CN108770281B - 一种高热流密度电子器件散热装置及使用方法 - Google Patents
一种高热流密度电子器件散热装置及使用方法 Download PDFInfo
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- CN108770281B CN108770281B CN201810324435.XA CN201810324435A CN108770281B CN 108770281 B CN108770281 B CN 108770281B CN 201810324435 A CN201810324435 A CN 201810324435A CN 108770281 B CN108770281 B CN 108770281B
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- heat
- cooling water
- bottom plate
- electronic device
- flux density
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
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CN201810324435.XA CN108770281B (zh) | 2018-04-12 | 2018-04-12 | 一种高热流密度电子器件散热装置及使用方法 |
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CN201810324435.XA CN108770281B (zh) | 2018-04-12 | 2018-04-12 | 一种高热流密度电子器件散热装置及使用方法 |
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CN108770281A CN108770281A (zh) | 2018-11-06 |
CN108770281B true CN108770281B (zh) | 2019-10-29 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110430733B (zh) * | 2019-08-08 | 2020-11-20 | 盐城市钊扬工业设计有限公司 | 一种电子元器件高效散热装置 |
WO2022170687A1 (zh) * | 2021-02-10 | 2022-08-18 | 刘沛然 | 水冷散热器及水冷散热系统 |
CN112802811B (zh) * | 2021-03-31 | 2021-06-25 | 度亘激光技术(苏州)有限公司 | 一种半导体器件散热结构及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105611807A (zh) * | 2016-01-30 | 2016-05-25 | 清华大学 | 一种基于金属相变材料和热管的一体化散热器 |
CN207213659U (zh) * | 2017-06-15 | 2018-04-10 | 华南理工大学 | 一种大功率led散热灯 |
Family Cites Families (5)
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KR200208005Y1 (ko) * | 2000-06-19 | 2000-12-15 | 주식회사태림테크 | 컴퓨터용 중앙연산처리장치의 냉각장치 |
CN2874398Y (zh) * | 2005-05-10 | 2007-02-28 | 苏子欣 | 一体化热导管散热结构 |
CN105810646B (zh) * | 2016-05-20 | 2018-08-24 | 扬州大学 | 一种多热管复合式高功率电子芯片散热器 |
CN106332529B (zh) * | 2016-10-18 | 2019-06-11 | 中车大连机车研究所有限公司 | 一种管带式微循环散热器及微循环换热系统 |
CN106643246A (zh) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | 一种复合吸液芯式异形热管散热器 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105611807A (zh) * | 2016-01-30 | 2016-05-25 | 清华大学 | 一种基于金属相变材料和热管的一体化散热器 |
CN207213659U (zh) * | 2017-06-15 | 2018-04-10 | 华南理工大学 | 一种大功率led散热灯 |
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Application publication date: 20181106 Assignee: Center for technology transfer Jiangsu University of Science and Technology Assignor: JIANGSU University OF SCIENCE AND TECHNOLOGY Contract record no.: X2021980006173 Denomination of invention: The invention relates to a heat dissipation device for high heat flux electronic devices and an application method thereof Granted publication date: 20191029 License type: Common License Record date: 20210714 |
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Assignee: Center for technology transfer Jiangsu University of Science and Technology Assignor: JIANGSU University OF SCIENCE AND TECHNOLOGY Contract record no.: X2021980006173 Date of cancellation: 20210826 |
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