TM from GE Silicones. Fluorosilicone rubbers are available as Silastic TM from GE Silicones.
• Butyl rubbers are available under Esso Butyl TM from Exxon Mobil.
• Styrene-butadiene rubbers are available under Buna S TM from Bayer, and Europrene TM from Eni Chem, and under Polysar S TM from Bayer.
• Polyvinylformals are available on Formvar TM from Ladd Research.
• thermoplastic materials from the group of the following polymers: polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyesters, hard polyvinyl chlorides, flexible polyvinyl chlorides, polyoxymethylenes, polybutylene terephthalates, polycarbonates, fluorinated polymers, such as. Polytetrafluoroethylene, polyamides, ethylene vinyl acetates, polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, polyolefins, e.g. Polyethylene, polypropylene, polybutene, polyisobutene, and poly (meth) acrylates.
• polyurethanes polystyrene, acrylonitrile-butadiene-styrene terpolymers
• polyesters hard polyvinyl chlorides, flexible polyvinyl chlorides, polyoxymethylenes, polybutylene
• the bond strength of the heat-activatable film can be increased by further targeted additization.
• Polyimine or polyvinyl acetate copolymers also use as adhesion-promoting additives.
• the mixtures according to the invention are preferably used as heat-activatable adhesives.
• the heat-activatable adhesives can be prepared from solution or in the melt.
• the known stirring units, such as kneaders are used.
• the entry of heat may be required.
• the heat-activatable adhesives from solution or from the melt in particular on After coating from solution the solvent is removed in a drying channel. For the coating from the melt, the solvent is previously removed from the blend.
• the solvent is removed in a concentrating extruder under reduced pressure, for example single or twin-screw extruders can be used, which preferably distill off the solvent in different or equal vacuum stages and grout over a feed preheat Then, a Schmelzduse or Extrusionsduse is coated, where appropriate, the adhesive film is stretched to achieve the optimum coating thickness
• the heat-activatable adhesive is produced in the melt.
• a kneader or a twin-screw extruder or a planetary roller extruder can be used for mixing the resins.
• the coating then takes place from the melt, again preferably to a temporary support Enamel or an extrusion die coated, where appropriate, the adhesive film is stretched to achieve the optimum coating thickness
• the familiar and familiar to those skilled materials such as films (polyester, PET, PE, PP, BOPP, PVC, polyimide), nonwovens, foams, fabric and fabric films and release paper (glassine, HDPE, LDPE) used
• the Tragermate ⁇ alien should be equipped with a release layer
• the release layer is in a very preferred embodiment of the invention of a silicone release varnish or a fluorinated release varnish.
• the heat-activable adhesive is coated directly onto a release paper and then further used as a transfer tape for producing larger layer thicknesses It may also be advantageous to laminate several adhesive layers together. This is particularly preferably done with the introduction of heat and pressure Examples
• the bond area is 2 cm 2 . It is a 1, 5 mm thick aluminum plate (1) with a width of 2 cm with a polycarbonate (PC) plate (2) with a width of 2 cm and a layer thickness of 3 mm using a heat-activatable invention Adhesive film (3) connected.
• a 200 micron thick heat-activatable film is laminated to the aluminum with the aid of a 95 0 C hot plate.
• the release film is peeled off.
• the heat activation is carried out with a 180 0 C hot stamping press at a pressure of 5 bar and 5 s Verpressdauer.
• the drop test is carried out (arrows in the figure: fall direction).
• a 50 g heavy weight (4) is attached to the PC plate.
• the entire composite is dropped from different heights onto a steel plate (5). It determines the height at which the bonding with the heat-activatable film can still absorb the impact and the AI / PC test specimens do not fall apart.
• the test is also carried out at different temperatures.
• Bond strength B (see FIGS. 2 and 3)
• the bond strength is determined by means of a dynamic shear test (compare FIG. 2).
• the bond area is 2 cm 2 .
• a 1.5 mm thick Al plate (1) having a width of 2 cm is connected to a PC plate (2) having a width of 2 cm and a layer thickness of 3 mm by means of a heat-activatable adhesive film (3) according to the present invention.
• a 200 micron thick heat-activatable film is laminated to the aluminum with the aid of a 95 0 C hot plate. Subsequently, the release film is peeled off.
• the bonding of the test specimens is carried out in a hot press (see Fig.
• test specimens are then torn apart using a 10 mm / min. Tacking machine using the slowly increasing force F.
• the measured unit is reported in N / mm 2 and is the maximum force measured to separate the specimens (aluminum and polycarbonate) from each other The measurement is carried out at different temperatures - 20 0 C, 0% humidity 23 0 C, 50% humidity 50 0 C, 50% humidity
• the measurements are carried out immediately after compression and heat activation, whereby about 30 minutes for Akkhmatisieiung to the respective temperature range is maintained
• the heat-activatable film is used with a layer thickness of 200 microns for bonding a Aluminiumdekorstuckes on a polycarbonate Handygehause
• the bonding area is about 4 cm 2
• the cell phone shell cooled down to - 20 ° C after bonding
• the test specimens are then mutually rotated at this temperature (twisted)
• PSA header - SDV 10 ⁇ , ID 8.0 mm x 50 mm
• Nipol N1094-80 nitl late rubber
• Resin Durez 33040 blended with 8% by weight of HMTA (Rohm and Haas) and 10% by weight of the phenolic resin resin 9610 LW from Bakelite were prepared as a 30% solution in methyl ethyl ketone in a kneader. The kneading time was 20 hours.
• the heat-activable adhesive was subsequently coated from solution onto a glassine release paper at 100 0 C for 10 minutes, dried After drying, the film thickness was 100 microns Two of these sheets were then subsequently with a roll laminator at 100 0 C laminated together Thereafter was the layer thickness 200 .mu.m
• Nipol N1094-80 nitylene rubber
• 40 wt -% of phenol novolak resin Durez 33040 blended with 8 wt -% HMTA (Rohm and Haas) and 10 weight -% of the phenolic resole resin 9610 LW from Bakelite were prepared as a 30% strength solution in methyl ethyl ketone in a kneader, the kneading time was 20 h the heat-activable was adhesive then from solution onto a glassine release paper streaked and at 100 0 C for 10 minutes, dried After drying, the film thickness was 100 microns Two of these plies
• 40% by weight of phenol novolak resin Durez 33040 mixed with 8% by weight of HMTA (Rohm and Haas) and 10% by weight of the phenolic resole resin 9610 LW Bakelite were as 30% ige solution in methyl ethyl ketone in a Kneader produced
• the kneading time was 20 h
• the heat-activatable adhesive was then spread out of solution on a glassine release paper and dried at 100 0 C for 10 minutes After drying, the layer thickness was 100 microns Two of these layers were then then with a roll laminator at 100 0 C
• Nipol N 1094-80 nitrile rubber
• Bakelite were prepared as a 30% solution in methyl ethyl ketone in a kneader. The kneading time was 20 h. The heat-activatable adhesive was then coated from solution onto a glassine release paper and dried at 100 0 C for 10 minutes. After drying, the layer thickness was 100 ⁇ m. Two of these sheets were then laminated together with a Rolllami ⁇ ator at 100 0 C. Subsequently, the layer thickness was 200 microns.
• the heat-activatable adhesive films 3 to 6 according to the invention were tested analogously with two reference examples 1 and 2.
• Reference Example 1 illustrates a heat-activatable film based on a standard heat-activatable adhesive with a nitrile rubber and an acrylonitrile content of 36% by weight.
• Reference Example 2 represents a heat-activatable film based on a standard heat-activatable adhesive with a nitrile rubber and an acrylonitrile content of 23% by weight. All examples were used under identical curing conditions for bonding aluminum to polycarbonate (PC) - an application e.g. occurs frequently in the manufacture of cell phones. After bonding, the samples were subjected to a drop test. The results are shown in Table 1. The respective drop height is given in cm.
• PC polycarbonate
• Table 1 shows that the inventive examples 3 to 6 at - 20 0 C have a significantly better cold shock sensitivity, which in turn is reflected in the higher case height At room temperature, however, the differences are very low and all examples have a high resistance to shock

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Adhesive Tapes (AREA)
• Compositions Of Macromolecular Compounds (AREA)

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• 2005
  • 2005-06-06 DE DE102005026191A patent/DE102005026191A1/de not_active Withdrawn
  • 2005-12-29 US US11/321,396 patent/US20060276591A1/en not_active Abandoned
• 2006
  • 2006-05-24 JP JP2008515084A patent/JP5363807B2/ja not_active Expired - Fee Related
  • 2006-05-24 TW TW095118432A patent/TW200706628A/zh unknown
  • 2006-05-24 CN CN2006800200798A patent/CN101198667B/zh not_active Expired - Fee Related
  • 2006-05-24 WO PCT/EP2006/004972 patent/WO2006131214A1/de not_active Ceased
  • 2006-05-24 ES ES06761933T patent/ES2377985T3/es active Active
  • 2006-05-24 KR KR1020077031015A patent/KR20080027294A/ko not_active Withdrawn
  • 2006-05-24 EP EP06761933A patent/EP1893708B1/de not_active Not-in-force
  • 2006-05-24 MX MX2007014574A patent/MX2007014574A/es active IP Right Grant
  • 2006-05-24 AT AT06761933T patent/ATE542868T1/de active

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