WO2006046796A1 - Soupape de systeme d'echappement de gaz - Google Patents
Soupape de systeme d'echappement de gaz Download PDFInfo
- Publication number
- WO2006046796A1 WO2006046796A1 PCT/KR2005/001035 KR2005001035W WO2006046796A1 WO 2006046796 A1 WO2006046796 A1 WO 2006046796A1 KR 2005001035 W KR2005001035 W KR 2005001035W WO 2006046796 A1 WO2006046796 A1 WO 2006046796A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flow passage
- valve
- slide tube
- gate plate
- main flow
- Prior art date
Links
- 239000007789 gas Substances 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 239000012530 fluid Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 10
- 230000008021 deposition Effects 0.000 abstract description 9
- 239000002103 nanocoating Substances 0.000 abstract description 8
- 230000007257 malfunction Effects 0.000 abstract description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/02—Stopping, starting, unloading or idling control
- F04B49/022—Stopping, starting, unloading or idling control by means of pressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/02—Stopping, starting, unloading or idling control
- F04B49/03—Stopping, starting, unloading or idling control by means of valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
- F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
- F16K11/06—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements
- F16K11/072—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with pivoted closure members
- F16K11/074—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with pivoted closure members with flat sealing faces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/0263—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor using particular material or covering means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/04—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members
- F16K3/10—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with pivoted closure members with special arrangements for separating the sealing faces or for pressing them together
Definitions
- the present invention relates to a valve of a gas exhaust system, and more par ⁇ ticularly, to a valve which is mounted to a harmful-gas exhausting system used for semiconductor and LCD fabricating processes.
- gate valves 4 and three-way valves 5 are mounted on a gas exhaust line 2 for exhausting harmful gases generated in fabricating processes for semiconductors and LCDs and on a vacuum line 3 for evacuating air from a semi ⁇ conductor or LCD fabricating space 1, respectively.
- a gas exhaust line 2 for exhausting harmful gases generated in fabricating processes for semiconductors and LCDs
- a vacuum line 3 for evacuating air from a semi ⁇ conductor or LCD fabricating space 1, respectively.
- SIO2, SI3N4 or W powder generated during the process frequently clogs the vacuum line 3, the gas exhaust line 2 and a scrubber 6. Disclosure of Invention Technical Problem
- the unsealed structure causes generation of environmental pollution sources and repair and maintenance costs, and waste of manpower and time.
- An object of the invention is to provide a valve of a gas exhaust system, which can avoid leakage of harmful gases and malfunction of the system by preventing a sealing portion for maintaining airtightness at a valve seat from being exposed to the harmful gases upon operation of the valve so as to avoid deposition of powder of the harmful gases, and can prevent a flow passage from being narrowed due to deposition of the powder of the harmful gases by means of nano-coating on an inner wall of the flow passage.
- a valve of a gas exhaust system comprising a valve body having at least one main flow passage; a slide tube that is slidably provided at the main flow passage of the valve body and has a discharge flow passage communicating with the main flow passage; a gate plate provided at the main flow passage of the valve body to be movable in a direction traversing the slide tube so as to open or close an end of the discharge flow passage of the slide tube; and an actuator for moving the gate plate in a state where a leading end of the slide tube is ascend from the gate plate is moved.
- valve of the present invention it is possible to avoid leakage of harmful gases and malfunction of the system by preventing a sealing portion for maintaining airtightness at the valve seat from being exposed to the harmful gases upon operation of the valve so as to avoid deposition of powder of the harmful gases, and to prevent the flow passage from being narrowed due to deposition of the powder of the harmful gases by means of nano-coating on an inner wall of the flow passage.
- FIG. 1 is a view showing the configuration of a gas exhaust system
- FIG. 2 is a sectional view showing a valve of a gas exhaust system according to an embodiment of the present invention
- FIG. 3 is a cross-sectional view showing the valve of the present invention.
- FIGs. 4 to 7 are sectional views showing operation states of the valve according to the embodiment of the present invention.
- FIGs. 8 and 9 are photographs showing the valve of the present invention.
- FIG. 10 is a schematic sectional view showing a nano-coated surface of the valve of the present invention.
- a valve body 10 has a main flow passage 11 in communication with a gas exhaust line or a vacuum line.
- Valve seats 12 are formed on two main flow passage 11a and l ib, respectively.
- Slide grooves 13 are concavely formed in sidewalls of two main flow passage 11a and l ib, respectively.
- Slide tubes 20 are slidably inserted into the slide grooves 13.
- Each of the slide tubes 20 has a discharge flow passage 21 communicating with the main flow passage 11.
- a piston 30 is circumferentially provided on an outer periphery of each of the slide tubes 20.
- a piston-receiving groove 14 is concavely formed in a sidewall of the slide groove 13.
- Fluid ports 15 are formed at the piston-receiving groove 14 so that a fluid for moving the piston 30 can flow in or out therethrough.
- the piston 30 is forcibly moved in a direction opposite to the fluid that flows in through one of the fluid ports 15 so that the slide tube 20 moves toward or away from the valve seat 12.
- Each of the fluid ports 15 is provided at one of both sides with respect to the center of the piston 30 so that the piston 30 is pushed by the fluid that flows in therethrough.
- a hydraulic mechanism 60 (referring to Fig. 8 and Fig. 9) for causing a fluid to flow through the fluid ports 15 is provided outside the valve body 10.
- the piston 30 is slid by means of hydraulic pressure. However, it is also possible to move the piston 30 using an electromagnetic force by installing an electromagnet in a sidewall of the piston-receiving groove 14 and making the piston 30 out of metal.
- One end of the slide tube 20 is seated on the valve seat 12, and an O-ring 12a is provided on the valve seat 12 to maintain airtightness when the slide tube 20 is seated on the valve seat 12, and also prevents damage due to contact of the slide tube 20 with the valve seat 12.
- a gate plate 40 is provided on (two main flow passage l la and 1 Ib) of the valve body 10 to be swing rotated in a direction traversing the slide tube 20.
- An actuator 50 for swing the gate plate 40 is mounted on the valve body 10.
- the actuator 50 is positioned between the two slide tubes 20.
- the actuator 50 rotates a rotary shaft 41 about an axis to turn the gate plate 40 so that the gate plate is positioned below any one of the slide tubes 20.
- the actuator 50 operates the gate plate 40 in a state where a low end of the slide tube 20 is ascend from the same plane as a plane on which the gate plate 40 is rotated.
- the gate plate 40 can be positioned between the slide tube 20 and the valve seat 12 by the operation of the actuator 50 in a state that the slide tube 20 is elevated from the valve seat 12.
- the gate plate 40 is mounted on the valve body 10 to be swing rotated by the rotary shaft 41, thereby opening or closing one end of the discharge flow passage 21 of the slide tube 20.
- a sealing member 42 is slidably provided at a side on the top of the gate plate to be in close contact with the low end of the slide tube 20 and maintain air- tightness.
- the sealing member 42 is provided on the top of the gate plate 40 to be slidable in the same direction as a direction in which the slide tube 20 is slid.
- the sealing member 42 is slid such that its lower end can be exposed below the gate plate 40, and also returns to its original position by means of an elastic mechanism (not shown).
- the sealing member 42 is formed to have the same shape as the leading end of the slide tube 20.
- the gate plate 40 is positioned above one of the valve seats 12 and thus is not turned on the same plane as the valve seat 12. Therefore, the gate plate does not come into frictional contact with the valve seat 12.
- the rotary shaft 41 or the gate plate 40 is preferably moved together with the slide tube 20 upon contact thereof with the slide tube 20 in the same direction as the direction in which the slide tube 20 descends, and then seated on the valve seat 12.
- the gate plate 40 can be moved by means of the turning operation of the rotary shaft 41, it is also possible to cause the gate plate 40 to linearly reciprocate so as to selectively open and close one of the two slide tubes 20.
- the gate plate 40 in a where there is a single main flow passage 11 and a single slide tube 20, it may be preferred that the gate plate 40 be slidably operated.
- the inner wall of the main flow passage 11 of the valve body 10 and the surfaces of the slide tubes 20 are nano-coated with nickel, fluorine, phosphorus, boron, lactic acid and tungsten.
- valve body 10 and the slide tube 20 are coated on a nano scale by means of electroless plating.
- a base material for the valve member 10 and the slide tubes 20 is stainless steel, aluminum, alumina, iron or the like.
- the nano-coating material comprises 60 to 65 parts by weight of nickel, 30 to 35 parts by weight of fluorine, 1 to 2 parts by weight of phosphorus, 1 to 2 parts by weight of boron, and 5 to 7 parts by weight of lactic acid.
- the nano-coating material comprises 62 parts by weight of nickel, 30 parts by weight of fluorine, 1 part by weight of phosphorus, 1 part by weight of boron and 6 parts by weight of tungsten.
- Fig. 10 shows that F, Ni, P, W and B are dispersed in the inner wall of the nano-coated main flow passage 11 and the inner walls of the nano-coated slide tubes 20.
- the nano-coating on the surfaces of the inner walls of the main flow passage 11 and the slide tubes 20 has a thickness of about 20 mm, thermal resistance at a temperature of about 480 0 C or higher, corrosion resistance, waterproofness and high hardness. Further, the nano-coating can minimize deposition of particles of the fluid thereon, thereby preventing the flow passages from being clogged.
- the valve of the present invention has advantages in that leakage of harmful gases and malfunction of a gas exhaust system can be avoided by preventing the sealing portion for maintaining airtightness at the valve seat from being exposed to the harmful gases upon operation of the valve so as to avoid deposition of powder of the harmful gases, and a flow passage can be prevented from being narrowed due to deposition of the powder of the harmful gases by means of nano-coating on the inner wall of the flow passage.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sliding Valves (AREA)
- Details Of Valves (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-0086954 | 2004-10-29 | ||
KR1020040086954A KR100503753B1 (ko) | 2004-10-29 | 2004-10-29 | 가스배출시스템의 개폐밸브 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006046796A1 true WO2006046796A1 (fr) | 2006-05-04 |
Family
ID=36228014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2005/001035 WO2006046796A1 (fr) | 2004-10-29 | 2005-04-11 | Soupape de systeme d'echappement de gaz |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100503753B1 (fr) |
WO (1) | WO2006046796A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008020715A1 (fr) * | 2006-08-16 | 2008-02-21 | Jong-Ha Park | Économiseur de gaz utilisé dans la fabrication de semi-conducteurs |
JP2016048097A (ja) * | 2014-08-28 | 2016-04-07 | 株式会社不二工機 | 流路切換弁 |
CN110762246A (zh) * | 2019-10-26 | 2020-02-07 | 五洲阀门股份有限公司 | 一种平板式高耐磨多路分配阀 |
ES2746360A1 (es) * | 2018-09-05 | 2020-03-05 | Mecanizados Esferimec S L | Valvula pivotante para regular el flujo de un fluido y procedimiento para regular el flujo de un fluido |
WO2021067346A1 (fr) * | 2019-10-03 | 2021-04-08 | Oceaneering International, Inc | Soupape d'isolement pour régulation d'écoulement de fluide |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101713549B1 (ko) * | 2015-10-27 | 2017-03-08 | 주식회사 앤아이윈 | 유-무기공정 반도체 제조시 발생가스의 희석 및 댐퍼의 세척이 동시에 가능한 배출가스 정밀압력제어용 투-웨이 슬라이드 오토 댐퍼의 제어장치 |
KR102587459B1 (ko) * | 2021-04-16 | 2023-10-11 | 주식회사 에스와이티 | 원격 플라즈마 소스 분리 밸브 및 이를 이용한 플라즈마 소스 또는 프로세스 가스 공급 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990005048U (ko) * | 1997-07-11 | 1999-02-05 | 고영복 | 가스 밸브용 액츄에이터 |
US6192922B1 (en) * | 1999-06-01 | 2001-02-27 | Synetics Solutions Inc. | Airflow control valve for a clean room |
US6719272B1 (en) * | 1999-06-02 | 2004-04-13 | Tokyo Electron Limited | Valve and vacuum processing device with the valve |
KR20040048443A (ko) * | 2002-12-03 | 2004-06-10 | 삼성전자주식회사 | 반도체소자 제조설비의 배기 시스템 및 그 방법 |
-
2004
- 2004-10-29 KR KR1020040086954A patent/KR100503753B1/ko not_active IP Right Cessation
-
2005
- 2005-04-11 WO PCT/KR2005/001035 patent/WO2006046796A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990005048U (ko) * | 1997-07-11 | 1999-02-05 | 고영복 | 가스 밸브용 액츄에이터 |
US6192922B1 (en) * | 1999-06-01 | 2001-02-27 | Synetics Solutions Inc. | Airflow control valve for a clean room |
US6719272B1 (en) * | 1999-06-02 | 2004-04-13 | Tokyo Electron Limited | Valve and vacuum processing device with the valve |
KR20040048443A (ko) * | 2002-12-03 | 2004-06-10 | 삼성전자주식회사 | 반도체소자 제조설비의 배기 시스템 및 그 방법 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008020715A1 (fr) * | 2006-08-16 | 2008-02-21 | Jong-Ha Park | Économiseur de gaz utilisé dans la fabrication de semi-conducteurs |
JP2016048097A (ja) * | 2014-08-28 | 2016-04-07 | 株式会社不二工機 | 流路切換弁 |
ES2746360A1 (es) * | 2018-09-05 | 2020-03-05 | Mecanizados Esferimec S L | Valvula pivotante para regular el flujo de un fluido y procedimiento para regular el flujo de un fluido |
WO2020049204A1 (fr) * | 2018-09-05 | 2020-03-12 | Mecanizados Esferimec, S.L. | Vanne pivotante pour réguler l'écoulement d'un fluide et procédé pour réguler l'écoulement d'un fluide |
US11408518B2 (en) | 2018-09-05 | 2022-08-09 | Mecanizados Esferimec, S.L. | Pivoting valve for regulating the flow of a fluid and procedure for regulating the flow of a fluid |
WO2021067346A1 (fr) * | 2019-10-03 | 2021-04-08 | Oceaneering International, Inc | Soupape d'isolement pour régulation d'écoulement de fluide |
CN110762246A (zh) * | 2019-10-26 | 2020-02-07 | 五洲阀门股份有限公司 | 一种平板式高耐磨多路分配阀 |
CN110762246B (zh) * | 2019-10-26 | 2021-06-11 | 五洲阀门股份有限公司 | 一种平板式高耐磨多路分配阀 |
Also Published As
Publication number | Publication date |
---|---|
KR100503753B1 (ko) | 2005-07-26 |
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