EP2740889A1 - Système et procédé de refroidissement d'outil de fond de trou - Google Patents

Système et procédé de refroidissement d'outil de fond de trou Download PDF

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Publication number
EP2740889A1
EP2740889A1 EP12306530.2A EP12306530A EP2740889A1 EP 2740889 A1 EP2740889 A1 EP 2740889A1 EP 12306530 A EP12306530 A EP 12306530A EP 2740889 A1 EP2740889 A1 EP 2740889A1
Authority
EP
European Patent Office
Prior art keywords
temperature
tec
thermoelectric cooling
housing
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12306530.2A
Other languages
German (de)
English (en)
Inventor
Sophie Salvadori Velu
Francois Barbara
Lahcen Garando
Kamal Kader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Services Petroliers Schlumberger SA
Gemalto Terminals Ltd
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Schlumberger Technology BV
Original Assignee
Services Petroliers Schlumberger SA
Gemalto Terminals Ltd
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Schlumberger Technology BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Services Petroliers Schlumberger SA, Gemalto Terminals Ltd, Schlumberger Holdings Ltd, Prad Research and Development Ltd, Schlumberger Technology BV filed Critical Services Petroliers Schlumberger SA
Priority to EP12306530.2A priority Critical patent/EP2740889A1/fr
Priority to PCT/US2013/072942 priority patent/WO2014089128A1/fr
Publication of EP2740889A1 publication Critical patent/EP2740889A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments

Definitions

  • the present disclosure relates generally to systems and methods for improving the operability of downhole tools for drilling operations.
  • a drill bit attached to a long string of drill pipe may be used to drill a borehole for an oil and/or gas well.
  • the drill string may also include a variety of downhole tools to measure or log properties of the surrounding rock formation or the conditions in the borehole. These tools often operate in high temperature and pressure conditions. Unfortunately, the high temperature conditions may reduce the operability or lifespan of the electronics components within the downhole tools. For example, overheating of the downhole tools may weaken certain joints or induce electro-erosion of the electronics components. Thus, it is now recognized that it may be desirable to prevent the downhole tools from overheating during operation of the drilling system in order to improve the efficiency and operability of these tools.
  • the downhole tool includes a multi-chip module (MCM) coupled to a thermoelectric cooling (TEC) system.
  • MCM multi-chip module
  • TEC thermoelectric cooling
  • the TEC system may reduce a temperature of the MCM using, for example, the Peltier effect.
  • a system in a first embodiment, includes a housing, an integrated circuit hermetically sealed within the housing, and a thermoelectric cooling (TEC) system coupled to the housing.
  • the TEC system may reduce a temperature of the integrated circuit.
  • the TEC includes a thermoelectric cooling module with a plurality of alternating p-type and n-type semiconductors, a first thermal interface material (TIM) coupled to a first end of the thermoelectric cooling module, and a second TIM coupled to a second end of the thermoelectric cooling module.
  • TIM thermal interface material
  • a method in a second embodiment, includes lowering a downhole tool into a borehole. The method also includes detecting a temperature of the downhole tool using a sensor. Furthermore, at least electronics component of the downhole tool is actively cooled using a first thermoelectric cooling system based on the detected temperature.
  • a drilling system in a third embodiment, includes a downhole tool and an electronics assembly.
  • the downhole tool may measure one or more parameters related to the drilling system, a rock formation, or both.
  • the electronics assembly may adjust operation of the drilling system based on the one or more parameters.
  • the electronics assembly includes a housing, a multi-chip module disposed within the housing, and a thermoelectric cooling system coupled to the housing. The thermoelectric cooling system may reduce a temperature of the multi-chip module.
  • FIG. 1 is a schematic diagram of a drilling system that employs a downhole tool having an electronics assembly equipped with a thermoelectric cooling (TEC) system, in accordance with an embodiment
  • TEC thermoelectric cooling
  • FIG. 2 is a schematic diagram of the electronics assembly of FIG. 1 , illustrating a multi-chip module coupled to the TEC system, in accordance with an embodiment
  • FIG. 3 is a schematic diagram of the electronics assembly of FIG. 1 , illustrating a the TEC system coupled to a housing of the electronics assembly, in accordance with an embodiment
  • FIG. 4 is a flowchart of a method to actively cool a multi-chip module using the TEC system of FIG. 1 , in accordance with an embodiment.
  • the downhole tools may include, for example, logging-while-drilling (LWD) tools, measurement-while-drilling (MWD) tools, steering tools, and/or other tools to communicate with drilling operators at the surface.
  • LWD logging-while-drilling
  • MWD measurement-while-drilling
  • steering tools and/or other tools to communicate with drilling operators at the surface.
  • TEC thermoelectric cooling
  • the TEC system may be used to reduce a temperature of the electronics components within the downhole tools, thereby improving the operability and/or efficiency of the downhole tools in boreholes of great depths and/or high temperatures.
  • the TEC system may include a TEC module with a plurality of alternating n-type and p-type semiconductors.
  • one end (e.g., a hot plate) of the TEC module increases in temperature and another end (e.g., a cold plate) decreases in temperature.
  • the electronics component may be coupled to the cold plate in order to remove heat from the electronics component.
  • the hot plate may expel the removed heat to a heat sink.
  • FIG. 1 illustrates a drilling system 10 that may benefit from the TEC system described above.
  • the drilling system 10 includes a drill string 12 used to drill a borehole 14 into a rock formation 16.
  • a drill collar 18 of the drill string 12 encloses the various components of the drill string 12.
  • Drilling fluid 20 from a reservoir 22 at the surface 24 may be driven into the drill string 12 by a pump 26.
  • the hydraulic power of the drilling fluid 20 causes a drill bit 28 to rotate, cutting into the rock formation 16.
  • the cuttings from the rock formation 16 and the returning drilling fluid 20 exit the drill string 12 through a space 30.
  • the drilling fluid 20 thereafter may be recycled and pumped, once again, into the drill string 12.
  • a variety of information relating to the rock formation 16 and/or the state of drilling of the borehole 14 may be gathered while the drill string 12 drills the borehole 14.
  • a measurement-while-drilling (MWD) tool 32 may measure certain drilling parameters, such as the temperature, pressure, orientation of the drilling tool, and so forth.
  • a logging-while-drilling (LWD) tool 34 may measure the physical properties of the rock formation 16, such as density, porosity, resistivity, and so forth. The MWD tool 32 and the LWD tool may be lowered into the borehole 14 to gather the information at various depths within the rock formation 16.
  • the MWD tool 32 and the LWD tool 34 may include electronics components stored within an electronics assembly 36.
  • the electronics components may perform calculations or otherwise control operation of the tools 32 and 34.
  • the electronics assembly 36 includes a TEC system 38 to remove heat from the electronics components, thereby enabling the drilling tools 32 and 34 to operate in harsher conditions, and in turn, drill deeper into the rock formation 16.
  • FIG. 1 illustrates the TEC system 38 used in the drilling system 10
  • the TEC system 38 may be used in any suitable downhole tools with any suitable means of conveyance.
  • the TEC system 38 may be used in downhole tools carried by wireline or coiled tubing, to name just a few examples.
  • FIG. 2 illustrates an embodiment of the electronics assembly 36 having an electronics component 40 disposed within a housing 42.
  • the electronics component 40 may be a single chip module, a multi-chip module (MCM), or any other suitable form of integrated circuit related to the operation of the drilling tools 32 and 34.
  • MCM multi-chip module
  • an MCM may include a plurality of dies disposed on a unifying substrate, thereby simplifying procurement and installation of the MCM.
  • the housing 42 includes a cover frame 44, which defines a space 46 where the electronics component 40 resides. Furthermore, the housing 42 hermetically seals the space 46, which helps to thermally insulate the electronics component 40 from the ambient temperature of the rock formation 16.
  • the space 46 may be filled with an inert gas 48, such as nitrogen or argon. The inert gas protects the electronics component 40 by inhibiting humidity, corrosion, and/or electro-erosion within the space 46. Additionally or alternatively, the space 46 may be placed under full or partial vacuum conditions. In a similar manner, the vacuum condition inhibits humidity and corrosion, thereby improving the operability of the electronics component 40.
  • the electronics assembly 36 may operate at depths corresponding to high ambient temperatures (e.g., greater than 200 degrees Celsius). Accordingly, the material of the housing 42 may be selected in order to withstand these high temperatures, while still maintaining operability with the TEC system 38.
  • the housing 42 may include a high-temperature co-fired ceramic (HTCC), such as a combination of aluminum oxide, tungsten, and molybdenum.
  • HTCC high-temperature co-fired ceramic
  • the TEC system 38 is coupled to the housing 42 at one or more junctions 50.
  • the TEC system 38 may be glued (e.g., with a high thermal conductivity epoxy) or soldered to the housing 42.
  • CTE coefficient of thermal expansion
  • plates 52 and 54 of the TEC system 38 may include alumina having a CTE of approximately 6.5 millimeters per meter per degree Kelvin (mm/m-K).
  • the solder may include MoCu15 (7 mm/m-K), WCu10 (5.6 to 8.3 mm/m-K), or any other suitable alloy.
  • junctions 50 may be exposed to high temperature conditions. In order to maintain the integrity of the junctions 50, it is desirable to maintain a temperature of the junctions 50 below a temperature threshold (e.g., 210 degrees Celsius). As will be appreciated, the temperature threshold is generally based on the material of the junction 50.
  • the TEC system 38 may be used to cool the junctions 50 as well as the electronics component 40 in order to improve the operability of the electronics assembly 36, as discussed further below.
  • the TEC system 38 includes a TEC module 56 coupled to two thermal interface materials (TIM) 58 and 60.
  • the TIMs 58 and 60 absorb or dampen thermal expansion of the TEC module 56 and the junctions 50. As a result, the TIMs 58 and 60 inhibit the formation of cracks in the junctions 50 and within the TEC system 38, thereby improving the mechanical integrity of the TEC system 38.
  • the TIMs 58 and 60 are generally metallic or metalloid and may include, for example, silicon.
  • the geometry of the TIMs 58 and 60 may be designed based on certain parameters of the TEC system 38. For example, the dimensions of the TEC system 38 may be smaller than the dimensions of the housing 42.
  • the TEC system 38 may have a generally rectangular (e.g., square) shape with a width of less than 20 millimeters and a thickness of less than 3 millimeters.
  • the varying sizes of the TEC system 38 may correspond to a cooling rate in a range of approximately 0.5 Watts to approximately 10. Watts.
  • the TIMs 58 and 60 may have a greater thickness or length than in the embodiment illustrated by FIG. 2
  • the electronics component 40 is directly coupled to the TIM 60, which may enable efficient cooling of the electronics component 40.
  • the geometry of the electronics assembly 36 may vary.
  • the electronics component 40 may be coupled to the housing 42, which is subsequently coupled to the TIM 60.
  • the electronics component 40 is not in direct contact with the TIM 60.
  • the TEC system 38 dissipates heat directly from the housing 42.
  • the cooled housing 42 subsequently removes heat from the electronics component 40.
  • This design may be desirable, for example, when a larger TEC system 38 is desired for a greater amount of cooling. In other words, because the junction 50 between the housing 42 and the TEC system 38 has a greater surface area, a greater cooling rate may be achieved.
  • the thickness of the TEC system 38 may be less than 4 millimeters.
  • the electronics assembly 36 may include a varying number of electronics components 40 and/or TEC systems 38.
  • a single electronics component 40 may be cooled using two or more TEC systems 38.
  • a single TEC system 38 may cool two or more electronics components 40.
  • the electronics assembly 36 may include 1, 2, 3, 4, or more electronics components 40 individually or collectively coupled to 1, 2, 3, 4, or more TEC systems 38.
  • the TEC module 56 between the TIMs 58 and 60 is illustrated.
  • the TEC module 56 includes the plates 52 and 54 and a plurality of pellets 62 (e.g., semiconductors) disposed therebetween.
  • the pellets 62 may alternate between n-type and p-type semiconductors.
  • the design of the pellets 62 may be based on the ambient temperature of the rock formation 16, among other considerations. For example, for operating conditions near 200 degrees Celsius, the pellets 62 may include bismuth telluride.
  • a TEC controller 64 may be communicatively coupled to the TEC system 38 in order to control the application of current to TEC module 56.
  • the TEC controller 64 includes one or more processors 66 and/or other data processing circuitry, such as memory 68, to execute instructions to enable cooling of the electronics assembly 36. These instructions may be encoded in software programs that are executed by the processor 66. For example, the processor 66 may determine when cooling the electronics component 40 is desirable based on a temperature 70 detected by a temperature sensor 72. These instructions may be stored in a tangible, non-transitory, computer-readable medium, such as the memory 68.
  • the memory 68 may include, for example, random-access memory, read-only memory, rewriteable memory, hard drives, optical discs, and/or the like. In certain embodiments, various temperature thresholds may be stored within the memory 68 to be later accessed by the processor 66. The operation of the TEC controller 64 is discussed below with respect to FIG. 4 .
  • FIG. 4 illustrates an embodiment of a method 74 to enable operation of the drilling system 10 at depths corresponding to higher ambient temperatures.
  • the drilling system 10 may drill (block 76) to a high-temperature depth. For example, the ambient temperature around the tip of the drill collar 18 may be greater than 200 degrees Celsius.
  • the temperature sensor 72 detects (block 78) the temperature 70 and communicates the temperature 70 to the TEC controller 64.
  • the TEC controller 64 determines (block 80) if the temperature is appropriate by, for example, comparing the detected temperature 70 to a temperature threshold.
  • the temperature threshold may be stored on the memory 68 and may be based on the material of the junction 50 and/or the design temperature of the electronics component 40. If the detected temperature 70 is greater than the temperature threshold or the temperature 70 is otherwise inappropriate, the TEC controller 64 activates (block 82) the TEC system 38 to cool the electronics assembly 36 by applying a current to the TEC module 56.
  • a myriad of different temperatures 70 may be detected (block 78) by the temperature sensor 72.
  • the temperature sensor 72 may detect (block 78) an ambient temperature of the reservoir rock 16, a temperature of the electronics component 40, a temperature of the junction 50, a temperature differential between the cold plate 52 and the hot plate 54 of the TEC module 56, or any combination thereof.
  • the temperature threshold of block 80 may vary depending on the type of temperature detected by the temperature sensor 72.
  • the TEC controller 64 may maintain a temperature of the junction 50 below a first temperature threshold (e.g., 210 degrees Celsius) using the TEC system 38.
  • a first temperature threshold e.g., 210 degrees Celsius
  • the cooling effect of the TEC system 38 is not instantaneous.
  • the TEC controller 64 may activate (block 82) the TEC system 38 when the temperature 70 of the junction 50 exceeds a second temperature threshold (e.g., 200 degrees Celsius).
  • the TEC controller 64 may maintain a temperature differential (e.g., less than a 40 degree difference) between the ambient temperature 70 of the reservoir rock and the temperature 70 of the electronics component 40, or a temperature differential (e.g., less than a 10 degree difference) between the hot and cold plates 52 and 54 of the TEC module 56, or both.
  • a temperature differential e.g., less than a 40 degree difference
  • a temperature differential e.g., less than a 10 degree difference
  • the TEC systems 38 may be activated (block 82) independently and at different temperature thresholds.
  • the TEC controller 64 may control two TEC systems 38 to maintain a temperature differential (e.g., less than a 40 degree difference) between the ambient temperature 70 and the temperature 70 of the electronics component 40.
  • a first temperature threshold e.g., a 20 degree difference
  • the TEC controller 64 may activate (block 82) the first TEC system 38.
  • a second temperature threshold is exceeded (e.g., a 30 degree difference)
  • the TEC controller 64 may activate (block 82) the second TEC system 38.
  • Such a configuration may generally improve the efficiency of the TEC systems 38.
  • the multiple TEC systems 38 may be designed with varying sizes and cooling rates.
  • the first TEC system 38 may remove approximately 1 watt (W) of heat using 1 amp (A)
  • the second TEC system 38 may remove approximately 2 W using 2 A.
  • the TEC controller 64 may independently activate (block 82) the TEC systems 38 to achieve a desired cooling rate. More specifically, the TEC system 38 may activate (block 82) the first TEC system 38 and disable the second TEC system 38 for a cooling rate of 1 W, activate (block 82) the second TEC system 38 and disable the first TEC system 38 for a cooling rate of 2 W, or activate (block 82) both TEC systems 38 for a cooling rate of 3 W.
  • the TEC controller 64 may be designed to apply a constant current or a variable current to the TEC module 56.
  • constant current applications may be easier to design, whereas variable current applications may provide more flexibility to operate the TEC system 38.
  • the TEC controller 64 may apply a greater or lesser amount of current depending on the proximity of the temperature 70 to the various temperature thresholds.
  • the TEC controller 64 may maintain a temperature differential (e.g., less than a 10 degree difference) between the hot plate 54 and the cold plate 52 of the TEC module 56.
  • the TEC controller 64 may increase the amount of current applied to the TEC module 56 as the temperature 70 approaches a first temperature threshold (e.g., an 8 degree difference), thereby increasing the amount of cooling to the electronics assembly 36.
  • a first temperature threshold e.g., an 8 degree difference
  • the TEC system 38 is coupled to the electronics component 40 either directly or indirectly through the housing 42 of the electronics assembly 36.
  • the TEC controller 64 controls application of current to the TEC system 38 in order to control the temperature of the electronics component 40, the junction 50, or both.

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  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geology (AREA)
  • Mining & Mineral Resources (AREA)
  • Geophysics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP12306530.2A 2012-12-06 2012-12-06 Système et procédé de refroidissement d'outil de fond de trou Withdrawn EP2740889A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP12306530.2A EP2740889A1 (fr) 2012-12-06 2012-12-06 Système et procédé de refroidissement d'outil de fond de trou
PCT/US2013/072942 WO2014089128A1 (fr) 2012-12-06 2013-12-04 Système et procédé de refroidissement d'outil de fond de trou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12306530.2A EP2740889A1 (fr) 2012-12-06 2012-12-06 Système et procédé de refroidissement d'outil de fond de trou

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EP2740889A1 true EP2740889A1 (fr) 2014-06-11

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019232015A1 (fr) * 2018-05-29 2019-12-05 Baker Hughes, A Ge Company, Llc Commande de gradient de température de dispositif
US10787897B2 (en) 2016-12-22 2020-09-29 Baker Hughes Holdings Llc Electronic module housing for downhole use
US20220382348A1 (en) * 2019-07-22 2022-12-01 Micron Technology, Inc. Using a thermoelectric component to improve memory sub-system performance

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240133267A1 (en) * 2022-10-21 2024-04-25 Helmerich & Payne Technologies, Llc Systems and methods for managing temperatures in wellbores

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US5547028A (en) * 1994-09-12 1996-08-20 Pes, Inc. Downhole system for extending the life span of electronic components
US6134892A (en) * 1998-04-23 2000-10-24 Aps Technology, Inc. Cooled electrical system for use downhole
US20060102353A1 (en) * 2004-11-12 2006-05-18 Halliburton Energy Services, Inc. Thermal component temperature management system and method
US20060117759A1 (en) * 2004-12-08 2006-06-08 Hall David R Method and system for cooling electrical components downhole
US20060162931A1 (en) * 2005-01-27 2006-07-27 Schlumberger Technology Corporation Cooling apparatus and method
US20110203798A1 (en) * 2008-11-13 2011-08-25 Halliburton Energy Services, Inc. Downhole Thermal Component Temperature Management System and Method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547028A (en) * 1994-09-12 1996-08-20 Pes, Inc. Downhole system for extending the life span of electronic components
US6134892A (en) * 1998-04-23 2000-10-24 Aps Technology, Inc. Cooled electrical system for use downhole
US20060102353A1 (en) * 2004-11-12 2006-05-18 Halliburton Energy Services, Inc. Thermal component temperature management system and method
US20060117759A1 (en) * 2004-12-08 2006-06-08 Hall David R Method and system for cooling electrical components downhole
US20060162931A1 (en) * 2005-01-27 2006-07-27 Schlumberger Technology Corporation Cooling apparatus and method
US20110203798A1 (en) * 2008-11-13 2011-08-25 Halliburton Energy Services, Inc. Downhole Thermal Component Temperature Management System and Method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10787897B2 (en) 2016-12-22 2020-09-29 Baker Hughes Holdings Llc Electronic module housing for downhole use
US11692431B2 (en) 2016-12-22 2023-07-04 Baker Hughes Oilfield Operations Llc Electronic module housing for downhole use
WO2019232015A1 (fr) * 2018-05-29 2019-12-05 Baker Hughes, A Ge Company, Llc Commande de gradient de température de dispositif
GB2589239A (en) * 2018-05-29 2021-05-26 Baker Hughes Holdings Llc Device temperature gradient control
US11396794B2 (en) 2018-05-29 2022-07-26 Baker Hughes, A Ge Company, Llc Device temperature gradient control
GB2589239B (en) * 2018-05-29 2022-09-21 Baker Hughes Holdings Llc Device temperature gradient control
US20220382348A1 (en) * 2019-07-22 2022-12-01 Micron Technology, Inc. Using a thermoelectric component to improve memory sub-system performance

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