WO2006119684A1 - Echangeur de chaleur a caloduc integre - Google Patents

Echangeur de chaleur a caloduc integre Download PDF

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Publication number
WO2006119684A1
WO2006119684A1 PCT/CN2005/002321 CN2005002321W WO2006119684A1 WO 2006119684 A1 WO2006119684 A1 WO 2006119684A1 CN 2005002321 W CN2005002321 W CN 2005002321W WO 2006119684 A1 WO2006119684 A1 WO 2006119684A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat pipe
heat dissipation
heat
dissipation structure
working liquid
Prior art date
Application number
PCT/CN2005/002321
Other languages
English (en)
Chinese (zh)
Inventor
Zixin Su
Original Assignee
Zixin Su
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zixin Su filed Critical Zixin Su
Publication of WO2006119684A1 publication Critical patent/WO2006119684A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Definitions

  • the invention relates to an integrated heat pipe heat dissipation structure, relating to a heat pipe principle of heat conduction, condensation and heat dissipation, and is a heat pipe heat dissipation structure for dissipating heat of a high-power heat source.
  • the computing speed of the electronic components inside the electronic device increases and the power consumption increases, the corresponding heat is also increased.
  • a heat sink In order to enable the electronic components to operate at normal operating temperatures, it is usually necessary to add a heat sink to the surface of the electronic components.
  • the ordinary air-cooled radiator In order to discharge the heat generated by the electronic components in time, with the rapid increase of the heat generation, the ordinary air-cooled radiator can not complete the temperature control requirements, the heat pipe radiator is widely used, and the heat pipe is disposed on a plurality of heat dissipation fins. In order to fully and quickly dissipate the heat generated by electronic components.
  • the contact surface of the heat pipe radiator combination and the electronic component is only the end of the heat pipe, and the heat transfer area is small, so the heat dissipation effect is not satisfactory.
  • the driving principle of the heat pipe is: the working liquid saturated in the capillary in the evaporation portion is heated by the external heat source, and the steam is moved in the direction of the condensation portion due to the pressure difference generated by the steam, the heat is transferred, and the condensation is re-cooled in the condensation portion. The heat is released, and the condensed driving working liquid is absorbed in the condensing portion, and is returned to the evaporation portion.
  • the movement of the driving working liquid and the recirculation process are cyclically operated, so that the evaporation portion continuously moves the heat to the condensing portion.
  • the main factors driving the movement of the working fluid are: the amount of heat transfer, the tube pressure of the capillary, the resistance to the flow of the working fluid in the capillary, and the viscosity limitation, capillary pressure limitation, conduction or overflow limitation, and boiling limitation. Performance is also limited.
  • the capillary structure for accelerating the return of the working medium inside the heat pipe is usually a mesh, a filled particle, a confirmation 2005/002321
  • Sintered powder, groove or fiber capillary structure are known to have disadvantages such as insufficient capillary tension or excessive flow resistance, resulting in poor heat dissipation of the heat pipe and capillary pressure of the sintered powder capillary.
  • the working fluid transporting capacity is affected by the gravitational resistance. Due to the inconsistency of the capillary direction, the transmittance is reduced, and the pressure loss is large when driving the working liquid.
  • the sintered layer It often reaches l-2mm thick, although it is beneficial to the reflow of working liquid, but it also produces a large thermal resistance, and it is difficult to make and process.
  • the invention is proposed to solve the problems of the conventional single capillary structure and the multi-capillary structure micro and large diameter heat pipe structure, and is characterized in that: the surface of the evaporation portion having the groove structure is provided with a copper powder sintered structure, and the surface has The condensing part of the concavo-convex-infiltrated structure, the columnar wick of the multi-layer copper wire concentrically braided, the working liquid and the heat-dissipating fins, and the internal heat-dissipating structure of the high-efficiency integrated heat pipe with a vacuum state.
  • the evaporation portion of the integrated heat pipe heat dissipation structure of the invention is provided with a plurality of convex pillars, the surface of which has a copper powder sintered capillary structure, and the convex surface of the evaporation portion and the multi-layer copper wire are concentrically woven and twisted to form a columnar liquid absorption.
  • the core is in full contact, and a plurality of steam guiding grooves are formed in the middle, and the steam flow is directly moved to the condensing portion through the steam guiding groove, and the working liquid returned by the wick is directly transmitted to the evaporation portion through the top of the convex portion of the evaporation portion, which is effective.
  • the thermal resistance and air resistance of the evaporation portion are reduced, which is more favorable for rapid evaporation and reflux of the working liquid.
  • the columnar wick of the multi-layer copper wire concentrically braided and twisted has a smoothness in the gap, a large transmittance, and a small pressure loss when driving the working liquid to move, which is more favorable for the rapid transfer of the working liquid.
  • Condensation The surface has a concave-convex structure capable of infiltrating the working liquid, which effectively reduces the thermal resistance and air resistance of the condensation portion, and is more conducive to rapid condensation.
  • the integrated heat pipe heat dissipation structure of the invention has higher efficiency and is suitable for heat dissipation of a high power heat source.
  • Figure 1 is a perspective exploded view of a first embodiment of an integrated heat pipe heat dissipation structure of the present invention.
  • Figure 2 is a cross-sectional view showing the assembly of the first embodiment of the integrated heat pipe heat dissipation structure of the present invention.
  • FIG. 3A and 3B are combined cross-sectional views showing a second embodiment of the heat dissipation structure of the integrated heat pipe of the present invention.
  • Figure 4 is a cross-sectional view showing the third embodiment of the integrated heat pipe heat dissipation structure of the present invention.
  • the heat pipe heat dissipation structure of the present invention comprises: an evaporation portion 26 having a plurality of convex pillars having a copper powder sintered capillary structure 28 on the surface, and a surface having irregularities
  • the columnar wick 22 can be formed by condensing the condensing portion 20 of the working liquid structure and concentrically braiding the plurality of copper wires.
  • the condensing tube 20 is welded to the upper portion 24 of the evaporation portion, and the columnar wick 22 which is concentrically braided and twisted by the multi-layer copper wire is inserted, so that the copper powder sintered capillary structure 28 on the surface of the evaporation portion 26 is concentrically woven with the multilayer copper wire.
  • the twisted cylindrical wick 22 is in full contact, and the evaporating portion upper case 24 and the evaporating portion 26 are spliced together, a working liquid is injected, and a vacuum is taken to seal it.
  • the working principle is as follows: the evaporation portion 26 is heated to evaporate and vaporize the working liquid to form a vapor flow, and is rapidly moved to the condensation portion through the evaporation portion guide groove 30 and the condensation portion guide groove 32, and is cooled and condensed in the condensation portion to form
  • 3A and 3B are a second embodiment of the heat pipe heat dissipation structure of the present invention.
  • the condensing tube 40 is welded to the upper portion 44 of the evaporation portion, and the columnar wick 42 formed by concentrically braiding the multi-layer copper wire is inserted.
  • the copper powder sintered capillary structure 48 on the surface of the evaporation portion is sufficiently in contact with the columnar wick 42 which is concentrically braided and twisted by the plurality of copper wires, and the evaporation portion 46 and the upper casing 44 are welded together, the working liquid is injected, and the vacuum is extracted. Seal it.
  • the working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.
  • the embodiment includes a tube body 62 having an inner wall having a concavo-convex shape capable of infiltrating the working liquid.
  • the first end is a sealed 60, and the second end is a second end.
  • the sealing body 64 is an evaporation portion of the heat dissipation structure of the heat pipe, and is provided with a plurality of convex pillars 66 having a copper powder sintered structure 68 on the surface thereof, and a plurality of layers of copper wires concentrically braided and wicked 70, Working fluid and heat sink fins 72.
  • the columnar wicking fastener 7 formed by concentric twisting of the multi-layer copper wire is in full contact with the copper powder sintered structure of the top of the evaporating portion, and the second end sealing body is welded, injected into the working liquid, and extracted. Vacuum, seal it, and then fully connect the outer wall of the tube 62 to the heat sink.
  • the working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.

Abstract

L’invention concerne un échangeur de chaleur à caloduc intégré comprenant un organe d’évaporation, un organe de condensation, une âme absorbante de liquide, un fluide thermodynamique et des ailettes d’échange de chaleur. L’organe d’évaporation est relié à l’organe de condensation pour former une cavité étanche qui contient l’âme absorbante de liquide et le fluide thermodynamique. L’intérieur de la cavité est sous vide, et les ailettes d’échange de chaleur sont en contact avec l’organe de condensation. L’organe d’évaporation, dont la surface présente une structure capillaire frittée métallique, comprend une pluralité de conduits d’alimentation en gaz liquide afin d’accroître la quantité du transfert de chaleur et la surface de conduction thermique. La structure de l’organe de condensation, qui peut absorber le fluide thermodynamique, est convexo-concave et hydrophile. L’âme absorbante de liquide métallique indépendante est un corps de colonne composé de torsades concentriques de fil de cuivre multicouche, qui réduit la résistance dans le processus de reflux du fluide thermodynamique. L’âme absorbante de liquide est bien en contact avec l’organe d’évaporation de sorte à permettre l’entrée du fluide thermodynamique dans cet organe directement via les conduits d’alimentation en gaz liquide, et sa production est facile.
PCT/CN2005/002321 2005-05-10 2005-12-26 Echangeur de chaleur a caloduc integre WO2006119684A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2005200581824U CN2874398Y (zh) 2005-05-10 2005-05-10 一体化热导管散热结构
CN200520058182.4 2005-05-10

Publications (1)

Publication Number Publication Date
WO2006119684A1 true WO2006119684A1 (fr) 2006-11-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2005/002321 WO2006119684A1 (fr) 2005-05-10 2005-12-26 Echangeur de chaleur a caloduc integre

Country Status (2)

Country Link
CN (1) CN2874398Y (fr)
WO (1) WO2006119684A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013373A (ja) * 2010-07-02 2012-01-19 Hitachi Cable Ltd ヒートパイプ式冷却装置及びこれを用いた車両制御装置
US10718574B2 (en) 2015-10-28 2020-07-21 Sustainable Engine Systems Limited Pin fin heat exchanger

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CN102306556B (zh) * 2011-06-29 2013-05-01 华北电力大学 一种碱金属热电转换器吸液芯组件及制作方法
CN102506600B (zh) * 2011-09-20 2014-01-29 华北电力大学 冷凝端扩展型一体化平板热管
CN102967164A (zh) * 2012-11-26 2013-03-13 华南理工大学 一种热管簇
CN203177703U (zh) * 2013-01-14 2013-09-04 深圳市万景华科技有限公司 立体式导热结构
WO2015087451A1 (fr) * 2013-12-13 2015-06-18 富士通株式会社 Caloduc de type en boucle, procédé de fabrication de celui-ci, et équipement électronique
CN103940126B (zh) * 2014-04-14 2015-09-16 浙江大学 基于传热改性表面的自然循环太阳能回路型集热管及方法
US20160081227A1 (en) * 2014-09-15 2016-03-17 The Regents Of The University Of Colorado, A Body Corporate Vacuum-enhanced heat spreader
CN106288891B (zh) * 2015-05-25 2018-08-17 讯凯国际股份有限公司 立体导热结构及其制法
CN107044790A (zh) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 立体传热装置
CN106091770A (zh) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 具端面强化效果的真空导热体
CN106197107A (zh) * 2016-07-29 2016-12-07 苏州聚力电机有限公司 一种具端面强化效果的真空导热体及其制法
US10433461B2 (en) * 2017-10-30 2019-10-01 Google Llc High-performance electronics cooling system
CN108601286B (zh) * 2018-01-02 2020-09-25 联想(北京)有限公司 电子设备
CN108770281B (zh) * 2018-04-12 2019-10-29 江苏科技大学 一种高热流密度电子器件散热装置及使用方法
CN209820234U (zh) * 2018-04-18 2019-12-20 广州市浩洋电子股份有限公司 一种高效板管换热器
CN111271997B (zh) * 2018-12-05 2023-02-17 多美达(深圳)电器有限公司 一种用于热管散热器的冷凝液回流管
JP6640401B1 (ja) * 2019-04-18 2020-02-05 古河電気工業株式会社 ヒートシンク
CN111712115A (zh) * 2019-08-08 2020-09-25 郑州威科特电子科技有限公司 一种电子元器件高效散热装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134488A (ja) * 1983-01-20 1984-08-02 Agency Of Ind Science & Technol 潜熱蓄熱装置
CN2329925Y (zh) * 1998-08-14 1999-07-21 侯增祺 平面型热管散热器
CN2543205Y (zh) * 2001-12-31 2003-04-02 南京赫特节能环保有限公司 电子元器件和台式电脑cpu芯片分离式相变散热器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134488A (ja) * 1983-01-20 1984-08-02 Agency Of Ind Science & Technol 潜熱蓄熱装置
CN2329925Y (zh) * 1998-08-14 1999-07-21 侯增祺 平面型热管散热器
CN2543205Y (zh) * 2001-12-31 2003-04-02 南京赫特节能环保有限公司 电子元器件和台式电脑cpu芯片分离式相变散热器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013373A (ja) * 2010-07-02 2012-01-19 Hitachi Cable Ltd ヒートパイプ式冷却装置及びこれを用いた車両制御装置
US10718574B2 (en) 2015-10-28 2020-07-21 Sustainable Engine Systems Limited Pin fin heat exchanger

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