WO2006054753A1 - 磁気ヘッド及び磁気ヘッドの製造方法 - Google Patents
磁気ヘッド及び磁気ヘッドの製造方法Info
- Publication number
- WO2006054753A1 WO2006054753A1 PCT/JP2005/021391 JP2005021391W WO2006054753A1 WO 2006054753 A1 WO2006054753 A1 WO 2006054753A1 JP 2005021391 W JP2005021391 W JP 2005021391W WO 2006054753 A1 WO2006054753 A1 WO 2006054753A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- slider
- flexure
- side electrode
- conductive material
- magnetic head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
Definitions
- the present invention relates to an electrode joining method for joining electrodes in an electronic component having an electrode provided on a substantially flat substrate and an electrode extending in a plane substantially perpendicular to the electrode surface. More specifically, the present invention relates to a joining method for joining an electrode on a flexure (corresponding to a substrate) in a magnetic head and an electrode on a magnetic head slider (corresponding to an electronic component), that is, a magnetic head manufacturing method. The present invention also relates to a magnetic head obtained by the manufacturing method. Background art
- a method using a gold ball is disclosed in, for example, Japanese Patent Application Laid-Open No. 2 0 0 2-0 15 4 13 Open 2 0 0 0 — 1 5 5 9 2 2
- pressure is applied to the gold ball in the direction in which the gold ball is pressed against the electrode to be joined, and ultrasonic vibration is applied to the gold ball in this state.
- ultrasonic vibration is applied to the gold ball in this state.
- the slider side electrode and the flexure side electrode are arranged so as to form an angle of about 90 °.
- the gold ball is brought into contact with each of these electrodes at an angle of approximately 45 °, and a load is applied toward the center of the formed angle.
- ultrasonic vibration is applied to the load application tool in this state, and this vibration is transmitted to the gold ball pressed against the tool, so that the joining operation is performed.
- the slider and flexure are fixed in place with a jig or the like.
- a solder ball is held in a V-shaped groove formed by a pair of electrodes, and this is melted by laser light. These electrodes are joined. According to this method, almost no load is applied to each electrode via the solder ball, and the solder ball is applied to the solder ball to hold the solder ball at a predetermined position of the V-shaped groove and to contact each electrode. Only the load that can be generated. Disclosure of the invention
- solder balls In the case of a configuration using solder balls, it is necessary to hold the electrodes at predetermined positions in the grooves in order to hold the solder balls in the V-shaped grooves formed by the pair of electrodes.
- the solder ball itself needs to have a certain size in order to make suitable contact with both electrodes and facilitate the holding at a predetermined position. For this reason, the amount of solder used between the pair of electrodes tends to be excessive, and there has been a problem that, for example, molten solder scatters around when the solder is melted.
- the slider and the flexure are bonded to each other by an epoxy resin or the like. This is to prevent the position of each electrode from shifting during electrode bonding.
- the molten solder solidifies and shrinks.
- the joint end of the slider is drawn to the flexure-side electrode on the flexure surface due to the shrinkage of the solder of the joint fixed to the electrode on one side of the slider.
- the attitude angle of the slider with respect to the flexure may fluctuate.
- the GDN (ground) electrode arranged on the side facing the one side of the slider and the corresponding flexure-side electrode the attitude angle fluctuation of the slider can be reduced.
- the flexure may be lifted to the slider side due to solidification and shrinkage of the molten solder. Therefore, it has been difficult to eliminate the presence of the adhesive in the conventional configuration using solder balls.
- the present invention provides a magnetic head having a structure that does not deform each shape, each posture, positional relationship, etc., by greatly reducing the load applied at the time of electrode joining of the slider and flexure.
- An object of the present invention is to provide a method for manufacturing the magnetic head in which the scattering of molten solder is reduced during electrode joining. It is.
- Another object of the present invention is to provide a magnetic head having a configuration in which an adhesive or the like existing between the slider and the flexure is eliminated, and a method for manufacturing the magnetic head.
- a magnetic head includes a slider having a slider-side electrode on one or a plurality of side surfaces, and the slider is placed at a predetermined position on the placement surface and the slider-side electrode.
- a magnetic head having a flexure-side electrode that is paired with each other, wherein the slider-side electrode and the flexure-side electrode are substantially V-shaped and are electrically conductive.
- a core material having a fixing part for fixing the slider side electrode and the flexure side electrode via the material, and having a higher melting point than the conductive material for the conductive material in all or any of the fixed parts. The slider is flexibly fixed to the flexure only by the fixed portion.
- the fixing portion serves both as the mechanical fixing between the slider and the flexure, and also as the electrical connection between the pair of slider-side electrode and flexure-side electrode.
- a magnetic head includes a slider having a slider-side electrode on one or a plurality of side surfaces, and a slider placed at a predetermined position on the placement surface.
- a magnetic head having a flexure-side electrode that forms a pair with the side electrode, wherein the slider-side electrode and the flexure-side electrode are substantially V-shaped and are electrically conductive in all or any one of the electrode pairs. It has a fixing part that fixes the slider-side electrode and the flexure-side electrode through the material. In all or any of the fixing parts, the conductive material has a higher melting point than the conductive material. Is characterized in that the mounting surface on the flexure and the flexure facing surface of the slider are substantially in contact with each other.
- a method for manufacturing a magnetic head according to the present invention includes a slider having a slider-side electrode on one or a plurality of side surfaces.
- a method of manufacturing a magnetic head that is placed at a predetermined position on a mounting surface of the flexure and electrically joins the flexure-side electrode and the slider-side electrode paired with the slider-side electrode of the flexure.
- the slider is held at a predetermined position on the flexure mounting surface so that the side surface on which the slider-side electrode is formed and the mounting surface of the flexure form a substantially V-shaped groove.
- a conductive material layer is formed on the surface of the core material having a melting point higher than that of the conductive material at least one of the pair of the slider side electrode and the flexure side electrode facing the mold.
- a conductive material is formed by placing a material ball, irradiating a conductive material ball with laser light to melt the conductive material layer, and solidifying the molten conductive material layer.
- Slider side electrode, core, and flexi The slider-side electrode and the flexure-side electrode are electrically connected to each other between the side electrodes, and the slider is flexibly bonded to the flexure by only the solidified conductive material. It is a sign.
- the mounting surface on the flexure and the flexure facing surface of the slider are maintained in a substantially contacted state. It is a feature.
- the present invention it is possible to greatly reduce the amount of molten conductive material having a large shrinkage defect, specifically, the amount of molten solder. Therefore, it is possible to reduce fluctuations in the slider attitude angle due to solder shrinkage and the like. In addition, since the fluctuation of the posture angle is suppressed, it is possible to simplify the mechanism for fixing and holding the slider and the flexure at the time of joining. In addition, since it is not necessary to forcibly maintain the positional relationship between the slider and the flexure, the slider and the flexure surface can be brought into direct contact and the adhesive can be eliminated.
- solder ball By using a solder ball with a core, it becomes possible to maintain the size of the ball itself to a certain extent or more, and using a solder ball holder or the like, the solder ball is suitably held at a predetermined position in the V-shaped groove. It is also possible to do. According to the present invention It is possible to eliminate the adhesive, but it is possible that the bonding strength of the slider and flexure will be insufficient if only the electrodes are bonded together with a cored solder ball. In this case, for example, a GND (ground) electrode may be further provided to increase the number of electrodes to be bonded and increase the bonding strength.
- GND ground
- FIG. 1 is a schematic view showing main steps in a method of manufacturing a magnetic head according to an embodiment of the present invention.
- FIG. 2 is a diagram showing a main part configuration of the magnetic head according to the embodiment of the present invention.
- FIG. 3 is a diagram showing a state in which the magnetic head slider and the flexure side electrode joined to the slider side electrode of the magnetic head slider are viewed from above.
- a magnetic head 1 includes a flexure 3 having a flexure side electrode 5, a slider 7 having a slider side electrode 9, a solidified solder 12 as a fixing portion, and a core substantially embedded in the solidified solder 12 ( Core material) Has 1 3.
- the flexure side electrode 5 is provided at a predetermined position on the slider mounting surface of the flexure 3.
- the slider 7 is placed at a predetermined position on the placement surface of the flexure 3.
- the slider-side electrode 9 is disposed at a position close to the mounting surface, which is an end surface portion of the slider 7 rising vertically from the mounting surface on the flexure in the mounting state.
- the core 13 can be made of an organic material, an inorganic material, a metal material, or the like. However, when considered as a wiring material, it is desirable to construct it from a metal material that can reduce electrical DC resistance. In this embodiment mode, solder is used as the main fixing material.
- the present invention is not limited to the material, and may be a highly conductive material having a characteristic of melting in a desired temperature range. It ’s fine.
- the core material may be a highly conductive material having a melting point sufficiently higher than that of the material.
- the characteristic features of the electrode bonding method according to the present invention that is, the magnetic head manufacturing method will be described.
- the slider-side electrode 9 and the flexure-side electrode 5 are arranged so as to form a substantially V shape, that is, an angle formed by approximately 90 °.
- a solder ball 15 having a solder layer 11 formed on the surface of the core 13 is brought into contact with each electrode at an angle of approximately 45 ° between the pair of electrodes.
- the solder ball 15 is transferred onto these electrodes so as to maintain the contact state by the holder 17 having an opening 17 a that allows introduction of laser light from an optical system (not shown). The movement is prevented.
- the slider 7 is substantially in contact with the surface of the flexure 3, and no processing for maintaining the contact state such as the arrangement of the adhesive is performed between them. Further, no load other than the urging force applied to the slider 7 and the flexure 3 by the holding device for holding the state shown in the figure is applied. In this state, the laser light is irradiated to the solder ball 15 through the opening 17a, and the solder layer 11 in the solder ball 15 is melted. Melting The solidified solder layer 11 is solidified into a state shown as solidified solder 12 in FIG. 2, and is electrically and mechanically joined to the flexure side electrode 5 and the slider side electrode 9 respectively.
- the slider-side electrode and the flexure-side electrode are joined together by a fixed portion made of a core material having a melting point higher than that of solder and solder that is substantially present in the solder.
- the presence of the core 13 can prevent the joint portion of the flexure 7 from being drawn toward the slider due to the solidification shrinkage of the solder.
- the solidified solder 12 is shown to fill the entire region surrounded by the core 13, the flexure side electrode 5, and the slider side electrode 9.
- the space between the core 13 and the flexure side electrode 5 and between the core 13 and the slider side electrode 9 may not be filled with the solidified solder 12. Specifically, it is only necessary that these are kept in a mechanical and electrical joining state by the solidified solder 12.
- the magnetic head according to the present invention is formed by the slider-side electrode and the flexure-side electrode, holds the solder ball with the core in the V-shaped groove, and the solder layer of the solder ball is formed.
- the slider is placed at a predetermined position on the slider mounting surface of the flexure. It is supposed to be fixed. That is, the flexure and the slider are fixed by a conductive path made of the flexure side electrode, the core, the slider side electrode, and solidified solder existing between them.
- the magnetic head and the method for manufacturing the magnetic head according to the present invention are more suitably used for a smaller and higher performance MR head or a magnetic head having a GMR element.
- the solder ball is described as having a spherical shape, it is preferable to have various shapes depending on the positional relationship between the slider-side electrode and the flexure-side electrode. In this case, it is preferable that the core portion has a shape that can contact both electrodes and does not come into contact with electrodes different from these.
- FIG. 3 shows an example of the magnetic head slider and the flexure side electrode joined to the slider side electrode of the magnetic head slider as viewed from above.
- FIG. 3 shows an example of the magnetic head slider and the flexure side electrode joined to the slider side electrode of the magnetic head slider as viewed from above.
- GND grounding
- solder balls 15 described above are preferably used for all electrode pairs. However, when trying to increase the mechanical joint strength of the slider to the flexure, for example, a solder ball 15 a made only of solder may be partially used. Alternatively, a solder ball having a large amount of solder with a small core material 13 and a large thickness of the solder layer 11 may be partially used. By increasing the amount of solder that contributes to fixation in this way, there is a high possibility that various phenomena due to the solidification shrinkage of the solder described as problems will occur. However, an increase in the amount of solder can provide an effect of stably providing the mechanical strength of fixing.
- the fixing part it is not necessary for the fixing part to have a core material in all of the fixing parts, as long as it is in any one of them. Les.
- the case where the solder ball including the core material is used by at least one electrode pair is also included in the disclosed scope of the present invention.
- the embodiment described above describes a method for manufacturing a magnetic head for joining the flexure side electrode 5 and the slider side electrode 9 in the magnetic head.
- the application target of the present invention is not limited to the magnetic head.
- an electronic component having an electrode provided on a substantially flat substrate and an electrode extending in a plane substantially perpendicular to the electrode surface, it is added to the member on which these electrodes are formed.
- the present invention can also be applied to the case where both electrodes are joined without hanging, and without joining these members in advance.
- This application claims priority from Japanese Patent Application No. 2 0 0 4-3 3 4 6 7 8 filed on Jan. 1st, 2008, and cites its contents. And are part of this application.
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-334678 | 2004-11-18 | ||
| JP2004334678A JP2006147031A (ja) | 2004-11-18 | 2004-11-18 | 磁気ヘッド及び磁気ヘッドの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006054753A1 true WO2006054753A1 (ja) | 2006-05-26 |
Family
ID=36407285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/021391 Ceased WO2006054753A1 (ja) | 2004-11-18 | 2005-11-16 | 磁気ヘッド及び磁気ヘッドの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006147031A (ja) |
| WO (1) | WO2006054753A1 (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0799385A (ja) * | 1993-09-29 | 1995-04-11 | Ibiden Co Ltd | はんだボール及びその製造方法並びに接続構造 |
| JP2000306225A (ja) * | 1999-04-20 | 2000-11-02 | Alps Electric Co Ltd | 磁気ヘッド及び磁気ヘッドの製造方法 |
| JP2002050018A (ja) * | 2000-08-03 | 2002-02-15 | Tdk Corp | 磁気ヘッド装置の製造方法、半田ボール供給素子、及び、製造装置 |
-
2004
- 2004-11-18 JP JP2004334678A patent/JP2006147031A/ja active Pending
-
2005
- 2005-11-16 WO PCT/JP2005/021391 patent/WO2006054753A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0799385A (ja) * | 1993-09-29 | 1995-04-11 | Ibiden Co Ltd | はんだボール及びその製造方法並びに接続構造 |
| JP2000306225A (ja) * | 1999-04-20 | 2000-11-02 | Alps Electric Co Ltd | 磁気ヘッド及び磁気ヘッドの製造方法 |
| JP2002050018A (ja) * | 2000-08-03 | 2002-02-15 | Tdk Corp | 磁気ヘッド装置の製造方法、半田ボール供給素子、及び、製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006147031A (ja) | 2006-06-08 |
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