WO2006119684A1 - A integrative heat pipe heat exchanging structure - Google Patents

A integrative heat pipe heat exchanging structure Download PDF

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Publication number
WO2006119684A1
WO2006119684A1 PCT/CN2005/002321 CN2005002321W WO2006119684A1 WO 2006119684 A1 WO2006119684 A1 WO 2006119684A1 CN 2005002321 W CN2005002321 W CN 2005002321W WO 2006119684 A1 WO2006119684 A1 WO 2006119684A1
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Prior art keywords
heat pipe
heat dissipation
heat
dissipation structure
working liquid
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PCT/CN2005/002321
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French (fr)
Chinese (zh)
Inventor
Zixin Su
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Zixin Su
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Publication of WO2006119684A1 publication Critical patent/WO2006119684A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Definitions

  • the invention relates to an integrated heat pipe heat dissipation structure, relating to a heat pipe principle of heat conduction, condensation and heat dissipation, and is a heat pipe heat dissipation structure for dissipating heat of a high-power heat source.
  • the computing speed of the electronic components inside the electronic device increases and the power consumption increases, the corresponding heat is also increased.
  • a heat sink In order to enable the electronic components to operate at normal operating temperatures, it is usually necessary to add a heat sink to the surface of the electronic components.
  • the ordinary air-cooled radiator In order to discharge the heat generated by the electronic components in time, with the rapid increase of the heat generation, the ordinary air-cooled radiator can not complete the temperature control requirements, the heat pipe radiator is widely used, and the heat pipe is disposed on a plurality of heat dissipation fins. In order to fully and quickly dissipate the heat generated by electronic components.
  • the contact surface of the heat pipe radiator combination and the electronic component is only the end of the heat pipe, and the heat transfer area is small, so the heat dissipation effect is not satisfactory.
  • the driving principle of the heat pipe is: the working liquid saturated in the capillary in the evaporation portion is heated by the external heat source, and the steam is moved in the direction of the condensation portion due to the pressure difference generated by the steam, the heat is transferred, and the condensation is re-cooled in the condensation portion. The heat is released, and the condensed driving working liquid is absorbed in the condensing portion, and is returned to the evaporation portion.
  • the movement of the driving working liquid and the recirculation process are cyclically operated, so that the evaporation portion continuously moves the heat to the condensing portion.
  • the main factors driving the movement of the working fluid are: the amount of heat transfer, the tube pressure of the capillary, the resistance to the flow of the working fluid in the capillary, and the viscosity limitation, capillary pressure limitation, conduction or overflow limitation, and boiling limitation. Performance is also limited.
  • the capillary structure for accelerating the return of the working medium inside the heat pipe is usually a mesh, a filled particle, a confirmation 2005/002321
  • Sintered powder, groove or fiber capillary structure are known to have disadvantages such as insufficient capillary tension or excessive flow resistance, resulting in poor heat dissipation of the heat pipe and capillary pressure of the sintered powder capillary.
  • the working fluid transporting capacity is affected by the gravitational resistance. Due to the inconsistency of the capillary direction, the transmittance is reduced, and the pressure loss is large when driving the working liquid.
  • the sintered layer It often reaches l-2mm thick, although it is beneficial to the reflow of working liquid, but it also produces a large thermal resistance, and it is difficult to make and process.
  • the invention is proposed to solve the problems of the conventional single capillary structure and the multi-capillary structure micro and large diameter heat pipe structure, and is characterized in that: the surface of the evaporation portion having the groove structure is provided with a copper powder sintered structure, and the surface has The condensing part of the concavo-convex-infiltrated structure, the columnar wick of the multi-layer copper wire concentrically braided, the working liquid and the heat-dissipating fins, and the internal heat-dissipating structure of the high-efficiency integrated heat pipe with a vacuum state.
  • the evaporation portion of the integrated heat pipe heat dissipation structure of the invention is provided with a plurality of convex pillars, the surface of which has a copper powder sintered capillary structure, and the convex surface of the evaporation portion and the multi-layer copper wire are concentrically woven and twisted to form a columnar liquid absorption.
  • the core is in full contact, and a plurality of steam guiding grooves are formed in the middle, and the steam flow is directly moved to the condensing portion through the steam guiding groove, and the working liquid returned by the wick is directly transmitted to the evaporation portion through the top of the convex portion of the evaporation portion, which is effective.
  • the thermal resistance and air resistance of the evaporation portion are reduced, which is more favorable for rapid evaporation and reflux of the working liquid.
  • the columnar wick of the multi-layer copper wire concentrically braided and twisted has a smoothness in the gap, a large transmittance, and a small pressure loss when driving the working liquid to move, which is more favorable for the rapid transfer of the working liquid.
  • Condensation The surface has a concave-convex structure capable of infiltrating the working liquid, which effectively reduces the thermal resistance and air resistance of the condensation portion, and is more conducive to rapid condensation.
  • the integrated heat pipe heat dissipation structure of the invention has higher efficiency and is suitable for heat dissipation of a high power heat source.
  • Figure 1 is a perspective exploded view of a first embodiment of an integrated heat pipe heat dissipation structure of the present invention.
  • Figure 2 is a cross-sectional view showing the assembly of the first embodiment of the integrated heat pipe heat dissipation structure of the present invention.
  • FIG. 3A and 3B are combined cross-sectional views showing a second embodiment of the heat dissipation structure of the integrated heat pipe of the present invention.
  • Figure 4 is a cross-sectional view showing the third embodiment of the integrated heat pipe heat dissipation structure of the present invention.
  • the heat pipe heat dissipation structure of the present invention comprises: an evaporation portion 26 having a plurality of convex pillars having a copper powder sintered capillary structure 28 on the surface, and a surface having irregularities
  • the columnar wick 22 can be formed by condensing the condensing portion 20 of the working liquid structure and concentrically braiding the plurality of copper wires.
  • the condensing tube 20 is welded to the upper portion 24 of the evaporation portion, and the columnar wick 22 which is concentrically braided and twisted by the multi-layer copper wire is inserted, so that the copper powder sintered capillary structure 28 on the surface of the evaporation portion 26 is concentrically woven with the multilayer copper wire.
  • the twisted cylindrical wick 22 is in full contact, and the evaporating portion upper case 24 and the evaporating portion 26 are spliced together, a working liquid is injected, and a vacuum is taken to seal it.
  • the working principle is as follows: the evaporation portion 26 is heated to evaporate and vaporize the working liquid to form a vapor flow, and is rapidly moved to the condensation portion through the evaporation portion guide groove 30 and the condensation portion guide groove 32, and is cooled and condensed in the condensation portion to form
  • 3A and 3B are a second embodiment of the heat pipe heat dissipation structure of the present invention.
  • the condensing tube 40 is welded to the upper portion 44 of the evaporation portion, and the columnar wick 42 formed by concentrically braiding the multi-layer copper wire is inserted.
  • the copper powder sintered capillary structure 48 on the surface of the evaporation portion is sufficiently in contact with the columnar wick 42 which is concentrically braided and twisted by the plurality of copper wires, and the evaporation portion 46 and the upper casing 44 are welded together, the working liquid is injected, and the vacuum is extracted. Seal it.
  • the working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.
  • the embodiment includes a tube body 62 having an inner wall having a concavo-convex shape capable of infiltrating the working liquid.
  • the first end is a sealed 60, and the second end is a second end.
  • the sealing body 64 is an evaporation portion of the heat dissipation structure of the heat pipe, and is provided with a plurality of convex pillars 66 having a copper powder sintered structure 68 on the surface thereof, and a plurality of layers of copper wires concentrically braided and wicked 70, Working fluid and heat sink fins 72.
  • the columnar wicking fastener 7 formed by concentric twisting of the multi-layer copper wire is in full contact with the copper powder sintered structure of the top of the evaporating portion, and the second end sealing body is welded, injected into the working liquid, and extracted. Vacuum, seal it, and then fully connect the outer wall of the tube 62 to the heat sink.
  • the working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An integrative heat pipe heat exchanging structure includes a evaporating part, a condensing part, a liquid absorbing core, working fluid and heat exchanging fins. The evaporating part is connected with the condensing part so as to form a sealed cavity structure, in which the liquid absorbing core and working fluid are contained. The interior of the cavity structure is vacuum, and the heat exchanging fins are in contact with the condensing part. The evaporating part, which has metal sintered capillary structure on the surface, is provided with plurality of fluid guide gas channels, in order to increase heat transferring quantity and heat conduction area. The structure of the condensing part, which can soak working fluid, is convexo-concave and hydrophilic. The independent metal liquid absorbing core is a column body composed of twisting multilayer copper wire concentrically, and it reduces the resistance in the working fluid back flow process. The metal liquid absorbing core is in contact with the evaporating part sufficiently, it can make the work liquid enter into the evaporating part directly through the fluid guide gas channels, and it can be easily made.

Description

一体化热导管散热结构 技术领域  Integrated heat pipe heat dissipation structure
本发明是关于一种一体化热导管散热结构, 涉及热传导、 冷凝、 散热的 热导管原理, 是一种大功率热源散热的热导管散热结构。  The invention relates to an integrated heat pipe heat dissipation structure, relating to a heat pipe principle of heat conduction, condensation and heat dissipation, and is a heat pipe heat dissipation structure for dissipating heat of a high-power heat source.
背景技术 Background technique
随着电子装置内部电子组件运算速度的提升及消耗功率的增大, 相应产 生的热量亦随之剧增, 为了使电子组件能够在正常工作温度下运作, 通常需 要在电子组件表面增设一散热器, 来及时排出电子组件产生的热量, 随着发 热量的剧增, 普通风冷散热器已经不能完成温控要求, 热导管散热器被广泛 采用, 并将热导管穿设在若干散热鳍片上, 以期充分快速散发电子组件产生 的热量。 此种热导管散热器组合与电子组件的接触面仅为热导管的端部, 用 于传热的面积较小, 因而散热效果并不理想。  As the computing speed of the electronic components inside the electronic device increases and the power consumption increases, the corresponding heat is also increased. In order to enable the electronic components to operate at normal operating temperatures, it is usually necessary to add a heat sink to the surface of the electronic components. In order to discharge the heat generated by the electronic components in time, with the rapid increase of the heat generation, the ordinary air-cooled radiator can not complete the temperature control requirements, the heat pipe radiator is widely used, and the heat pipe is disposed on a plurality of heat dissipation fins. In order to fully and quickly dissipate the heat generated by electronic components. The contact surface of the heat pipe radiator combination and the electronic component is only the end of the heat pipe, and the heat transfer area is small, so the heat dissipation effect is not satisfactory.
一般热导管的驱动原理是: 在蒸发部饱和于毛细管内的工作液体受外部 热源加热, 由于蒸汽产生的压差, 使蒸汽向冷凝部方向移动, 进行热量输送, 在冷凝部重新冷却凝缩、 放热, 此时凝缩的驱动工作液体吸收于冷凝部, 再 向蒸发部回流, 上述驱动工作液体的移动及回流过程循环运作, 从而由蒸发 部不断向冷凝部持续性的移动热量。  Generally, the driving principle of the heat pipe is: the working liquid saturated in the capillary in the evaporation portion is heated by the external heat source, and the steam is moved in the direction of the condensation portion due to the pressure difference generated by the steam, the heat is transferred, and the condensation is re-cooled in the condensation portion. The heat is released, and the condensed driving working liquid is absorbed in the condensing portion, and is returned to the evaporation portion. The movement of the driving working liquid and the recirculation process are cyclically operated, so that the evaporation portion continuously moves the heat to the condensing portion.
一般驱动工作液体移动的主要因素在于: 热传导量、 毛细管的管压、 毛 细管内对于驱动工作液体流向的阻力透过率, 另外由于粘性限制、 毛细管压 限制、 传导或溢流限制及沸腾限制, 其性能也受到限制。  The main factors driving the movement of the working fluid are: the amount of heat transfer, the tube pressure of the capillary, the resistance to the flow of the working fluid in the capillary, and the viscosity limitation, capillary pressure limitation, conduction or overflow limitation, and boiling limitation. Performance is also limited.
目前热导管内部加速工作介质回流的毛细结构通常为网孔、 填充颗粒、 确 认 本 2005/002321 At present, the capillary structure for accelerating the return of the working medium inside the heat pipe is usually a mesh, a filled particle, a confirmation 2005/002321
2  2
烧结粉末、 凹槽或纤维毛细结构, 然而, 已知的这些毛细结构都存在毛细张 力不够或流动阻抗过大等缺点, 因而导致热导管的散热效果不良, 烧结粉末 毛细管的毛细管压大, 因此对于受引力阻力影响的工作流体输送能力卓越, 由于其毛细孔方向的不一致性, 透过率减小, 驱动工作液体移动时压力损失 大, 特别是大口径的热导管, 为了提高传导率, 烧结层往往达到 l-2mm厚, 虽然有利于工作液体的回流, 但也产生很大的热阻, 而且制作加工难度较大。 Sintered powder, groove or fiber capillary structure. However, these capillary structures are known to have disadvantages such as insufficient capillary tension or excessive flow resistance, resulting in poor heat dissipation of the heat pipe and capillary pressure of the sintered powder capillary. The working fluid transporting capacity is affected by the gravitational resistance. Due to the inconsistency of the capillary direction, the transmittance is reduced, and the pressure loss is large when driving the working liquid. Especially for the large-diameter heat pipe, in order to improve the conductivity, the sintered layer It often reaches l-2mm thick, although it is beneficial to the reflow of working liquid, but it also produces a large thermal resistance, and it is difficult to make and process.
由于热导管中蒸汽流与工作液体的回流是反向的, 产生流动的阻抗力也 较大, 导致蒸汽流与工作液体间必产生相互干扰而影响工作介质的循环。  Since the flow of steam in the heat pipe is reversed from the return of the working fluid, the resistance to flow is also large, which causes mutual interference between the steam flow and the working fluid and affects the circulation of the working medium.
因此, 如何提供一种散热效果良好改善上述缺点的热导管结构, 即为本 发明所要解决的课题。  Therefore, how to provide a heat pipe structure which is excellent in heat dissipation effect and which is capable of improving the above disadvantages is a problem to be solved by the present invention.
发明内容 Summary of the invention
本发明是为了解决以往单一毛细结构、 多重毛细管结构的微型及大口径 热导管结构的问题而提出的, 其特点为: 是由具有凹槽结构的蒸发部表面设 有铜粉烧结结构、 表面具有凹凸形浸润结构的冷凝部、 多层铜丝同心编织扭 合而成的柱状吸液芯、 工作液体及散热鳍片组成的, 内部呈真空状态的高效 能一体化热导管原理散热结构。  The invention is proposed to solve the problems of the conventional single capillary structure and the multi-capillary structure micro and large diameter heat pipe structure, and is characterized in that: the surface of the evaporation portion having the groove structure is provided with a copper powder sintered structure, and the surface has The condensing part of the concavo-convex-infiltrated structure, the columnar wick of the multi-layer copper wire concentrically braided, the working liquid and the heat-dissipating fins, and the internal heat-dissipating structure of the high-efficiency integrated heat pipe with a vacuum state.
本发明一体化热导管散热结构的蒸发部设有若干个凸起柱状物, 其表面 具有铜粉烧结毛细结构, 蒸发部的凸起面与多层铜丝同心编织扭合而成的柱 状吸液芯充分接触, 中间形成多道导流汽槽, 蒸汽流通过导流汽槽直接迅速 向冷凝部移动, 同时吸液芯回流的工作液体通过蒸发部凸起的顶部直接迅速 向蒸发部传送, 有效减小了蒸发部的热阻、 气阻, 更利于工作液体迅速蒸发 回流。 多层铜丝同心编织扭合而成的柱状吸液芯, 其空隙具有顺向性, 透过 率大, 驱动工作液体移动时压力损失小, 更利于工作液体迅速传送。 冷凝部 表面具有凹凸形能够浸润工作液体的结构, 有效降低了冷凝部的热阻、气阻, 更利于迅速冷凝。 The evaporation portion of the integrated heat pipe heat dissipation structure of the invention is provided with a plurality of convex pillars, the surface of which has a copper powder sintered capillary structure, and the convex surface of the evaporation portion and the multi-layer copper wire are concentrically woven and twisted to form a columnar liquid absorption. The core is in full contact, and a plurality of steam guiding grooves are formed in the middle, and the steam flow is directly moved to the condensing portion through the steam guiding groove, and the working liquid returned by the wick is directly transmitted to the evaporation portion through the top of the convex portion of the evaporation portion, which is effective. The thermal resistance and air resistance of the evaporation portion are reduced, which is more favorable for rapid evaporation and reflux of the working liquid. The columnar wick of the multi-layer copper wire concentrically braided and twisted has a smoothness in the gap, a large transmittance, and a small pressure loss when driving the working liquid to move, which is more favorable for the rapid transfer of the working liquid. Condensation The surface has a concave-convex structure capable of infiltrating the working liquid, which effectively reduces the thermal resistance and air resistance of the condensation portion, and is more conducive to rapid condensation.
由于采用了上述技术方案, 本发明一体化热导管散热结构具有更高的效 能, 适合于大功率热源散热。  Due to the adoption of the above technical solution, the integrated heat pipe heat dissipation structure of the invention has higher efficiency and is suitable for heat dissipation of a high power heat source.
附图说明 DRAWINGS
图 1是本发明一体化热导管散热结构第一实施例的立体分解图。  BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of a first embodiment of an integrated heat pipe heat dissipation structure of the present invention.
图 2是本发明一体化热导管散热结构第一实施例的组合剖视图。  Figure 2 is a cross-sectional view showing the assembly of the first embodiment of the integrated heat pipe heat dissipation structure of the present invention.
图 3A、 3B是本发明一体化热导管散热结构第二实施例的组合剖视图。 图 4是本发明一体化热导管散热结构第三实施例的组合剖视图。  3A and 3B are combined cross-sectional views showing a second embodiment of the heat dissipation structure of the integrated heat pipe of the present invention. Figure 4 is a cross-sectional view showing the third embodiment of the integrated heat pipe heat dissipation structure of the present invention.
具体实施方式 detailed description
请参阅图 1、 2是本发明热导管散热结构的第一实施例, 本发明热导管散 热结构包括: 具有若干凸起柱状物, 表面具有铜粉烧结毛细结构 28的蒸发部 26、 表面具有凹凸形能够浸润工作液体结构的冷凝部 20、 多层铜丝同心编织 扭合而成的柱状吸液芯 22。 将冷凝管 20焊接于蒸发部上壳 24上, 插入多层 铜丝同心编织扭合而成的柱状吸液芯 22,使蒸发部 26表面的铜粉烧结毛细结 构 28与多层铜丝同心编织扭合而成的柱状吸液芯 22充分接触, 将蒸发部上 壳 24与蒸发部 26悍接在一起, 注入工作液体, 抽取真空, 使之密封。  1 and 2 are a first embodiment of the heat pipe heat dissipation structure of the present invention. The heat pipe heat dissipation structure of the present invention comprises: an evaporation portion 26 having a plurality of convex pillars having a copper powder sintered capillary structure 28 on the surface, and a surface having irregularities The columnar wick 22 can be formed by condensing the condensing portion 20 of the working liquid structure and concentrically braiding the plurality of copper wires. The condensing tube 20 is welded to the upper portion 24 of the evaporation portion, and the columnar wick 22 which is concentrically braided and twisted by the multi-layer copper wire is inserted, so that the copper powder sintered capillary structure 28 on the surface of the evaporation portion 26 is concentrically woven with the multilayer copper wire. The twisted cylindrical wick 22 is in full contact, and the evaporating portion upper case 24 and the evaporating portion 26 are spliced together, a working liquid is injected, and a vacuum is taken to seal it.
其工作原理是: 蒸发部 26受热, 使工作液体蒸发汽化, 形成汽流, 通过 蒸发部导流槽 30和冷凝部导流槽 32向冷凝部迅速移动, 在冷凝部冷却、 凝 缩, 又形成工作液体,.通过多层铜丝同心编织扭合而成的柱状吸液芯 22向蒸 发部 26回流, 往复快速循环, 达到散热的目的。  The working principle is as follows: the evaporation portion 26 is heated to evaporate and vaporize the working liquid to form a vapor flow, and is rapidly moved to the condensation portion through the evaporation portion guide groove 30 and the condensation portion guide groove 32, and is cooled and condensed in the condensation portion to form The working liquid, the columnar wick 22 twisted by the multi-layer copper wire concentrically woven, flows back to the evaporation portion 26, and reciprocates rapidly to achieve the purpose of heat dissipation.
请参阅图 3A、 3B是本发明热导管散热结构的第二实施例, 将冷凝管 40 焊接于蒸发部上壳 44上, 插入多层铜丝同心编织扭合而成的柱状吸液芯 42, 使蒸发部表面的铜粉烧结毛细结构 48与多层铜丝同心编织扭合而成的柱状吸 液芯 42充分接触, 将蒸发部 46与上壳 44焊接在一起, 注入工作液体, 抽取 真空, 使之密封。 本实施例的工作原理与第一实施例相同, 此不赘述。 3A and 3B are a second embodiment of the heat pipe heat dissipation structure of the present invention. The condensing tube 40 is welded to the upper portion 44 of the evaporation portion, and the columnar wick 42 formed by concentrically braiding the multi-layer copper wire is inserted. The copper powder sintered capillary structure 48 on the surface of the evaporation portion is sufficiently in contact with the columnar wick 42 which is concentrically braided and twisted by the plurality of copper wires, and the evaporation portion 46 and the upper casing 44 are welded together, the working liquid is injected, and the vacuum is extracted. Seal it. The working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.
请参阅图 4是本发明热导管散热结构的第三实施例, 该实施例包括一管 体 62, 其内壁具有凹凸形能够浸润工作液体的结构, 第一端是密封的 60, 第 二端为密封体 64, 是该热导管散热结构的蒸发部, 设有若干凸起柱状物 66, 其表面具有铜粉烧结结构 68,若干条多层铜丝同心编织扭合而成的吸液芯 70, 工作液体及散热鳍片 72。 将多层铜丝同心编织扭合而成的柱状吸液芯用扣具 7 与蒸发部凸起柱状物顶部铜粉烧结结构充分接触, 将第二端密封体盖上焊 接, 注入工作液体, 抽取真空, 使之密封, 然后将该管体 62外壁与散热片充 分连接。 本实施例的工作原理与第一实施例相同, 此不赘述。  4 is a third embodiment of the heat pipe heat dissipation structure of the present invention. The embodiment includes a tube body 62 having an inner wall having a concavo-convex shape capable of infiltrating the working liquid. The first end is a sealed 60, and the second end is a second end. The sealing body 64 is an evaporation portion of the heat dissipation structure of the heat pipe, and is provided with a plurality of convex pillars 66 having a copper powder sintered structure 68 on the surface thereof, and a plurality of layers of copper wires concentrically braided and wicked 70, Working fluid and heat sink fins 72. The columnar wicking fastener 7 formed by concentric twisting of the multi-layer copper wire is in full contact with the copper powder sintered structure of the top of the evaporating portion, and the second end sealing body is welded, injected into the working liquid, and extracted. Vacuum, seal it, and then fully connect the outer wall of the tube 62 to the heat sink. The working principle of this embodiment is the same as that of the first embodiment, and details are not described herein.
以上所述的实施例仅为本发明的较佳施例而已, 并非用以限定本发明实 施的范围, 故凡依本发明申请专利范围所述的形状、 构造、 特征、 精神所为 的均等变化及修饰, 均应包括于本发明的申请专利范围内。  The embodiments described above are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, so that the shapes, structures, features, and spirits described in the claims of the present invention vary equally. And modifications are intended to be included in the scope of the patent application of the present invention.

Claims

权 利 要 求 Rights request
1、 一种一体化热导管散热结构, 其特征在于, 该一体化热导管散热结构 包括: 具有凹槽结构的蒸发部、 冷凝部、 金属吸液芯、 工作液体及散热鳍片, 其中蒸发部和冷凝部连接形成一个密封的空腔结构, 金属吸液芯和工作液体 位于空腔结构内部, 该空腔结构内部呈真空状态, 散热鳍片和冷凝部相接触, 通过各部位明确的工作功能提高热导管的热传导度、 热输送量及温度控制性 能。 1 . An integrated heat pipe heat dissipation structure, characterized in that: the integrated heat pipe heat dissipation structure comprises: an evaporation portion having a groove structure, a condensation portion, a metal wick, a working liquid and a heat dissipation fin, wherein the evaporation portion And the condensation portion is connected to form a sealed cavity structure, the metal wick and the working liquid are located inside the cavity structure, the cavity structure is in a vacuum state, the heat dissipation fins are in contact with the condensation portion, and the clear working function is adopted through each part Improve heat transfer, heat transfer and temperature control of the heat pipe.
2、 根据权利要求 1所述的一体化热导管散热结构, 其特征在于: 蒸发部 设有若干个凸起柱状物。  2. The integrated heat pipe heat dissipation structure according to claim 1, wherein the evaporation portion is provided with a plurality of raised pillars.
3、 根据权利要求 1或 2所述的一体化热导管散热结构, 其特征在于: 蒸 发部若干凸起柱状物的表面具有铜粉烧结的毛细结构。  The integrated heat pipe heat dissipation structure according to claim 1 or 2, wherein the surface of the plurality of raised pillars in the evaporation portion has a copper powder sintered capillary structure.
4、 根据权利要求 1所述的一体化热导管散热结构, 其特征在于: 冷凝部 表面具有凹凸形能够浸润工作液体的结构。  4. The integrated heat pipe heat dissipation structure according to claim 1, wherein the surface of the condensation portion has a concavo-convex shape capable of infiltrating the working liquid.
5、 根据权利要求 1所述的一体化热导管散热结构, 其特征在于: 金属吸 液芯为多层铜丝同心编织扭合而成的柱状体。  5. The integrated heat pipe heat dissipation structure according to claim 1, wherein the metal wick is a columnar body formed by concentric twisting of a plurality of layers of copper wires.
6、 根据权利要求 1所述的一体化热导管散热结构, 其特征在于: 热导管 内部注入工作液体, 热导管内部呈真空状态。  6. The integrated heat pipe heat dissipation structure according to claim 1, wherein the inside of the heat pipe is filled with a working liquid, and the inside of the heat pipe is in a vacuum state.
PCT/CN2005/002321 2005-05-10 2005-12-26 A integrative heat pipe heat exchanging structure WO2006119684A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013373A (en) * 2010-07-02 2012-01-19 Hitachi Cable Ltd Heat pipe type cooling system and vehicle control equipment using the same
US10718574B2 (en) 2015-10-28 2020-07-21 Sustainable Engine Systems Limited Pin fin heat exchanger
CN113418414A (en) * 2021-07-07 2021-09-21 福建强纶新材料股份有限公司 Novel heat pipe
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JP6640401B1 (en) 2019-04-18 2020-02-05 古河電気工業株式会社 heatsink
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US20240147667A1 (en) * 2022-10-31 2024-05-02 Guangzhou Neogene Thermal Management Technology Co., Ltd. Liquid-cooling heat-dissipating module with embedded three-dimensional vapor chamber device
US20240147666A1 (en) * 2022-10-31 2024-05-02 Guangzhou Neogene Thermal Management Technology Co., Ltd. Three-dimensional vapor chamber device and the method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134488A (en) * 1983-01-20 1984-08-02 Agency Of Ind Science & Technol Latent heat type heat accumulator
CN2329925Y (en) * 1998-08-14 1999-07-21 侯增祺 Plane-type heat pipe radiator
CN2543205Y (en) * 2001-12-31 2003-04-02 南京赫特节能环保有限公司 Separating phase-change radiator for electronic element and device and desk computer CPU chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134488A (en) * 1983-01-20 1984-08-02 Agency Of Ind Science & Technol Latent heat type heat accumulator
CN2329925Y (en) * 1998-08-14 1999-07-21 侯增祺 Plane-type heat pipe radiator
CN2543205Y (en) * 2001-12-31 2003-04-02 南京赫特节能环保有限公司 Separating phase-change radiator for electronic element and device and desk computer CPU chip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013373A (en) * 2010-07-02 2012-01-19 Hitachi Cable Ltd Heat pipe type cooling system and vehicle control equipment using the same
US10718574B2 (en) 2015-10-28 2020-07-21 Sustainable Engine Systems Limited Pin fin heat exchanger
CN113418414A (en) * 2021-07-07 2021-09-21 福建强纶新材料股份有限公司 Novel heat pipe
CN116399148B (en) * 2023-03-31 2024-06-07 东莞智富五金制品有限公司 Production method of high-power efficient heat exchange transpiration loop module

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