WO2006122491A1 - Pate a polissage - Google Patents

Pate a polissage Download PDF

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Publication number
WO2006122491A1
WO2006122491A1 PCT/CN2006/000973 CN2006000973W WO2006122491A1 WO 2006122491 A1 WO2006122491 A1 WO 2006122491A1 CN 2006000973 W CN2006000973 W CN 2006000973W WO 2006122491 A1 WO2006122491 A1 WO 2006122491A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing slurry
group
slurry according
polishing
concentration
Prior art date
Application number
PCT/CN2006/000973
Other languages
English (en)
Chinese (zh)
Inventor
Danny Zhenglong Shiao
Andy Chunxiao Yang
Original Assignee
Anji Microelectronics (Shanghai) Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anji Microelectronics (Shanghai) Co., Ltd filed Critical Anji Microelectronics (Shanghai) Co., Ltd
Publication of WO2006122491A1 publication Critical patent/WO2006122491A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La présente invention concerne une pâte à polissage, ladite pâte à polissage contenant des grains abrasifs de polissage et un véhicule, mais également un réactif ayant deux groupes fonctionnels. La pâte à polissage selon la présente invention permet de réduire la concentration en grains abrasifs qu'elle contient, et de diminuer la pression de polissage vers le bas requise dans un procédé de CMP, permettant ainsi d'améliorer la qualité du substrat et de minimiser le taux de défauts, tout en maintenant la vitesse de polissage désirée.
PCT/CN2006/000973 2005-05-17 2006-05-15 Pate a polissage WO2006122491A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200510025865.4 2005-05-17
CN2005100258654A CN1865385B (zh) 2005-05-17 2005-05-17 抛光浆料

Publications (1)

Publication Number Publication Date
WO2006122491A1 true WO2006122491A1 (fr) 2006-11-23

Family

ID=37424535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2006/000973 WO2006122491A1 (fr) 2005-05-17 2006-05-15 Pate a polissage

Country Status (2)

Country Link
CN (1) CN1865385B (fr)
WO (1) WO2006122491A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101177591B (zh) * 2007-12-07 2010-06-02 天长市华润清洗科技有限公司 金属抛光剂及其制备方法
CN114231182A (zh) * 2021-12-29 2022-03-25 盐城工学院 一种易解理氧化镓晶片化学机械抛光工艺、抛光液及其制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101665664B (zh) * 2008-09-05 2013-08-28 安集微电子（上海）有限公司 季铵盐型阳离子表面活性剂和一种化学机械抛光液的应用
CN102504705B (zh) * 2011-10-17 2014-07-09 河南省化工研究所有限责任公司 光通讯Zr02陶瓷插芯精密加工用抛光液及其制备方法
CN104593776B (zh) * 2014-12-24 2017-11-03 上海新安纳电子科技有限公司 一种用于钛的化学机械抛光液
CN108117842A (zh) * 2016-11-30 2018-06-05 上海新昇半导体科技有限公司 一种化学机械抛光液及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6702954B1 (en) * 2000-10-19 2004-03-09 Ferro Corporation Chemical-mechanical polishing slurry and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4010903B2 (ja) * 2002-08-02 2007-11-21 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US20040162011A1 (en) * 2002-08-02 2004-08-19 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6702954B1 (en) * 2000-10-19 2004-03-09 Ferro Corporation Chemical-mechanical polishing slurry and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101177591B (zh) * 2007-12-07 2010-06-02 天长市华润清洗科技有限公司 金属抛光剂及其制备方法
CN114231182A (zh) * 2021-12-29 2022-03-25 盐城工学院 一种易解理氧化镓晶片化学机械抛光工艺、抛光液及其制备方法

Also Published As

Publication number Publication date
CN1865385B (zh) 2011-01-05
CN1865385A (zh) 2006-11-22

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