WO2006054468A1 - Méthode de fabrication de carte d’identité et carte de test utilisée par celle-ci - Google Patents

Méthode de fabrication de carte d’identité et carte de test utilisée par celle-ci Download PDF

Info

Publication number
WO2006054468A1
WO2006054468A1 PCT/JP2005/020534 JP2005020534W WO2006054468A1 WO 2006054468 A1 WO2006054468 A1 WO 2006054468A1 JP 2005020534 W JP2005020534 W JP 2005020534W WO 2006054468 A1 WO2006054468 A1 WO 2006054468A1
Authority
WO
WIPO (PCT)
Prior art keywords
card
sheet member
test
layer
test card
Prior art date
Application number
PCT/JP2005/020534
Other languages
English (en)
Japanese (ja)
Inventor
Ryoji Hattori
Original Assignee
Konica Minolta Medical & Graphic, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Medical & Graphic, Inc. filed Critical Konica Minolta Medical & Graphic, Inc.
Priority to JP2006544917A priority Critical patent/JPWO2006054468A1/ja
Publication of WO2006054468A1 publication Critical patent/WO2006054468A1/fr

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/23Identity cards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B42BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42DBOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

Definitions

  • the present invention relates to a method of issuing an ID card by adjusting an ID card issuing device and a test card used therefor.
  • ID cards such as ID cards, employee ID cards, employee ID cards, membership ID cards, medical cards, and student ID cards are widespread.
  • This type of ID card contains a face image for identity verification and character information images such as characters and symbols related to the owner. For this reason, printing for the purpose of preventing falsification of ID cards is often performed.
  • contact-type or non-contact-type electronic cards or magnetic cards that store personal information or the like have been widely used.
  • This face image is usually a full-color image having multiple gradations, and is formed by, for example, a sublimation thermal transfer recording method, a silver halide color photographic method, or the like.
  • the character information image is composed of a binary image, and is formed by, for example, a melt type thermal transfer recording method, a sublimation type thermal transfer recording method, a silver halide color photographic method, an electrophotographic method, an ink jet method or the like.
  • the ID card issuing device uses a card as described in Patent Document 1 to obtain recording quality that satisfies the customer.
  • the transportability and image quality were checked and adjusted in advance.
  • Patent Document 1 Japanese Patent Laid-Open No. 2003-317065
  • the present invention has been made in view of power, and uses an IC card that can be adjusted in a reproducible manner at a low cost by pre-adjusting an ID card issuing device using the IC card.
  • the purpose is to provide an ID card manufacturing method and a test card.
  • identification information and bibliographic information are formed by at least one method selected from a sublimation thermal transfer method, a melt thermal transfer method, and an inkjet method.
  • test card is one in which the first sheet member and the second sheet member are bonded via an adhesive and do not hold the electronic component.
  • a method for producing an ID card of 3 comprising at least a first sheet member, a second sheet member, and an IC card made of the same material as the IC card.
  • an 1C card that holds an electronic component with an IC chip and an antenna via an adhesive between the first sheet member and the second sheet member.
  • This is a test card that has an identification surface recording layer that is used for preconditioning of the ID card issuing device.
  • an ID card issuing device using an IC card can be pre-adjusted at a low cost and a reproducible adjustment can be performed. Can be provided.
  • FIG. 1 is a diagram showing a schematic configuration of an ID card manufacturing method.
  • FIG. 2 is a diagram showing a schematic configuration of a test card.
  • FIG. 3 (a) and FIG. 3 (b) are diagrams showing a schematic configuration of a test card and an IC card.
  • FIGS. 4 (a) to 4 (f) show examples of patterns on the surface of a card used for production.
  • FIG. 5 (a) to FIG. 5 (c) show examples of symbols on the back side of a card used for production.
  • FIG. 6 (a) and FIG. 6 (b) are schematic views of an IC module.
  • FIG. 7 (a) and FIG. 7 (b) are schematic configuration diagrams of a card manufacturing apparatus.
  • FIG. 8 (a) and FIG. 8 (b) are diagrams showing a card substrate.
  • FIG. 9 is a schematic configuration diagram of an ID card issuing device.
  • FIG. 10 (a) and FIG. 10 (b) are schematic configuration diagrams of a card punching machine.
  • FIG. 11 (a) and FIG. 11 (b) are diagrams showing a card thickness measuring unit.
  • FIG. 12 (a) and FIG. 12 (b) are diagrams illustrating a method for measuring surface irregularities.
  • FIG. 13 shows a finished test card.
  • FIG. 14 is a view showing a finished IC card.
  • FIG. 1 is a diagram showing a schematic configuration of an ID card manufacturing method.
  • an ID card issuing device 601 prints at least an ID card issuing device 601 on an IC card 600 produced via an adhesive between the first sheet member and the second sheet member, and the ID card Issue card 602.
  • the test card 620 is issued by using at least the conveyance or printing using the test card 610.
  • the ID force issuing device 601 forms and issues a character information image and a face image by at least a thermal transfer recording method or an ink jet method.
  • the test card 610 is used to adjust at least the transportability and printability of the ID card issuing device 601 in advance. The adjustment can be made and the test card 610 can be saved and not used, and the adjustment can be performed with a sufficient amount of the test card, so that the adjustment accuracy can be improved.
  • FIG. 2 is a diagram showing a schematic configuration of the test card.
  • the test card 610 of this embodiment is manufactured using an adhesive 613 between a first sheet member 611 and a second sheet member 612, and excludes an electronic component having an IC chip and an antenna. At least the first sheet member 611, the second sheet member 612, and the adhesive 613 are the same as the material of the IC card 600.
  • the first sheet member 611 has at least an image receiving layer 611a
  • the second sheet member 612 has at least a writing layer 612a. Since the test card 610 is made of the same material as the IC card 600 for producing the ID card, the performance such as the transportability and printability of the ID card issuing device 601 can be reproduced by using the test card 610. Can be confirmed at low cost [0016]
  • the test card 610 has an identification surface recording layer 614.
  • the test card 610 before issuance for adjusting the ID card issuing device 601 by the identification surface recording layer 614 and an IC card 600 Identify. In this way, it is preferable that the shape can be easily identified without using a jig such as a card tester.
  • the trouble that the test card 610 is used as a card for an ID card is also solved. That is, if the system describes an identification image that shows a test card at the time of issuance, there is a risk of handling errors and problems such as erroneous issuance, so the surface recording layer 614 for identification is provided before issuance. It is preferable.
  • FIG. 3 is a diagram showing a schematic configuration of a test card and an IC card.
  • Fig. 3 (a) shows the test card 610 before issuance
  • Fig. 3 (b) shows the IC card 600 before issuance.
  • the thickness of the test card 610 before issuance and the thickness of the IC card 600 before issuance Satisfaction force The following general formula (1) is satisfied.
  • the relationship between the surface irregularities of the test card 610 before issuing and the surface irregularities of the IC card 600 before issuing satisfies the relationship of the following general formula (2).
  • Thickness force of test card 610 Thickness of IC card 600 and force to satisfy general formula (1), surface unevenness of test card 610 Satisfies surface roughness of IC card 600 for production material and general formula (2) Therefore, it is possible to confirm the reproducibility at low cost by using the performance test card 610 such as transportability and printability of the ID card issuing device 601. If the relationship of general formula (1) is less than 0.81 or greater than 1.24, or if the relationship of general formula (2) is less than -80.0 or greater than 80.0, IC card issuing device Although the 601 transportability and printability are good with the test card 610, there may be a problem in reproducibility when an actual ID card is issued.
  • the thickness of the test card and IC card was measured at five points, and the maximum film thickness was taken as the card film thickness.
  • the thickness was measured using a contact-type film thickness meter (Electric Micrometer Minicom M manufactured by Tokyo Seimitsu Co., Ltd.). The relationship of general formula (1) was determined from the obtained data.
  • the card surface irregularities of test cards and IC cards are measured at lmm intervals using “Mitaka Kogyo Co., Ltd .: Non-contact 3D measuring device NH_ 3N”, and the maximum and minimum heights are obtained from the obtained data.
  • the difference ⁇ ⁇ was calculated, and the relationship of general formula (2) was obtained. That is, measurement was performed as shown in FIG. 12 (a), and the difference ⁇ ⁇ between the maximum height and the minimum height from the end portion on the long side of the card to the end portion on the opposite side was calculated to obtain surface irregularity.
  • Fig. 12 (b) is an enlarged view of one point from the long side edge of the card to the opposite edge measured in Fig. 12 (a).
  • the maximum height and the minimum height from the average value calculated from ⁇ H at each measurement point are in a specific range.
  • the card surface irregularities have a maximum height from the average value of 40 ⁇ 30 ⁇ or less, more preferably 30 / im or less.
  • the minimum height is preferably 1-40 zm or less, more preferably _30 x m or less. It is preferable that the IC card has the same surface irregularity.
  • the test card of the present invention is preferably used in the ID card issuing device for carrying out at least the conveyance or printing test. Further, in the case where a protective layer is provided in the ID card issuing device, etc. It can also be used when post-processing is performed. Moreover, it may be used as a test card for shipping inspection such as card surface quality and card appearance inspection. It is used for applications that are necessary for quality management, and is useful for reducing the cost of quality control and improving adjustment accuracy. It is for.
  • the test card refers to a card form before forming identification information such as a character information image such as bibliographic information and a face image by a thermal transfer recording method or an ink jet method. It is preferable in terms of cost that the test card does not contain an operable IC chip and antenna.
  • Card sheet members include, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, and polyvinylidene fluoride.
  • polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer
  • polyolefin resins such as polyethylene, polypropylene, and polymethylpentene
  • polyvinyl fluoride polyvinylidene fluoride
  • the thickness of the sheet member is 30 to 300 ⁇ m, desirably 50 to 200 ⁇ m.
  • a magnetic recording layer a falsification preventing printing layer (pearl pigment layer, watermark printing layer, micro-character, etc.), an embossed printing layer, an IC chip concealing layer, etc. can be provided.
  • the sheet member can be provided with an image receiving layer, a cushion layer, a writing layer, a format printing layer, and the like, if necessary.
  • the image receiving layer refers to a layer in which bibliographic information and identification information can be formed by the thermal transfer recording method (a) or the ink jet method (b).
  • the thermal transfer recording method (a) include a generally known sublimation type thermal transfer method and a melt type thermal transfer method.
  • the ink jet system (b) a generally known method can be used.
  • a method for forming a character information image by a sublimation thermal transfer method or a melt thermal transfer method while forming a gradation information-containing image such as a face image by a sublimation thermal transfer method (a) a method for forming a character information image by a sublimation thermal transfer method or a melt thermal transfer method while forming a gradation information-containing image such as a face image by a sublimation thermal transfer method, b) A method of recording a gradation information-containing image and a character information image by an inkjet method is preferably used.
  • a conventionally known binder for a sublimation type thermal transfer recording image-receiving layer can be appropriately used, and preferably a polychlorinated bur resin, a salted bulb and other monomers.
  • Copolymer polyester resin, polybutylacetal resin, polyvinyl butyral resin, copolymer of styrene and other monomers, epoxy resin, photocurable resin, thermosetting resin, and the like.
  • a metal ion-containing compound may be contained, in which a chelate is formed by reacting the heat-transfer compound with the metal ion-containing compound to form an image. Is preferred.
  • M represents a metal ion
  • Ql, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M
  • L is a counter-anion that can form a complex
  • k is It represents an integer of 1, 2 or 3
  • m represents 1, 2 or 0, and n represents 1 or 0.
  • p represents 1, 2 or 3.
  • Examples of this type of metal ion-containing compound include those exemplified in US Pat. No. 4,987,049.
  • the added pressure amount for the image-receiving layer 0. 5 to 20 g / m 2 is preferred instrument:! ⁇ 15g / m 2 is more preferable.
  • a release agent may be added to the image receiving layer.
  • a hardening agent, a cationic mordant, or the like may be used in order to improve film strength that can be in any of the commonly known swelling type or void type.
  • Various known additives such as anti-fading agent, various anionic, cationic or nonionic surfactants, lubricants, preservatives, thickeners, antistatic agents and matting agents may be contained.
  • the image receiving layer may be formed of two or more layers.
  • the image-receiving layer is a coating method in which an image-receiving layer coating solution prepared by dispersing or dissolving the formation component in a solvent is prepared, the image-receiving layer coating solution is coated on a sheet member, and dried. Can be manufactured by S.
  • the thickness of the image receiving layer is generally from 0.01 to 30 111, preferably from 0.01 to 20 zm, more preferably from 0.03 to 20 ⁇ .
  • the card can be provided with a cushion layer in order to improve the printability.
  • a resin having flexibility and low thermal conductivity is suitable.
  • the thickness of the cushion layer is usually 1 to 50 ⁇ , preferably 3 to 30 ⁇ m.
  • the cushion layer may be any one of a) between the image receiving layer and the sheet member, and b) between the writing layer and the sheet member, and a plurality of layers may not be used.
  • a writing layer may be provided on the card.
  • the writing layer is a layer that allows writing on the back side of the ID card, and can be formed of a binder and various additives.
  • an inorganic fine powder, a porous material, or the like can be used.
  • Other additives may contain wax, surfactant, solvent and water, and are not particularly limited.
  • the thickness of the writing layer is preferably 5 to 40 ⁇ , more preferably 5 to 30 ⁇ .
  • an adhesive layer may be provided to improve the adhesion to the sheet member, and a cushion layer may be provided to improve the writing property.
  • the surface Ra of the writing layer is not more than 2.0 ⁇ ⁇ . Force S is preferable, more preferably 0.2 to 2. ⁇ , still more preferably 0.3 to 1.8 ⁇ m.
  • Format printing can be provided on the image receiving layer or the writing layer, and the test card has a surface recording layer for identification. Since test cards are not handled as IC cards by mistake, an identification mark that is a test card is required. As shown in Fig. 4 (a) to Fig. 4 (e), it is understood that the identification mark is a test card, test, test, test, etc. There is no particular limitation as long as the mark can be made.
  • For format printing specifically, the shoreline, company name, card name, precautions, issuer telephone number, etc. are written. For example, the back of the test card is shown in Fig. 5 (a) or Fig. 5 (b It is configured as shown in the figure. Fig. 5 (a) is the same as the back side of the IC card shown in Fig. 5 (c).
  • the test card should have a notation that can be understood as the test as described above. Other notations may be the same as or different from the IC card.
  • the format printing layer may employ watermark printing, fine prints, etc. to prevent forgery by visual inspection.
  • the IC card is provided with electronic components.
  • the electronic component is an IC module that functions as an information recording member, and specifically includes an IC chip that electrically stores information of the IC card user and a coiled antenna connected to the IC chip.
  • the IC chip is only a memory or a microcomputer in addition to it, and may include a capacitor.
  • As the antenna a coil made of copper wire, a conductor paste such as silver paste printed in a spiral on an insulating base, or a coil etched with a metal foil such as copper foil is used. .
  • a coil made of copper wire with communicability. In some cases, it may be covered with a resin or an insulating layer.
  • the number of turns of the antenna coil is preferably 2 to 10 turns.
  • Fig. 6 is a schematic diagram of an IC module, in which an IC chip is joined to an antenna coil obtained by winding a copper wire four times.
  • Fig. 6 (a) shows a non-woven fabric type, where the non-woven fabric with the antenna pattern inserted is bonded to the IC chip by bonding, etc., and the IC chip has at least 50% of the reinforcing plate to cover the IC chip.
  • Fig. 6 (b) shows the printed circuit board type. The printed circuit board on which the printed pattern is formed and the IC chip are joined together by bonding or the like, and the reinforcing plate covers at least one of the IC chips at least 50% of the IC chip. It is the schematic diagram which interposes.
  • the joint is disconnected due to the shearing force due to the flow of the resin, or the resin flows and cools. Therefore, in order to eliminate the lack of stability, such as the loss of surface smoothness, a resin layer is formed on the sheet member in advance, and the module can be encased in the resin layer. It is preferable to use it in the form of a porous resin sheet, a porous resin sheet or a non-woven fabric sheet. Also, since the IC chip has a weak point pressure strength, it is preferable to have a reinforcing plate in the vicinity of the IC chip.
  • the total thickness of the electronic component is preferably 10 to 500 xm, more preferably 10 to 450 zm, and still more preferably 10 to 350 ⁇ .
  • test card it is preferable that the electronic component described above is not included in the card.
  • the card thickness and surface irregularity satisfy the relational expressions (1) and (2), and that the test card should have similar card rigidity. Masle. Therefore, it is okay to enclose electronic components that do not work inside the card. Specifically, since the IC chip substrate, the antenna, the substrate sheet, the reinforcing plate, and the like take a form that does not operate, one or more of them may be enclosed to create the same surface form as the IC card.
  • the test card manufacturing method of the present invention is not particularly limited, but is preferably the same manufacturing method as the IC card in order to satisfy the relations of the general formulas (1) and (2).
  • the test card production apparatus is shown in FIG. 7 (a)
  • the IC card production apparatus is shown in FIG. 7 (b)
  • the sheet member is shown in FIG.
  • a specific method for producing a test card includes a method in which at least two of the sheet members are bonded together with an adhesive.
  • the heat bonding method, the adhesive bonding method and the injection molding method are known.
  • the first sheet member and the second sheet member may be subjected to format printing or information recording before and after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, It can also be formed by a printing method such as letterpress printing, an ink jet method, a sublimation heat transfer method, an electrophotographic method, a melt heat transfer method, or the like.
  • an IC card it can be formed by providing means for inserting a predetermined electronic component between the first sheet member and the second sheet member.
  • the IC card manufacturing method does not insert electronic parts into the force test card disclosed in Japanese Patent Laid-Open No. 2000-0336026, 2000-219855, 2000-211278, Japanese Patent Laid-Open No. 10-316959, 11-11964, etc. In this case, any method can be used without providing the insertion portion. [0047] Even when a non-operating part or the like is inserted, it is possible to manufacture using a similar manufacturing method and manufacturing apparatus.
  • a low-temperature adhesive to reduce thermal deformation of the sheet member, and when bonding, the card surface smoothness, adhesion between the first sheet member and the second sheet member
  • the heating is preferably 10 to 120 ° C, more preferably 30 to 100.
  • the caloric pressure is preferably 0.05 to 300 kgf / cm 2 force S, more preferably 0.05 to 100 kgf / cm 2 .
  • the caloric heat and the caloric pressure time are preferably 0.01 to 180 seconds, more preferably 0.01 to 120 seconds.
  • the sheet or long sheet roll bonded by the adhesive bonding method or the resin injection method is allowed to stand for a predetermined time in accordance with a predetermined curing time of the adhesive, and then records an authentication identification image and bibliographic items. After that, it may be formed into a predetermined card size. Examples of the method for forming a predetermined card size include a punching method and a cutting method.
  • the adhesive a light curable adhesive, a moisture curable adhesive, an elastic epoxy adhesive, or the like is used. In the present invention, it is preferable to use a moisture curable adhesive.
  • Moisture hard type materials as reactive hot melt adhesives are disclosed in JP-A-2000-36026, JP-A-2000-219855, JP-A-2000 211278, and JP-A-2002-175510.
  • Photocurable adhesives are disclosed in JP-A-10-316959 and JP-A-11-5964. Any of these adhesives may be used.
  • the thickness of the adhesive layer depends on the finishing force card, but is preferably 800 to 300 ⁇ m, more preferably f to 800 to 400 ⁇ , more preferably f to 700 to 400 ⁇ .
  • the thickness of the card for both the test card and the IC card is from 400 to 1200 111, more preferably from ⁇ to 500 to 1000 ⁇ m, and even more preferably from f to 500 to 950 ⁇ m.
  • At least one selected from authentication identification images such as face images and bibliographic information such as attribute information can be provided on the image receiving layers of the test card and the IC card.
  • Face image Usually, a full color image having gradation is produced by, for example, a sublimation type thermal transfer recording method, an inkjet method or the like.
  • the character information image such as bibliographic information is a binary image, and is preferably produced by, for example, a melt type thermal transfer recording method, a sublimation type thermal transfer recording method, an ink jet method or the like. More preferably, an authentication identification image such as a face image is recorded by a sublimation type thermal transfer recording method, and bibliographic information is recorded by a melting type thermal transfer recording method.
  • bibliographic information specifically refers to attribute information such as name, address, date of birth, and qualifications.
  • the heat diffusible dye-containing ink layer of the sublimation type thermal transfer recording ink sheet and the image receiving layer are overlapped to give imagewise thermal energy.
  • a thermal head is generally used, but other known devices such as a single laser beam, an infrared flash, and a thermal pen can be used.
  • heat treatment may be performed for the purpose of improving image storage stability.
  • the recording signal is
  • pressure Caro preferably ⁇ or 0. 25 ⁇ 0. 01kg / cm 2, more preferably ⁇ or from 0.25 to 0. Range of 02kg / cm 2, temperature 50 of the head 500. It is preferable to form an image containing gradation information at C, preferably 100 to 500 ° C., more preferably 100 to 400 ° C.
  • the heat-meltable ink layer and the image-receiving layer surface of the melt-type thermal transfer recording ink sheet are brought into close contact with each other, and a thermal pulse is applied by a thermal head to support the desired print or transfer pattern
  • the hot-melt ink layer to be transferred is locally heated for transfer.
  • a recording signal (corresponding to 0.3 to 0.01 kg / cm 2 , preferably f or 0.25 to 0.01 kg). / cm 2 , more preferably 0.25 to 0.02 kg / cm 2 and pressurizing at a head temperature of 50 to 500 ° C., preferably 100 to 500. C, formed at 100 to 400 ° C.
  • the power to do S preferred.
  • the bubble jet (registered trademark) method is used with a resolution of about 400 dpi.
  • face images it is possible to use multi-tones in the shear mode. it can.
  • the type of ink and the image forming method in which post-heating, post-exposure, etc. may be performed after writing character information, a face image, etc. by inkjet.
  • the optical change element layer can be provided by transfer, and a hologram is preferable.
  • the card supply unit 10 and the information recording unit 20 are arranged at an upper position of the ID card issuing device 601, and a transparent protective layer and / or an optical change element transfer layer applying unit / or a resin are arranged at a lower position.
  • the layer applying unit 70 is disposed, and thereafter, the transparent protective layer and the Z or optical change element transfer layer applying unit / or the resin layer applying unit 70 are further disposed.
  • a plurality of IC cards 600 that have been cut into a single sheet in advance are stocked with the face recording face up, and one by one from the card supply unit 10 to a predetermined timing. Automatically supplied.
  • a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged corresponding to each of them.
  • An image area that has a gradation such as a photograph of the face of the card user in a predetermined area of the image receiving layer while the IC card 600 is being conveyed by thermal transfer using a thermal transfer sheet such as a yellow ribbon, a magenta ribbon, or a cyan ribbon. Is recorded.
  • a character ribbon cassette 31 and a recording head 32 are arranged, and bibliographic information such as the name and card issue date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, thereby forming an image recording layer.
  • the transparent protective layer and / or the optical change element transfer layer applying unit / or the resin layer applying unit 70 includes a transfer foil cassette 71.
  • the heat roller 72 is arranged corresponding to the transfer foil cassette 71.
  • Optical change element transfer foil 43 and Z or transparent protective layer transfer foil 64, curable transfer foil 66 are transferred, and an optical change element layer and / or a transparent protective layer and a cured protective layer are provided.
  • an example of an apparatus in which two surface protective layers are provided is shown as one example in which there is no particular limitation on an ID card issuing apparatus that records bibliographic information and identification information on a card.
  • test cards 1 to 7 were used to make adjustments using the ID card issuing device shown in Fig. 9, and then the ID card was issued.
  • test card 1 was prepared by the following method.
  • a photocurable cushion layer having the following composition is formed on the heat-absorbing grade, and the first image-receiving layer-forming coating solution and the second image-receiving-layer-forming coating solution are applied and dried in this order.
  • the first sheet member was formed by laminating the layer 10.0 ⁇ 10. ⁇ , the first image receiving layer 2.5 ⁇ , and the second image receiving layer 0.5 / m.
  • a powerful actinic ray curable composition was applied, dried at 90 ° C / 30 sec, and then photocured with a mercury lamp (300 mj / cm 2 ).
  • Format printing (employee ID, name) was performed on the image receiving layer by the resin convex printing method to produce a first sheet member that had been formatted.
  • the printing ink used was UV ink, and the UV irradiation equivalent to 200mj was performed with a high-pressure mercury lamp, and the patterns shown in Table 1 were produced.
  • Polyester resin [Toyobo Co., Ltd .: Byron 200]
  • Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80]
  • Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 2 parts
  • the second sheet member was produced by performing the format printing with the pattern shown in Table 1 in the same manner as the image receiving layer side by the resin convex printing method.
  • test card 1 was manufactured using the test card manufacturing apparatus shown in Fig. 7 (a).
  • the test card manufacturing apparatus is provided with a long sheet-like second sheet member (back surface sheet) and a sheet-fed sheet-like first sheet member (front sheet), and the first sheet member
  • the moisture supply type hot melt adhesive MK2013 made by Sekisui Chemical Co., Ltd. was melted at 120 ° C under nitrogen from the adhesive supply section, and the adhesive was supplied from the adhesive supply section by the T-die coating method. Then, 180 ⁇ was applied to the first sheet member.
  • the second sheet member is similarly coated with an adhesive by a T-die coating method from the adhesive supply section.
  • the first sheet member and the second sheet member coated with the adhesive are bonded to each other by a heating / pressurizing roll (pressure 3 kg / cm 2 , roll surface temperature 65 ° C) to form a film.
  • An original plate controlled to 760 / m by a thickness control roll was prepared. It is preferable to cut to card size after the adhesive has been fully cured and closely attached to the support. After the 14-day curing was accelerated in a 23 ° C / 55% RH environment, A test card 1 having a size of 55 mm X 85 mm and a thickness of 760 zm was obtained using the card punching machine shown in FIG.
  • the value of general formula (1) was 1.0
  • the value of general formula (2) was 5.0.
  • FIG. 10 The card punching machine shown in FIG. 10 is composed of a punching die device, FIG. 10 (a) is a schematic perspective view of the entire punching die device, and FIG. 10 (b) is a punching die device. It is front sectional drawing of the principal part of a die-die apparatus.
  • This punching die apparatus has an upper die set 110 and a lower die set 120.
  • the upper die set 110 includes a punching die.
  • the upper die set 110 includes a punching punch 111 provided with a relief 141 inside the extension.
  • the lower die set 120 includes a punching die 121.
  • Test card 2 was prepared in the same manner as test card 1 except that.
  • the value of general formula (1) was 0.79
  • the value of general formula (2) was 8.0.
  • Test card 3 was prepared in the same manner as test card 1 except that.
  • the value of general formula (1) was 1 ⁇ 25, and the value of general formula (2) was ⁇ 18 ⁇ 0.
  • Test card 3 was prepared in the same way as test card 1 except that the thickness control roll was set to 1000 ⁇ m and the test card was 860 ⁇ m thick.
  • the value of general formula (1) was 1. 13 and the value of general formula (2) was ⁇ 87 ⁇ 0.
  • the base material constituting the first sheet member and the second sheet member was changed to U2L98W (100 am) made by Teijin DuPont Film Co., Ltd., and 280 ⁇ m of adhesive was applied to the first sheet member.
  • the value of general formula (1) was 1.0
  • the value of general formula (2) was 0.0.
  • Test card 6 was produced in the same manner except that the third writing layer of the second sheet member was not formed in the production of test card 1.
  • the value of general formula (1) is 1.0
  • the value of general formula (2) is 4 It was 0.
  • the base material constituting the first sheet member and the second sheet member was changed to U2L98W (100 am) made by Teijin DuPont Film Co., Ltd., and the photocurable cushion layer of the first sheet member, the second Without forming the image receiving layer and the third writing layer of the second sheet member, apply 190 zm of adhesive to the first sheet member, and apply 180 xm of adhesive to the second sheet member.
  • Test card 7 was made in the same way as test card 1, except that the thickness of the control roll was set to 760 am and the test card was 760 ⁇ m thick.
  • the value of general formula (1) was 1.0
  • the value of general formula (2) was -3.0.
  • an IC card was manufactured by the following manufacturing method.
  • FIG. 8 shows the external appearance of the first sheet member (FIG. 8 (a)) and the second sheet member (FIG. 8 (b)).
  • the IC card manufacturing apparatus shown in FIG. 7 (b) is provided with a long sheet-like second sheet member (back sheet) and a single-wafer sheet-like first sheet member (front sheet).
  • Moisture-curing type hot melt adhesive M K2013 made by Sekisui Chemical Co., Ltd. from the adhesive supply section to the first sheet material was melted under nitrogen at 120 ° C and supplied by T-die coating method.
  • the IC module shown in Fig. 6 (a) which is an IC / fixing member with a thickness of 300 ⁇ m, is placed on the coating part from the IC / fixing member supply part. In the same manner, the adhesive was supplied to the second sheet member from the adhesive supply section by the T-die coating method.
  • the first sheet member and the second sheet member coated with the adhesive are bonded to each other by a heating / pressurizing roll (pressure 3 kg / cm 2 , roll surface temperature 65 ° C) to form a film.
  • An IC card master controlled to 760 zm by a thickness control roll is prepared.
  • IC An IC card of 55 mm X 85 mm size and 760 m thickness was obtained by using the force punching machine shown in Fig. 10. surface The uneven life was 5 ⁇ .
  • thermal transfer ink sheet was used, and bibliographic information and identification information were recorded with an ID card issuing device.
  • the thermal transfer ink sheet was installed in the information recording section 20 of the IC card issuing device shown in FIG.
  • a 6 ⁇ m-thick polyethylene terephthalate sheet with anti-fusing processing on the back side was coated with a yellow ink layer forming coating solution, a magenta ink layer forming coating solution, and a cyan ink layer forming coating solution having the following composition.
  • a yellow ink layer forming coating solution was set to 1 ⁇ m, and yellow, magenta, and cyan ink sheets were obtained.
  • a person image with gradation was formed on the image by heating under the above conditions.
  • a 6 ⁇ m thick polyethylene terephthalate sheet with anti-fusing processing on the back side was coated with an ink layer forming coating solution having the following composition to a thickness of 2 ⁇ m and dried to obtain an ink sheet.
  • Phenolic resin [Ara J11 Chemical Industries, Ltd .: Tamanol 52 1] 5 parts 90 parts of methyl ethyl ketone
  • the surface protective transfer foils 1 to 3 were installed in the transparent protective layer and / or the optical change element transfer layer applying part / or the resin layer applying part 70 of FIG.
  • a transparent resin transfer foil 1 was formed by coating and drying the following prescription with a wire bar coating on one side of Daifoil Hequist Co., Ltd. polyethylene terephthalate (S — 25). ⁇ Releasing layer (film thickness 0.5 z m) forming coating solution>
  • Acrylic resin (Mitsubishi Rayon Co., Ltd., Dianal BR-87) 5 parts
  • Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]
  • the curing agent was cured at 50 ° C. for 24 hours.
  • the release layer was dried at 90 ° C / 30 sec after coating.
  • the actinic ray curable layer composition after coating was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mj / cm 2 ).
  • Resin 1 was synthesized by the following method.
  • Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]
  • the curing agent was cured at 50 ° C. for 24 hours.
  • the actinic ray curable transfer foil 2 prepared above was calorically heated to a surface temperature of 200 ° C., using a heat roller having a diameter of 5 cm and a rubber hardness of 85 at a pressure of 150 kg / cm 2 . Transfer was performed by heating for 2 seconds.
  • Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane]
  • Fig. 13 shows the surface of the test card produced by the card issuing device
  • Fig. 14 shows the surface of the IC card produced by the card issuing device.
  • Ten card issuers adjusted each card issuing device with a test card and made an ID card. At that time, how many people wrongly issued a test card was counted and evaluated.
  • Example 10 there was no identification mark on the surface recording layer for identification.
  • Example 11 there was an identification mark, but the card surface printed on the back of the test card was not confirmed. An error was issued.
  • Comparative Examples 2 and 3 the IC card had no identification mark, so an error was issued.
  • the ID card issuing device when issuing an ID card in the ID card issuing device, it is possible to adjust at least the transportability and printability of the ID force issuing device in advance with a sufficient amount of test cards, which is inexpensive and highly accurate. Adjustment is possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une méthode de fabrication de carte d’identité employant une carte CI capable de prérégler un dispositif d’établissement de cartes d’identité utilisant une carte CI, pour un coût raisonnable et dont les réglages sont reproductibles. L'invention concerne également une carte de test. La méthode de fabrication de carte d’identité utilise une carte CI (600) qui maintient par de l’adhésif une partie électronique possédant une puce de CI et une antenne entre un premier élément feuille et un deuxième élément feuille. Une carte d’identité (602) est fabriquée par un dispositif d’établissement de cartes d’identité (601) exécutant une étape de transmission et une étape d’impression. Les caractéristiques de transmission et/ou les caractéristiques d’impression sont évaluées au moyen d’une carte de test (610) permettant le préréglage du dispositif d’établissement de cartes d’identité. La carte de test est, de préférence, conçue de façon à ce que premier élément feuille soit fixé par adhésif au deuxième élément feuille, que la partie électronique ne soit par maintenue et qu’une couche d’enregistrement de surface d’identification soit présente.
PCT/JP2005/020534 2004-11-17 2005-11-09 Méthode de fabrication de carte d’identité et carte de test utilisée par celle-ci WO2006054468A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006544917A JPWO2006054468A1 (ja) 2004-11-17 2005-11-09 Idカードの作製方法及びそれに用いるテストカード

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-333463 2004-11-17
JP2004333463 2004-11-17

Publications (1)

Publication Number Publication Date
WO2006054468A1 true WO2006054468A1 (fr) 2006-05-26

Family

ID=36407011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/020534 WO2006054468A1 (fr) 2004-11-17 2005-11-09 Méthode de fabrication de carte d’identité et carte de test utilisée par celle-ci

Country Status (2)

Country Link
JP (1) JPWO2006054468A1 (fr)
WO (1) WO2006054468A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3095428U (ja) * 2003-01-23 2003-07-31 ティーディーケイ株式会社 テスト印刷用紙
JP2003317065A (ja) * 2002-04-23 2003-11-07 Konica Minolta Holdings Inc Icカードの作成方法及びicカード

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6067963A (ja) * 1983-09-24 1985-04-18 Casio Comput Co Ltd 画像形成装置
JPH0744662Y2 (ja) * 1990-01-19 1995-10-11 日本碍子株式会社 建築用パネルの取付構造
JPH11296631A (ja) * 1998-04-14 1999-10-29 Konica Corp Icカード収納カートリッジ及びプリンタ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003317065A (ja) * 2002-04-23 2003-11-07 Konica Minolta Holdings Inc Icカードの作成方法及びicカード
JP3095428U (ja) * 2003-01-23 2003-07-31 ティーディーケイ株式会社 テスト印刷用紙

Also Published As

Publication number Publication date
JPWO2006054468A1 (ja) 2008-05-29

Similar Documents

Publication Publication Date Title
JP4062728B2 (ja) Icカード
JP2004021814A (ja) Icカードの作成方法及びicカード
US6986467B2 (en) IC card
JP2004094492A (ja) Icカード
JP2007226736A (ja) Icカード及びicカード製造方法
JP2005031721A (ja) Icカード及びicカードの製造方法
JP2004213253A (ja) Icカード、icカード製造方法及びicカード製造装置並びにicカード判定システム
JP2007066048A (ja) Icカード
JP2004213259A (ja) Icカード、icカード製造方法及びicカード製造装置並びにicカード判定システム
WO2006054468A1 (fr) Méthode de fabrication de carte d’identité et carte de test utilisée par celle-ci
JP2006178566A (ja) Icカード作製方法、icカード作製装置及びicカード
JP2007047937A (ja) Icカード及びicカード製造方法
JP2006178549A (ja) Icカード作製方法、icカード作製装置及びicカード
JP4263006B2 (ja) Icカードの製造方法及びicカードの製造装置
JP2006015498A (ja) 転写箔及びidカード並びにidカードの製造方法
JP2016071608A (ja) カード及びカード製造方法
JP2005313502A (ja) Icカード及びその作成方法
JP2005339462A (ja) Icカード及びicカードの製造方法
JP2005182430A (ja) Icカードの製造方法及びicカード
JP2008158621A (ja) Ed表示機能付きicカード及びその製造方法
JP2007011441A (ja) Icカード
JP2005332248A (ja) Icカード製造方法及びicカード
JP2007007901A (ja) カード
WO2005104026A1 (fr) Carte à circuit intégré et procédé pour la fabrication de celui-ci
JP2006139533A (ja) Icカード及びicカード製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006544917

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 05805921

Country of ref document: EP

Kind code of ref document: A1