WO2006055099A2 - Systeme et procede de gestion de temperature de composant thermique - Google Patents

Systeme et procede de gestion de temperature de composant thermique Download PDF

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Publication number
WO2006055099A2
WO2006055099A2 PCT/US2005/034608 US2005034608W WO2006055099A2 WO 2006055099 A2 WO2006055099 A2 WO 2006055099A2 US 2005034608 W US2005034608 W US 2005034608W WO 2006055099 A2 WO2006055099 A2 WO 2006055099A2
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WO
WIPO (PCT)
Prior art keywords
heat
temperature management
management system
thermal component
thermal
Prior art date
Application number
PCT/US2005/034608
Other languages
English (en)
Other versions
WO2006055099A3 (fr
Inventor
Bruce H. Storm, Jr.
Haoshi Song
Clive D. Menezes
Original Assignee
Halliburton Energy Services, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Halliburton Energy Services, Inc. filed Critical Halliburton Energy Services, Inc.
Publication of WO2006055099A2 publication Critical patent/WO2006055099A2/fr
Publication of WO2006055099A3 publication Critical patent/WO2006055099A3/fr

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH DRILLING; MINING
    • E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH DRILLING; MINING
    • E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments

Definitions

  • a drill bit bores thousands of feet into the crust of the earth.
  • the drill bit typically extends downward from a drilling platform on a string of pipe, commonly referred to as a "drill string.”
  • the drill string may be jointed pipe or coiled tubing, through which drilling fluid is pumped to cool and lubricate the bit and lift the drill cuttings to the surface.
  • a bottom hole assembly (BHA), which includes, among other components, the drill bit.
  • the BHA includes electronic instrumentation.
  • LWD logging- while-drilling
  • MWD measurement-while-drilling
  • Such tools on the drill string contain various electronic components incorporated as part of the BHA. These electronic components generally consist of computer chips, circuit boards, processors, data storage, power converters, and the like.
  • Downhole tools must be able to operate near the surface of the earth as well as many thousands of feet below the surface.
  • Environmental temperatures tend to increase with depth during the drilling of the well. As the depth increases, the tools are subjected to a severe operating environment. For example, downhole temperatures are generally high and may even exceed 200 0 C. In addition, pressures may exceed 20,000 psi.
  • vibration and shock stress associated with operating in the downhole environment, particularly during drilling operations.
  • the electronic components in the downhole tools also internally generate heat. For example, a typical wireline tool may dissipate over 100 watts of power, and a typical downhole tool on a drill string may dissipate over 10 watts of power.
  • drill string electronics may remain downhole for as short as several hours to as long as one year.
  • tools are lowered into the well on a wireline or a cable. These tools are commonly referred to as "wireline tools.”
  • wireline tools generally remain in the downhole environment for less than twenty-four hours.
  • a problem with downhole tools is that when downhole temperatures exceed the temperature of the electronic components, the heat cannot dissipate into the environment. The heat may accumulate internally within the electronic components and this may result in a degradation of the operating characteristics of the component or may result in a failure.
  • two general heat sources must be accounted for in downhole tools, the heat incident from the surrounding downhole environment and the heat generated by the tool components, e.g. , the tool's electronics components.
  • thermally induced failure has at least two modes. First, the thermal stress on the components degrades their useful lifetime. Second, at some temperature, the electronics may fail and the components may stop operating. Thermal failure may result in cost not only due to the replacement costs of the failed electronic components, but also because electronic component failure interrupts downhole activities. Trips into the borehole also use costly rig time.
  • Heat storing temperature management involves removing heat from the thermal component and storing the heat in another element of the heat storing temperature management system, such as a heat sink.
  • Heat exhausting temperature management involves removing heat from the thermal component and transferring the heat to the environment outside the heat exhausting temperature management system. The heat may be transferred to the drill string or to the drilling fluid inside or outside the drill string.
  • a traditional method of managing the temperature of thermal components in a downhole tool using a heat exhausting system involves modest environmental temperatures such that the electronics operate at a temperature above the environmental temperature.
  • the electronics may be thermally connected to the tool housing.
  • the thermal connection allows the heat to dissipate to the environment by the natural heat transfer of conduction, convection, and/or radiation.
  • TMs approach is limited by the temperature gradient between the electronics and the environment.
  • a traditional method of managing the temperature of thermal components in a downhole tool using a heat storage system in harsh thermal environments is to place the electronics on a chassis in an insulated vacuum flask. The vacuum flask acts as a thermal barrier to retard heat transfer from the downhole environment to the electronics.
  • thermal flasks are heat storage systems that only slow the harmful effects of thermal failure. Because of the extended periods downhole in both wireline and drilling operations, insulated flasks may not provide sufficient thermal management for the electronic components for extended periods. Specifically, the flask does not remove the heat generated internally by the electronic components.
  • a thermal mass such as a eutectic material, can be included in the flask to absorb heat from the downhole environment as well as the heat generated internally by the electronics.
  • both the thermal flask and the thermal mass are only used to thermally manage the temperature of the interior of the electronics compartment. Because the discrete components may internally generate heat, they may remain at a higher temperature than the average temperature of the interior of the electronics compartment. Thus, although the average temperature of the interior of the compartment may remain at a desired level, discrete components may exceed their desired operating temperatures.
  • Another temperature management method for downhole electronics proposes a vapor compression temperature management system using water or other suitable liquid; e.g., FREON ® .
  • liquid in one tank is thermally coupled with the electronics chassis of the downhole tool.
  • the liquid absorbs heat via the heat exchanger from the downhole environment and the electronics, where the electronics are isolated from the liquid, and begins to vaporize.
  • water would begin to vaporize at 100°C so long as the pressure of the tank is maintained at 1.01 x 10 5 Pa (14.7 psi).
  • the steam is removed from the tank and compressed and stored in a second tank, which is at or near the temperature of the downhole environment.
  • vaporization temperature management has significant problems.
  • a compressor must be supplied that is able to compress the vapor to a pressure greater than the saturation pressure of the vapor at the temperature of the downhole environment; e.g., 1.55 x 10 6 Pa (225 psi) at 200°C for water.
  • the method does not isolate the thermal components but instead attempts to cool the entire electronics region. While the average temperature of the region may remain at 100 0 C, the temperature of the discrete electronic components may be higher because they may internally generate heat.
  • Another temperature management method proposes a sorbent temperature management system.
  • This method again uses the evaporation of a liquid that is thermally connected via heat exchanger with the thermal components to manage the temperature of the components. Instead of using a compressor to remove the vapor, this method uses desiccants in a second tank to absorb the vapor as it evaporates in a first tank, thus providing heat storage while requiring no input power. However, the desiccants must absorb sufficient vapor in order to maintain a constant pressure in the first tank. Otherwise, the boiling point of the liquid will rise as the pressure in the lower tank rises.
  • prior sorbent temperature management systems manage the temperature of the entire electronics region, not the discrete thermal components.
  • the thermal components may remain at a higher temperature than the average temperature of the entire thermal component region.
  • the desiccants must absorb sufficient vapor in order to maintain a constant pressure in the first tank. Otherwise, the liquid will evaporate at a higher temperature and thus the temperature in the first tank will increase. Further, the amount of water in the first tank limits the system. Once all the water evaporates, the system no longer functions.
  • thermoelectric refrigeration system comprising a cold heat exchanger and a hot heat exchanger thermally coupled by semiconductor materials.
  • the cold heat exchanger of the temperature management system is thermally coupled with the thermal components.
  • thermoelectric refrigeration temperature management systems Due to the typically low efficiency of thermoelectric refrigeration temperature management systems and the typically relatively high amount of heat to be extracted, substantial power is required by the temperature management system.
  • This power can typically only be provided from downhole power generation devices such as turbines and alternators.
  • the downhole power generation devices are typically powered by drilling fluid being pumped through the inside of the drill string during drilling. At times during the drilling process, the pumping is stopped to perform various tasks such as adding pipe to or removing pipe from the drill string. When the pumping is stopped, the downhole power generation devices are unable to supply power to the heat exhausting temperature management system.
  • the thermoelectric refrigeration systems are unable to cool the thermal components when pumping is stopped because of the loss of power. Even if batteries are provided downhole, they are limited in the duration for which they can provide power to the thermoelectric refrigeration system.
  • thermoacoustic temperature management system Another temperature management method involves a downhole thermoacoustic temperature management system.
  • An example of a downhole thermoacoustic temperature management system is described in U.S. Patent No. 5,165,243, issued November 24, 1992 and entitled “Compact Acoustic Refrigerator", hereby incorporated herein by reference for all purposes.
  • the compact acoustic refrigeration system cools components, e.g., electrical circuits, in a downhole environment.
  • the system includes an acoustic engine that includes first thermodynamic elements for generating a standing acoustic wave in a selected medium.
  • the system also includes an acoustic refrigerator that includes second thermodynamic elements located in the standing wave for generating a relatively cold temperature at a first end of the second thermodynamic elements and a relatively hot temperature at a second end of the second thermodynamic elements.
  • a resonator volume cooperates with the first and second thermodynamic elements to support the standing wave.
  • first heat pipes transfer heat from the heat load to the second thermodynamic elements and second heat pipes transfer heat from the first and second thermodynamic elements to the downhole environment.
  • FIGURE 1 is a schematic view illustrating a temperature management system according to a first embodiment
  • FIGURE 2 is a schematic view of a thermoelectric cooler optionally used in the temperature management system of FIGURE 1;
  • FIGURE 3 is a flow chart representing a control system for the heat exhausting temperature management system of the temperature management system of FIGURE 1;
  • FIGURE 4 is a schematic view illustrating a second embodiment temperature management system;
  • FIGURE 5 is a schematic view illustrating a third embodiment temperature management system.
  • FIGURE 6 is a schematic view illustrating a fourth embodiment temperature management system.
  • the present invention relates to a thermal component temperature management system and includes embodiments of different forms.
  • the drawings and the description below disclose specific embodiments with the understanding that the embodiments are to be considered an exemplification of the principles of the invention, and are not intended to limit the invention to that illustrated and described. Further, it is to be fully recognized that the different teachings of the embodiments discussed below may be employed separately or in any suitable combination to produce desired results.
  • thermally coupled as used herein is intended to mean either an indirect or a direct connection. Thus, if a first device couples to a second device, that connection may be through a direct connection; e.g., via conduction through one or more devices, or through an indirect connection; e.g., via convection or radiation.
  • temperature management as used herein is intended to mean the overall management of temperature, including maintaining, increasing, or decreasing temperature and is not meant to be limited to only decreasing temperature.
  • FIGURE 1 illustrates a first embodiment of a temperature management system 10 disposed in a downhole tool 14 such as on a drill string 16 for drilling a borehole 13 in a formation 17.
  • the temperature management system 10 might also be used in a downhole wireline tool, a permanently installed downhole tool, or a temporary well testing tool. Downhole, the ambient temperature may sometimes exceed 200°C. However, the temperature management system 10 may also be used in other situations and applications where the surrounding environment ambient temperature is either greater than or less than that of the thermal components being cooled.
  • the temperature management system 10 manages the temperature of at least one thermal component 12 that may, e.g., be mounted on at least one board 18 in the downhole tool 14.
  • the thermal component 12 comprises, but is not limited to, heat-dissipating components, heat-generating components, and/or heat-sensitive components.
  • Au example of a thermal component 12 may be an integrated circuit, e.g., a computer chip, or other electrical or mechanical device that is heat-sensitive or whose performance is deteriorated by high temperature operation, or that generates heat.
  • the board 18 is in turn mounted on a chassis (not illustrated) and installed within a cavity 15 of the downhole tool 14.
  • HEAT EXCHANGER HEAT EXCHANGER
  • the temperature management system 10 further comprises a heat exchanger 20 thermally coupled with the thermal component 12.
  • the heat exchanger 20 is thermally coupled via a conductive path to the thermal component 12.
  • the heat exchanger 20 may be thermally coupled with the thermal component 12 by radiation or convection.
  • the heat exchanger 20 may be any appropriate type of heat exchanger, such as a conduction heat exchanger that uses heat conduction to transfer the heat through solids.
  • the heat exchanger 20 may also comprise multiple layers of different materials, e.g., copper flow tubes with aluminum fins or plates.
  • the heat exchanger 20 may also be a micro-capillary heat exchanger.
  • the micro-capillary heat exchanger may also be a micro-channel, cold plate heat exchanger with stacked plates enclosed in a housing.
  • the heat exchanger may also be a liquid cold plate heat exchanger.
  • the temperature management system 10 further comprises a heat storing temperature management system 11 thermally coupled with the heat exchanger 20.
  • the heat storing temperature management system 11 removes heat from the thermal component 12 through the heat exchanger 20 and stores the removed heat in within the heat storing temperature management system 11.
  • the heat storing temperature management system 11 comprises a heat sink 22 comprising a phase change material for storing the removed heat.
  • the phase change material is designed to take advantage of the heat absorbed during the phase change at certain temperature ranges; e.g., a eutectic material.
  • Eutectic material is an alloy having a component composition designed to achieve a desired melting point for the material. The desired melting point takes advantage of latent heat of fusion to absorb energy.
  • Latent heat is the energy absorbed by the material as it changes phase from solid into liquid. Thus, when the material changes its physical state, it absorbs energy without a change in the temperature of the material. Therefore, additional heat will only change the phase of the material, not its temperature.
  • the eutectic material may have a melting point below the desired maintenance temperature of the thermal component 12.
  • the heat sink 22 may also comprise other types of thermal mass, such as copper, to store removed heat.
  • the heat sink 22 may be stored in a jacket 24 capable of withstanding downhole temperatures and shock conditions.
  • the jacket 24 can be a stainless steel container. Because the heat sink 22 may undergo a phase change, the jacket 24 may also be capable of withstanding the contraction and/or expansion of the heat sink 22.
  • the heat storing temperature management system 11 also comprises a thermal conduit system 26 for thermally coupling the heat exchanger 20 and the heat sink 22.
  • the temperature gradient between thermal component 12 and the heat sink 22 is such that the heat sink 22 absorbs the heat from the thermal component 12 through the heat exchanger 20 and the thermal conduit system 26.
  • the thermal conduit system 26 comprises a thermally conductive material for transferring heat from the heat exchanger 20 to the heat sink 22.
  • the thermal conduit system 26 may alternatively comprise a coolant fluid conduit system that transfers the removed heat using a coolant fluid in a closed-loop or an open-loop system.
  • the coolant fluid is thermally coupled to the heat exchanger 20 and the heat sink 22 and transfers heat absorbed from the heat exchanger 20 to the heat sink 22, returning the coolant fluid to a lower temperature.
  • the thermal conduit system 26 maintains the coolant fluid separate from the heat sink 22 material.
  • the path of the thermal conduit system 26 through the heat sink 22 may be straight or tortuous depending on the performance specifications of the temperature management system 10.
  • the thermal conduit system 26 may flow helically into the heat sink 22, reverse, and then flow helically out of the heat sink 22.
  • the thermal conduit system 26 may also transfer heat to the heat sink 22 using any other suitable means.
  • the fluid may be moved within the thermal conduit system 26 using a fluid transfer device, e.g., a fluid purap.
  • the fluid in the thermal conduit system 26 flows via convection, i.e., by maintaining a temperature differential between any two points in the system.
  • the thermal component 12 may be immersed in fluid, e.g., water or a fluorinated organic compound, e.g., FLUORINERT ® , or any other thermally conductive fluid.
  • the fluid the thermal component 12 is immersed in need not be the same fluid as the coolant fluid in the thermal conduit system 26.
  • the thermal component 12 may be immersed in silicone oil or any other suitable fluid.
  • the thermal component 12 may be immersed in a fluid regardless of whether the thermal conduit system 26 is a fluid thermal conduit system.
  • the fluid thermal conduit system 26 may be a single-phase or multiple-phase system. Examples of thermal conduit systems are discussed in U.S. Patent Application Serial No.
  • the thermal conduit system may thermally couple more than one thermal component 12 to the heat sink 22.
  • the heat removed from the thermal component 12 may be absorbed directly by the heat sink 22; e.g., via conduction by being in contact with the heat exchanger, or via convection or radiation from the heat exchanger to the heat sink.
  • the heat storing temperature management system 11 requires no power to remove heat from the thermal component 12. Even with the fluid transfer device, the heat storing temperature management system 11 would require low amounts of power, e.g., less than 500 mw, and would be able to operate for approximately 9 hours on a conventional 9 volt battery.
  • HEAT EXHAUSTING TEMPERATURE MANAGEMENT SYSTEM The temperature management system 10 also comprises a heat exhausting temperature management system 40 thermally coupled with the heat storing temperature management system 11. The heat exhausting temperature management system 40 removes heat from the heat storing temperature management system 11 and transfers the heat to the environment outside the temperature management system 10.
  • the heat exhausting temperature management system 40 comprises a thermoelectric cooler comprising, e.g., a hot plate 46 and a cold plate 44.
  • the heat exhausting temperature management system 40 may also comprise a multiple stage thermoelectric temperature management system.
  • the thermoelectric cooler 40 comprises two different types of semiconductors 40' and 40", such as a p-type semiconductor and an n-type semiconductor, respectively, sandwiched between the cold plate 44 and the hot plate 46.
  • the cold plate 44 and the hot plate 46 may be made from a ceramic material.
  • the semiconductors 40' and 40" are connected electrically in series and thermally in parallel.
  • a power source 36 provides energy for the thermoelectric cooler 40.
  • heat energy 48 is initially transferred from a heat source to the cold junction, or cold plate 44. This heat is then transferred by the semiconductors to the hot junction, or hot plate 46. The heat transferred is proportional to the current and the number of thermoelectric couples. From the hot plate 46, the heat is transferred to the environment outside the temperature management system 10.
  • thermoelectric cooler includes both a single stage thermoelectric cooler, as well as multistage and cascade arrangements of multiple thermoelectric cooler stages.
  • the cold plate 44 of the heat exhausting temperature management system 40 is thermally coupled with the heat sink 22 of the heat storing temperature management system 11.
  • the heat exhausting temperature management system 40 removes heat from the heat sink 22 at the cold plate 44 and transfers the removed heat to the hot plate 46. From the hot plate 46, the heat is then transferred to the environment outside the temperature management system 10.
  • the heat may be transferred to the drill string 16, the drilling fluid traveling in the annulus 52 between the downhole tool 14 and the formation 17, or the drilling fluid being pumped through the drill string 16 and the downhole tool 14.
  • the heat may be transferred from the hot plate 46 to the environment through conduction or through convection or radiation, or any combination of direct and indirect transfer.
  • the heat exhausting temperature management system 40 allows removed heat to be transferred to the drilling fluid even though the drilling fluid may be at a higher temperature than the thermal component 12.
  • the heat exhausting temperature management system 40 may also comprise more than one thermoelectric cooler thermally coupled with the heat storing temperature management system 11. Instead of a thermoelectric cooler, alternatively the heat exhausting temperature management system 40 may comprise a thermoacoustic system, a vapor compression system, or other suitable heat pumping device. Power for the thermal component 12 and the thermoelectric cooler 40 may be supplied by a turbine alternator 42, which is driven by the drilling fluid pumped through the drill string 16.
  • the turbine alternator 16 may be of the axial, radial, or mixed flow type.
  • the alternator 42 may be driven by a positive displacement motor driven by the drilling fluid, such as a Moineau-type motor.
  • the heat exhausting temperature management system 40 may operate during pumping of drilling fluid through the drill string 16 and for short time periods with the pumps off. With the pumps on, the heat exhausting temperature management system 40 removes heat from the heat storing temperature management system 11 and allows the temperature management system 10 to maintain heat removal from the thermal component 12. There are, however, periods when drilling fluid is not pumped through the drill string 16. During these times, the heat exhausting temperature management system 40 may not be operational, unless there is some other source of power.
  • the heat storing temperature management system 11 is able to remove heat from the thermal component 12 and store the removed heat the heat sink 22. Once drilling fluid flow is restored, the heat exhausting temperature management system 40 will then remove the stored removed heat from the heat sink 22.
  • the heat storing temperature management system 11 and the heat exhausting temperature management system 40 combine to manage the temperature of the thermal component 12.
  • the heat exhausting temperature management system 40 may be operated by a control system that determines when the heat exhausting temperature management system 40 operates. The control system is represented by the flow chart shown in FIGURE 3.
  • the heat exhausting temperature management system 40 may remain in the off state until the temperature of the heatsink (T ⁇ eats in k ), or some other monitored component, e.g., a thermal component 12, reaches a predetermined setpoint temperature (Ts etpo i nt )- Thus, even though the power source 36 is providing power, the control system dictates whether the heat exhausting temperature management system 40 operates based on the monitored criteria. THERMAL BARRIER
  • the temperature management system 10 may alternatively further comprise a thermal barrier 50 enclosing the heat storing temperature management system 11, the heat exchanger 20, and the thermal component 12.
  • the thermal barrier 50 thus separates the heat storing temperature management system 11, the heat exchanger 20, and the thermal component 12 from the downhole environment.
  • the thermal barrier 50 may also enclose only a portion of the heat storing temperature management system 11.
  • the thermal barrier 50 hinders heat transfer from the outside environment to the heat storing temperature management system 11 and the thermal component 12.
  • the barrier 50 may be an insulated vacuum "flask", a vacuum "flask” filled with an insulating solid, a material-filled chamber, a gas-filled chamber, a fluid-filled chamber, or any other suitable barrier.
  • the space 52 between the thermal barrier 50 and the tool 14 may be evacuated. Creating a vacuum aids in hindering heat transfer to the temperature management system 10 and the thermal component 12.
  • the temperature management system 10 removes enough heat to maintain the thermal component 12 at or below its rated temperature, which may be; e.g., no more than 125°C.
  • the temperature management system 10 may maintain the component 12 at or below 100 0 C, or even at or below 80 0 C.
  • the lower the temperature the longer the life of the thermal component 12.
  • the temperature management system 10 may not manage the temperature of the entire cavity 15 or even the entire electronics chassis, but does manage the temperature of the thermal component 12 itself.
  • the temperature management system 10 may allow the average temperature of the cavity 15 to reach a higher temperature than that at which the thermal components 12 are held. Absorbing heat from the thermal component 12 thus extends the useful life of the thermal component 12, despite the average temperature of the cavity 15 being higher. This allows the thermal component 12 to operate a longer duration at a given environment temperature for a given volume of heat sink than possible if the average temperature of the entire cavity 15 is managed.
  • FIGURE 4 illustrates a second embodiment of a temperature management system 310 disposed in a downhole tool 14 such as on a drill string 16 for drilling a borehole 13 in a formation 17.
  • the temperature management system 310 might also be used in a downhole wireline tool, a permanently installed downhole tool, or a temporary well testing tool. However, the temperature management system 310 may also be used in other situations and applications where the surrounding environment ambient temperature is either greater than or less than that of the thermal components being cooled.
  • the temperature management system 310 manages the temperature of a thermal component 312 mounted, e.g., on a board 318 in the downhole tool 14.
  • the temperature management system 310 also comprises a heat exchanger 320 thermally coupled with the thermal component 312 as with the temperature management system 10.
  • the temperature management system 310 also comprises a heat storing temperature management system 311 thermally coupled with the heat exchanger 320 as disclosed in the temperature management system 10, including similar reference numerals for like parts.
  • the heat storing temperature management system 311 removes heat from the thermal component 312 through the heat exchanger 320 and stores the removed heat within the heat storing temperature management system 311.
  • the heat storing temperature management system 311 also comprises a thermal conduit system 326 for thermally coupling the heat exchanger 320 and the heat sink 322.
  • the temperature management system 310 also comprises a heat exhausting temperature management system 340.
  • the heat exhausting temperature management system 340 is thermally coupled with a second heat exchanger 321, which is thermally coupled to the thermal component 312 in a similar manner as the heat exchanger 320.
  • the heat exhausting temperature management system 340 instead of removing heat from the heat sink 322 of the heat storing temperature management system 311, the heat exhausting temperature management system 340 removes heat from the thermal component 312 through the second heat exchanger 321. The heat exhausting temperature management system 340 then transfers the removed heat to the environment outside the temperature management system 310.
  • the heat may be transferred to the drill string 16, the drilling fluid traveling in the annulus 52 between the downhole tool 14 and the formation 17, or the drilling fluid being pumped through the drill string 16 and the downhole tool 14.
  • the heat may be transferred from the hot plate to the environment directly through conduction or indirectly through convection or radiation, or any combination of direct and indirect transfer.
  • the heat exhausting temperature management system 340 allows removed heat to be transferred to the drilling fluid even though the drilling fluid may be at a higher temperature than the thermal component 312.
  • the heat exhausting temperature management system 340 may also comprise more than one thermoelectric cooler thermally coupled with the thermal component 312, thus comprising multiple stages of heat exhausting temperature management.
  • the heat exhausting temperature management system 340 may comprise a thermoacoustic cooler or a vapor compression temperature management system.
  • the temperature management system 310 may also be used to cool more than one thermal component 312.
  • Power for the thermal component 312 and the thermoelectric cooler 340 is similarly supplied by the turbine alternator 42, a battery, or combination thereof, which may be driven by the drilling fluid pumped through the drill string 16. Because the heat exhausting temperature management system 340 is powered by the turbine alternator 42, it may only operate during pumping of drilling fluid through the drill string 16. During that time, the heat exhausting temperature management system 340 removes heat from the thermal component 312 and allows the temperature management system 310 to maintain heat removal from the thermal component 312. There are, however, periods when drilling fluid is not pumped through the drill string 16. During these times, the heat exhausting temperature management system 340 may not be operational, unless there is some amount of battery power.
  • the heat storing temperature management system 311 is still able to remove heat from the thermal component 312 and store the removed heat the heat sink 322. Once drilling fluid flow is restored, the heat exhausting temperature management system 340 will then be able to begin removing heat from the thermal component 312. Thus, the heat storing temperature management system 311 and the heat exhausting temperature management system 340 combine to manage the temperature of the thermal component 312.
  • the heat exhausting temperature management system 340 may be operated by a control system that determines when the heat exhausting temperature management system 340 operates.
  • the control system is similar to the control system described above and represented by the flow chart shown in FIGURE 3. THERMAL BARRIER
  • the temperature management system 310 may also alternatively comprise a thermal barrier 350 enclosing the temperature management system 310.
  • the thermal barrier 350 may also enclose only a portion of the temperature management system 310.
  • the thermal barrier 350 hinders heat transfer from the outside environment to the temperature management system 310 and the thermal component 312.
  • GENERAL CLOSING The temperature management system 310 removes enough heat to maintain the thermal component 312 at or below its rated temperature, which may be; e.g., no more than 125°C.
  • the temperature management system 310 may maintain the component 312 at or below 100 0 C, or even at or below 80°C.
  • the lower the temperature the longer the life of the thermal component 312.
  • the temperature management system 310 may not manage the temperature of the entire cavity 315 or even the entire electronics chassis, but does manage the temperature of the thermal component 312 itself.
  • the temperature management system 310 may allow the average temperature of the cavity 315 to reach a higher temperature than that at which the thermal components 312 are held. Absorbing heat from the thermal components 312 thus extends the useful life of the thermal component 312, despite the average temperature of the cavity 315 being higher. This allows the thermal component 312 to operate a longer duration at a given environment temperature for a given volume of heat sink than possible if the average temperature of the entire cavity 315 is managed.
  • FIGURE 5 illustrates a third embodiment of a temperature management system 410 disposed in a downhole tool 14 such as on a drill string 16 for drilling a borehole 13 in a formation 17.
  • the temperature management system 410 might also be used in a downhole wireline tool, a permanently installed downhole tool, or a temporary well testing tool. However, the temperature management system 410 may also be used in other situations and applications where the surrounding environment ambient temperature is either greater than or less than that of the thermal components being cooled.
  • the temperature management system 410 manages the temperature of one or more thermal components 412 mounted on one or more boards 418 in the downhole tool 14.
  • the temperature management system 410 also comprises a heat exchanger 420 thermally coupled with the thermal component 412 as with the temperature management system 10.
  • the temperature management system 410 also comprises a heat storing temperature management system 411 thermally coupled with the heat exchanger 420 as disclosed in the temperature management system 10, including similar reference numerals for like parts.
  • the heat storing temperature management system 411 removes heat from the thermal component 412 through the heat exchanger 420 and stores the removed heat in within the heat storing temperature management system 411.
  • the heat storing temperature management system 411 also comprises a thermal conduit system 426 for thermally coupling the heat exchanger 420 and the heat sink 422.
  • the temperature management system 410 also comprises a heat exhausting temperature management system 440.
  • the heat exhausting temperature management system 440 is thermally coupled with the heat exchanger 420, not the heat sink 422.
  • the heat exhausting temperature management system 440 removes heat from the heat exchanger 420.
  • the heat exhausting temperature management system 440 then transfers the removed heat to the environment outside the temperature management system 410.
  • the heat may be transferred to the drill string 16, the drilling fluid traveling in the annulus 52 between the downhole tool 14 and the formation 17, or the drilling fluid being pumped through the drill string 16 and the downhole tool 14.
  • the heat may be transferred from the hot plate to the environment directly through conduction or indirectly through convection or radiation, or any combination of direct and indirect transfer.
  • the heat exhausting temperature management system 440 allows removed heat to be transferred to the drilling fluid even though the drilling fluid may be at a higher temperature than the thermal component 412.
  • the heat exhausting temperature management system 440 may also comprise more than one thermoelectric cooler thermally coupled with the thermal component 412, thus comprising multiple stages of heat exhausting temperature management.
  • the heat exhausting temperature management system 440 may comprise a thermoacoustic cooler or a vapor compression temperature management system.
  • the temperature management system 410 may also be used to cool more than one thermal component 412.
  • Power for the thermal component 412 and the thermoelectric cooler 440 may be similarly supplied by the turbine alternator 42, which may be driven by the drilling fluid pumped through the drill string 16. If the heat exhausting temperature management system 440 is powered by the turbine alternator 42, it may only operate during pumping of drilling fluid through the drill string 16. During that time, the heat exhausting temperature management system 440 removes heat from the thermal component 412 through the heat exchanger 420 and allows the temperature management system 410 to maintain heat removal from the thermal component 412. There are, however, periods when drilling fluid is not pumped through the drill string 16. During these times, the heat exhausting temperature management system 440 may not be operational, unless there is some amount of battery power.
  • the heat storing temperature management system 411 is still able to remove heat from the thermal component 412 and store the removed heat the heat sink 422. Once drilling fluid flow is restored, the heat exhausting temperature management system 440 will then be able to begin removing heat from the thermal component 412. Thus, the heat storing temperature management system 411 and the heat exhausting temperature management system 440 combine to manage the temperature of the thermal component 412.
  • the heat exhausting temperature management system 440 may be operated by a control system that determines when the heat exhausting temperature management system 440 operates.
  • the control system is similar to the control system described above and represented by the flow chart shown in FIGURE 3. THERMAL BARRIER
  • the temperature management system 410 may also alternatively comprise a thermal barrier 450 enclosing the temperature management system 410.
  • the thermal barrier 450 may also enclose only a portion of the temperature management system 410.
  • the thermal barrier 450 hinders heat transfer from the outside environment to the temperature management system 410 and the thermal component 412. GENERAL CLOSING
  • the temperature management system 410 removes enough heat to maintain the thermal component 412 at or below its rated temperature, which may be; e.g., no more than 125°C.
  • the temperature management system 410 may maintain the component 412 at or below 100 0 C, or even at or below 80°C.
  • the lower the temperature the longer the life of the thermal component 412.
  • the temperature management system 410 may not manage the temperature of the entire cavity 415 or even the entire electronics chassis, but does manage the temperature of the thermal component 412 itself.
  • the temperature management system 410 may allow the average temperature of the cavity 415 to reach a higher temperature than that at which the thermal components 412 are held. Absorbing heat from the thermal component 412 thus extends the useful life of the thermal component 412, despite the average temperature of the cavity 415 being higher. This allows the thermal component 412 to operate a longer duration at a given environment temperature for a given volume of heat sink than possible if the average temperature of the entire cavity 415 is managed.
  • FIGURE 6 illustrates a fourth embodiment of a temperature management system 510 disposed in a downhole tool 14 such as on a drill string 16 for drilling a borehole 13 in a formation 17.
  • the temperature management system 510 might also be used in a downhole wireline tool, a permanently installed downhole tool, or a temporary well testing tool. However, the temperature management system 510 may also be used in other situations and applications where the surrounding environment ambient temperature is either greater than or less than that of the thermal components being cooled.
  • the temperature management system 510 manages the temperature of one or more thermal components 512 mounted on one or more boards 518 in the downhole tool 14.
  • the temperature management system 510 also comprises a heat exchanger 520 thermally coupled with the thermal component 512 as with the temperature management system 10.
  • the temperature management system 510 also comprises a heat storing temperature management system 511 thermally coupled with the heat exchanger 520 as disclosed in the temperature management system 10, including similar reference numerals for like parts.
  • the heat storing temperature management system 511 removes heat from the thermal component 512 through the heat exchanger 520 and stores the removed heat in within the heat storing temperature management system 511.
  • the heat storing temperature management system 511 also comprises a thermal conduit system 526 for thermally coupling the heat exchanger 520 and the heat sink 522.
  • the temperature management system 510 also comprises a heat exhausting temperature management system 540.
  • the heat exhausting temperature management system 540 is thermally coupled with the thermal conduit system 526, not the heat sink 522.
  • the heat exhausting temperature management system 540 removes heat from the thermal conduit 526.
  • the heat exhausting temperature management system 540 then transfers the removed heat to the environment outside the temperature management system 510. As before, the heat may be transferred to the drill string 16, the drilling fluid traveling in the annulus 52 between the downhole tool 14 and the formation 17, or the drilling fluid being pumped through the drill string 16 and the downhole tool 14.
  • the heat may be transferred from the hot plate to the environment directly through conduction or indirectly through convection or radiation, or any combination of direct and indirect transfer.
  • the heat exhausting temperature management system 540 allows removed heat to be transferred to the drilling fluid even though the drilling fluid may be at a higher temperature than the thermal component 512.
  • the heat exhausting temperature management system 540 may also comprise more than one thermoelectric cooler thermally coupled with the thermal component 512, thus comprising multiple stages of heat exhausting temperature management.
  • the heat exhausting temperature management system 540 may comprise a thermo acoustic cooler or a vapor compression temperature management system.
  • the temperature management system 510 may also be used to cool more than one thermal component 512.
  • Power for the thermal component 512 and the thermoelectric cooler 540 may similarly be supplied by the turbine alternator 42, which may be driven by the drilling fluid pumped through the drill string 16. Because the heat exhausting temperature management system 540 is powered by the turbine alternator 42, it may only operate during pumping of drilling fluid through the drill string 16. During that time, the heat exhausting temperature management system 540 removes heat from the thermal component 512 through the thermal conduit 526 and allows the temperature management system 510 to maintain heat removal from the thermal component 512. There are, however, periods when drilling fluid is not pumped through the drill string 16. During these times, the heat exhausting temperature management system 540 may not be operational, unless there is some amount of battery power.
  • the heat storing temperature management system 511 is still able to remove heat from the thermal component 512 and store the removed heat the heat sink 522. Once drilling fluid flow is restored, the heat exhausting temperature management system 540 will then be able to begin removing heat from the thermal component 512.
  • the heat storing temperature management system 511 and the heat exhausting temperature management system 540 combine to manage the temperature of the thermal component 512.
  • the heat exhausting temperature management system 540 may be operated by a control system that determines when the heat exhausting temperature management system 540 operates.
  • the control system is similar to the control system described above and represented by the flow chart shown in FIGURE 3.
  • THERMAL BARRIER The temperature management system 510 may also alternatively comprise a thermal barrier 550 enclosing the temperature management system 510.
  • the thermal barrier 550 may also enclose only a portion of the temperature management system 510. The thermal barrier 550 hinders heat transfer from the outside environment to the temperature management system 510 and the thermal component 512.
  • the temperature management system 510 removes enough heat to maintain the thermal component 512 at or below its rated temperature, which may be; e.g., no more than 125°C.
  • the temperature management system 510 may maintain the component 512 at or below 100 0 C, or even at or below 80°C.
  • the lower the temperature the longer the life of the thermal component 512.
  • the temperature management system 510 may not manage the temperature of the entire cavity 515 or even the entire electronics chassis, but does manage the temperature of the thermal component 512 itself.
  • the temperature management system 510 may allow the average temperature of the cavity 515 to reach a higher temperature than that at which the thermal components 512 are held.
  • Absorbing heat from the thermal component 512 thus extends the useful life of the thermal component 512, despite the average temperature of the cavity 515 being higher. This allows the thermal component 512 to operate a longer duration at a given environment temperature for a given volume of heat sink than possible if the average temperature of the entire cavity 515 is managed.

Abstract

L'invention concerne un système de gestion de la température d'un composant thermique. Le système comprend un échangeur de chaleur en contact thermique avec le composant thermique. Le système de gestion de température comprend également un système de gestion de température à stockage de chaleur destiné à évacuer la chaleur du composant thermique et à stocker la chaleur évacuée à l'intérieur du système de gestion de température à stockage de chaleur. Le système de gestion de température comprend en outre un système de gestion de température à évacuation de chaleur destiné à évacuer la chaleur du composant thermique et à transférer la chaleur évacuée vers l'environnement à l'extérieur du système de gestion de température.
PCT/US2005/034608 2004-11-12 2005-09-29 Systeme et procede de gestion de temperature de composant thermique WO2006055099A2 (fr)

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US10/987,243 US20060102353A1 (en) 2004-11-12 2004-11-12 Thermal component temperature management system and method
US10/987,243 2004-11-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010057017A2 (fr) * 2008-11-13 2010-05-20 Halliburton Energy Services, Inc. Système et méthode de gestion de température d'un composant thermique de fond
WO2019204345A1 (fr) * 2018-04-16 2019-10-24 Baker Hughes, A Ge Company, Llc Barrière thermique pour dispositifs électroniques associés à un fond de trou
WO2020021454A1 (fr) * 2018-07-24 2020-01-30 Aarbakke Innovation, As Élimination de la chaleur de l'électronique dans des outils de fond de trou

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7659722B2 (en) * 1999-01-28 2010-02-09 Halliburton Energy Services, Inc. Method for azimuthal resistivity measurement and bed boundary detection
JP4204635B2 (ja) * 2006-01-23 2009-01-07 パナソニック株式会社 筐体表面温度予測装置、方法、プログラム及び記録媒体
CN101501297B (zh) 2006-07-11 2013-10-16 哈里伯顿能源服务公司 模块化地质导向工具组件
WO2008021868A2 (fr) 2006-08-08 2008-02-21 Halliburton Energy Services, Inc. Diagraphie de résistivité à artéfacts de pendage réduits
WO2008076130A1 (fr) 2006-12-15 2008-06-26 Halliburton Energy Services, Inc. Outil de mesure de composant de couplage d'antenne doté d'une configuration d'antenne rotative
US20080223579A1 (en) * 2007-03-14 2008-09-18 Schlumberger Technology Corporation Cooling Systems for Downhole Tools
US20080277162A1 (en) * 2007-05-08 2008-11-13 Baker Hughes Incorporated System and method for controlling heat flow in a downhole tool
US8020621B2 (en) * 2007-05-08 2011-09-20 Baker Hughes Incorporated Downhole applications of composites having aligned nanotubes for heat transport
US7440283B1 (en) * 2007-07-13 2008-10-21 Baker Hughes Incorporated Thermal isolation devices and methods for heat sensitive downhole components
GB2468734B (en) 2008-01-18 2012-08-08 Halliburton Energy Serv Inc Em-guided drilling relative to an existing borehole
US8347985B2 (en) * 2008-04-25 2013-01-08 Halliburton Energy Services, Inc. Mulitmodal geosteering systems and methods
SG175311A1 (en) 2009-04-27 2011-12-29 Halliburton Energy Serv Inc Thermal component temperature management system and method
US8826984B2 (en) * 2009-07-17 2014-09-09 Baker Hughes Incorporated Method and apparatus of heat dissipaters for electronic components in downhole tools
NO330346B1 (no) * 2009-07-20 2011-03-28 Sinvent As Lokal termisk styring
US8567500B2 (en) * 2009-10-06 2013-10-29 Schlumberger Technology Corporation Cooling apparatus and methods for use with downhole tools
US8726725B2 (en) 2011-03-08 2014-05-20 Schlumberger Technology Corporation Apparatus, system and method for determining at least one downhole parameter of a wellsite
EP2594732A1 (fr) * 2011-11-21 2013-05-22 Services Pétroliers Schlumberger Dissipation thermique dans un équipement de trou de forage
NO338979B1 (no) * 2012-02-08 2016-11-07 Visuray Tech Ltd Anordning og fremgangsmåte for kjøling av nedihullsverktøy, samt anvendelse av et forhåndskjølt, massivt kuldekildelegeme som en kuldekilde for en kjølekretstermisk forbundet med et nedihullsverktøy
BR112014030170A2 (pt) 2012-06-25 2017-06-27 Halliburton Energy Services Inc método e sistema de perfilagem eletromagnética
EP2740890B1 (fr) * 2012-12-06 2017-02-01 Services Pétroliers Schlumberger Système de refroidissement et procédé pour un outil de fond de trou
EP2740889A1 (fr) * 2012-12-06 2014-06-11 Services Pétroliers Schlumberger Système et procédé de refroidissement d'outil de fond de trou
US20160356731A1 (en) * 2015-06-05 2016-12-08 Probe Holdings, Inc. Thermal conductivity quartz transducer with waste-heat management system
US20180347336A1 (en) * 2017-06-02 2018-12-06 Vierko Enterprises, LLC System for improving the usage of a thermoelectric cooler in a downhole tool
US10519751B2 (en) 2017-07-12 2019-12-31 Vierko Enterprises, LLC Apparatus and methods for regulating component temperature in a downhole tool
US10731878B2 (en) 2017-11-22 2020-08-04 International Business Machines Corporation Thermal cooling of an enclosure
US20190316442A1 (en) * 2018-04-16 2019-10-17 Baker Hughes, A Ge Company, Llc Thermal barrier for downhole flasked electronics
CN108952688B (zh) * 2018-08-22 2021-11-23 西安石油大学 一种深水高温高压油气井测试管柱及其测试方法
CN109577948A (zh) * 2018-12-05 2019-04-05 西安石油大学 一种井下工具的温度敏感元件的温度管理系统及方法
CN109630097A (zh) * 2018-12-05 2019-04-16 西安石油大学 一种井下热组件温度管理系统及方法
US11371338B2 (en) * 2020-06-01 2022-06-28 Saudi Arabian Oil Company Applied cooling for electronics of downhole tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5701751A (en) * 1996-05-10 1997-12-30 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US6458319B1 (en) * 1997-03-18 2002-10-01 California Institute Of Technology High performance P-type thermoelectric materials and methods of preparation

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3937209A (en) * 1974-07-12 1976-02-10 Bell Telephone Laboratories, Incorporated Heat storage device
US4407136A (en) * 1982-03-29 1983-10-04 Halliburton Company Downhole tool cooling system
US4449164A (en) * 1982-09-27 1984-05-15 Control Data Corporation Electronic module cooling system using parallel air streams
US4537067A (en) * 1982-11-18 1985-08-27 Wilson Industries, Inc. Inertial borehole survey system
US4722026A (en) * 1986-08-20 1988-01-26 The United States Of America As Represented By The United States Department Of Energy Thermal protection apparatus
US4755350A (en) * 1987-03-11 1988-07-05 The United States Of America As Represented By The Secretary Of The Air Force Thermionic reactor module with thermal storage reservoir
US5007478A (en) * 1989-05-26 1991-04-16 University Of Miami Microencapsulated phase change material slurry heat sinks
US5000252A (en) * 1990-02-22 1991-03-19 Wright State University Thermal energy storage system
US5165243A (en) * 1991-06-04 1992-11-24 The United States Of America As Represented By The United States Department Of Energy Compact acoustic refrigerator
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5456081A (en) * 1994-04-01 1995-10-10 International Business Machines Corporation Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability
US5771984A (en) * 1995-05-19 1998-06-30 Massachusetts Institute Of Technology Continuous drilling of vertical boreholes by thermal processes: including rock spallation and fusion
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
US5737923A (en) * 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US5784255A (en) * 1995-12-04 1998-07-21 Integrated Device Technology, Inc. Device and method for convective cooling of an electronic component
US5713208A (en) * 1996-04-03 1998-02-03 Amana Refrigeration Inc. Thermoelectric cooling apparatus
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US5878824A (en) * 1996-11-27 1999-03-09 Digital Control Incorporated Boring tool or other device including thermal protection for an electronic component assembly and method
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6200536B1 (en) * 1997-06-26 2001-03-13 Battelle Memorial Institute Active microchannel heat exchanger
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
US6411512B1 (en) * 1999-06-29 2002-06-25 Delta Engineers High performance cold plate
US6324904B1 (en) * 1999-08-19 2001-12-04 Ball Semiconductor, Inc. Miniature pump-through sensor modules
US6201221B1 (en) * 1999-09-16 2001-03-13 Lucent Technologies, Inc. Method and apparatus for heat regulating electronics products
US6481216B2 (en) * 1999-09-22 2002-11-19 The Coca Cola Company Modular eutectic-based refrigeration system
US6644395B1 (en) * 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
DE10017971A1 (de) * 2000-04-11 2001-10-25 Bosch Gmbh Robert Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager
EP1162659A3 (fr) * 2000-06-08 2005-02-16 MERCK PATENT GmbH Utilisation de PCM dans les dissipateurs de chaleur pour dispositifs électroniques
ATE267507T1 (de) * 2000-09-29 2004-06-15 Nanostream Inc Mikrofluidische vorrichtung zur wärmeübertragung
US6877332B2 (en) * 2001-01-08 2005-04-12 Baker Hughes Incorporated Downhole sorption cooling and heating in wireline logging and monitoring while drilling
US6341498B1 (en) * 2001-01-08 2002-01-29 Baker Hughes, Inc. Downhole sorption cooling of electronics in wireline logging and monitoring while drilling
US6997241B2 (en) * 2001-01-13 2006-02-14 Enertron, Inc. Phase-change heat reservoir device for transient thermal management
US6687126B2 (en) * 2001-04-30 2004-02-03 Hewlett-Packard Development Company, L.P. Cooling plate arrangement for electronic components
US6496375B2 (en) * 2001-04-30 2002-12-17 Hewlett-Packard Company Cooling arrangement for high density packaging of electronic components
US6415612B1 (en) * 2001-06-29 2002-07-09 Intel Corporation Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler
US6766817B2 (en) * 2001-07-25 2004-07-27 Tubarc Technologies, Llc Fluid conduction utilizing a reversible unsaturated siphon with tubarc porosity action
WO2003046463A2 (fr) * 2001-11-27 2003-06-05 Parish Overton L Systeme de refroidissement empile peu encombrant et procede de fabrication
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US20030112603A1 (en) * 2001-12-13 2003-06-19 Roesner Arlen L. Thermal interface
US6609561B2 (en) * 2001-12-21 2003-08-26 Intel Corporation Tunnel-phase change heat exchanger
AU2002335883A1 (en) * 2002-02-06 2003-09-02 Parker Hannifin Corporation Thermal management materials having a phase change dispersion
US6590770B1 (en) * 2002-03-14 2003-07-08 Modine Manufacturing Company Serpentine, slit fin heat sink device
US6918437B2 (en) * 2002-03-21 2005-07-19 Delphi Technologies, Inc. Heatsink buffer configuration
US7096929B2 (en) * 2002-03-29 2006-08-29 Leading Technology Designs, Inc. PCM (phase change material) system and method for shifting peak electrical load
US6557354B1 (en) * 2002-04-04 2003-05-06 International Business Machines Corporation Thermoelectric-enhanced heat exchanger
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US20040079100A1 (en) * 2002-10-25 2004-04-29 Sun Microsystems, Inc. Field replaceable packaged refrigeration module with capillary pumped loop for cooling electronic components
US6769487B2 (en) * 2002-12-11 2004-08-03 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US7246940B2 (en) * 2003-06-24 2007-07-24 Halliburton Energy Services, Inc. Method and apparatus for managing the temperature of thermal components
US20050097911A1 (en) * 2003-11-06 2005-05-12 Schlumberger Technology Corporation [downhole tools with a stirling cooler system]
US20060086506A1 (en) * 2004-10-26 2006-04-27 Halliburton Energy Services, Inc. Downhole cooling system
CN101147038A (zh) * 2005-06-24 2008-03-19 嘉合科技有限公司 传热装置
US8726997B2 (en) * 2006-04-07 2014-05-20 Raise Production Inc. Method of cooling a downhole tool and a downhole tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5701751A (en) * 1996-05-10 1997-12-30 Schlumberger Technology Corporation Apparatus and method for actively cooling instrumentation in a high temperature environment
US6458319B1 (en) * 1997-03-18 2002-10-01 California Institute Of Technology High performance P-type thermoelectric materials and methods of preparation

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010057017A2 (fr) * 2008-11-13 2010-05-20 Halliburton Energy Services, Inc. Système et méthode de gestion de température d'un composant thermique de fond
WO2010057017A3 (fr) * 2008-11-13 2010-07-29 Halliburton Energy Services, Inc. Système et méthode de gestion de température d'un composant thermique de fond
GB2477230A (en) * 2008-11-13 2011-07-27 Halliburton Energy Serv Inc Downhole thermal component temperature management system and method
GB2477230B (en) * 2008-11-13 2012-12-05 Halliburton Energy Serv Inc Downhole thermal component temperature management system and method
US9995131B2 (en) 2008-11-13 2018-06-12 Halliburton Energy Services, Inc. Downhole thermal component temperature management system and method
WO2019204345A1 (fr) * 2018-04-16 2019-10-24 Baker Hughes, A Ge Company, Llc Barrière thermique pour dispositifs électroniques associés à un fond de trou
GB2587151A (en) * 2018-04-16 2021-03-17 Baker Hughes Holdings Llc Thermal barrier for downhole flasked electronics
US11306578B2 (en) 2018-04-16 2022-04-19 Baker Hughes, A Ge Company, Llc Thermal barrier for downhole flasked electronics
GB2587151B (en) * 2018-04-16 2022-06-01 Baker Hughes Holdings Llc Thermal barrier for downhole flasked electronics
WO2020021454A1 (fr) * 2018-07-24 2020-01-30 Aarbakke Innovation, As Élimination de la chaleur de l'électronique dans des outils de fond de trou

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