WO2006043631A1

WO2006043631A1 - Anisotropic conductive connector for inspecting wafer, manufacturing method thereof, waver inspection probe card, manufacturing method thereof, and wafer inspection device

Info

Publication number: WO2006043631A1
Application number: PCT/JP2005/019309
Authority: WO
Inventors: Kiyoshi Kimura; Fujio Hara; Daisuke Yamada; Sugiro Shimoda
Original assignee: Jsr Corporation
Priority date: 2004-10-22
Filing date: 2005-10-20
Publication date: 2006-04-27
Also published as: TW200625725A

Abstract

There is disclosed an anisotropic conductive connector capable of surely achieving a preferable electric connection state even when electrodes to be inspected on a wafer have an extremely small pitch. There are also disclosed a manufacturing method of the anisotropic conductive connector, a probe card, a manufacturing method thereof, and a wafer inspection device. The anisotropic conductive connector manufacturing method includes: a step for arranging contact members formed by magnetic metal and arranged on the surface of conductive elastomer material layer formed on a detachable support plate; a step for applying a magnetic field to the conductive elastomer material layer in its thickness direction; a step for performing a hardening process to form a conductive elastomer layer; a step of machining the conductive elastomer layer by using laser; a step or removing portions other than the portion where the contact members are arranged, thereby forming connection conductive parts having the contact members; a step for introducing each of the connection conductive parts into the insulation part material layer formed so as to close the opening of the frame plate; and a step for hardening the insulation part material layer so as to form an insulation part.

Description

Specification

Anisotropic conductive connector for wafer inspection and manufacturing method thereof, probe card for wafer inspection and manufacturing method thereof, and wafer inspection apparatus

Technical field

The present invention relates to an anisotropic conductive connector for wafer inspection used for performing electrical inspection of a plurality of integrated circuits formed on a wafer in a wafer state, a method for manufacturing the same, and a probe card for wafer inspection The present invention relates to a manufacturing method and a wafer inspection apparatus. Background art

In general, in the manufacturing process of a semiconductor integrated circuit device, a large number of integrated circuits are formed on a wafer made of, for example, silicon, and then basic electrical characteristics of each of these integrated circuits are inspected. Thus, a probe test for selecting defective integrated circuits is performed. Next, the semiconductor chip is formed by cutting the wafer, and the semiconductor chip is housed in an appropriate package and sealed. Further, each packaged semiconductor integrated circuit device is subjected to a burn-in test for selecting a semiconductor integrated circuit device having a potential defect by examining electrical characteristics in a high temperature environment.

In such an electrical inspection of an integrated circuit such as a probe test or a burn-in test, a probe card is used to electrically connect each of the electrodes to be inspected in the inspection object to a tester. As such a probe card, an inspection circuit board in which an inspection electrode is formed according to a pattern corresponding to the pattern of the test electrode, an anisotropic conductive elastomer sheet disposed on the inspection circuit board, and It is known that a sheet-like probe is disposed on the anisotropically conductive elastomer sheet.

[0003] Conventionally, anisotropic conductive elastomer sheets in a powerful probe card are known in various structures. For example, Patent Document 1 discloses that metal particles are uniformly dispersed in an elastomer. An anisotropic conductive elastomer sheet (hereinafter referred to as a “dispersed anisotropic conductive elastomer sheet”) is disclosed, and Patent Document 2 and others disclose a conductive magnetic sheet. An anisotropic conductive elastomer sheet (hereinafter referred to as this) in which a large number of conductive parts extending in the thickness direction and insulating parts that insulate them from each other are formed by non-uniform distribution of the particles in the elastomer. Is referred to as “the unevenly distributed anisotropic conductive elastomer sheet”).

Furthermore, Patent Document 3 and the like disclose an unevenly distributed anisotropic conductive elastomer sheet in which a step is formed between the surface of the conductive portion and the insulating portion.

Among these anisotropically conductive elastomer sheets, the unevenly distributed anisotropically conductive elastomer sheet has a conductive portion formed according to a pattern corresponding to the pattern of the electrode to be inspected of the integrated circuit to be inspected. More reliable electrical connection between electrodes compared to distributed anisotropic conductive elastomer sheet, even for integrated circuits where the arrangement pitch of the electrodes to be inspected, that is, the distance between the centers of adjacent electrodes to be inspected is small Is advantageous in that it can be achieved with Therefore, an unevenly distributed anisotropic conductive elastomer sheet is used in a probe test or burn-in test of a semiconductor integrated circuit device in which the pitch of electrodes to be inspected is small.

[0004] Thus, in a probe test performed on an integrated circuit formed on a wafer, conventionally, a wafer is placed in a plurality of areas in which, for example, 16 or 32 integrated circuits are formed. A method is adopted in which a probe test is performed on all integrated circuits formed in this area at once, and a probe test is sequentially performed on integrated circuits formed in other areas. In recent years, in order to improve the inspection efficiency and reduce the inspection cost, for example, 64 or 124 of all the integrated circuits formed on the wafer, or all of the integrated circuits are collectively subjected to the probe test. It is requested to do.

On the other hand, in the burn-in test, the integrated circuit device to be inspected is very small and inconvenient to handle, so in order to perform electrical inspection of many integrated circuit devices individually, It takes a long time, which makes the inspection costs considerably higher. For this reason, a WLBI (Wafer Lebel Burn-in) test has been proposed in which a burn-in test of a large number of integrated circuits formed on a wafer is performed in a wafer state.

[0005] While the force is applied, the Ueno to be inspected is, for example, a large one having a diameter of 8 inches or more. When the number of electrodes to be inspected is, for example, 5000 or more, particularly 10000 or more, the pitch of the electrodes to be inspected in each integrated circuit is extremely small. When the anisotropically conductive elastomer sheet is used, there are the following problems.

(1) In order to inspect a wafer with a diameter of, for example, 8 inches (about 20 cm), it is necessary to use an unevenly distributed anisotropically conductive elastomer sheet having a diameter of about 8 inches. However, such an unevenly distributed anisotropic conductive elastomer sheet has a considerably large overall area, but each conductive part is fine and the conductive part occupying the surface of the unevenly distributed anisotropic conductive elastomer sheet. Since the surface area ratio is small, it is extremely difficult to reliably manufacture the unevenly anisotropic anisotropic conductive elastomer sheet. Therefore, in the production of the anisotropic conductive elastomer sheet, the yield is drastically reduced, resulting in an increase in the production cost of the anisotropic conductive elastomer sheet, which in turn increases the inspection cost.

(2) In the electrical connection work between the unevenly distributed anisotropic conductive elastomer sheet and the circuit board for inspection and the wafer to be inspected, it must be held and fixed with a specific positional relationship to them. is required. However, anisotropically conductive elastomer sheets are flexible and easily deformable and have low handling properties. Therefore, when an electrical connection is made to an inspection target electrode of a wafer to be inspected. In addition, it is extremely difficult to align and hold and fix the unevenly distributed anisotropic conductive elastomer sheet.

(3) the linear thermal expansion coefficient of the material for example silicon constituting the wafer 3. is about 3 X 10- ⁶ ZK, whereas linear thermal expansion coefficient of the material such as silicone rubber constituting the anisotropically conductive elastomer one sheet 2. is about 2 Χ 10- ⁴ ΖΚ. Thus, for example, at 25 ° C, if each wafer and anisotropic conductive elastomer sheet with a diameter of 20cm are heated from 20 ° C to 120 ° C, the change in wafer diameter is theoretically Although it is only 0066 cm, the change in diameter of the anisotropically conductive elastomer sheet reaches 0.44 cm. in this way

Because the coefficient of thermal expansion differs greatly between the material constituting the integrated circuit device to be inspected (for example, silicon) and the material constituting the unevenly anisotropic conductive elastomer sheet (for example, silicone rubber), the burn-in test Even if the required alignment and holding / fixing of the wafer and the unevenly distributed anisotropic conductive elastomer sheet is realized. When a thermal history due to temperature changes is received, the electrical connection state changes as a result of displacement between the conductive part of the unevenly distributed anisotropically conductive elastomer sheet and the inspected electrode of the wafer. Is difficult to maintain.

[0006] In order to solve the above problem, a frame plate in which a plurality of openings are formed corresponding to an electrode region in which an inspection target electrode of an integrated circuit in a wafer to be inspected is formed, and the frame plate An anisotropic conductive connector composed of a plurality of elastic anisotropic conductive films arranged so as to close each of the openings, and the anisotropic conductive connector and a sheet-like probe arranged on the anisotropic conductive connector. Proposed probe cards have been proposed (for example, see Patent Document 4). According to such an anisotropic conductive connector, the following effects can be obtained.

(1) Each of the openings formed in the frame plate has a size corresponding to the electrode region of the integrated circuit in the wafer to be inspected. Therefore, the anisotropic anisotropic conductive film disposed in each of the openings is Since a small size is sufficient, it is easy to form individual elastic anisotropic conductive films.

(2) Since each of the elastic anisotropic conductive films is supported by the frame plate, it can be easily handled by being deformed, and it can be integrated by forming positioning marks (for example, holes) in the frame plate in advance. In the electrical connection work of the circuit device, it is possible to easily align and hold and fix the integrated circuit device.

(3) Since the elastic anisotropic conductive film with a small size has a small absolute amount of thermal expansion even when it receives a thermal history, the thermal expansion of the elastic anisotropic conductive film is regulated by the frame plate, and the anisotropic conductive film The thermal expansion of the entire connector depends on the thermal expansion of the material that makes up the frame plate, so if you use a material with a low coefficient of thermal expansion as the material that makes up the frame plate, In addition, as a result of preventing the displacement between the conductive portion of the anisotropic conductive connector and the electrode to be inspected on the wafer, a favorable electrical connection state is stably maintained.

[0007] Such an anisotropic conductive connector 1 is manufactured as follows.

A mold for forming an elastic anisotropic conductive film comprising an upper mold 80 and a lower mold 85 as a pair as shown in FIG. 54 is prepared. Each of the upper mold 80 and the lower mold 85 in this mold has a substrate 81 , 86, a plurality of ferromagnetic layers 82, 87 arranged according to a pattern corresponding to the pattern of the conductive portion of the anisotropic conductive elastomer sheet to be formed, and these ferromagnetic layers 82, 87 Nonmagnetic material layers 83 and 88 are provided at locations other than the formed location, and the ferromagnetic material layers 82 and 87 and the nonmagnetic material layers 83 and 88 form a molding surface. The upper mold 80 and the lower mold 85 are arranged so that the corresponding ferromagnetic layers 82 and 87 face each other.

In such a mold, as shown in FIG. 55, a frame plate 90 in which an opening 91 is formed corresponding to the electrode region in the wafer to be inspected is aligned and disposed, and is elasticized by a hardening process. A molding material layer 95 なる formed by dispersing conductive particles 磁性 exhibiting magnetism in a polymer material forming material to be a polymer material is formed so as to close each opening 91 of the frame plate 90. Here, the conductive particles contained in the molding material layer 95 are dispersed in the molding material layer 95.

[0008] Then, for example, a pair of electromagnets are arranged on the upper surface of the upper die 80 and the lower surface of the lower die 85 to operate them, whereby the ferromagnetic material layer 82 of the upper die 80 is formed on the molding material layer 95Α. And the corresponding lower portion 85 of the ferromagnetic layer 87 of the lower mold 85, that is, the portion that becomes the conductive portion, a magnetic field that is larger and stronger than the other portions is applied in the thickness direction of the molding material layer 95 95. The As a result, the conductive particles P dispersed in the molding material layer 95A are, as shown in FIG. 56, the portion of the molding material layer 95A to which a strong magnetic field is applied, that is, the strength of the upper mold 80. They are gathered at a portion between the magnetic layer 82 and the corresponding ferromagnetic layer 87 of the lower mold 85, and are further aligned in the thickness direction. In this state, the molding material layer 95A is subjected to a curing process, whereby the plurality of conductive portions 96 contained in a state in which the conductive particles P are aligned in the thickness direction are mutually connected. An elastic anisotropic conductive film 95 composed of an insulating part 97 and an insulating part 97 are formed in a state where the peripheral part is supported by the opening edge part of the frame plate 90, whereby an anisotropic conductive connector is manufactured.

However, such a manufacturing method has the following problems.

When electrical inspection is performed on a wafer in which the electrodes to be inspected are arranged at a high density with a small pitch, use anisotropic conductive connectors with a small pitch of the conductive parts and a high density. is required. Thus, in the manufacture of such anisotropically conductive connectors Of course, it is necessary to use the upper die 80 and the lower die 85 in which the ferromagnetic layers 82 and 87 are arranged at a very small pitch.

However, when such an upper die 80 and lower die 85 are used to form the elastic anisotropic conductive film 95 as described above, in each of the upper die 80 and the lower die 85, ferromagnetic materials adjacent to each other are formed. Since the separation distance between the layers 82 and 87 is small, as shown in FIG. 57, the direction force from one ferromagnetic layer 82a in the upper mold 80 to the corresponding ferromagnetic layer 87a in the lower mold 85 is shown in FIG. In addition to the direction (indicated by the arrow X), for example, from the upper layer 80 of the ferromagnetic layer 82a to the corresponding lower layer 85 of the ferromagnetic layer 87a, the ferromagnetic layer 87b is directed in the direction ( (Indicated by arrow Y), or a magnetic field also acts in the direction of the direction of force from the ferromagnetic layer 82b of the upper mold 80 to the ferromagnetic layer 87a adjacent to the corresponding ferromagnetic layer 87b of the lower mold 85. Become. Therefore, in the molding material layer 95A, the conductive particles P can be gathered in a portion located between the ferromagnetic layer 82a of the upper die 80 and the corresponding ferromagnetic layer 87a of the lower die 85. For example, conductive particles gather in the portion located between the upper layer 80 of the ferromagnetic layer 82a and the lower layer 85 of the ferromagnetic layer 87b, and the conductive particles P are formed. It becomes difficult to sufficiently orient the material layer 95A in the thickness direction, and as a result, an anisotropic conductive connector having a desired conductive portion and insulating portion cannot be obtained.

[0010] Further, the above professional card has the following problems.

In order to construct a probe card, it requires three parts: a test circuit board, an anisotropic conductive connector, and a sheet-like probe, so the overall structure is complicated. When assembling, it is necessary to align the anisotropic conductive connector and the sheet-like probe.

In addition, since the electrode probe is disposed on an insulating sheet made of, for example, polyimide, the sheet-like probe is subjected to a thermal history due to a temperature change, so that the position relative to the electrode to be inspected due to thermal expansion of the insulating sheet. As a result of the deviation, the electrical connection state changes and it is difficult to maintain a stable connection state.

Patent Document 1: Japanese Patent Application Laid-Open No. 51-93393

Patent Document 2: Japanese Patent Laid-Open No. 53-147772 Patent Document 3: Japanese Patent Application Laid-Open No. 61-250906

Patent Document 4: Japanese Patent Laid-Open No. 2002-334732

Disclosure of the invention

[0012] The present invention has been made based on the circumstances as described above, and a first object thereof is to provide a wafer even when the pitch of electrodes to be inspected in the wafer to be inspected is extremely small. It is an object to provide an anisotropic conductive connector for wafer inspection and a method for manufacturing the same, which can surely achieve a good electrical connection state to.

The second object of the present invention is to ensure required insulation between adjacent electrodes to be inspected even if the pitch of the electrodes to be inspected on the wafer to be inspected is extremely small. A probe card for wafer inspection that can reliably achieve a good electrical connection state, and can maintain a good electrical connection state to the wafer stably even when subjected to thermal stress due to temperature changes. And providing a manufacturing method thereof. The third object of the present invention is to perform wafer inspection that can reliably achieve a good electrical connection to the wafer even if the pitch of the electrodes to be inspected in the wafer to be inspected is extremely small. To provide an apparatus.

[0013] A method for manufacturing an anisotropic conductive connector for wafer inspection according to the present invention is provided in an electrode region in which electrodes to be inspected are arranged in all or part of integrated circuits formed on a wafer to be inspected. Correspondingly, a frame plate having a plurality of openings formed therein, and a plurality of conductive particles exhibiting magnetism contained in an elastic polymer material arranged according to a pattern corresponding to the pattern of the electrode to be inspected in the electrode region. A plurality of elastic anisotropic conductive films having a conductive part for connection and an insulating part made of an elastic polymer material that insulates them from each other, and arranged and supported by the frame plate so as to close the opening; A method for manufacturing an anisotropic conductive connector for wafer inspection, comprising a plurality of contact members made of metal integrally provided on each connection conductive portion in an elastic anisotropic conductive film,

On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed. A contact member made of a metal exhibiting magnetism is disposed on the surface of the material layer for the conductive elastomer according to a specific pattern corresponding to the pattern of the electrode to be inspected. In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer. The elastomer layer is laser processed to remove a portion other than the portion where the contact member is disposed, so that a plurality of the contact members disposed on the releasable support plate according to the specific pattern are provided. In this state, each of the connecting conductive portions provided with the contact members is cured to form an elastic polymer substance that is cured to close the opening of the frame plate. It is characterized by having a step of forming an insulating part by infiltrating into the insulating part material layer made of the polymer substance forming material and curing the insulating part material layer.

[0014] In the method for manufacturing an anisotropic conductive connector for wafer inspection of the present invention, a resist layer having openings formed in a specific pattern is formed on a metal foil, and the resist layer in the metal foil is formed. Opening force By subjecting the surface of the exposed portion to a magnetic treatment with a metal that exhibits magnetism, a contact member composite in which a contact member is formed in each opening of the resist layer is manufactured. It is preferable to arrange a contact member made of a metal exhibiting magnetism according to the specific pattern on the surface of the conductive elastomer material layer by stacking on the surface of the conductive elastomer material layer.

[0015] An anisotropic conductive connector for wafer inspection according to the present invention is obtained by the manufacturing method described above.

The probe card for wafer inspection according to the present invention has a plurality of inspection electrodes on the surface according to a pattern corresponding to the pattern of the electrode to be inspected in all or some of the integrated circuits formed on the wafer to be inspected. And the above-mentioned anisotropic conductive connector for wafer inspection disposed on the surface of the inspection circuit board.

[0017] According to the method of manufacturing a probe card for wafer inspection of the present invention, a plurality of inspection electrodes are provided in accordance with a pattern corresponding to an inspection target electrode in all or some integrated circuits formed on a wafer to be inspected. A test circuit board formed on the surface and a plurality of connecting conductive parts extending in the thickness direction, which are integrally provided on the surface of the test circuit board and are located on the surfaces of the test electrodes And the insulation that insulates them from each other And a method for producing a probe force probe for wafer inspection, comprising: an anisotropic conductive elastomer layer, and a contact member made of metal integrally provided on a connecting conductive portion of the anisotropic conductive elastomer layer. Because

A contact member composite is prepared by forming a plurality of contact members made of metal each exhibiting magnetism according to a specific pattern relating to the inspection electrode on a metal plate, and is cured on the contact member composite. A liquid polymer substance forming an elastic polymer substance and forming a conductive elastomer material layer containing conductive particles exhibiting magnetism in the forming material, and on each of the conductive elastomer material layers, Each of the plurality of metal masks made of metal exhibiting magnetism is disposed so as to face the contact member with the conductive elastomer material layer interposed therebetween, and in this state, the conductive elastomer material layer is disposed on the conductive elastomer material layer. On the other hand, by applying a magnetic field in the thickness direction and curing the material layer for conductive elastomer, a conductive elastomer layer is formed, and the conductive elastomer layer is formed. The by removing the portion other than the portion located between the contact member and the metal mask by laser machining, by forming a plurality of conductive parts for connection arranged in accordance with the specific pattern,

The metal mask disposed on each conductive part for connection is removed, and then the contact member composite formed with the conductive part for connection is insulated from an insulating material made of a material that becomes an elastic polymer substance. Overlaying on the inspection circuit board on which the layer is formed, each of the inspection electrodes of the inspection circuit board is brought into contact with the corresponding conductive part for connection, and in this state, the insulating part material It has the process of forming an insulating part by hardening the layer.

[0018] The probe card for wafer inspection of the present invention is obtained by the manufacturing method described above.

[0019] A wafer inspection apparatus of the present invention is a wafer inspection apparatus that performs an electrical inspection of a plurality of integrated circuits formed on a wafer in the state of a wafer. It is characterized by comprising a probe card.

[0020] According to the method for manufacturing an anisotropic conductive connector for wafer inspection of the present invention, the pattern of the electrode to be inspected on the wafer to be inspected is formed on the material layer for the conductive elastomer. The conductive material obtained by applying a magnetic field in the thickness direction of the conductive elastomer material layer and curing the conductive elastomer material layer in a state where the magnetic contact member is arranged according to a specific pattern. In the conductive elastomer layer, the conductive particles in the portion where the contact member is disposed are dense, and the conductive particles in the other portions are sparse. Therefore, by using the contact member as a mask and laser processing one layer of the conductive elastomer, the contact member in the one layer of the conductive elastomer can be disposed and the portion can be easily removed. It is possible to reliably form the conductive part for connection in the desired form according to a specific pattern. Then, after forming a plurality of connecting conductive portions arranged according to a specific pattern, an insulating portion material layer is formed between these connecting conductive portions and cured to form the insulating portions. As a result, an insulating part free from conductive particles can be obtained with certainty.

Therefore, according to the anisotropic conductive connector for wafer inspection of the present invention obtained by such a method, the pitch of the electrodes to be inspected on the wafer to be inspected is very small and densely arranged. Even so, the required electrical connection can be reliably achieved for each of the electrodes to be inspected, and the force can be manufactured at a low cost.

In addition, since the contact member is provided on the connecting conductive portion of the elastic anisotropic conductive film, it is not necessary to use a sheet-like probe when inspecting the wafer. A probe card having a simple structure can be obtained, and connection failure due to misalignment of the sheet-like probe can be avoided.

[0022] According to the method for manufacturing a probe card for wafer inspection of the present invention, the conductive elastomer layer is laser processed and a part thereof is removed to form the connection conductive portion. The conductive part for connection which has property is obtained.

In addition, a conductive elastomer material layer is formed on a contact member composite in which a plurality of contact members each made of a metal exhibiting magnetism are formed according to a specific pattern related to the inspection electrode, and the conductive elastomer material is used. In order to apply a magnetic field in the thickness direction of the conductive elastomer material layer in a state where metal masks each showing magnetism are arranged in accordance with a specific pattern on the material layer, the obtained conductive elastomer layer has contact points. The conductive particles in the part located between the member and the metal mask become dense, and in the other parts The conductive particles are sparse. For this reason, by laser processing the conductive elastomer layer, it is possible to easily remove the portion of the conductive elastomer layer where the contact member is not arranged. It can be reliably formed according to the pattern.

Further, by curing the material layer for conductive elastomer formed on the contact member composite, each contact member in the contact member composite is bonded to the obtained conductive elastomer layer. Thus, it is possible to form a conductive portion for connection in which the contact member is physically provided. In addition, after forming a plurality of connecting conductive portions arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected, an insulating material layer is formed on each of the connecting conductive portions. In this state, the insulating part material layer is cured to be in contact with each of the inspection electrodes of the inspection circuit board, so that no insulating particles are formed at all. The insulation part is integrally formed on the inspection circuit board. An anisotropic conductive elastomer layer formed can be formed.

Therefore, according to the probe card for wafer inspection of the present invention obtained by such a method, a plurality of connecting conductive portions having desired conductivity are not present at all in the conductive particles. Therefore, even if the pitch of the electrodes to be inspected in the wafer to be inspected is extremely small! /, The required insulation between the adjacent electrodes to be inspected is ensured, and the wafer has a good pitch. An electrical connection state can be reliably achieved. In addition, the anisotropic conductive elastomer layer is integrally formed on the circuit board for inspection, and the contact force is integrated with the conductive part for connection, so that a sheet-like probe is used. Therefore, even when a thermal history due to a temperature change is received, it is possible to prevent poor connection due to misalignment between the conductive part for connection and the inspection electrode, and misalignment of the sheet-like probe. Therefore, it is possible to avoid a poor connection due to the above-mentioned, and thus it is possible to stably maintain a good electrical connection state to the wafer.

Further, since it is not necessary to use a sheet-like probe, an assembly work is not required and a probe card having a simple structure can be obtained.

Brief Description of Drawings

FIG. 1 is a plan view showing an anisotropic conductive connector for wafer inspection of a first example according to the present invention. is there.

FIG. 2 is an enlarged plan view showing a part of the anisotropic conductive connector for wafer inspection of the first example.

FIG. 3] An explanatory cross-sectional view showing an enlarged part of the anisotropic conductive connector for wafer inspection of the first example.

圆 4] It is a sectional view for explanation showing a state in which a resist layer is formed on a metal foil.

FIG. 5 is an explanatory sectional view showing a state in which a contact member is formed in the opening of the resist layer.

FIG. 6 is an explanatory cross-sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.

FIG. 7 is an explanatory sectional view showing a state in which the contact member composite is disposed on the material layer for conductive elastomer.

8] A sectional view for explanation showing a state in which a magnetic field is applied in the thickness direction of the material layer for conductive elastomer.

[9] FIG. 9 is an explanatory cross-sectional view showing a state in which a conductive elastomer layer is formed on a releasable support plate.

[10] FIG. 10 is an explanatory cross-sectional view showing a state where the metal foil in the contact member composite is removed.

FIG. 11 is an explanatory cross-sectional view showing a state in which a connecting conductive portion is formed on a releasable support plate.

[12] FIG. 12 is an explanatory cross-sectional view showing a state in which a frame plate is arranged on a releasable support plate and an insulating material layer is formed.

FIG. 13 is an explanatory cross-sectional view showing a state in which a releasable support plate on which a conductive part for connection is formed is superimposed on a releasable support plate on which an insulating material layer is formed.

FIG. 14 is an explanatory cross-sectional view showing a state in which an insulating portion is formed between adjacent connecting conductive portions.

[15] FIG. 15 is a plan view showing a second example of the anisotropic conductive connector for wafer inspection according to the present invention.

FIG. 16 is an explanatory cross-sectional view showing the configuration of the first example of the probe card according to the present invention. 圆 17] An explanatory cross-sectional view showing an enlarged configuration of a main part of the probe card of the first example.

FIG. 18 is a plan view showing an inspection circuit board in the probe card of the first example. FIG. 19 is an explanatory diagram showing an enlarged view of the lead electrode portion of the circuit board for inspection.

FIG. 20 is a cross-sectional view illustrating the configuration of a second example of the probe card according to the present invention.圆 21] An explanatory sectional view showing, in an enlarged manner, the configuration of the main part of the probe card of the second example

FIG. 22 is a plan view showing an inspection circuit board in the probe card of the second example. FIG. 23 is a cross-sectional view illustrating the configuration of a third example of the probe card according to the present invention.圆 24] An explanatory cross-sectional view showing an enlarged configuration of a main part of the probe card of the third example. 圆 25] An explanatory cross-sectional view showing an anisotropic conductive elastomer layer in an enlarged manner.

FIG. 26 is an explanatory cross-sectional view showing a state in which a resist layer having a plurality of openings formed according to a specific pattern is formed on a metal foil.

FIG. 27 is an explanatory sectional view showing a state in which a contact member is formed in each opening of the resist layer to form a metal mask composite.

FIG. 28 is an explanatory sectional view showing a state in which a conductive elastomer material layer is formed on a contact member composite.

29] A sectional view for explanation showing a state in which a metal mask composite is disposed on the surface of a material layer for conductive elastomer.

FIG. 30 is an explanatory cross-sectional view showing a state in which a magnetic field is applied to the material layer for conductive elastomer in the thickness direction.

[31] FIG. 31 is an explanatory cross-sectional view showing a state in which a conductive elastomer layer is formed on the contact member composite.

FIG. 32 is an explanatory cross-sectional view showing a state where the metal foil of the metal mask composite has been removed. FIG. 33 is a cross-sectional view illustrating a state in which a plurality of conductive portions for connection are formed according to a specific pattern on the contact member composite.

圆 34] Cross section for explanation showing a state in which an insulating material layer is formed on the circuit board for inspection FIG.

FIG. 35 is an explanatory cross-sectional view showing a state in which the contact member composite having the connection conductive portion formed thereon is superimposed on the inspection circuit board on which the insulating layer material layer is formed.

36] A sectional view for explanation showing a state in which an insulating portion is formed between adjacent conductive portions for connection.

[37] FIG. 37 is an explanatory cross-sectional view showing the configuration of the fourth example of the probe card according to the present invention.圆 38] is an explanatory cross-sectional view showing an enlarged configuration of the main part of the probe card of the fourth example. 圆 39] is an explanatory cross-sectional view showing the configuration of the first example of the wafer inspection apparatus according to the present invention. is there.圆 40] is an explanatory sectional view showing an enlarged configuration of a main part of the wafer inspection apparatus of the first example. 圆 41] An explanatory sectional view showing an enlarged connector of the wafer inspection apparatus of the first example. is there.

FIG. 42 is a cross-sectional view illustrating the configuration of a second example of the wafer inspection apparatus according to the present invention. FIG. 43] A sectional view for explanation showing the configuration of a third example of the wafer inspection apparatus according to the present invention.圆 44] An explanatory cross-sectional view showing an enlarged configuration of a main part of the wafer inspection apparatus of the third example. 圆 45] An explanatory cross-sectional view showing the configuration of the fourth example of the wafer inspection apparatus according to the present invention. It is.

FIG. 46 is an explanatory view showing a state in which the connecting conductive portion is formed by removing only the peripheral portion of the conductive elastomer layer in the conductive elastomer layer.

FIG. 47 is an explanatory cross-sectional view showing a state in which the conductive portion for connection is formed by removing only the peripheral portion of the portion that becomes the conductive portion for connection in the conductive elastomer layer.

FIG. 48 is an explanatory sectional view showing, in an enlarged manner, the configuration of the main part in another example of the probe card according to the present invention.

FIG. 49 is a top view of a test wafer used in Examples.

FIG. 50 is an explanatory view showing the position of the electrode region to be inspected of the integrated circuit formed on the test wafer shown in FIG.

FIG. 51 is an illustration showing an inspected electrode of an integrated circuit formed on the test wafer shown in FIG. 49. FIG.

FIG. 52 is a top view of the frame plate produced in the example.

FIG. 53 is an explanatory diagram showing an enlarged part of the frame plate shown in FIG. 52.

[54] FIG. 54 is a cross-sectional view for explaining the structure of a mold for manufacturing a conventional anisotropically conductive connector.

FIG. 55 is an explanatory cross-sectional view showing a state in which a frame plate is arranged in a mold and a molding material layer is formed in a process of manufacturing a conventional anisotropically conductive connector. [56] FIG. 56 is an explanatory cross-sectional view showing a state in which a magnetic field is applied in the thickness direction of the molding material layer.

FIG. 57 is an explanatory cross-sectional view showing the direction of a magnetic field applied to a molding material layer in a conventional method for manufacturing an anisotropic conductive connector.

Explanation of symbols

2 Controller

3 Input / output terminals

3R input / output terminal

4 Connector

4A conductive pin

4B Support member

5 Wafer mounting table

6 Ueno coffee

7 Inspected electrode

10 Probe card

11 Circuit board for inspection

12 First substrate element

13 Lead electrode

13R Lead electrode

14 Honoreda

14K opening Second substrate element

Inspection electrode

R Inspection electrode

Reinforcing member

Anisotropic conductive connector Frame plate

Opening

Elastic anisotropic conductive film

Conductive part for connection

A Material layer for conductive elastomer B Conductive elastomer layer Insulation part

A Insulation material layer

Protrusion

Contact member

F contact member composite

Metal foil

Resist layer

K opening

, 35A releasable support plate

Anisotropic conductive elastomer layer Conductive part for connection

A Insulation material layer

Anisotropic conductive elastomer sheet Metal foil 47 Resist layer

47K opening

48 Metal mask

48F metal mask composite

80 Upper mold

81 board

82, 82a, 82b ferromagnetic layer

83 Non-magnetic layer

85 Lower mold

86 PCB

87 87a, 87b Ferromagnetic layer

88 Non-magnetic layer

90 frame board

91 opening

95 Elastic anisotropic conductive film

95A molding material layer

96 Conductive part

97 Insulation

A Inspected electrode area

P conductive particles

H Air inlet

L Integrated circuit

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments for carrying out the present invention will be described in detail.

[Anisotropic conductive connector]

FIG. 1 is a plan view showing an anisotropic conductive connector for wafer inspection of a first example according to the present invention, and FIG. 2 is an enlarged view of a part of the anisotropic conductive connector for wafer inspection shown in FIG. Plan view, Fig. 3 shows an enlarged part of the anisotropic conductive connector for wafer inspection shown in Fig. 1. It is sectional drawing for description.

[0027] The anisotropic conductive connector for wafer inspection (hereinafter, also simply referred to as "anisotropic conductive connector 1") 20 of the first example is an example of the integrated circuit on a wafer on which a plurality of integrated circuits are formed. The frame plate 21 is used to perform each electrical inspection in the state of a wafer and has a plurality of openings 22 (shown by broken lines). The opening 22 of the frame plate 21 is formed corresponding to an electrode region in which electrodes to be inspected in all integrated circuits formed on a wafer to be inspected. A plurality of elastic anisotropic conductive films 23 having conductivity in the thickness direction are arranged on the frame plate 21 so as to close one opening 22 and supported by the opening edge.

The elastic anisotropic conductive film 23 is formed of an elastic polymer material, and is disposed so as to be positioned in the opening 22 of the frame plate 21 as shown in FIG. 2 (in FIG. 2, perpendicular to the paper surface). A plurality of connecting conductive portions 24 extending in the same direction) and insulating portions 25 that are formed around each of the connecting conductive portions 24 and insulate each of the connecting conductive portions 24 from each other. Yes. Each of the connecting conductive parts 24 is arranged according to a pattern corresponding to the pattern of the electrode to be inspected in the integrated circuit formed on the wafer to be inspected, and is electrically connected to the electrode to be inspected in the inspection of the wafer. As shown in FIG. 3, the conductive particles 24 for connection in the anisotropic anisotropic conductive film 23 are densely contained in a state in which the conductive particles P exhibiting magnetism are aligned in the thickness direction. . On the other hand, the insulating portion 25 does not contain the conductive particles P at all.

Further, in the illustrated example, each of the connecting conductive portions 24 is formed so that one surface force of the insulating portion 25 protrudes, so that one surface of the elastic anisotropic conductive film 23 protrudes according to the connecting conductive portion 24. Part 26 is formed.

Further, a contact member 27 made of a metal exhibiting magnetism is provided on one surface of the connection conductive portion 24 in the elastic anisotropic conductive film 23 in a state of being integrally bonded to the connection conductive portion 24.

[0028] The thickness of the frame plate 21 is preferably a force of 25 to 600 µm, and more preferably 40 to 400 µm, depending on the material. If this thickness is less than 25 m, the strength required when using the anisotropically conductive connector 20 is not obtained, the durability becomes low, and the shape of the frame plate 21 is maintained immediately. As a result, the anisotropic conductive connector 20 is poor in handling and performance. On the other hand, when the thickness exceeds 600 m, the elastic anisotropic conductive film 23 formed in the opening 22 becomes excessively thick and good electrical conductivity in the connecting conductive portion 24 can be obtained. It can be difficult.

The shape and size in the plane direction at the opening 22 of the frame plate 21 are designed according to the size, pitch, and pattern of the inspected electrode of the wafer to be inspected.

[0029] The material constituting the frame plate 21 is not particularly limited as long as the frame plate 21 is not easily deformed and has a rigidity that allows its shape to be stably maintained. For example, Various materials such as a metal material, a ceramic material, and a resin material can be used. When the frame plate 21 is made of, for example, a metal material, an insulating film is formed on the surface of the frame plate 21. Anyway.

Specific examples of metal materials constituting the frame plate 21 include iron, copper, nickel, chromium, connort, magnesium, manganese, molybdenum, indium, lead, palladium, titanium, tantasten, aluminum, gold, platinum, silver, etc. Or an alloy or alloy steel in which two or more of these metals are combined.

Specific examples of the resin material constituting the frame plate 21 include liquid crystal polymer and polyimide resin.

[0030] As a material for forming the frame plate 21, more preferably it is preferred instrument linear thermal expansion coefficient used the following 3 X 10- ⁵ ZK one 1 X 10- ⁷ ~1 X 10- ^{5 ΖΚ,} particularly preferably ^{1 X 10- 6 ~8 X 10- 6} / Κ.

Specific examples of such materials include Invar type alloys such as Invar, Elinvar type alloys such as Elinvar, magnetic metal alloys such as Super Invar, Kovar, and 42 alloy, or alloy steel.

[0031] The total thickness of the elastic anisotropic conductive film 23 (in the illustrated example, the thickness of the connecting conductive portion 24) is preferably 50 to 2000 μm, more preferably 70 to: LOOO μm, particularly preferably. Is 80-500 / ζ πι. If this thickness is 50 m or more, it has sufficient strength The conductive film 23 can be obtained reliably. On the other hand, if the thickness is 2000 m or less, the connecting conductive portion 24 having the required conductivity characteristics can be obtained with certainty.

It is preferable that the total height of the protrusions 26 is 10% or more of the thickness of the protrusions 26, and more preferably 20% or more. By forming the protruding portion 26 having such a protruding height, the connecting conductive portion 24 is sufficiently compressed with a small applied pressure, so that good conductivity can be reliably obtained.

The protrusion height of the protrusion 26 is preferably 100% or less of the shortest width or diameter of the protrusion 26, more preferably 70% or less. By forming the projecting portion 26 having such a projecting height, the projecting portion 26 is not buckled when pressed, and thus the desired conductivity can be reliably obtained.

[0032] As the elastic high molecular weight material forming the connecting conductive portion 24 and the insulating portion 25 in the elastic anisotropic conductive film 23, a heat resistant high molecular weight material having a crosslinked structure is preferable. As the curable polymer material-forming material that can be used for obtaining such a crosslinked polymer material, a liquid silicone rubber that can use various materials is preferable.

The liquid silicone rubber may be an addition type or a condensation type, but an addition type liquid silicone rubber is preferred. This addition-type liquid silicone rubber is cured by the reaction between the bur group and the Si H bond, and is a one-pack type (one-component type) made of polysiloxane containing both vinyl groups and Si—H bonds. There are two-component type (two-component type) which also has polysiloxane power containing a butyl group and polysiloxane power containing Si—H bond. It is preferable to use silicone rubber.

[0033] As the addition-type liquid silicone rubber, it is preferable to use one having a viscosity of 100 to 1,250 Pa-s at 23 ° C, more preferably 150 to 800 Pa's, particularly preferably 250 to 500 Pa '. s thing. When this viscosity is less than lOOPa's, the conductive particles used for the conductive elastomer for obtaining the connection conductive portion 24 described later cause sedimentation of the conductive particles in the additional liquid silicone rubber. Immediately, good storage stability cannot be obtained, and when a parallel magnetic field is applied to the conductive elastomer material layer described later, the conductive particles are not aligned in the thickness direction and are in a uniform state. To form a chain of conductive particles May be difficult to do. On the other hand, when the viscosity exceeds 1,250 Pa's, the resulting conductive elastomer material has a high viscosity, so that even when a parallel magnetic field is applied to the conductive elastomer material layer, the conductive material is conductive. The conductive particles do not move sufficiently, and it may be difficult to orient the conductive particles so that they are aligned in the thickness direction.

The viscosity of such an addition type liquid silicone rubber can be measured with a B-type viscometer.

[0034] When the elastic anisotropic conductive film 23 is formed from a cured liquid silicone rubber (hereinafter referred to as "silicone rubber cured product"), the cured silicone rubber has a compression set at 150 ° C. It is preferably 10% or less, more preferably 8% or less, and further preferably 6% or less. If this compression set exceeds 10%, the resulting conductive anisotropic connector 20 will be permanently set in the connecting conductive part 24 when used repeatedly or repeatedly in a high temperature environment. As a result, the chain of conductive particles in the connecting conductive portion 24 is disturbed, and it becomes difficult to maintain the required conductivity.

Here, the compression set of the cured silicone rubber can be determined by a method according to JIS K 6249.

[0035] Further, the cured silicone rubber forming the elastic anisotropic conductive film 23 preferably has a durometer A hardness of 10 to 60 at 23 ° C, more preferably 15 to 60, particularly Preferably it is 20-60. If this durometer A hardness is less than 10, the insulation 25 that insulates the connection conductive parts 24 from each other when pressed is excessively distorted or immediately required insulation between the conductive parts 24 for connection. May be difficult to maintain. On the other hand, if the durometer A hardness is more than 60, it is necessary to apply a considerably large load in order to give the connecting conductive part 24 an appropriate strain. For example, the wafer to be inspected is greatly deformed. Or breakage easily occurs.

In addition, when a silicone rubber cured product having a durometer A hardness outside the above range is used, if the resulting anisotropic conductive connector 20 is repeatedly used many times, the connecting conductive portion 24 is permanently strained. As a result, the chain of conductive particles in the connecting conductive part 24 is disturbed, and the required conductivity is maintained. It becomes difficult.

Further, when the anisotropic conductive connector 20 is used in a test under a high temperature environment, for example, a WLBI test, the cured silicone rubber forming the elastic anisotropic conductive film 23 has a durometer A hardness of 25 at 23 ° C. It is preferable that it is ˜40.

When a cured silicone rubber with a durometer A hardness outside the above range is used, when the anisotropically conductive connector 20 obtained is repeatedly used in a test under a high temperature environment, the conductive part for connection 24 As a result, permanent distortion occurs immediately, and this causes disturbance in the chain of conductive particles in the conductive part 24 for connection. As a result, it becomes difficult to maintain the required conductivity.

Here, the durometer A hardness of the cured silicone rubber can be measured by a method based on JIS K 6249.

[0036] The cured silicone rubber forming the elastic anisotropic conductive film 23 preferably has a tear strength at 23 ° C of 8 kNZm or more, more preferably lOkNZ m or more, more preferably 15 kNZm. As mentioned above, it is particularly preferably 20 kNZm or more. If the tear strength is less than 8 kNZm, the durability tends to decrease when the elastic anisotropic conductive film 23 is excessively strained.

Here, the tear strength of the cured silicone rubber can be determined by a method based on JIS K 6249.

[0037] As an addition type liquid silicone rubber having such characteristics, liquid silicone rubbers “KE2000” series and “KE1950” series manufactured by Shin-Etsu Chemical Co., Ltd. are commercially available! Can do.

In the present invention, an appropriate curing catalyst can be used for curing the addition-type liquid silicone rubber. As such a curing catalyst, a platinum-based catalyst can be used. Specific examples thereof include chloroplatinic acid and a salt thereof, a platinum-unsaturated group-containing siloxane complex, a complex of bursiloxane and platinum, Known complexes such as a complex of platinum and 1,3-dibule tetramethyldisiloxane, a triorganophosphine, a complex of phosphite and platinum, a acetyl acetate platinum chelate, a complex of cyclic gen and platinum, etc. . The amount of the curing catalyst used is appropriately selected in consideration of the type of curing catalyst and other curing conditions, but is usually 3 to 15 parts by weight with respect to 100 parts by weight of the addition type liquid silicone rubber.

[0039] Further, in the addition-type liquid silicone rubber, a thixotropic property improvement of the addition-type liquid silicone rubber, viscosity adjustment, improvement in dispersion stability of the conductive particles, or a substrate having high strength is obtained. For this purpose, an inorganic filler such as normal silica powder, colloidal silica, air-mouthed gel silica, alumina, or the like can be contained as necessary.

The amount of such an inorganic filler used is not particularly limited, but if used in a large amount, the orientation of the conductive particles by a magnetic field cannot be sufficiently achieved, which is not preferable.

[0040] As the conductive particles P contained in the conductive portion 24 for connection in the elastic anisotropic conductive film 23,

It is preferable to use a magnetic core particle (hereinafter also referred to as “magnetic core particle”) whose surface is coated with a highly conductive metal!

[0041] The magnetic core particles for obtaining the conductive particles P preferably have a number average particle diameter of 3 to 40 μm.

Here, the number average particle diameter of the magnetic core particles refers to that measured by a laser diffraction scattering method.

When the number average particle diameter is 3 μm or more, it is easy to obtain a conductive part 24 for connection that is easily deformed under pressure, has a low resistance value, and high connection reliability. On the other hand, when the number average particle diameter is 40 μm or less, the fine connecting conductive portion 24 can be easily formed, and the obtained connecting conductive portion 24 has stable conductivity. It is easy to become.

[0042] The BET specific surface area of the magnetic core particles is preferably 10 to 500 m ² / kg, more preferably 20 to 500 m ² Zkg, and particularly preferably 50 to 400 m ² Zkg.

If the BET specific surface area is 10 m ² / kg or more, the magnetic core particle has a sufficiently large area that can be measured, so that the required amount of plating can be reliably applied to the magnetic core particle. Therefore, the conductive particles P having high conductivity can be obtained, and the contact area between the conductive particles P is sufficiently large, so that stable and high conductivity can be obtained. On the other hand, if the BET specific surface area is 500 m ² Zkg or less, the magnetic core particles are brittle. It does not become weak, and maintains stable and high conductivity with less damage when subjected to physical stress.

[0043] Further, the magnetic core particles preferably have a coefficient of variation in particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20% or less. Is.

Here, the coefficient of variation of the particle diameter is expressed by the formula: (σ / Dn) X 100 (where σ represents the standard deviation value of the particle diameter, and Dn represents the number average particle diameter of the particles). If the coefficient of variation of the particle diameter is 50% or less, the uniformity of the particle diameter is large, so that the connection conductive portion 24 with small variation in conductivity can be formed.

[0044] As a material constituting the magnetic core particles, iron, nickel, cobalt, a force obtained by coating these metals with copper, resin, etc. can be used. The saturation magnetic field is 0.1 W b / m. ^Two or more can be preferably used, more preferably 0.3 Wb / m ² or more, and particularly preferably 0.5 WbZm ² or more, specifically iron, nickel, cobalt or those And alloys thereof.

If this saturation magnetic field is 0.1 lWbZm ² or more, the conductive particles P can be easily formed in the material layer for conductive elastomer for forming the anisotropic anisotropic conductive film 23 by the method described later. In this way, the conductive particles P can be reliably moved to a portion that becomes the conductive portion for connection in the conductive elastomer material layer to form a chain of conductive particles P. Can do.

[0045] The conductive particles P used for obtaining the connecting conductive portion 24 are obtained by coating the surfaces of the magnetic core particles with a highly conductive metal.

Here, the “highly conductive metal” means one having an electrical conductivity at 0 ° C. of 5 × 10 ⁶ Ω— ¹ !!! — ¹ or more.

As such a highly conductive metal, gold, silver, rhodium, platinum, chromium, or the like can be used. Among these, gold is preferable because it is chemically stable and has high conductivity.

[0046] The conductive particle Ρ is a ratio of the highly conductive metal to the core particle [(mass of highly conductive metal Ζ The mass of the core particles) X 100] is 15% by mass or more, preferably 25 to 35% by mass. When the proportion of the highly conductive metal is less than 15% by mass, the conductivity of the conductive particles P is significantly reduced when the anisotropic conductive connector 20 obtained is repeatedly used in a high temperature environment. The required conductivity cannot be maintained.

[0047] In addition, the conductive particles P have a thickness t of the covering layer of highly conductive metal calculated by the following formula (1) of 50 nm or more, and preferably 100 to 200 nm. The Formula (1) t = [l / (Sw)] X [N / (l -N)]

[Where t is the thickness of the coating layer made of a highly conductive metal (m), Sw is the BET specific surface area of the core particle (m ² / kg), is the specific gravity of the highly conductive metal (kgZm ³ ), and N is (high conductivity (Weight of conductive metal / weight of conductive particles as a whole). ]

[0048] The above mathematical formula is derived as follows.

(i) When the weight of the magnetic core particle is Mp (kg), the surface area S (m ² ) of the magnetic core particle is S = Sw Mp (2)

Sought by.

(ii) When the weight of the coating layer made of highly conductive metal is m (kg), the volume V (m ³ ) of the coating layer is

V = m / p formula (3)

Sought by.

(iii) Here, assuming that the thickness of the coating layer is uniform over the entire surface of the conductive particles, t = VZS. Substituting Equation (2) and Equation (3) above into The layer thickness t is

t = (m / p) / (Sw Mp) = m / (Sw p-Mp) Equation (4)

Sought by.

(iv) Also, since N is the ratio of the mass of the coating layer to the mass of the entire conductive particle, the value of N is

N = m / (Mp + m) Equation (5)

Sought by.

(V) Dividing the numerator and denominator on the right side of this equation (5) by Mp, N = (m / Mp) Z (1 + m / Mp), and when (1 + m / Mp) is applied to both sides,

N (l + m / Mp) = mZMp, and

N + N (m / Mp) = mZMp, and when N (mZMp) is shifted to the right side,

N = m / Mp -N (m / Mp) = (m / Mp) (1 N), and when both sides are divided by (1 N),

N / (l -N) = mZMp

Therefore, the weight Mp of the magnetic core particle is

Mp = m / [N / (1 -N)] = m (l -N) / N Equation (6)

Sought by.

(vi) And when substituting equation (6) into equation (4),

t = l / [Sw p (1 N) ZN]

Is guided.

[0049] When the thickness t of the coating layer is 50 nm or more, when the anisotropically conductive connector 20 is repeatedly used in a high temperature environment, the ferromagnetic material constituting the magnetic core particles is a high layer constituting the coating layer. Even if it is transferred to the conductive metal, a high proportion of highly conductive metal is present on the surface of the conductive particle P, so that the conductivity of the conductive particle P is not significantly reduced. The electrical conductivity of the period is maintained.

[0050] Further, the number average particle diameter of the conductive particles P is preferably 3 to 40 µm, more preferably 6 to 25 πι.

By using such conductive particles, the resulting elastic anisotropic conductive film 23 can be easily deformed under pressure, and the conductive conductive portion 24 for connection in the elastic anisotropic conductive film 23 can be used.

Sufficient electrical contact can be obtained between V and conductive particles.

The shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or aggregated in that it can be easily dispersed in the polymer material-forming material. It is preferable that it is a lump with secondary particles.

[0051] Such conductive particles can be obtained, for example, by the following method.

First, a ferromagnetic material is made into particles by a conventional method or commercially available ferromagnetic particles are prepared, and the particles are classified to prepare magnetic core particles having a required particle diameter. To make.

Here, the particle classification treatment can be performed by a classification device such as an air classification device or a sonic sieving device.

Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target magnetic core particles, the type of the classification device, and the like.

Next, the surface of the magnetic core particle is treated with an acid, and further washed with pure water, for example, to remove impurities such as dirt, foreign matter, and oxide film present on the surface of the magnetic core particle. Conductive particles can be obtained by coating the surface of the core particles with a highly conductive metal.

Here, hydrochloric acid can be used as the acid used to treat the surface of the magnetic core particles.

The method of coating the surface of the magnetic core particles with the highly conductive metal is not limited to these methods, which can use an electroless plating method, a replacement plating method, or the like. The method of producing conductive particles by the electroless plating method or the substitution plating method will be described. First, a magnetic core particle that has been subjected to acid treatment and washing treatment is added to a plating solution to prepare a slurry. While stirring the slurry, electroless plating or substitution plating of the magnetic core particles is performed. Next, the particles in the slurry are separated by MEC solution, and then the particles are washed with, for example, pure water to obtain conductive particles in which the surface of the magnetic core particles is coated with a highly conductive metal. It is done.

Alternatively, after forming an undercoat layer on the surface of the magnetic core particles, a finish layer made of a highly conductive metal may be formed on the surface of the undercoat layer. The method for forming the base plating layer and the plating layer formed on the surface thereof is not particularly limited, but the base plating layer is formed on the surface of the magnetic core particles by the electroless plating method, and then the substitution plating method. It is preferable to form a plating layer made of a highly conductive metal on the surface of the base plating layer. The plating solution used for the electroless plating or the substitution plating is not particularly limited, but variously sold products. Can be used.

Also, when the surface of the magnetic core particles is coated with a highly conductive metal, the particles may aggregate. Since conductive particles having a larger particle size may be generated, it is preferable to classify the conductive particles as necessary. As a result, conductive particles having an intended particle size can be obtained. It is definitely obtained.

Examples of the classification device for performing the classification treatment of the conductive particles include those exemplified as the classification device used for the classification treatment for preparing the above-described magnetic core particles.

[0054] The conductive particles P in the connection conductive portion 24 are preferably used in such a ratio that the volume fraction is 10 to 60%, and preferably 15 to 50%. If this ratio is less than 10%, the connecting conductive part 24 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive part 24 for connection becomes fragile, and the elasticity necessary for the conductive part 24 for connection may not be obtained immediately.

[0055] As the material constituting the contact member 27, it is preferable to use a metal material exhibiting magnetism, and specific examples thereof include nickel, cobalt, and alloys thereof. The thickness of the contact member 27 is preferably 1 to: LOO / zm, more preferably 5 to 40 / zm. If this thickness is too small, it may be difficult to use as a mask in laser processing in the manufacturing method described later. On the other hand, if this thickness is excessive, a large pressure may be required to compressively deform the connecting conductive portion 24 in the elastic anisotropic conductive film 23, which is preferable.

[0056] In the present invention, the anisotropic conductive connector 20 includes conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material on a releasable support plate. A contact member made of a metal having a magnetic property according to a specific pattern corresponding to the pattern of the electrode to be inspected is formed on the surface of the conductive elastomer material layer. In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form one conductive elastomer layer. Then, this conductive elastomer layer is laser processed to remove portions other than the portion where the contact member ₂₇ is disposed.

On the releasable support plate, a plurality of connecting conductive portions 24 arranged according to a specific pattern are formed, and each of the connecting conductive portions 24 formed on the releasable support plate is attached to the frame plate 2. It penetrates into an insulating material layer made of a liquid polymer material forming material that is cured to become an elastic polymer material formed so as to close the opening of 1 and in this state, the insulating material layer is hardened. This is obtained by forming the insulating portion.

Hereinafter, a method for manufacturing the anisotropic conductive connector 20 will be specifically described.

[0057] The anisotropic conductive connector 20 described above can be manufactured as follows.

A frame plate 21 in which an opening 22 is formed corresponding to an electrode region in which electrodes to be inspected are arranged in all integrated circuits formed on a wafer to be inspected is produced. Here, the method for forming the opening 22 of the frame plate 21 is appropriately selected according to the material constituting the frame plate 21, and for example, an etching method or the like can be used.

[0058] << Formation of one layer of conductive elastomer >>

First, a contact member composite 27F having a plurality of contact members 27 arranged according to a specific pattern is manufactured.

More specifically, as shown in FIG. 4, the openings 31K are formed on the metal foil 30 according to a specific pattern corresponding to the pattern of the conductive part for connection to be formed, that is, the pattern of the electrode to be inspected, by a photolithography technique. Then, a resist layer 31 is formed. Thereafter, the surface of the exposed portion of the metal foil 30 through the opening 31K of the resist layer 31 is subjected to a plating treatment with a metal exhibiting magnetic properties, so that the opening 31K of the resist layer 31 is formed as shown in FIG. A contact member 27 is formed on each of the two. As a result, a contact member composite 27F in which the contact member 27 is formed on the metal foil 30 according to a specific pattern is obtained.

[0059] In the above, as the metal foil 30, copper, nickel, or the like can be used. Further, the metal foil 30 may be laminated on a resin film.

The thickness of the metal foil 30 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.

The thickness of the resist layer 31 is set according to the thickness of the contact member 27 to be formed.

[0060] Next, magnetic properties are formed in the liquid polymer material forming material that is cured to become an elastic polymer material. As shown in FIG. 6, a conductive elastomer material is prepared on a releasable support plate 35 for forming a conductive part for connection, as shown in FIG. Is applied to form a conductive elastomer material layer 24A. Then, as shown in FIG. 7, the contact member composite 27F is disposed on the conductive elastomer material layer 24A so that each of the contact members 27 is in contact with the conductive elastomer material layer 24A. . Here, in the conductive elastomer material layer 24A, the conductive particles P exhibiting magnetism are contained in a dispersed state.

Next, a magnetic field is applied to the conductive elastomer material layer 24A via the contact member 27 in the thickness direction of the conductive elastomer material layer 24A. As a result, since the contact member 27 is formed of a metal exhibiting magnetism, a magnetic field having a strength higher than that of the other portion is formed in the portion where the contact member 27 is disposed in the conductive elastomer material layer 24A. Is done. As a result, as shown in FIG. 8, the conductive particles P dispersed in the conductive elastomer material layer 24A gather at the portion where the contact member 27 is disposed, and further, the conductive elastomer material material. Oriented so as to be aligned in the thickness direction of the layer 24A. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 24A, or after stopping the action of the magnetic field, the conductive elastomer material layer 24A is cured, as shown in FIG. In addition, a conductive elastomer layer 24B, which is contained in an elastic polymer substance in a state in which the conductive particles P are aligned in the thickness direction, is formed in a state of being supported on the releasable support plate 35. The

In the above, as a material constituting the releasable support plate 35, metals, ceramics, resins, composite materials thereof and the like can be used.

As a method of applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 24A is set according to the thickness of the connecting conductive portion to be formed.

As means for applying a magnetic field to the conductive elastomer material layer 24A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 24A is 0.2 to 2.5 Tesla. Is preferred.

The curing treatment of the conductive elastomer material layer 24A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the conductive elastomer material layer 24A, the time required to move the conductive particles, and the like.

First, as shown in FIG. 10, by removing the metal foil 30 in the contact member composite 27F disposed on the conductive elastomer layer 24B by etching, the contact member 27 and the resist layer are removed. Expose 31. Then, laser processing is performed on the conductive elastomer layer 24B and the resist layer 31 using the contact member 27 as a mask, so that part of the resist layer 31 and the conductive elastomer layer 24B is removed. As shown in FIG. 11, a plurality of connection conductive portions 24 arranged according to a specific pattern and provided with contact members 27 are formed on the releasable support plate 35.

Here, the laser processing is preferably performed using a carbon dioxide laser, whereby the connection conductive portion 24 having a desired form can be reliably formed.

[0063] << Formation of Insulating Portion >>

As shown in FIG. 12, a releasable support plate 35A for forming an insulating portion is prepared, and a frame plate 21 is disposed on the surface of the releasable support plate 35A and cured to be an insulating elastic polymer. The insulating material layer 25A is formed by applying a liquid polymer material forming material as a material. Next, as shown in FIG. 13, the releasable support plate 35 on which the plurality of conductive portions 24 for connection, each provided with the contact member 27, is formed, and the releasability on which the insulating material layer 25A is formed. By superimposing on the support plate 35A, each of the connecting conductive portions 24 is infiltrated into the insulating material layer 25A, brought into contact with the releasable support plate 35A, and further pressurized to connect the conductive portions for connection. Each of the portions 24 is deformed to be compressed in the thickness direction, and an insulating portion material layer 25A is formed between the adjacent conductive portions 24 for connection. Thereafter, in this state, the insulating material layer 25A is cured, so that as shown in FIG. 14, the insulating portions 25 that insulate them from each other are provided around the conductive portions 24 for connection. The elastic anisotropic conductive film 23 is formed integrally with the connecting conductive portion 24, thereby forming the elastic anisotropic conductive film 23. Then, by releasing the mold from the releasable support plates 35 and 35A, each of the compressed connecting conductive parts 24 is restored to the original form, and as a result, it protrudes from both surfaces of the insulating part 25. Thus, the anisotropic conductive connector 20 having the configuration shown in FIG. 1 is obtained.

[0064] As described above, as the material constituting the releasable support plate 35A, the same material as the releasable support plate 35 for forming the connecting conductive portion can be used.

As a method for applying the polymer material forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the insulating part material layer 25A is set according to the thickness of the insulating part to be formed. The curing process of the insulating part material layer 25A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 25A.

[0065] According to the above manufacturing method, the contact member 27 exhibiting magnetism is arranged on the conductive elastomer material layer 24A according to a specific pattern corresponding to the pattern of the electrode to be inspected in the wafer to be inspected. In this state, by applying a magnetic field in the thickness direction of the conductive elastomer material layer 24A and curing the conductive elastomer material layer 24A, the resulting conductive elastomer layer 24B has the contact member 27 The conductive particles P in the arranged portion become dense, and the conductive particles P in the other portions become sparse. Therefore, by using the contact member 27 as a mask to process the conductive elastomer layer 24B with a laser, the contact member 27 in the conductive elastomer layer 24B can be disposed and the portion can be easily removed. As a result, it is possible to reliably form the connecting conductive portion 24 in the desired form according to a specific pattern. Then, after forming a plurality of connecting conductive portions 24 arranged according to a specific pattern, an insulating portion material layer 25A is formed between the connecting conductive portions 24 and cured to form insulating portions. Therefore, it is possible to reliably obtain the insulating portion 25 in which the conductive particles P are not present. Therefore, according to the anisotropic conductive connector 20 obtained by such a method, even when the pitch of the electrodes to be inspected on the wafer to be inspected is very small and densely arranged, The required electrical connection is reliably achieved for each of the electrodes. Therefore, the force can be manufactured at a low cost.

Further, since the contact member 27 is provided on the connecting conductive portion 24 in the elastic anisotropic conductive film 23, it is not necessary to use a sheet-like probe when inspecting the wafer. Therefore, it is possible to obtain a probe card having a simple structure and to avoid a connection failure due to a positional deviation of the sheet-like probe.

[0066] In addition, since each of the elastic anisotropic conductive films 23 is supported by the opening edge of the frame plate 21, it is difficult to be deformed and in electrical connection work with a wafer that is to be handled and immediately inspected. Positioning and holding and fixing to the wafer can be easily performed. Further, each of the openings 22 of the frame plate 21 is formed corresponding to an electrode region in which the electrodes to be inspected of all the integrated circuits formed on the wafer to be inspected are arranged. Since the elastic anisotropic conductive film 23 to be arranged may have a small area, it is easy to form the individual elastic anisotropic conductive film 23.

In addition, the elastic anisotropic conductive film 23 having a small area has a small absolute amount of thermal expansion in the surface direction of the elastic anisotropic conductive film 23 even when subjected to a thermal history. The thermal expansion in is reliably regulated by the frame plate 21. However, the thermal expansion of the anisotropic conductive connector 20 as a whole depends on the thermal expansion of the material composing the frame plate 21, so that a material having a low coefficient of thermal expansion is used as the material composing the frame plate 21. Even when a thermal history due to change is received, the position of the conductive portion 24 for connection in the anisotropic conductive connector 20 and the electrode to be inspected on the wafer is prevented, so that a good electrical connection state is stable. Maintained.

FIG. 15 is a plan view showing a second example of the anisotropically conductive connector according to the present invention.

The anisotropic conductive connector 20 of the second example includes a rectangular plate-like frame plate 21 in which a plurality of openings 22 extending through the thickness direction are formed. The opening 22 of the frame plate 21 corresponds to the pattern of the electrode region in which the electrodes to be inspected are formed in, for example, 32 (8 × 4) integrated circuits formed on the wafer to be inspected. Is formed. A plurality of anisotropic anisotropic conductive films 23 having conductivity in the thickness direction are arranged on the frame plate 21 so as to be supported by the opening edges of the frame plate 21 so as to block the one opening 22 respectively. The The anisotropic conductive connector 20 of the second example Other configurations are the same as those of the anisotropic conductive connector 20 of the first example.

The anisotropic conductive connector 20 of the second example can be manufactured in the same manner as the anisotropic conductive connector 20 of the first example.

According to the anisotropic conductive connector 20 of the second example, the same effect as that of the anisotropic conductive connector 20 of the first example can be obtained.

FIG. 16 is a cross-sectional view illustrating the configuration of a first example of a wafer inspection probe card (hereinafter simply referred to as a “probe card”) according to the present invention, and FIG. 17 is a diagram of the first example. It is sectional drawing for description which shows the structure of the principal part of a lobe card.

The probe card 10 of the first example is used for performing a burn-in test of each integrated circuit in a wafer state on a wafer on which a plurality of integrated circuits are formed, for example. The circuit board 11 and the anisotropic conductive connector 20 of the first example shown in FIG. 1 arranged on one surface (the upper surface in FIGS. 16 and 17) of the circuit board 11 for inspection are composed of .

[0069] As shown in FIG. 18, the inspection circuit board 11 has a disk-shaped first substrate element 12, and the surface of the first substrate element 12 (the upper surface in FIGS. 16 and 17). In the central portion of FIG. 2, a regular octagonal plate-like second substrate element 15 is disposed, and this second substrate element 15 is held by a holder 14 fixed to the surface of the first substrate element 12. . In addition, a reinforcing member 17 is provided at the center of the back surface of the first substrate element 12.

A plurality of connection electrodes (not shown) are formed in an appropriate pattern at the center of the surface of the first substrate element 12. On the other hand, as shown in FIG. 19, a lead electrode portion in which a plurality of lead electrodes 13 are arranged along the circumferential direction of the first substrate element 12 at the peripheral edge portion on the back surface of the first substrate element 12. 13R is formed. The pattern of the lead electrode 13 is a pattern corresponding to the pattern of the input / output terminal of the controller in the wafer inspection apparatus described later. Each of the lead electrodes 13 is electrically connected to the connection electrode via an internal wiring (not shown).

On the surface of the second substrate element 15 (upper surface in FIGS. 16 and 17), a plurality of inspection electrodes 16 are inspected in all integrated circuits formed on the wafer to be inspected. The inspection electrode portion 16R is formed in accordance with a pattern corresponding to the pole pattern. On the other hand, on the back surface of the second substrate element 15, a plurality of terminal electrodes (not shown) are arranged according to an appropriate pattern, and each of the terminal electrodes is connected to the inspection electrode 16 via an internal wiring (not shown). It is electrically connected!

The connection electrode of the first substrate element 12 and the terminal electrode of the second substrate element 15 are electrically connected by appropriate means.

[0070] As a substrate material constituting the first substrate element 12 in the circuit board 11 for inspection, conventionally known various materials can be used, and specific examples thereof include glass fiber reinforced epoxy resin. Examples thereof include composite resin substrate materials such as glass fiber reinforced phenol resin, glass fiber reinforced polyimide resin, and glass fiber reinforced bismaleimide triazine resin.

As a material for forming the second substrate element 15 in the circuit board for inspection 11, more preferably it is preferred instrument Sen'netsu膨expansion coefficient is used the following ^{3 X 10- 5 Ζκ 1 X 10-} 7 ~ 1 X 10 "VK, particularly preferably ^{^{1 X 10- 6 ~6 X 10- 6}} Ζκ. as tool body examples of such substrate materials, Pyrex (registered trademark) glass, quartz glass, alumina, beryllia, carbide An inorganic substrate material made of silicon, aluminum nitride, boron nitride or the like, or a metal plate made of iron-nickel alloy steel such as 42 alloy, Kovar, or Invar as a core material, such as epoxy resin or polyimide resin. Examples include laminated substrate materials in which fat is laminated.

[0071] The holder 14 has a regular octagonal opening 14K that fits the outer shape of the second substrate element 15, and the second substrate element 15 is accommodated in the opening 14K. The outer edge of the holder 14 is circular.

[0072] According to the probe card 10 of the first example as described above, since the anisotropic conductive connector 20 shown in Fig. 1 is provided, the pitch of the electrodes to be inspected on the wafer to be inspected is very small and highly densely arranged. Even if it is, it is possible to reliably achieve the required electrical connection to each of the electrodes to be inspected. The connection state is kept stable. Therefore, in the wafer burn-in test, it is possible to stably maintain a good electrical connection to the wafer.

FIG. 20 is an explanatory cross section showing the configuration of the second example of the probe card according to the present invention. FIG. 21 is an explanatory cross-sectional view showing a configuration of a main part of the probe card of the second example.

The probe card 10 of the second example is used for performing a probe test of each integrated circuit in the state of the wafer on a wafer on which a plurality of integrated circuits are formed, for example. 11 and an anisotropic conductive connector 20 of the second example shown in FIG. 15 arranged on one surface (the upper surface in FIGS. 20 and 21) of the circuit board 11 for inspection.

In the inspection circuit board 11 of the probe card 10 of the second example, as shown in FIG. 22, the integrated circuit formed on the wafer to be inspected is formed on the surface of the second substrate element 15. For example, an inspection electrode portion 16R in which a plurality of inspection electrodes 16 are arranged according to a pattern corresponding to the pattern of the electrode to be inspected in 32 (8 × 4) integrated circuits is formed. Other configurations of the inspection circuit board 11 are basically the same as those of the inspection circuit board 11 in the probe card 10 of the first example.

[0074] According to the probe card 10 of the second example as described above, since the anisotropic conductive connector 20 shown in Fig. 15 is provided, the pitch of the electrodes to be inspected on the wafer to be inspected is very small and high density. Even if it is arranged, it is possible to reliably achieve the required electrical connection to each of the electrodes to be inspected, and even when it receives a thermal history due to a temperature change, good electrical connection can be achieved. Connection state is maintained stably. Therefore, it is possible to stably maintain a good electrical connection state to the wafer in the wafer probe test.

FIG. 23 is an explanatory cross-sectional view showing the configuration of the third example of the probe card according to the present invention, and FIG. 24 is an explanatory cross-sectional view showing the configuration of the main part of the probe card of the third example. It is a figure.

The probe card 10 of the third example is used for performing a burn-in test of each of the integrated circuits in a batch on the wafer on which a plurality of integrated circuits are formed. The circuit board for inspection 11 having the same configuration as the probe card 10 in the example of FIG. 14 and an anisotropic conductive elastomer layer integrally formed on one surface (the upper surface in FIG. 23) of the circuit board for inspection 40 And a contact member 27 provided integrally on the connecting conductive portion 41 in the anisotropic conductive elastomer layer 40. [0076] The anisotropic conductive elastomer layer 40 is arranged in accordance with the same pattern as the pattern of the inspection electrode 16 on the inspection circuit board 11, and adjacent to the plurality of connection conductive portions 41 extending in the thickness direction. Insulating parts 42 are formed between the connecting conductive parts 41 to be connected to each other, and are integrally bonded to each of the connecting conductive parts 41. The anisotropic conductive elastomer layer 40 is arranged such that each of the connecting conductive portions 41 is positioned on the inspection electrode 16 in the inspection circuit board 11.

As shown in an enlarged view in FIG. 25, each connection conductive portion 41 is configured to be contained in an insulating elastic polymer substance in a state in which the conductive particles P exhibiting magnetism are aligned in the thickness direction. ing. On the other hand, the insulating part 42 is made of an elastic polymer material that does not contain the conductive particles P at all. The elastic polymer material constituting the connecting conductive portion 41 and the elastic polymer material constituting the insulating portion 42 may be of different types or the same type.

In the illustrated example, on the surface of the anisotropic conductive elastomer layer 40 (upper surface in FIG. 25), a protruding portion from which the connecting conductive portion 41 protrudes also the surface force of the insulating portion 42 is formed. According to such an example, the degree of compression by pressurization is much larger than that of the insulating portion 42 to the connecting conductive portion 41, so that the resistance value is sufficiently low!ヽ The conductive path is reliably formed in the connecting conductive portion 41, and this makes it possible to reduce the change in the resistance value against the change or fluctuation of the applied pressure, and as a result, acts on the anisotropic conductive elastomer layer 40. Even if the applied pressure is not uniform, it is possible to prevent variation in conductivity between the conductive portions 41 for connection.

[0077] The thickness of the connecting conductive portion 41 is preferably 50 to 3000 µm, more preferably 70 to 2500 µm, and particularly preferably <100 to 2000 µm. When the thickness force is 50 μm or more, the conductive portion for connection 41 having sufficient strength can be obtained with certainty. On the other hand, when the thickness is 3 000 m or less, the connecting conductive portion 41 having the required conductive characteristics can be obtained with certainty.

The protruding height of the connecting conductive portion 41 from the insulating portion 42 is preferably 10% or more of the thickness of the connecting conductive portion 41, more preferably 20% or more. Such a bump By forming the connecting conductive portion 41 having a protruding height, the connecting conductive portion 41 is sufficiently compressed with a small applied pressure, so that good conductivity can be reliably obtained.

The protruding height is preferably 100% or less of the shortest width or diameter of the connecting conductive portion 41, more preferably 70% or less. By forming the connecting conductive portion 41 having such a protruding height, the connecting conductive portion 41 is not buckled when pressed, and thus the desired conductivity can be reliably obtained. .

[0078] The elastic polymer material forming the conductive portion 41 for connection and the insulating portion 42 may be a high elastic material for forming the conductive portion 24 for connection and the insulating portion 25 in the anisotropic conductive connector 20 of the first example described above. The thing similar to a molecular substance can be used.

The conductive particles P contained in the connecting conductive part 41 are the same as the conductive particles P contained in the connecting conductive part 21 in the anisotropic conductive connector 20 of the first example described above. Can be used.

The content ratio of the conductive particles P in the conductive part 41 for connection is preferably 10 to 60%, preferably 15 to 50% in terms of volume fraction. When this ratio is less than 10%, the connection conductive part 41 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio exceeds 60%, the obtained conductive part 41 for connection becomes fragile and the elasticity necessary for the conductive part 41 for connection may not be obtained immediately.

[0079] On each surface of the connecting conductive portion 41 in the anisotropic conductive elastomer layer 40, a flat contact member 27 made of metal is provided integrally with the connecting conductive portion 41. As the metal constituting the contact member 27, a metal exhibiting magnetism is used, and specific examples thereof include nickel, cobalt, and alloys thereof.

The thickness of the contact member 27 is preferably 1 to: LOO / z m, more preferably 5 to 40 μm.

[0080] In the present invention, the probe card 10 of the first example is obtained through the following steps (a) to (d).

(a) Manufacturing a contact member composite in which a plurality of contact members 27 each made of a metal exhibiting magnetism are formed on a metal foil in accordance with a specific pattern related to the inspection electrode 16 of the inspection circuit board 11 To do. (b) On the contact member composite, a material layer for a conductive elastomer is formed in which a liquid polymer material forming material that is cured to become an elastic polymer material contains conductive particles P exhibiting magnetism. On the conductive elastomer material layer, a plurality of metal masks each made of a metal exhibiting magnetism are disposed so as to face the contact member 27 with the conductive elastomer material layer interposed therebetween, In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer.

(c) A plurality of conductive portions 41 for connection arranged according to a specific pattern are formed by removing a portion other than the portion located between the contact member 27 and the metal mask by laser processing the conductive elastomer layer. To do.

(d) The metal mask disposed on each connection conductive portion 41 is removed, and then the contact member composite formed with the connection conductive portion 41 is made of a material that is cured to become an elastic polymer substance. Each of the inspection electrodes 16 of the inspection circuit board 11 and the corresponding connection conductive part 41 are brought into contact with each other by being superimposed on the inspection circuit board 11 on which the part material layer is formed. The insulating portion 42 is integrally formed on the inspection circuit board 11 by curing the insulating portion material layer in this state.

The method for manufacturing the probe card of the third example will be specifically described below.

A contact member composite 27 F in which a plurality of contact members 27 are formed on a metal foil 30 in accordance with a specific pattern is manufactured in the same manner as the method for manufacturing the anisotropic conductive connector 10 of the first example described above (see FIG. 4 and Figure 5).

As shown in FIG. 26, a resist layer 47 having an opening 47K formed in accordance with a specific pattern is formed on the metal foil 46 by a photolithography technique. Thereafter, the surface of the portion exposed through the opening 47K of the resist layer 47 in the metal foil 46 is subjected to a plating process using a metal exhibiting magnetism, thereby forming the opening 47K of the resist layer 47 as shown in FIG. A metal mask 48 is formed on each. As a result, a metal mask composite 48F in which a plurality of metal masks 48 are formed on the metal foil 46 in accordance with a specific pattern is obtained. In the above, as the metal foil 46, copper, nickel or the like can be used. Further, the metal foil 46 may be laminated on a resin film.

The thickness of the metal foil 46 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.

The thickness of the resist layer 47 is set according to the thickness of the metal mask 48 to be formed. As a material constituting the metal mask 48, nickel, cobalt, or an alloy thereof can be used.

A conductive elastomer material is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material. A conductive elastomer material layer 41A is formed by applying a conductive elastomer material on one surface of the body 27F on which the contact member 27 is formed. Then, as shown in FIG. 29, a metal mask composite 48F is formed on the conductive elastomer material layer 41A, and each of the metal masks 48 passes through the conductive elastomer material layer 41A. The contact members 27 are arranged so as to face each other. Here, in the conductive elastomer material layer 41A, the conductive particles P exhibiting magnetism are contained in a dispersed state.

Next, a magnetic field is applied to the conductive elastomer material layer 41A through the contact member 27 and the metal mask 48 in the thickness direction of the conductive elastomer material layer 41A. As a result, since each of the contact member 27 and the metal mask 48 is formed of a metal exhibiting magnetism, the portion of the conductive elastomer material layer 41A located between the contact member 27 and the metal mask 48 is not provided. A magnetic field having a larger intensity than that of other portions is formed. As a result, as shown in FIG. 30, the conductive particles P dispersed in the conductive elastomer material layer 41A gather in a portion located between the contact member 27 and the metal mask 48, and further, The conductive elastomer material layer 41A is aligned in the thickness direction. And while continuing the action of the magnetic field on the conductive elastomer material layer 41A, or After stopping the operation of the conductive elastomer material 41A, the conductive elastomer material layer 41A is cured so that the conductive particles P are aligned in the thickness direction in the elastic polymer substance as shown in FIG. The contained conductive elastomer layer 41B is integrally formed on the contact member composite 27F. In the conductive elastomer layer 41B, the conductive particles in the portion located between the contact member 27 and the metal mask 48 are dense, and the conductive particles in the other portions are sparse.

In the above, as a method for applying the material for conductive elastomer, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 41A is set in accordance with the thickness of the connecting conductive portion to be formed.

As means for applying a magnetic field to the conductive elastomer material layer 41A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 41A is preferably 0.2 to 2.5 Tesla.

The curing process of the conductive elastomer material layer 41A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the conductive elastomer material layer 41A, the time required to move the conductive particles, and the like.

[0084] <Formation of conductive portion for connection>

First, as shown in FIG. 32, by removing the metal foil 46 in the metal mask composite 48F disposed on the conductive elastomer layer 41B by etching, the metal mask 48 and the resist layer 47 are removed. Expose. Then, by performing laser processing on the conductive elastomer layer 41B and the resist layer 47, the resist layer 47, the conductive elastomer layer 41B, and the portions other than the portion located between the contact member 27 and the metal mask 48 and The resist layer 45 is removed, and as a result, as shown in FIG. 33, the connection conductive portion 41 is formed on each contact member 27 in the contact member composite 27F. Thereafter, the metal mask 48 is also peeled off from the surface force of the connecting conductive portion 41.

Here, the laser processing is preferably a carbon dioxide laser or an ultraviolet laser. As a result, it is possible to reliably form the conductive part 41 for connection in the desired form.

[0085] <Formation of insulating part>

As shown in FIG. 34, by applying a liquid polymer substance forming material that is cured to become an insulating elastic polymer substance on the surface of the second substrate element 15 in the circuit board for inspection, The insulating part material layer 42A is formed. Next, as shown in FIG. 35, the contact member composite body 27F in which the plurality of conductive portions for connection 41 are formed is placed on the second substrate element 15 in the circuit board for inspection in which the insulating layer material layer 42A is formed. By superimposing, each of the inspection electrodes 16 of the second substrate element 15 is brought into contact with the connection conductive portion 41 corresponding thereto. As a result, the insulating material layer 42A is formed between the adjacent connecting conductive parts 41. Thereafter, in this state, the insulating part material layer 42A is cured, so that the insulating part 42 that insulates them from each other between the adjacent connecting conductive parts 41 as shown in FIG. It is formed integrally with the connecting conductive portion 41 and the second substrate element 15 in the inspection circuit board.

Then, by removing the metal foil 30 in the contact member composite 27F, for example, by etching, an anisotropically conductive elastomer layer 40 is formed on the surface of the second substrate element 15 in the circuit board 11 for inspection. Thus, the probe card 10 having the configuration shown in FIG. 23 is obtained, in which the contact member 30 is provided on each surface of each of the connecting conductive portions 41 of the anisotropic conductive elastomer layer 40.

As described above, as a method for applying the polymer substance-forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the insulating part material layer 42A is set according to the thickness of the insulating part to be formed. The curing process of the insulating portion material layer 42A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 42A.

[0087] According to such a manufacturing method, the conductive elastomer layer 41B is laser processed and a part thereof is removed to form the connection conductive portion 41. Therefore, the connection having the desired conductivity is achieved. A conductive part 41 is obtained. Further, a conductive elastomer material layer 41A is formed on a contact member composite 27F in which a plurality of contact members 27 each made of a metal exhibiting magnetism are formed according to a specific pattern related to the inspection electrode 16, It is obtained by applying a magnetic field in the thickness direction of the conductive elastomer material layer 41A in a state where the metal mask 48 showing magnetism is arranged on the conductive elastomer material layer 41A according to a specific pattern. The conductive elastomer layer 41B becomes dense with the conductive particles P in a portion located between the contact member 27 and the metal mask 48, and the conductive particles P in other portions become sparse. Therefore, when the conductive elastomer layer 41B is laser-processed, the contact member 27 in the conductive elastomer layer 41B can be easily removed, so that the conductive conductor for connection in the expected form can be removed. The portion 41 can be reliably formed according to a specific pattern.

In addition, the conductive elastomer layer 41A formed on the contact member composite 27F is hardened to obtain the conductive elastomer layer 40B, and each of the contact members 27 in the contact member composite 27F. Therefore, the connection conductive portion 41 in which the contact member 27 is physically provided can be formed.

In addition, after forming a plurality of connection conductive portions 41 arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected, each of these connection conductive portions 41 is formed with an insulating material layer 42A. In this state, the insulating material layer 42A is cured so that it does not exist at all and the insulating portion 42 is used for inspection. An anisotropic conductive elastomer layer 40 integrally formed on the circuit board 11 can be formed.

Therefore, according to the probe card 10 obtained by such a method, a plurality of connecting conductive parts 41 having the desired conductivity are isolated by the insulating parts 42 in which no conductive particles are present. Even if the pitch of the electrodes to be inspected in the wafer is extremely small, the required insulation between the adjacent electrodes to be inspected is ensured, and a good electrical connection state to the wafer can be reliably achieved. it can.

In addition, the anisotropic conductive elastomer layer 40 is integrally formed on the inspection circuit board 11, and the contact force 27 is also provided integrally with the connecting conductive part 41. Since it is not necessary to use a sheet-like probe, it is possible to prevent poor connection due to misalignment between the connecting conductive part 41 and the inspection electrode 16 even when a thermal history due to a temperature change is received. Connection failure due to misalignment of the probe can be avoided, and therefore, a good electrical connection to the wafer can be stably maintained. Further, since it is not necessary to use a sheet-like probe, it is possible to obtain a probe card 10 having a simple structure that does not require assembling work.

FIG. 37 is an explanatory cross-sectional view showing the configuration of the fourth example of the probe card according to the present invention, and FIG. 38 is an explanatory cross-sectional view showing the configuration of the main part of the probe card of the fourth example. .

The probe card 10 of the fourth example is used to perform a probe test of each integrated circuit in a wafer state on a wafer on which a plurality of integrated circuits are formed, for example. An inspection circuit board 11 having the same configuration as the probe card 10 in the example, and an anisotropic conductive elastomer layer 40 integrally formed on one surface (the upper surface in FIGS. 37 and 38) of the inspection circuit board 11; The anisotropic conductive elastomer layer 40 is formed of a contact member 27 provided integrally on the connecting conductive portion 41. The anisotropic conductive elastomer layer 40 is arranged in accordance with the same pattern as the pattern of the inspection electrode 16 on the inspection circuit board 11 and each of the connection conductive portions 41 extending in the thickness direction and adjacent to the connection conductive portion 41. The conductive portion 41 is formed by an insulating portion 42 that is integrally bonded to each of the connecting conductive portions 41 and insulates the connecting conductive portions 41 from each other. The directionally conductive elastomer layer 40 is arranged such that each of the connecting conductive portions 41 is positioned on the inspection electrode 16 in the inspection circuit board 11. Each of the connecting conductive portions 41 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer material in an aligned state in the thickness direction (see FIG. 25). On the other hand, the insulating part 42 is made of an elastic polymer material that does not contain the conductive particles P at all. The elastic polymer material constituting the connecting conductive portion 41 and the elastic polymer material constituting the insulating portion 42 may be of different types or the same type.

弹 constituting the anisotropic conductive elastomer layer 40 in the probe card 10 of the fourth example As the conductive polymer substance and the conductive particles, the same elastic polymer substance and conductive particles that constitute the elastic anisotropic conductive film 23 in the anisotropic conductive connector 20 of the first example may be used. it can.

A flat contact member 27 made of a metal is integrally provided on the surface of each of the connecting conductive portions 41 in the anisotropic conductive elastomer layer 40. The material and dimensions of the contact member 27 are the same as those of the probe card 10 according to the third example described above.

In the present invention, the probe card 10 of the fourth example can be manufactured in the same manner as the probe card 10 of the third example.

That is, the probe card 10 of the fourth example is obtained through the following steps (a) to (d).

(a) Manufacturing a contact member composite in which a plurality of contact members 27 each made of a metal exhibiting magnetism are formed on a metal foil in accordance with a specific pattern related to the inspection electrode 16 of the inspection circuit board 11 To do.

(b) On the contact member composite, a material layer for a conductive elastomer is formed in which a liquid polymer material forming material that is cured to become an elastic polymer material contains conductive particles P exhibiting magnetism. On the conductive elastomer material layer, a plurality of metal masks each made of a metal exhibiting magnetism are disposed so as to face the contact member 27 with the conductive elastomer material layer interposed therebetween, In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer.

(d) The metal mask disposed on each connection conductive portion 41 is removed, and then the contact member composite formed with the connection conductive portion 41 is made of a material that is cured to become an elastic polymer substance. Each of the inspection electrodes 16 of the inspection circuit board 11 is paired with the corresponding conductive portion 41 for connection by superimposing it on the inspection circuit board 11 on which the part material layer is formed. In this state, the insulating portion material layer is cured and the insulating portion 42 is integrally formed on the inspection circuit board 11.

[0091] According to such a manufacturing method, the conductive conductive layer 41 is formed by laser processing of one layer of the conductive elastomer and removing a part thereof, and thus has the desired conductivity. A conductive part 41 for connection is obtained.

In addition, a conductive elastomer material layer is formed on a contact member composite in which a plurality of contact members 27 each made of a metal exhibiting magnetism are formed according to a specific pattern related to the inspection electrode 16, and the conductive material In order to apply a magnetic field in the thickness direction of the conductive elastomer material layer in a state where metal masks showing magnetism are arranged in accordance with a specific pattern on the elastomer material layer, the resulting conductive elastomer layer is obtained. Is dense with the conductive particles P in the portion located between the contact member 27 and the metal mask, and the conductive particles P in the other portions are sparse. Therefore, by processing one layer of the conductive elastomer with a laser, a portion of the conductive elastomer layer where the contact member 27 is not disposed can be easily removed. It can be reliably formed according to a specific pattern.

Further, by curing the conductive elastomer material layer formed on the contact member composite, each contact member 27 in the contact member composite is bonded to the resulting conductive elastomer layer. After that, it is possible to form the connection conductive portion 41 in which the contact member 27 is physically provided.

Further, after forming a plurality of connection conductive portions 41 arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected, each of the connection conductive portions 41 was formed with an insulating material layer. Insulating circuit board 11 is in contact with each of inspection electrodes 16, and in this state, insulating material layer is hardened, so that insulation 22 without any conductive particles P is present at the inspection circuit board. An anisotropic conductive elastomer layer 40 integrally formed on the substrate 11 can be formed.

Therefore, according to the probe card 10 obtained by such a method, the plurality of connecting conductive portions 41 having the desired conductivity are isolated by the insulating portions 42 having no conductive particles. The pitch of the electrodes to be inspected on the wafer to be inspected is extremely small Even if it is not necessary, the required insulation between the adjacent electrodes to be inspected is ensured, and a good electrical connection state to the wafer can be reliably achieved.

Further, the anisotropic conductive elastomer layer 40 is formed integrally with the inspection circuit board 11, and the contact member 27 is also provided integrally with the connection conductive part 41, so that the sheet-like probe is formed. Therefore, even when a thermal history due to a temperature change is received, it is possible to prevent a connection failure due to misalignment between the connection conductive portion 41 and the inspection electrode 16, and the sheet-like probe. Connection failure due to misalignment can be avoided, and therefore a good electrical connection state to the wafer can be stably maintained. Further, since it is not necessary to use a sheet-like probe, it is possible to obtain a probe card 10 having a simple structure that does not require assembling work.

[Wafer inspection equipment]

FIG. 39 is a cross-sectional view for explaining the outline of the configuration of the first example of the wafer inspection apparatus according to the present invention, and FIG. 40 is an enlarged view of the main part of the wafer inspection apparatus of the first example. It is sectional drawing for description. This first wafer inspection apparatus is for performing a burn-in test of the integrated circuit in a batch on the wafer for each of a plurality of integrated circuits formed on the wafer.

The wafer inspection apparatus of the first example detects the temperature of the wafer 6 to be inspected, power supply for detecting the wafer 6, signal input / output control, and output signal from the wafer 6 to detect the wafer. It has a controller 2 for judging whether the integrated circuit in 6 is good or bad. As shown in FIG. 41, the controller 2 has an input / output terminal portion 3R on the lower surface of which a large number of input / output terminals 3 are arranged along the circumferential direction.

Below the controller 2, the probe card 10 of the first example is held by appropriate holding means so that each force of the lead electrode 13 of the circuit board 11 for inspection faces the input / output terminal 3 of the controller 2 It is arranged in the state that was done.

A connector 4 is arranged between the input / output terminal portion 3R of the controller 2 and the lead electrode portion 13R of the inspection circuit board 11 1 in the probe card 10. The connector 4 leads the lead electrode 13 of the inspection circuit board 11 Are electrically connected to each of the input / output terminals 3 of the controller 2. The connector 4 in the example shown is The conductive pin 4A is composed of a plurality of contractible conductive pins 4A and a support member 4B that supports these conductive pins 4A. The conductive pins 4A are formed on the input / output terminal 3 of the controller 2 and the first substrate element 12. The lead electrodes 13 are arranged so as to be positioned between them.

Below the probe card 10, a wafer mounting table 5 on which a wafer 6 to be inspected is mounted is provided.

In such a wafer inspection apparatus, the wafer 6 to be inspected is placed on the wafer mounting table 5, and then the probe card 10 is pressed downward, whereby its anisotropic conductivity is achieved. Each force of the contact member 27 in the connector 20 comes into contact with each of the electrodes 7 to be inspected of the wafer 6, and each of the electrodes 7 to be inspected of the wafer 6 is pressurized by each of the contact members 27. In this state, each of the connecting conductive parts 24 in the elastic anisotropic conductive film 23 of the anisotropic conductive connector 20 is sandwiched between the test electrode 16 and the contact member 27 of the test circuit board 11 and has a thickness. As a result, a conductive path is formed in the connecting conductive portion 24 in the thickness direction. As a result, the inspection electrode 7 of the wafer 6 and the inspection electrode 16 of the inspection circuit board 11 are formed. Electrical connection with is achieved. Thereafter, the wafer 6 is heated to a predetermined temperature via the wafer mounting table 5, and in this state, a required electrical inspection is performed on each of the plurality of integrated circuits on the wafer 6.

According to the wafer inspection apparatus of the first example as described above, electrical connection to the inspection target electrode 7 of the wafer 6 to be inspected is achieved via the probe card 10 of the first example. A good electrical connection to the wafer can be reliably achieved, and the force can also stably maintain a good electrical connection to the wafer, so that in the wafer burn-in test, Ensure that the required electrical inspection is performed.

FIG. 42 is a cross-sectional view for explaining the outline of the configuration of the second example of the wafer inspection apparatus according to the present invention. The wafer inspection apparatus includes a plurality of integrated circuits formed on the wafer. In order to conduct a probe test of the integrated circuit in a wafer state.

The wafer inspection apparatus of the second example is basically the same as the wafer inspection apparatus of the first example except that the probe card 10 of the second example is used instead of the probe card 10 of the first example. It is the same composition.

In the wafer inspection apparatus of the second example, the probe card 10 is electrically connected to the inspected electrodes 7 of, for example, 32 integrated circuits in which the intermediate force of all the integrated circuits formed on the wafer 6 is also selected. Then, by repeating the process of inspecting the probe card 10 electrically connected to the electrodes 7 to be inspected of a plurality of integrated circuits selected from other integrated circuits, the wafer 6 is repeated. Probe testing is performed on all integrated circuits formed on the board.

According to the wafer inspection apparatus of the second example as described above, the electrical connection to the inspection target electrode 7 of the wafer 6 to be inspected is achieved via the probe card 10 of the second example. A good electrical connection state can be reliably achieved, and the force can also stably maintain a good electrical connection state to the wafer. Electrical inspection can be performed reliably.

FIG. 43 is a cross-sectional view for explaining the outline of the configuration of the third example of the wafer inspection apparatus according to the present invention, and FIG. 44 shows an enlarged main part of the wafer inspection apparatus of the third example. It is sectional drawing for description. The wafer inspection apparatus of the third example is for performing a burn-in test of the integrated circuit in a batch on the wafer for each of a plurality of integrated circuits formed on the wafer. The wafer inspection apparatus of the third example is the same as the wafer inspection apparatus of the first example except that the probe card 10 of the third example is used instead of the probe force card 10 of the first example. The configuration is basically the same.

In such a wafer inspection apparatus, the wafer 6 to be inspected is placed on the wafer mounting table 5, and then the probe card 10 is pressed downward, whereby the contact member 27 Each force contacts each of the electrodes 7 to be inspected on the wafer 6, and further, each of the electrodes 7 to be inspected on the wafer 6 is pressurized by each of the contact members 27. In this state, each of the connecting conductive portions 41 in the anisotropic conductive elastomer layer 40 is sandwiched between the test electrode 16 and the contact member 27 of the test circuit board 11 and compressed in the thickness direction. As a result, a conductive path is formed in the connecting conductive portion 41 in the thickness direction, and as a result, electrical connection between the electrode 7 to be inspected 7 on the wafer 6 and the electrode 16 to be inspected on the circuit board 11 for inspection is performed. Is achieved. Thereafter, the wafer 6 is heated to a predetermined temperature via the wafer mounting table 5, and in this state, required electrical inspection is performed on each of the plurality of integrated circuits on the wafer 6.

According to the wafer inspection apparatus of the third example as described above, the electrical connection to the electrode 7 to be inspected of the wafer 6 to be inspected is achieved via the probe card 10 of the third example. Even if the wafer 6 has a large area of 8 inches or more in diameter and the pitch of the electrodes 7 to be inspected is extremely small, the burn-in test reliably achieves good electrical connection to the wafer. In addition, it is possible to reliably prevent the displacement with respect to the electrode 7 to be inspected due to the temperature change, and thus it is possible to stably maintain a good electrical connection state to the wafer 6. Accordingly, in the wafer burn-in test, the required electrical inspection for the wafer can be reliably executed.

FIG. 45 is a cross-sectional view for explaining the outline of the configuration of the fourth example of the wafer inspection apparatus according to the present invention. The wafer inspection apparatus includes a plurality of integrated circuits formed on the wafer. In order to conduct a probe test of the integrated circuit in a wafer state.

The wafer inspection apparatus of the fourth example is basically the same as the wafer inspection apparatus of the first example, except that the probe card 10 of the fourth example is used instead of the probe card 10 of the first example. It is the composition.

In the wafer inspection apparatus of the fourth example, the probe card 10 is electrically connected to the electrodes 7 to be inspected of, for example, 32 integrated circuits in which the intermediate forces of all the integrated circuits formed on the wafer 6 are also selected. Then, by repeating the process of inspecting the probe card 10 electrically connected to the electrodes 7 to be inspected of a plurality of integrated circuits selected from other integrated circuits, the wafer 6 is repeated. Probe testing is performed on all integrated circuits formed on the board.

According to such a wafer inspection apparatus of the fourth example, since electrical connection to the inspection target electrode 7 of the wafer 6 to be inspected is achieved via the probe card 10 of the fourth example, the wafer 6 However, even in the case of a large area with a diameter of 8 inches or more and a very small pitch of the electrodes 7 to be inspected, a good electrical connection to the wafer in the burn-in test is possible. In addition, it is possible to reliably achieve a continuous state, and to reliably prevent misalignment with respect to the electrode 7 to be inspected due to a temperature change, thereby stably maintaining a good electrical connection state to the wafer 6. Can do. Therefore, the required electrical inspection for the wafer can be reliably executed in the probe test of the wafer.

The present invention is not limited to the above embodiment, and various modifications can be made as follows.

(1) In the anisotropic conductive connector 20, it is not indispensable that the protruding portion 26 is formed on the elastic anisotropic conductive film 23, even if the entire surface of the elastic anisotropic conductive film 23 is flat. Good.

Further, in the anisotropic conductive elastomer layer 40 of the probe card 10, it is not essential that the connecting conductive portion 41 is formed with a protrusion, and the entire surface of the anisotropic conductive elastomer layer 40 is flat. May be.

(2) The elastic anisotropic conductive film 23 in the anisotropic conductive connector 20 is electrically connected to the electrode to be inspected in addition to the connecting conductive part 24 formed according to the pattern corresponding to the pattern of the electrode to be inspected. A conductive part for non-connection may be formed without being connected.

In addition, the anisotropic conductive elastomer layer 40 of the probe card 10 is electrically connected to the electrode to be inspected in addition to the conductive portion 41 for connection formed according to the pattern corresponding to the pattern of the electrode to be inspected. However, a conductive part for non-connection may be formed.

(3) The anisotropic conductive elastomer layer 40 of the probe card 10 may be divided and formed for each inspection electrode portion 16R of the inspection circuit board 11, for example.

(4) In the formation of the connecting conductive portion 24, the connecting conductive portion 24 is formed by removing all portions of the conductive elastomer layer 24B other than the connecting conductive portion by laser processing. However, as shown in FIG. 46 and FIG. 47, the conductive portion 24 for connection can also be formed by removing only the peripheral portion of the conductive elastomer layer 24B that becomes the conductive portion for connection. . In this case, the remaining portion of the conductive elastomer layer 24B can be removed by mechanically peeling from the releasable support plate 35.

(5) The probe card 10 is integrated on the inspection circuit board 11 as shown in FIG. On the anisotropically conductive elastomer layer 40 provided on the surface, and in a state in which the conductive particles P are further aligned in the elastic polymer material so as to be aligned in the thickness direction to form a chain. A so-called dispersive anisotropic conductive elastomer sheet 45 containing the chain dispersed in the plane direction can be disposed.

(6) The connector 4 for electrically connecting the controller 2 and the inspection circuit board 11 in the wafer inspection apparatus is not limited to the one shown in FIG. 41, and various structures can be used.

Example

[0101] Hereinafter, the ability to describe specific examples of the present invention The present invention is not limited to these examples.

[0102] [Production of test wafer]

Test wafers having the configurations shown in FIGS. 49 to 51 were produced. When specifically described, the wafer (6), the diameter is more than 8 inches silicon (coefficient of linear thermal expansion 3. 3 X 10- ⁶ ZK), on those said wafer (6) with dimensions respectively 9mm A total of 393 X 9mm square integrated circuits (L) are formed. Each of the integrated circuits (L) formed on the wafer (6) has an inspected electrode region (A) in the center thereof, and the inspected electrode region (A) has a vertical direction (in FIG. 51). 40 rectangular electrodes (7) with a dimension of 200 μm in the vertical direction and a horizontal dimension of 60 μm in the horizontal direction (Fig. 51!) Are laterally spaced at a pitch of 120 μm. Arranged in a row in the direction. The total number of electrodes (7) to be inspected on the entire wafer (6) is 15720, and all the electrodes to be inspected (7) are electrically insulated from each other. Hereinafter, this wafer is referred to as “test wafer Wl”.

Instead of electrically insulating all the electrodes to be inspected (7) from each other, one of the 40 electrodes to be inspected in the integrated circuit (L) counted from the outermost electrode to be inspected (7) A wafer (6) having 393 integrated circuits (L) having the same configuration as the test wafer W1 was prepared except that every other two pieces were electrically connected to each other. Hereinafter, this wafer is referred to as “test wafer W2.”

[Fabrication of frame plate] According to the configuration shown in FIG. 52 and FIG. 53, a frame plate (diameter 8 inches) having 393 openings (22) formed corresponding to each electrode area to be inspected in the test wafer W1 according to the following conditions ( 21) was produced.

In the material of this frame plate (21) is Kovar (coefficient of linear thermal expansion 5 X 10- ⁶ ΖΚ), its thickness is 60 m. Each of the openings (22) in the frame plate (21) has a horizontal dimension (horizontal direction in FIGS. 52 and 53) of 5.5 mm and a vertical dimension (vertical direction in FIGS. 52 and 53). Is 0.4 mm.

In addition, a circular air inflow hole (H) is formed at the center position between the vertically adjacent openings (22), and the diameter thereof is lmm.

[Fabrication of forming spacer 1]

Two spacers for forming an elastic anisotropic conductive film having a plurality of openings formed corresponding to the electrode area to be inspected in the test wafer W1 were produced under the following conditions. The material of these spacers is stainless steel (SUS304), and its thickness is 20 μm. Each of the spacer openings has a horizontal dimension of 7 mm and a vertical dimension force of 4 mm.

[Preparation of magnetic core particle [A]]

Using commercially available nickel particles (Westaim, “FC1000”), magnetic core particles [A] were prepared as follows.

By Nisshin Engineering air classifier Co., Ltd. "Turbo Classifier TC- 15N" nickel particles 2 kg, specific gravity of 8.9, air flow rate 2. 5 m ³ Zmin, the rotor speed is 1, 600 rpm, a classification point of 25 m, the feed rate of the nickel particles classified under conditions of 16GZmin, collecting nickel particles 1. 8 kg, further, the nickel particles 1. 8 kg, specific gravity is 8.9, the air volume is 2. 5 m ³ Zmin Then, classification was performed under the conditions of a rotor speed of 3,000 rpm, a classification point of 10 m, and a nickel particle supply speed of 14 gZmin, and 1.5 kg of nickel particles were collected.

Next, 120 g of nickel particles classified by an air classifier were further classified by a sonic sieve “SW-20AT type” manufactured by Ritsuka Tsutsui Engineering Co., Ltd. Specifically, each has a diameter of 200 mm and an opening diameter of 25 m, 20 m, 16 μm and 8 μm. Four sieves are stacked in this order from the top, 10 g of ceramic balls with a diameter of 2 mm are introduced into each sieve, and 20 g of nickel particles are introduced into the top sieve (opening diameter is 25 μm). Classification was performed under conditions of 55 Hz for 12 minutes and 125 Hz for 15 minutes, and nickel particles collected in the bottom sieve (opening diameter: 8 μm) were collected. By performing this operation 25 times in total, 110 g of magnetic core particles [A] were prepared.

The obtained magnetic core particle [A] has a number average particle diameter of 10 m, a particle diameter variation coefficient of 10%, a BET specific surface area of 0.2 X 10 ³ m ² / kg, and a saturation magnetization of 0.6 Wb / kg. It was m ^2.

[Preparation of conductive particles [a]]

100 g of the magnetic core particle [A] was put into the treatment tank of the powder plating apparatus, and further 2 L of 0.32N hydrochloric acid aqueous solution was added and stirred to obtain a slurry containing the magnetic core particle [A]. The slurry was stirred at room temperature for 30 minutes to treat the magnetic core particles [A] with an acid, and then left to stand for 1 minute to precipitate the magnetic core particles [A], and the supernatant was removed.

Next, 2 L of pure water is added to the acid-treated magnetic core particles [A], stirred at room temperature for 2 minutes, and then allowed to stand for 1 minute to precipitate the magnetic core particles [A] and remove the supernatant. did. By repeating this operation two more times, the magnetic core particles [A] were washed.

Then, add 2 L of a gold plating solution with a gold content of 20 g / L to the magnetic core particles [A] that have been subjected to acid treatment and washing treatment, and raise the temperature in the treatment layer to 90 ° C. The slurry was prepared by stirring. In this state, the magnetic core particles [A] were replaced with gold while stirring the slurry. Thereafter, the slurry was left standing to cool to precipitate the particles, and the supernatant liquid was removed to prepare conductive particles [a] for the present invention.

The conductive particles [a] thus obtained are charged with 2 L of pure water, stirred at room temperature for 2 minutes, and then allowed to stand for 1 minute to precipitate the conductive particles [a]. The liquid was removed. This operation was further repeated twice, and then 2 L of pure water heated to 90 ° C. was added and stirred, and the resulting slurry was filtered through a filter paper to collect the conductive particles [a]. The conductive particles [a] were dried by a dryer set at 90 ° C.

The obtained conductive particles [a] have a number average particle diameter of 12 m, a BET specific surface area of 0.15 X 10 ³ mVkg, a coating layer thickness t of ll lnm, (the mass of gold forming the coating layer) ) / (Conductive particle [a] total mass) value N was 0.3. [Manufacture of contact member composite]

Prepare a laminated material in which a metal foil (30) made of copper with a thickness of S18 μm is peeled and laminated on one side of a 100 μm thick resin film made of polyethylene terephthalate. Corresponds to the pattern of the electrode to be inspected on the surface of the foil (30) by a photolithography technique using a rectangular 15720 (31K) force test wafer W1 with dimensions of 60 m X 200 / zm. A resist layer (31) having a thickness of 80 μm formed according to the pattern was formed (see FIG. 4). After that, the surface of the metal foil (30) is subjected to electrolytic-nickel plating to form a contact member (27) made of nickel having a thickness of about 80 m in each opening (31K) of the resist layer (31). Thus, a contact member composite (27F) was manufactured (see FIG. 5).

[Formation of one layer of conductive elastomer]

A conductive elastomer material was prepared by dispersing 70 parts by weight of the conductive particles [a] in 100 parts by weight of addition-type liquid silicone rubber. The conductive elastomer material is applied to the surface of a releasable support plate (35) made of stainless steel having a thickness of 5 mm by screen printing, so that the thickness of the conductive elastomer material on the releasable support plate (35) is increased. A conductive elastomer material layer (24A) with a thickness of 140 / zm was formed (see Fig. 6).

Next, the contact member composite (27F) is arranged on the conductive elastomer material layer (24A) so that each of the contact members (27) is in contact with the conductive elastomer material layer (24A). In this state, the conductive elastomer material layer (24A) is subjected to a curing treatment at 120 ° C for 1 hour while applying a magnetic field of 2 Tesla in the thickness direction by an electromagnet. A conductive elastomer layer (21B) having a thickness of 140 m supported on the support plate (35) was formed (see FIGS. 7 to 9).

[0109] In the above, the addition-type liquid silicone rubber used is a two-component type consisting of liquid A and liquid B each having a viscosity of 250 Pa's, and the compression set of the cured product is 5%, Durometer A with a hardness of 32 and a tear strength of 25 kNZm.

Here, the properties of the addition-type liquid silicone rubber and its cured product were measured as follows.

(i) Viscosity of addition-type liquid silicone rubber was measured at 23 ± 2 ° C using a B-type viscometer. Set.

(ii) The compression set of the cured silicone rubber was measured as follows.

The liquid A and liquid B in the two-component type addition type liquid silicone rubber were stirred and mixed at an equal ratio. Next, after pouring this mixture into a mold and subjecting the mixture to defoaming treatment under reduced pressure, a curing treatment is performed at 120 ° C for 30 minutes, resulting in a thickness of 12.7 mm and a diameter of 29 mm. A cylindrical body made of a cured silicone rubber was prepared, and post-curing was performed on this cylindrical body at 200 ° C. for 4 hours. The cylindrical body thus obtained was used as a test piece, and compression set at 150 ± 2 ° C. was measured according to JIS K 6249.

(iii) The tear strength of the cured silicone rubber was measured as follows.

The addition type liquid silicone rubber was cured and post-cured under the same conditions as in (ii) above to produce a 2.5 mm thick sheet.

Talecent-shaped specimens were produced from this sheet by punching, and the bow I crack strength at 2 ° C for 23 persons was measured in accordance with JIS K 6249.

(iv) The durometer A hardness is set to 23 ± 2 ° C according to JIS K 6249 by stacking five sheets prepared in the same manner as in (m) above and using the resulting stack as a test piece. The value was measured.

[Formation of conductive part for connection]

Surface force of the metal foil (30) in the contact member composite (27F) The resin film is peeled off, and the metal foil (30) is removed by etching treatment, whereby the contact member (27) and the resist layer (31) Was exposed (see Figure 10). In this state, the conductive rubber laster layer (24B) and the resist layer (31) are subjected to laser processing with a carbon dioxide gas laser device using the contact member (27) as a mask, thereby supporting the releasability. 15720 connecting conductive parts (24) each supported by a plate (35) and each having a contact member (27) were formed (see FIG. 11).

In the above, the laser processing conditions by the carbon dioxide laser device are as follows. In other words, a carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) was used as the equipment, and the laser beam diameter was 60 m and the laser output was 0.8 mJ. Then, laser processing was performed by irradiating 10 shots of a laser beam at one processing point.o

[0111] [Formation of insulating part]

A mold release support plate (35A) made of stainless steel with a thickness of 5mm is prepared, and one molding spacer is placed on the surface of the mold release support plate (35A). The frame plate (21) was positioned and placed on the spacer for use in molding, and the other forming spacer was placed on the frame plate (21) in alignment.

Next, an addition-type liquid silicone rubber used in the preparation of the conductive elastomer material is prepared, and the addition-type liquid silicone rubber is defoamed under reduced pressure, and then the addition-type liquid silicone rubber is screen-printed. By applying to the releasable support plate (35A), the additional liquid silicone rubber is filled into the openings of each of the two molding spacers and the opening (22) of the frame plate (21). As a result, an insulating material layer (25A) was formed (see FIG. 12).

Next, the release support plate (35) formed with 15720 connecting conductive portions (24) each provided with the contact member (27) is replaced with the release portion formed with the insulating material layer (25A). By superimposing on the conductive support plate (35A), each of the conductive parts for connection (24) enters the insulating material layer (25A), and the contact member (27) is placed on the release support plate (35A). ) (See FIG. 13). After that, in this state, by applying a pressure of 1 500 kgf to the releasable support plate (35) and the releasable support plate (35A), the connecting conductive portion (24) is compressed in the thickness direction while the insulating portion By hardening the material layer (25A), it is integrated with the connection conductive part (24) around each of the connection conductive parts (24) and the insulation part (25) force that insulates them from each other. The formed elastic anisotropic conductive film (23) was formed (see FIG. 14).

Then, the anisotropically conductive connector of the present invention is removed by releasing the moldable support plate (35), (35A) and the elastic anisotropically conductive film (23) and removing the forming spacer. Manufactured.

[0112] The elastic anisotropic conductive film in the obtained anisotropic conductive connector will be described in detail. Each of the elastic anisotropic conductive films has a lateral dimension of 5.5 mm and a longitudinal dimension of 0.4. mm.

Each elastic anisotropic conductive film has 40 connecting conductive parts in the transverse direction at a pitch of 120 m Each of the connecting conductive parts has a horizontal dimension of 60 m, a vertical dimension of 200 μm, a thickness of about 140 μm, and an insulating part thickness of 100 μm. m. Further, the thickness of the supported portion (one thickness of the bifurcated portion) in each elastic anisotropic conductive film is 20 μm.

Further, when the content ratio of the conductive particles in the connecting conductive portion in each of the elastic anisotropic conductive films was examined, the volume fraction was about 30% in all the connecting conductive portions.

[0113] [Production of circuit board for inspection]

Alumina ceramics (coefficient of linear thermal expansion 4.8 X 10-so-K) is used as the substrate material, and a test circuit board with test electrodes formed according to the pattern corresponding to the pattern of the test electrode in Weno for testing and W1 is manufactured. did. The inspection circuit board has a rectangular shape with an overall dimension of ³ Ocm × 30 cm, and the inspection electrode has a lateral dimension force of ½ μm and a longitudinal dimension of 200 / zm. Hereinafter, this inspection circuit board is referred to as “inspection circuit board T”.

[0114] [Evaluation of anisotropically conductive connector]

(1) Test 1:

Place the test wafer W1 on the test stand, and place the anisotropic conductive connector on the test wafer W1 so that each of the conductive parts for connection is located on the electrode to be inspected on the test wafer W1. Arranged together. Next, on this anisotropic conductive connector, the inspection circuit board Τ is aligned and fixed so that each of the inspection electrodes is positioned on the connecting conductive portion of the anisotropic conductive connector. The circuit board 用 was pressed downward with a load of 160 kg.

At room temperature (25 ° C), a sequential voltage is applied to each of the inspection electrodes on the inspection circuit board T, and the electrical resistance between the inspection electrode to which the voltage is applied and the inspection electrode adjacent thereto is applied. Was measured as the electrical resistance between the conductive parts for connection in the anisotropic conductive connector (hereinafter referred to as “insulation resistance”), and the number of conductive part pairs for connection having an insulation resistance of 5 Ω or less was determined. Here, when the insulation resistance between the conductive parts for connection is 5Ω or less, it may be difficult to actually use this in the electrical inspection of the integrated circuit formed on the wafer.

The results are shown in Table 1 below. [0115] (2) Test 2:

The test wafer W2 is placed on a test stand equipped with an electric heater, and an anisotropic conductive connector is placed on the test wafer W1 so that each of the conductive portions for connection is placed on the test electrode of the test wafer W2. The inspection circuit board T is aligned on the anisotropic conductive connector so that each of the inspection electrodes is positioned on the conductive portion for connection of the anisotropic conductive connector. Furthermore, the circuit board for inspection T was pressed downward with a load of 32 kg (the load applied to each conductive part for connection was about 2 g on average). Then, at room temperature (25 ° C), 15720 test electrodes on the test circuit board T are electrically connected to each other via the anisotropic conductive connector, the test weno, and W1. The electrical resistance between the two test electrodes is measured sequentially, and the half of the measured electrical resistance value is used as the electrical resistance of the conductive part for connection in the anisotropic conductive connector (hereinafter referred to as `` conducting resistance ''). t), and the number of conductive parts for connection having a conduction resistance of 0.5 Ω or more was determined. The above operation is referred to as “operation (1)”.

Next, the load to pressurize the inspection circuit board T is changed to 126 kg (the average load applied to each conductive part for connection is about 8 g), and then the test bench is heated to 125 ° C and the temperature of the test bench is After being stabilized, it was left in this state for 1 hour. The above operation is referred to as “operation (2)”. Next, the test table was cooled to room temperature, and then the pressure applied to the inspection circuit board T was released. The above operation is referred to as “operation (3)”.

Then, the above operation (1), operation (2) and operation (3) were performed as one cycle, and the operation was performed continuously for a total of 500 sites.

As described above, it is difficult to actually use the conductive part having a conduction resistance of 0.5 Ω or more in the electrical inspection of the integrated circuit formed on the wafer.

The results are shown in Table 2 below.

[0116] <Comparative Example 1>

By using the same frame plate as in Example 1 and forming an elastic anisotropic conductive film having the following specifications in each of the openings of the frame plate according to the method described in Japanese Patent Application Laid-Open No. 2002-334732, a comparatively different anisotropic plate is formed. A directionally conductive connector was produced. The elastic anisotropic conductive film in the comparative anisotropic conductive connector obtained will be described. Each of the elastic anisotropic conductive films has a lateral dimension of 5.5 mm and a longitudinal dimension of 0.4 mm. .

Each of the elastic anisotropic conductive films has 40 connecting conductive parts arranged in a row in the horizontal direction at a pitch of 120 m. Each of the connecting conductive parts has a horizontal dimension of 60 m and a vertical length of The dimension in the direction is 200 μm, the thickness is about 140 μm, and the thickness of the insulating part is 100 μm. Further, the thickness of the supported portion (one thickness of the bifurcated portion) in each elastic anisotropic conductive film is 20 μm.

Further, when the content ratio of the conductive particles in the conductive portion for connection in each of the elastic anisotropic conductive films was examined, the volume fraction was about 20%.

The comparative anisotropic conductive connector was evaluated in the same manner as in Example 1. The results are shown in Tables 1 and 2.

[0117] [Table 1]

[0118] [Table 2]

As is clear from the results in Tables 1 and 2, according to the anisotropic conductive connector according to Example 1, even when the pitch of the conductive portions for connection in the elastic anisotropic conductive film is small, the connection is possible. Good electrical conductivity is obtained in the conductive part for the connection, and sufficient insulation is obtained between the adjacent conductive parts for connection, and the force is also resistant to environmental changes such as thermal history due to temperature changes. However, it was confirmed that a good electrical connection state was stably maintained, and that even when repeatedly used in a high temperature environment, good conductivity was maintained over a long period of time in all the conductive parts for connection. .

On the other hand, in the anisotropic conductive connector of Comparative Example 1, conductive particles remain in the insulating portion, so there are connecting conductive portion pairs with low insulation resistance. Due to the large variation in the content ratio of conductive particles, this is a high temperature environment! / When repeated use, some conductive parts for connection show a decrease in conductivity.

Claims

The scope of the claims

[1] A frame plate in which a plurality of openings are formed corresponding to an electrode region in which an electrode to be inspected in all or a part of an integrated circuit formed on a wafer to be inspected, and a target in the electrode region A plurality of conductive parts for connection in which conductive particles exhibiting magnetism are contained in a conductive polymer material arranged according to a pattern corresponding to the pattern of the inspection electrode, and an insulation made of an elastic polymer material that insulates them from each other A plurality of elastic anisotropic conductive films arranged and supported by the frame plate so as to close the openings, and integrally provided on each connection conductive part in these elastic anisotropic conductive films. A method for manufacturing an anisotropic conductive connector for wafer inspection, comprising a plurality of contact members made of metal,

On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed. A contact member made of a metal exhibiting magnetism is arranged on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the electrode to be inspected, and in this state, the conductive elastomer material A magnetic field is applied to the layer in the thickness direction, the conductive elastomer material layer is cured to form a conductive elastomer layer, and the conductive elastomer layer is laser processed to form the contact member. By removing the portions other than the portion where is disposed, a plurality of connection conductive portions are formed on the releasable support plate according to the specific pattern and provided with the contact member, In this state, each of the connecting conductive portions provided with the contact members is insulated from a liquid polymer material forming material that is cured to become an elastic polymer material so as to block the opening of the frame plate. A method for manufacturing an anisotropic conductive connector for wafer inspection, comprising: a step of forming an insulating portion by intrusion into a portion material layer and curing the insulating portion material layer.

[2] A resist layer having openings formed according to a specific pattern is formed on the metal foil, and the opening force of the resist layer in the metal foil is subjected to a plating process with a metal exhibiting magnetism. To produce a contact member composite in which a contact member is formed in each of the openings of the resist layer, and this contact member composite is used as a material for a conductive elastomer. The contact member made of a metal exhibiting magnetism according to the specific pattern is disposed on the surface of the material layer for conductive elastomer by stacking on the surface of the layer. Manufacturing method of anisotropic conductive connector for wafer inspection.

[3] An anisotropic conductive connector for wafer inspection obtained by the manufacturing method according to claim 1 or claim 2.

[4] An inspection circuit board in which a plurality of inspection electrodes are formed on the surface according to a pattern corresponding to the pattern of the electrode to be inspected in all or some of the integrated circuits formed on the wafer to be inspected, and this inspection A probe card for wafer inspection comprising the anisotropic conductive connector for wafer inspection according to claim 3 disposed on the surface of a circuit board for operation.

[5] An inspection circuit board having a plurality of inspection electrodes formed on the surface according to a pattern corresponding to the electrodes to be inspected in all or some of the integrated circuits formed on the wafer to be inspected, and the inspection circuit board Anisotropic conductivity composed of a plurality of connecting conductive parts extending in the thickness direction, which are integrally provided on the surface of the circuit board and extending on the surface of each of the inspection electrodes, and insulating parts which insulate them from each other. A method for manufacturing a probe card for wafer inspection comprising a single layer of elastomer and a contact member made of metal integrally provided on a conductive portion for connection of the anisotropic conductive elastomer layer,

A contact member composite is prepared by forming a plurality of contact members made of metal each exhibiting magnetism according to a specific pattern relating to the inspection electrode on a metal plate, and is cured on the contact member composite. A liquid polymer substance forming an elastic polymer substance and forming a conductive elastomer material layer containing conductive particles exhibiting magnetism in the forming material, and on each of the conductive elastomer material layers, Each of the plurality of metal masks made of metal exhibiting magnetism is disposed so as to face the contact member with the conductive elastomer material layer interposed therebetween, and in this state, the conductive elastomer material layer is disposed on the conductive elastomer material layer. On the other hand, by applying a magnetic field in the thickness direction and curing the material layer for conductive elastomer, a conductive elastomer layer is formed, and the conductive elastomer layer is formed. By removing portions other than the portion located between the metal mask and the contact member by laser processing, a plurality of connections arranged according to the specific pattern Forming a conductive part,

The metal mask disposed on each conductive part for connection is removed, and then the contact member composite formed with the conductive part for connection is insulated from an insulating material made of a material that becomes an elastic polymer substance. Overlaying on the inspection circuit board on which the layer is formed, each of the inspection electrodes of the inspection circuit board is brought into contact with the corresponding conductive part for connection, and in this state, the insulating part material A method for producing a probe card for wafer inspection, comprising a step of forming an insulating portion by curing a layer.

[6] A probe card for wafer inspection, which is obtained by the manufacturing method according to claim 5.

[7] A wafer inspection apparatus that performs electrical inspection of a plurality of integrated circuits formed on a wafer in a wafer state,

A wafer inspection apparatus comprising the probe card for wafer inspection according to claim 4 or 6.