WO2006059416A1 - 複合材料振動装置 - Google Patents
複合材料振動装置 Download PDFInfo
- Publication number
- WO2006059416A1 WO2006059416A1 PCT/JP2005/016403 JP2005016403W WO2006059416A1 WO 2006059416 A1 WO2006059416 A1 WO 2006059416A1 JP 2005016403 W JP2005016403 W JP 2005016403W WO 2006059416 A1 WO2006059416 A1 WO 2006059416A1
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- WO
- WIPO (PCT)
- Prior art keywords
- piezoelectric
- plate
- vibration
- thermal expansion
- reflective layer
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
Definitions
- the present invention relates to a composite material vibration device in which a plurality of material portions having different acoustic impedances are connected, and more specifically, a plurality of material layers having different acoustic impedances are laminated on a vibration element such as a piezoelectric element.
- the present invention relates to a laminated composite material vibration device.
- Patent Document 1 discloses a composite material vibration device shown in FIGS. 7 (a) and 7 (b).
- a plate-like piezoelectric resonance element 102 is used as a vibration element.
- a holding member 104 is laminated on the upper surface of the piezoelectric resonant element 102 with a reflective layer 103 interposed therebetween.
- a holding member 106 is laminated on the lower surface of the piezoelectric resonant element 102 via a reflective layer 105.
- An external electrode 107 is formed on one end face of the laminate in which these members are laminated, and an external electrode 108 is formed on the other end face.
- an excitation electrode 112 is formed on the upper surface of a plate-like piezoelectric substrate 111, and an excitation electrode 113 is formed on the lower surface.
- the piezoelectric substrate 111 is made of lead zirconate titanate-based piezoelectric ceramic, and is polarized in the length direction that connects the external electrodes 107 and 108.
- the excitation electrodes 112 and 113 are opposed to each other via the piezoelectric substrate 111 at the center in the length direction of the piezoelectric substrate 111.
- the facing portions of the excitation electrodes 112 and 113 constitute a vibrating portion to which an electric field is applied during driving, and the piezoelectric resonant element 102 operates as a piezoelectric resonant element utilizing an energy trapping thickness-slip mode.
- the excitation electrode 112 is electrically connected to the external electrode 107
- the excitation electrode 113 is electrically connected to the external electrode 108.
- the acoustic impedance value Z 1S of the reflective layers 103 and 105 is smaller than the acoustic impedance value Z of the piezoelectric substrate 111 and the holding portion
- the acoustic impedance value Z of the materials 104 and 106 is made smaller. More specifically, here In this case, the reflective layers 103 and 105 are made of epoxy resin, and the holding members 104 and 106 are made of ceramics. Since Z> Z, the piezoelectric resonant element 102 to the reflective layers 103, 10
- the vibration force propagated to 5 is reflected at the interface between the reflective layers 103 and 105 and the holding members 104 and 106. Therefore, since vibration is confined between the upper and lower interfaces, even if the piezoelectric resonant element 102 is mechanically held by the holding members 104 and 106, it is difficult to affect the vibration of the piezoelectric resonant element 102. ! / Speak.
- the holding member 106 is made of dielectric ceramics.
- the capacitive electrodes 114 and 115 are opposed to the upper surface of the holding member 106 with a gap in the center.
- a capacitive electrode 116 is formed on the lower surface of the holding member 106.
- the capacitive electrodes 114 and 115 and the capacitive electrode 116 are opposed to each other via the holding member 106, and constitute a three-terminal capacitor.
- Patent Document 2 discloses a method of manufacturing this type of composite material vibration device.
- an epoxy resin as a fluid material for forming a reflective layer is applied on a holding substrate constituting the holding member.
- the vibration element is bonded, and the fluid material is cured by heat to form a reflective layer.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-332875
- Patent Document 2 Japanese Patent Laid-Open No. 2003-338720
- the material constituting the reflective layer and the protective layer is not particularly limited, but it is described that an appropriate material capable of achieving the target acoustic impedance values Z and Z is used.
- Patent Document 2 discloses a structure in which the reflective layer is formed of a cured epoxy resin.
- thermosetting epoxy resin-based curable composition is cured by heating at around 100 ° C to give a cured product.
- this cured product has a much larger coefficient of thermal expansion than ceramics. Therefore, when the cured product significantly shrinks due to cooling after curing, the shrinkage occurs at the interface between the reflective layer and the piezoelectric substrate constituting the vibration element. Stress along the surface direction is applied by the spray layer. That is, as schematically shown by arrows A and —A in FIG.
- the acoustic impedance of the reflection layer By reducing the value Z relatively small,
- the reflective layers 103 and 105 are made of a cured product of a thermosetting epoxy-resin curable composition, due to shrinkage upon cooling after curing, There is a problem that the stress is generated and the characteristics of the piezoelectric resonant element 102 are deteriorated.
- the thermal expansion coefficient of the finally obtained reflective layers 103 and 105 is the vibration member.
- the thermal expansion coefficient is much larger than the material constituting the piezoelectric resonance element 102
- the stress in the A and -A directions is applied as described above, The characteristics tended to deteriorate.
- the ambient temperature suddenly increased, stress in the direction opposite to the A and A directions was applied, and the characteristics tended to deteriorate.
- An object of the present invention has a structure in which an acoustic impedance is relatively low and a plate-like holding member is laminated on a plate-like vibration element via a reflective layer in view of the current state of the related art described above.
- the vibration characteristic of the composite material vibration device is hardly deteriorated based on the difference between the thermal expansion coefficient of the reflective layer and the thermal expansion coefficient of the material constituting the vibration element. There is to do.
- the present invention is a composite vibration device having a structure in which a plurality of members having different acoustic impedances are coupled, and using a plate-like body made of a material having a first acoustic impedance value Z1.
- a plate-like vibration element having an excitation electrode on at least one of the upper surface and the lower surface of the plate-like body, and smaller than the first acoustic impedance value Z1.
- the thermal expansion coefficient of the reflective layer along the surface direction of the interface between the reflective layer and the vibration element is X
- the reflective layer and the holding When the thermal expansion coefficient of the holding member along the surface direction of the interface with the material is Y, a) X and Y are of opposite polarity and the absolute value of Y is 4% or less of the absolute value of X, b) X And Y are of the same polarity and Y is 3% or less of or c) Y is 0.
- the composite material vibration device further includes a plate-like capacitor bonded to a surface opposite to the surface laminated on the reflective layer of the holding member.
- the plate capacitor includes a dielectric substrate and a plate capacitor including a plurality of capacitance electrodes provided on the dielectric substrate.
- the vibration element includes an electromechanical coupling conversion element.
- Examples of the electromechanical coupling conversion element include a piezoelectric element and an electrostrictive element.
- a plate-like vibration element configured using a plate-like body made of a material having an acoustic impedance value Z1 has a reflection having a material force having an acoustic impedance value Z2.
- the vibration propagated from the vibration element to the reflection layer is reflected at the interface between the reflection layer and the holding member. Therefore, even if the holding member is used to mechanically support the vibration element, The influence on the dynamic characteristics can be suppressed. Therefore, since a space for not preventing vibration is not required, it is possible to provide a composite material vibration device that is small in size and excellent in mechanical strength.
- the thermal expansion coefficient along the surface direction of the interface between the reflective layer and the vibrating element is X
- the thermal expansion coefficient of the holding member along the interface between the holding member and the reflective layer is Y.
- X and Y are of opposite polarity and the absolute value of Y is 4% or less of the absolute value of X
- b) X and Y are of the same polarity and Y is 3% or less of X
- c) Y Therefore, it is possible to suppress deterioration of characteristics due to a difference in thermal expansion coefficient between the reflective layer and the vibration element.
- the interface between the reflective layer and the vibration element is formed. Stress due to the difference in thermal expansion coefficient is applied.
- a) X and Y are opposite in polarity and the absolute value of Y is 4% or less of the absolute value of X.
- the contraction or expansion behavior of the reflective layer is suppressed by the holding member, the contraction or expansion of the reflective layer at the interface between the reflective layer and the vibration element is also suppressed, and the stress at the interface can be reduced. For this reason, the stress due to the difference in thermal expansion coefficient between the reflective layer and the vibration element is reduced, so that it is possible to reliably suppress the characteristic deterioration due to the difference in thermal expansion coefficient.
- a holding plate is further provided with a plate-like capacitor adhered to the surface opposite to the surface laminated on the reflective layer, and the plate-like capacitor is provided on the dielectric substrate and the dielectric substrate. If you have a plurality of capacitance electrodes, configure a plate-shaped capacitor! / The dielectric substrate is not directly bonded to the vibration element. In the case of a structure in which a plate-like capacitor is bonded directly to the vibration element, the thermal expansion coefficient of the material constituting the vibration element and the thermal expansion coefficient of the dielectric substrate constituting the plate-like capacitor are I have to make the difference small. This is because peeling occurs at the bonded portion.
- the plate-like capacitor is directly bonded to the vibration element, it is necessary to form a plate-like capacitor! Coefficient of thermal expansion
- the vibration element can be selected without being restricted by the thermal expansion coefficient of the material. Accordingly, it is possible to select a wide range of material strengths for the dielectric substrate by placing importance on the characteristics of the capacitor such as the dielectric constant ⁇ and the temperature characteristic of the dielectric constant.
- the vibration element is an electromechanical coupling conversion element
- a material vibration device can be easily provided.
- FIG. 1 (a) and FIG. 1 (b) are a front sectional view and a perspective view showing an external appearance of a composite material vibration device according to a first embodiment of the present invention.
- FIGS. 2 (a) and 2 (b) are a plan view and a bottom view of a piezoelectric resonance element used in the composite material vibration device of the first embodiment.
- FIG. 3 (a) is a diagram showing the change of the phase angle maximum value ⁇ in the phase frequency characteristic when the thermal expansion coefficient of the holding member is changed in the piezoelectric resonator of the first embodiment.
- Figure 3 (b) shows the result of rewriting the result of (a) with the horizontal axis as YZX (%).
- Figures 4 (a) and 4 (b) show the stress applied to the piezoelectric resonant element by the finite element method when the thermal expansion coefficient of the holding member is 9.3ppmZ ° C and -0.4ppmZ ° C. It is each figure which shows typically the result.
- FIG. 5 is a schematic front perspective view showing a laminated piezoelectric resonance apparatus as a composite material vibration apparatus according to a second embodiment of the present invention.
- FIG. 6 is a perspective view showing a modification of the multilayer piezoelectric resonator according to the second embodiment.
- FIG. 7 (a) and FIG. 7 (b) are a front sectional view and an external perspective view of a conventional composite material vibration device.
- FIGS. 1 (a) and 1 (b) are a front sectional view and a perspective view showing an appearance of a laminated piezoelectric resonator as a composite material vibration device according to an embodiment of the present invention.
- the piezoelectric resonance apparatus 1 has a plate-like piezoelectric resonance element 2.
- a first reflective layer 3 is laminated on the upper surface of the plate-like piezoelectric resonator element 2, and a second reflective layer 5 is laminated on the lower surface.
- a first holding member 4 and a second holding member 6 are laminated on the surface of the reflective layers 3 and 5 opposite to the side laminated on the piezoelectric resonance element 2.
- a first external electrode 7 is formed on one end face of the laminate composed of the reflective layers 3 and 5 and the holding members 4 and 6 and the second external electrode 8 is formed on the other end face of the piezoelectric resonant element 2. Speak.
- the plate-like piezoelectric resonance element 2 has a rectangular plate-like piezoelectric plate 11. As shown in FIG. 2A, a first excitation electrode 12 is formed on the upper surface of the piezoelectric plate 11. Figure 2 (b) shows the plane. As shown in the figure, a second excitation electrode 13 is formed on the lower surface of the piezoelectric plate 11.
- the excitation electrodes 12 and 13 are not particularly limited, but in the present embodiment, the excitation electrodes 12 and 13 are formed of a laminated metal film in which three layers of a chromium thin film, a monel thin film, and a silver thin film are sequentially laminated.
- the piezoelectric plate 11 has an elongated, rectangular plate shape, that is, a strip shape. In this embodiment, the piezoelectric plate 11 also has a lead zirconate titanate-based piezoelectric ceramic force and is polarized in the length direction.
- the acoustic impedance value Z1 of the piezoelectric plate 11 is 2.87 ⁇ 10 7 kg / (m 2 s).
- the piezoelectric plate 11 may be composed of other piezoelectric ceramics or a piezoelectric single crystal.
- the excitation electrodes 12 and 13 are formed to reach the entire width of the piezoelectric plate 11. However, the excitation electrodes 12 and 13 do not necessarily have to reach the full width of the piezoelectric plate 11.
- the excitation electrodes 12 and 13 are opposed to each other via the piezoelectric plate 11 in the center in the length direction of the piezoelectric plate 11.
- This opposed portion is a vibrating portion to which a voltage is applied during driving. Vibration attenuating portions are formed on both sides of the vibration portion in the length direction of the piezoelectric plate 11. That is, the piezoelectric resonance element 2 is an energy confinement type piezoelectric resonance element using a thickness shear mode.
- the reflective layers 3 and 5 are made of a cured product of an epoxy resin composition, and the acoustic impedance value Z2 is 2.80 X 10 6 kg / (m 2 s). .
- the thermal expansion coefficient X of the reflective layers 3 and 5 in the direction along the interface between the reflective layers 3 and 5 and the piezoelectric resonant element 2 is 50 ppm Z ° C.
- the first and second holding members 4 and 6 are made of lead titanate-based insulating ceramics, and the acoustic impedance value Z3 thereof is 3. 43 X 10 7 kgZ (m 2 s), and the thermal expansion coefficient Y in the direction along the interface between the holding members 4 and 6 and the reflective layers 3 and 5 is 0.4 ppm Z ° C.
- the excitation electrode 12 is drawn out to one end face of the laminate, and is electrically connected to the first external electrode 7.
- the excitation electrode 13 is drawn out to the other end face of the laminate, and is electrically connected to the second external electrode 8.
- the external electrodes 7 and 8 are each composed of a laminated metal film in which three layers of a nichrome thin film, a nickel plating film, and a sparrow film are sequentially laminated. Further, the external electrodes 7 and 8 are provided on the lower surface of the laminated body, that is, the lower holding member 6 for mounting on a circuit board or the like. It is extended to reach the bottom of!
- the material constituting the external electrodes 7, 8 is not particularly limited. Further, the extension portions 7a and 8a are not necessarily provided.
- the characteristics of the piezoelectric resonator 1 of the present embodiment are that the acoustic impedance value Z2 is smaller than the acoustic impedance value Z1 and smaller than Z3, and the polarity of the thermal expansion coefficient Y is
- the polarity of the thermal expansion coefficient X is opposite, and the absolute value of Y is 4% or less of the absolute value of X.
- the acoustic impedance value Z2 is smaller than the acoustic impedance values Z1 and Z3, even if the vibration generated in the piezoelectric resonant element 2 propagates to the reflective layers 3 and 5, the reflection layer 3 and the holding member 4 Reflected by the interface and the interface between the reflective layer 5 and the holding member 6. Therefore, even if the holding members 4 and 6 are mechanically supported, it is difficult to affect the vibration characteristics of the piezoelectric resonant element 2 due to the support structure.
- the thermal expansion coefficient of the piezoelectric plate 11 of the piezoelectric resonant element 2 and the thermal expansion of the reflective layers 3 and 5 Deterioration of resonance characteristics due to coefficient difference is also unlikely to occur. That is, for example, when the ambient temperature changes abruptly, or when the material constituting the reflective layers 3 and 5 is a thermosetting adhesive, and shrinkage occurs upon cooling after the adhesive is cured, As described above, the thermal expansion coefficient X of the cured product of the epoxy adhesive is 1.18 ppm / ° C, which is the thermal expansion coefficient of the lead zirconate titanate ceramics constituting the piezoelectric plate 11. Much larger than the value. Therefore, stress in the A, —A direction or in the opposite direction in FIG. 1 is generated at the interface between the piezoelectric resonator element 2 and the reflective layers 3 and 5.
- the polarity of Y is different from the polarity of X, and the absolute value of Y is 4% or less of the absolute value of X.
- the holding members 4 and 6 exist outside the reflective layers 3 and 5, and the holding members 4 and 6 try to expand or contract contrary to the reflective layers 3 and 5. That is, the contraction or expansion on the outer surfaces of the reflective layers 3 and 5 is offset by the expansion or contraction of the holding members 4 and 6. For this reason, the shrinkage or expansion of the reflective layers 3 and 5 is suppressed, and as a result, the stress at the interface between the reflective layers 3 and 5 and the piezoelectric plate 11 is reduced. Therefore, the reflective layers 3 and 5 As described above, when composed of a cured product of a curable composition of epoxy resin, it is possible to suppress the influence of shrinkage upon cooling after curing.
- the piezoelectric plate 11 is made of a lead zirconate titanate ceramic and has a length of 1.8 mm.
- Excitation electrodes 12 and 13 were formed on both sides.
- the excitation electrodes 12 and 13 were formed by sequentially sputtering three layers of -chrome, monel, and silver, and the dimension of the opposing region of the excitation electrodes 12 and 13 was 0.4 mm X O.5 mm. In this way, a piezoelectric resonant element 2 having a designed resonant frequency of 13 MHz was manufactured.
- An epoxy resin-based curable composition is applied to the upper and lower surfaces of the piezoelectric resonator element 2, and in the semi-cured state, holding members 4 and 6 are laminated via the curable composition,
- the curable composition was cured by heating to a temperature of 100 ° C. to form the reflective layers 3 and 5. That is, the curable composition was cured, and the piezoelectric resonance element 2 and the holding members 4 and 6 were bonded to each other by the reflective layers 3 and 5 by the adhesive force of the cured product. After tightening, it was cooled to room temperature.
- the dimensions of the reflective layers 3 and 5 formed as described above are 1.8 mm X O. 5 mm X thickness 0.02 mm, and the acoustic impedance value Z2 is 2. 80 X 10 6 kg / (m 2 s), and the coefficient of thermal expansion X along the surface direction is 50 ppmZ ° C.
- the dimensions of the holding members 4 and 6 used were 1.8 mm X O. 5 mm X thickness 0.06 mm, and the acoustic impedance value Z3 was 3.43 X 10 7 kg / (m 2 s).
- the coefficient of thermal expansion Y is -0.4p pmZ ° C.
- the laminated piezoelectric resonance device 1 of the present embodiment thus obtained and the materials constituting the holding members 4 and 6 are variously changed, and the thermal expansion coefficient along the surface direction of the holding members 4 and 6 is changed.
- a plurality of types of piezoelectric resonators were fabricated in the same manner as described above except that Y was changed.
- the phase and frequency characteristics were measured, and the maximum phase angle ⁇ was measured.
- the phase angle maximum value ⁇ is the design resonance in the piezoelectric resonator 1 of this embodiment. This is the maximum phase value near the frequency of 13 MHz.
- the phase maximum value ⁇ in the phase frequency characteristic is large! /, Indicating that a better resonance characteristic can be obtained.
- FIG. 3 (b) is a result of rewriting the result of FIG. 3 (a) with the horizontal axis of FIG. 3 (a) as YZX (%).
- YZX the horizontal axis of FIG. 3 (a) as YZX (%).
- FIGS. 4 (a) and 4 (b) indicate compression stress and tensile stress, respectively. The longer the length, the greater the stress. Show.
- the stress due to the difference in thermal expansion coefficient applied to the piezoelectric resonant element 2 is very small.
- the piezoelectric resonator element 2 and the reflective layers 3 and 5 This is thought to be due to a large stress applied to the interface.
- the thermal expansion coefficient Y of the holding members 4 and 6 is a negative value or smaller than 2 ppm / ° C, the holding members 4 and 6 act to suppress the shrinkage of the reflective layers 3 and 5. It is considered that the stress is reduced and good resonance characteristics are obtained.
- the thermal expansion coefficient Y of the holding members 4 and 6 is equal to the thermal expansion coefficient of the piezoelectric plate 11 constituting the piezoelectric resonance element 2. If the polarity is reversed and the absolute value of Y is 4% or less of the absolute value of X, or if the polarity is the same, the holding member is compared to the thermal expansion coefficient X of the reflective layers 3 and 5.
- the thermal expansion coefficient Y of 4 and 6 sufficiently small to be 3% or less of, more specifically, by setting Y to zero or near zero, it is possible to achieve good resonance characteristics as described above. Recognize. Therefore, Y may be zero.
- the reflective layers 3 and 5 are composed of a cured product of an epoxy resin-based curable composition, and the cured product is cured by heating the curable composition. It was. Therefore, the stress was generated by shrinkage after curing.
- the piezoelectric resonator device 1 of the present embodiment is not limited to the one using the reflective layer formed by being cured by heating. That is, even when the reflective layer made of a material other than the thermosetting material is configured, for example, when the ambient temperature of the obtained piezoelectric resonator 1 changes rapidly, the thermal expansion coefficient of the reflective layer and the piezoelectric element are configured. In the case where the thermal expansion coefficient of the piezoelectric plate greatly differs, the same problem occurs. Therefore, even in such a case, the thermal expansion coefficient Y of the holding member is opposite to the thermal expansion coefficient X of the material constituting the reflective layer, and the absolute value of Y is 4% or less of the absolute value of X.
- the reflective layer may be formed of a cured product cured by light irradiation, for example, a photocured epoxy resin cured product. Further, the reflective layer may be composed of a material other than a cured product of the curable material, and may be composed of a resin material other than epoxy, or other organic or inorganic material.
- the holding members 4 and 6 may also be formed of a material other than ceramics, such as other ceramics, as long as the thermal expansion coefficient relationship and the acoustic impedance relationship are satisfied.
- FIG. 5 is a perspective view showing a stacked piezoelectric resonance device as a composite material vibration device according to the second embodiment of the present invention.
- the excitation electrode 12A is electrically connected to the external electrode 8
- the excitation electrode 13A is electrically connected to the external electrode 7, and the reflective layers 3A, 5A
- the thickness of the first capacitor is less than that of the reflective layers 3 and 5, and the plate-like capacitor element 23 is laminated on the lower surface of the lower holding member with the adhesive layer 22 interposed therebetween.
- the configuration is the same as that of the piezoelectric resonator 1 of the embodiment. Accordingly, the same parts are denoted by the same reference numerals, and detailed description thereof is omitted.
- a plate-like capacitor element 23 is laminated via an adhesive layer 22 having an appropriate adhesive force such as an epoxy adhesive.
- the plate-shaped capacitor element 23 has a rectangular plate-shaped dielectric substrate 24.
- the outer end of the capacitive electrode 25 is connected to the external electrode 7, and the outer end of the capacitive electrode 26 is connected to the external electrode 8.
- a capacitor electrode 27 is formed at the center of the lower surface of the dielectric substrate 24 so as to face the capacitor electrodes 25, 26 via the dielectric substrate 24.
- the capacitive electrode 27 functions to extract capacitance between the capacitive electrodes 25 and 26 that merely act as a terminal electrode when the piezoelectric resonator 21 is mounted on the circuit board.
- the plate-like capacitor element 23 is a three-terminal capacitor element having the capacitance electrodes 25 and 26 and the terminal electrode 27.
- the capacitor element 23 is bonded to the lower surface of the holding member 6.
- the material constituting the dielectric substrate can be selected from a wide range. In other words, in the structure in which the dielectric substrate 24 is directly bonded to the piezoelectric resonant element 2 ⁇ , if the difference in thermal expansion coefficient between the two is too large, there is a possibility that peeling occurs due to a change in ambient temperature. Therefore, the selection range of the dielectric substrate material constituting the capacitor is narrow.
- the dielectric substrate 24 is bonded to the lower surface of the holding member 6 via the adhesive layer 22, so that the dielectric material constituting the dielectric substrate 24 is piezoelectric. Selection can be made without any restriction on the value of the thermal expansion coefficient of the piezoelectric plate 11 constituting the resonant element 2. Therefore, the plate-like capacitor element 23 can be formed using a dielectric material that is necessary and optimal for forming a built-in capacitor type piezoelectric resonance element.
- FIG. 6 is a perspective view showing a piezoelectric resonator device according to a modification of the piezoelectric resonator device 21 of the second embodiment.
- the piezoelectric resonance device 31 is provided with the fact that the reflection layer 3 and the holding member 4 provided above the piezoelectric resonance element 2 are not provided, and that the coating film 32 is provided on the upper surface of the piezoelectric resonance element 2. Except for this, the configuration is the same as that of the piezoelectric plate 21 of the second embodiment.
- the holding member 6 may be laminated only on one surface side of the vibration member via the reflective layer 5 ⁇ .
- the coating film 32 is provided to protect the upper surface of the piezoelectric resonator element 2 and can be made of an appropriate material that performs such a protective action. Examples of such a material include an appropriate insulating material.
- the present invention is not limited to the above-described multilayer piezoelectric resonator, and is widely applied to the multilayer composite vibration device using a plate-like resonant element other than the piezoelectric resonant element. can do. Therefore, instead of the plate-like piezoelectric resonant elements 2 and 2A, a plate-like vibration element other than an electromechanical coupling conversion element such as an electrostrictive element may be used. .
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Abstract
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004350165A JP2008072156A (ja) | 2004-12-02 | 2004-12-02 | 複合材料振動装置 |
| JP2004-350165 | 2004-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006059416A1 true WO2006059416A1 (ja) | 2006-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/016403 Ceased WO2006059416A1 (ja) | 2004-12-02 | 2005-09-07 | 複合材料振動装置 |
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| JP (1) | JP2008072156A (ja) |
| WO (1) | WO2006059416A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021048481A (ja) * | 2019-09-18 | 2021-03-25 | 株式会社村田製作所 | フィルタ装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9557328B2 (en) | 2009-06-30 | 2017-01-31 | Koninklijke Philips N.V. | Magnetic sensor device, method of operating such a device and sample |
| KR101919118B1 (ko) | 2012-01-18 | 2018-11-15 | 삼성전자주식회사 | 체적 음향 공진기 |
| JP6099096B2 (ja) * | 2013-09-04 | 2017-03-22 | アルプス電気株式会社 | 複合圧電素子 |
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| JP2001267342A (ja) * | 2000-03-22 | 2001-09-28 | Seiko Instruments Inc | 半導体装置の製造方法 |
| JP2002203739A (ja) * | 2000-12-27 | 2002-07-19 | Kyocera Corp | コンデンサ素子 |
| JP2002223146A (ja) * | 2000-11-27 | 2002-08-09 | Murata Mfg Co Ltd | 複合材料振動装置 |
| JP2003338726A (ja) * | 2002-05-21 | 2003-11-28 | Murata Mfg Co Ltd | 複合材料振動装置 |
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2004
- 2004-12-02 JP JP2004350165A patent/JP2008072156A/ja active Pending
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2005
- 2005-09-07 WO PCT/JP2005/016403 patent/WO2006059416A1/ja not_active Ceased
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|---|---|---|---|---|
| JPH11102985A (ja) * | 1997-09-26 | 1999-04-13 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JPH11340777A (ja) * | 1998-05-25 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 圧電振動素子 |
| JP2001267342A (ja) * | 2000-03-22 | 2001-09-28 | Seiko Instruments Inc | 半導体装置の製造方法 |
| JP2002223146A (ja) * | 2000-11-27 | 2002-08-09 | Murata Mfg Co Ltd | 複合材料振動装置 |
| JP2002203739A (ja) * | 2000-12-27 | 2002-07-19 | Kyocera Corp | コンデンサ素子 |
| JP2003338726A (ja) * | 2002-05-21 | 2003-11-28 | Murata Mfg Co Ltd | 複合材料振動装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021048481A (ja) * | 2019-09-18 | 2021-03-25 | 株式会社村田製作所 | フィルタ装置 |
| JP7415261B2 (ja) | 2019-09-18 | 2024-01-17 | 株式会社村田製作所 | フィルタ装置 |
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|---|---|
| JP2008072156A (ja) | 2008-03-27 |
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