WO2006021986A1 - Procédé et appareil de flottement de substrat - Google Patents

Procédé et appareil de flottement de substrat Download PDF

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Publication number
WO2006021986A1
WO2006021986A1 PCT/JP2004/012078 JP2004012078W WO2006021986A1 WO 2006021986 A1 WO2006021986 A1 WO 2006021986A1 JP 2004012078 W JP2004012078 W JP 2004012078W WO 2006021986 A1 WO2006021986 A1 WO 2006021986A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas
substrate
holes
floating
gas ejection
Prior art date
Application number
PCT/JP2004/012078
Other languages
English (en)
Japanese (ja)
Inventor
Masaki Kusuhara
Masashi Inamitsu
Takahiro Hatanaka
Original Assignee
Wacom Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacom Electric Co., Ltd. filed Critical Wacom Electric Co., Ltd.
Priority to PCT/JP2004/012078 priority Critical patent/WO2006021986A1/fr
Publication of WO2006021986A1 publication Critical patent/WO2006021986A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0294—Vehicle bodies

Definitions

  • the present invention relates to a substrate floating apparatus and method, and more specifically, a substrate corresponding to a processing apparatus in a processing step by floating the substrate when a substrate-like wafer or glass plate is conveyed.
  • the present invention relates to a substrate floating device and a method that can be applied as a transfer device that carries in or out the substrate.
  • a substrate floating apparatus and the same method are generally applied to a system for floating a substrate and transporting the substrate in this state.
  • a substrate floating apparatus and the same method are generally applied to a system for floating a substrate and transporting the substrate in this state.
  • this application for example, there is one that transports a glass plate for a TFT type liquid crystal display.
  • Patent Document 1 is a prior invention example 1 similar to the present invention in the technical field.
  • Patent Document 1 Japanese Laid-Open Patent Publication No. 2001-063822 “Floating and Conveying Method”
  • An object of the invention of Patent Document 1 is to provide a levitating and conveying method that prevents a plate-like body from coming into contact with the carrying surface when the curved plate-like object is levitated and conveyed.
  • the plate-shaped body is arranged so that the convex surface of the plate-shaped body faces the conveyance surface, and the large convex surface portion of the undulating surface faces the conveyance surface. Place the body. As a result, the plate-like body can be prevented from coming into contact with the conveyance surface during the floating conveyance of the plate-like body.
  • the conventional substrate floating apparatus and the same method have the following problems.
  • the size of the substrate to be transported is increasing and the plate pressure tends to be thin, and the plate-like body is easily deformed.
  • the plate-like body is subjected to various processes, for example, a process of providing a pattern or a film on one surface of the plate-like body or a process of heating the plate-like body, the plate-like body is bent.
  • the cross-sectional shape of the plate-like body becomes an arc shape or a semi-elliptical shape.
  • the plate-like body may be deformed to cause undulations in the plate-like body, and may have a convex portion with a shape larger than the generated undulation.
  • the occurrence of the obstacles may be prevented by increasing the floating position of the substrate to be transported.
  • this solution requires a larger amount of gas to be ejected onto the substrate to be transported, which degrades operational efficiency.
  • the floating position of the substrate to be transported is increased, there are problems such as that control for transport becomes more difficult. Therefore, the flying height of the substrate to be transported is required to be as low as possible. However, if the flying position is simply lowered in response to this, the probability of occurrence of a trouble that the conveyed object comes into contact with the floor surface increases.
  • the present invention solves such a problem, and for stable substrate transport in a state in which no failure occurs, the substrate can be lifted with an unreasonable and efficient substrate floating state.
  • An object is to provide an apparatus and method.
  • the substrate levitation device of the invention according to claim 1 is a substrate levitation device that levitates a planar transported body, and jets gas from below to the plane of the transported body. And a gas supply portion for supplying the gas to the gas injection hole portion, and a gas supply amount adjusting portion for adjusting the supply amount of the gas. .
  • the hole is individually communicated with the gas supply unit, and the amount of gas ejected from the hole can be adjusted by the gas supply adjusting unit. This makes it possible to easily adjust the amount of ejection from each hole continuously from fully closed to fully open.
  • the gas ejection hole portion is provided with a plurality of holes at regular intervals, the holes are dispersedly arranged in a checkered pattern, and two or more predetermined holes communicate with each other through one air passage.
  • the road is composed of multiple rows per row or row IJ. Making the carrier substrate more desirable In order to ascend, it is desirable to individually control the amount of gas ejected from these individual vents.
  • a plurality of holes are provided on the flat plate at regular intervals, and the holes are distributed in a grid pattern, grouped together for each row or column, or for each half of the holes. The effect of the present invention can also be obtained by configuring a ventilation path for each of these holes and managing the amount of jetted gas.
  • the above gas is air, and the adjustment of the gas ejection amount can be performed for each hole or for each grid-like column or row. Furthermore, by arbitrarily selecting holes in a grid shape and mechanically closing the selected holes, it is possible to open and close the gas ejection for each hole, and open / close in a vertical or horizontal row of the substrate size. It is advisable to adjust the shape and height of the transported object when it floats.
  • the substrate levitation method of the present invention is a substrate levitation method for levitating a planar object to be conveyed, and a hole arrangement in which gas ejection hole groups for ejecting gas from below are dispersedly arranged with respect to the plane of the object to be conveyed. And a gas supply step for supplying the gas to be ejected to the gas ejection hole group, and a gas supply amount adjusting step for adjusting the supply amount of the gas to be ejected from the gas ejection hole group.
  • the gas ejection hole portion is provided with a plurality of holes at regular intervals, and the dispersed arrangement of the holes has a grid shape, and a predetermined ventilation hole communicates with two or more predetermined air holes.
  • the gas should be air, and the adjustment of the amount of ejection can be performed in grid-like vertical 1J or horizontal units, arbitrarily selecting the grid-shaped holes and mechanically closing the selected holes This makes it possible to adjust the opening and closing of the gas ejection for each hole, and this opening / closing is performed according to the vertical or horizontal row of the substrate size, and the shape and height of the transported object can be adjusted freely. It should be possible.
  • the substrate levitation apparatus and the method for levitating the planar transported body of the present invention have dispersedly arranged holes for ejecting gas from below with respect to the plane of the transported body, The supply amount is adjusted by adjusting the gas supply amount to the gas ejection hole. According to this configuration, the floating state of the substrate of the transported body can be adjusted as appropriate.
  • the hole is individually communicated with the gas supply unit, and the amount of gas discharged from the hole can be adjusted by adjusting the gas supply adjusting unit. This allows you to It is possible to easily adjust the ejection amount, and to finely adjust the floating state of the substrate. By individually controlling the amount of gas ejected from these individual vents, it is possible to adjust the amount of gas ejection in a better form.
  • the gas ejection hole portion is provided with a plurality of holes at regular intervals, the holes are dispersedly arranged in a grid shape, and two or more predetermined holes communicate with each other through a single air passage.
  • the road is composed of multiple rows per row or column. This makes it possible to easily manage the amount of gas ejected.
  • the gas is air
  • the adjustment of the gas ejection amount can be performed in a grid-like vertical rod 1 or in a row unit, and the holes are arbitrarily selected and the holes are mechanically selected.
  • the air jet is opened / closed corresponding to the vertical or horizontal rows of the substrate size for each hole, and the shape and height of the transported object can be adjusted easily and easily.
  • FIG. 1 is a plan view showing an arrangement configuration example of gas ejection holes, which is applied to an embodiment of a substrate floating apparatus and method according to the present invention.
  • FIG. 2 is a diagram conceptually showing a vertical cross-sectional configuration of a gas ejection plate corresponding to FIG. 1 and a connection relationship between gas supply units.
  • FIG. 3 is a diagram conceptually showing a relationship between a development view showing a configuration example of a gas ejection plate and a gas supply unit.
  • FIG. 4 Distribution of flying height in test A (i) corresponding to a substrate size of 300 X 400 mm in the vertical X horizontal workpiece size.
  • FIG. 5 Air flow distribution diagram of test A (i).
  • FIG. 6 is a flying height distribution chart of test A (ii).
  • FIG. 7 is an air flow distribution diagram of test A (ii).
  • FIG. 8 is a flying height distribution chart of test A (iii).
  • FIG. 10 A flying height distribution diagram of test B (iv) corresponding to a substrate size of 600 X 800 mm in the vertical X horizontal workpiece size.
  • FIG. 11 Air flow distribution diagram of test B (iv).
  • FIG. 12 is a flying height distribution chart of test B (v).
  • FIG. 13 is an air flow distribution diagram of test B (v).
  • FIG. 15 is an air flow distribution diagram of test B (vi).
  • FIG. 16 is a diagram for explaining a conventional method for floating and conveying a plate-like body.
  • FIGS. 1 to 15 there is shown one embodiment of the substrate floating apparatus and method of the present invention.
  • FIGS. 1 to 3 are views for explaining the basic configuration of the substrate floating apparatus according to the present embodiment.
  • Fig. 4 and Fig. 15 illustrate the test results of substrate levitation.
  • the unit size of glass substrates to be transported has been increasing.
  • glass substrates such as work size force S300 X 400 X tO. 7 and work size S600 X 800 X tO.
  • Test A and Test B The results of studies aiming at practical use of a more efficient and transfer system that can cope with these recent situations are shown below as Test A and Test B.
  • Figure 1 shows the gas ejection corresponding to the substrate size of 300 X 400 mm in the vertical X horizontal work size It is a top view showing the example of arrangement
  • 2 and 3 are diagrams showing a configuration example of the gas supply unit.
  • FIG. 4 and FIG. 9 are explanatory views of Test A corresponding to the substrate levitation apparatus constituted by FIG. 1 to FIG.
  • FIGS. 10 to 15 are explanatory diagrams of test B corresponding to the substrate size of 600 ⁇ 800 mm in the vertical and horizontal work sizes.
  • the arrangement of the gas ejection holes corresponding to the explanatory diagram of this test B is the same as that in Figs. 1 to 3, and the number of arrangements differs from the former as the work size is expanded.
  • FIG. 1 shows a configuration example of the gas ejection plate 1 showing an arrangement example of ejection holes.
  • 10 ⁇ 10 100 gas ejection holes are arranged at equal intervals in the vertical and horizontal directions in a vertical X horizontal workpiece size of 300 X 400 mm.
  • the 10 rows in this arrangement are denoted by L.
  • the gas ejection holes H 1 — H 1Q having the above-described configuration have two ventilation holes per row.
  • the two air passages 12a and 12b in the first row L in FIG. 1 conceptually show an example of the arrangement configuration of one unit.
  • FIG. 2 conceptually shows a configuration example when the arrangement state of the one unit is viewed from the side.
  • FIG. 3 is a developed perspective view showing a configuration example of the gas ejection plate 1. 1 to 3, the gas ejection plate 1 is constituted by a combination of a hole plate 11, a gas passage plate 12 and a bottom plate 13.
  • the unit in FIGS. 2 and 3 is a Y-shaped unit that communicates between the gas supply amount measuring device 3 and the gas ejection plate 1 and the gas supply amount measuring device 3.
  • the pipe 2 and the gas supply amount regulator 4 are configured.
  • 10 gas ejection holes for example, H 1 H 1Q ) are provided for each unit.
  • the gas ejection plate 1 of the present configuration example is configured such that five ejection holes in the gas passage plate 12 are communicated with each other through the same air passage. This is an example in which the number of constituent gas supply units described later is reduced and simplified. Therefore, the amount of gas ejection is controlled more finely for each hole. For this purpose, it is necessary to connect the gas ejection plate 1 and the gas supply amount measuring device 3 to each of the ejection holes through a predetermined pipe and to provide the gas supply amount regulator 4 individually. It becomes.
  • the gas ejection plate 1 in which the gas ejection holes are formed is configured as a flat plate having a flat surface.
  • the requirement that the gas ejection plate 1 be a flat plate has a meaning as a requirement that an air pool is formed between the substrate of the floating body and the flat plate, and that the gas ejected from the gas ejection holes works effectively.
  • corrugation etc. is low, it has been obtained by experiment that the effect of the function which floats a to-be- floated body is low.
  • a glass substrate 5 having a workpiece size force of S300 X 400 X tO. 7 mm is mounted on the substrate levitating apparatus of the present embodiment shown in FIGS. 1 to 3, and the flotation height is examined and the flow distribution is used. The effect on the flying height displacement was investigated. The purpose of this test is to obtain gas ejection conditions for minimizing the deflection of the glass substrate 5 when it floats. In addition, the air flow rate distribution is changed, the degree of influence on the substrate deflection is examined, and the optimum levitation condition is obtained. More specifically, tests A and B were conducted for the following items, and evaluation / examination was performed.
  • the flying height was measured by ejecting Air from below the substrate using the substrate floating apparatus having the above-described configuration.
  • the flow rate of Air was adjusted and the flow rate distribution was changed to obtain the conditions for obtaining the optimal levitation state.
  • the main points of the desired floating state of the substrate are as follows.
  • the flying position must be a comma number of mm.
  • Test A is a test on the floating height examination of the workpiece size force 00 X 400 X t0.7 mm substrate size and the effect on the flying height due to the flow distribution.
  • Substrate floating applied to this test The upper apparatus is an apparatus having the configuration shown in FIGS. Using this equipment, the following conditions are changed, and the workpiece size to be tested is 300 x 400 x tO. 7mm substrate size. (1) Floating form, (2) Floating position, (3) Floating position The total amount of air supply required for the survey was investigated. In this test, the following conditions are selected.
  • Fig. 4 and Fig. 9 are graphs showing the test results of the three different conditions (i) (mouth).
  • Each of (1); Fig. 47, Fig. 5, (ii); Fig. 6Z, Fig. 7, (iii); Fig. 8Z, and Fig. 9 represents the relationship of the flying height distribution chart ZAir flow distribution.
  • L is open and the other two rows L and L are closed. Also, vertical 8 rows L of 1 row L 1 one L 1Q
  • FIG. 5 shows the setting conditions in a graph.
  • Fig. 4 is a graph showing the measurement results of the floating state of a 300 ⁇ 400 ⁇ tO. 7 mm size glass substrate under the conditions of the air flow rate distribution in Fig. 5.
  • the vertical memory is a 0.1 mm unit cell, and the maximum displacement amount above and below the substrate is approximately 0.4 mmp_p located between approximately 0.25-0.65. known. From the results of this experiment, it is known that (1) there is no flatness in the form of the ascent, and (2) the upper part of the ascending position is high under the ascent condition.
  • the total air supply amount is 12LZmin, and an equal amount of air is supplied to each pipe. Distributed supply. As a result, an equal amount of 0.3 L / min of Air is ejected from the 40 individual gas ejection holes.
  • Fig. 7 shows this setting condition in a graph.
  • Fig. 6 is a graph showing the measurement results of the floating state of a 300 ⁇ 400 ⁇ tO. 7mm size glass substrate under the conditions of the air flow distribution in Fig. 7.
  • the vertical memory is a 0.1 mm unit grid, and the maximum vertical displacement of the substrate is 0.35 mmp_p located between approximately 0.15-0.50 mm.
  • FIG. 8 is a graph showing the measurement results of the floating state of a 300 ⁇ 400 ⁇ tO. 7 mm size glass substrate under the air flow distribution conditions shown in Fig. 9.
  • the memory in the vertical direction is a grid of 0.1 mm units, and the maximum displacement of the top and bottom of the substrate is 0 ⁇ 15 mmp-p located between approximately 0 ⁇ 2 ⁇ 0 ⁇ 35 mm. It is known that there is. From these experimental results, it is known that under the ascent condition, (1) the shape of the ascent is sufficiently flat and (2) the overall ascent position is low.
  • Test B is a test on the flying height examination of the workpiece size force S600 X 800 X tO. 7mm substrate size and the effect on the flying height due to the flow distribution.
  • the substrate levitation device applied to this test is different from the device applied to Test A.
  • the main difference is the number of gas outlets.
  • the basic configuration is the same as that shown in FIGS.
  • 20 X 20 400 gas ejection holes are arranged at equal intervals in the vertical and horizontal directions within a workpiece size of 600 X 800 mm in the vertical and horizontal directions.
  • Other conditions Is the same as test A.
  • FIG. 10 to FIG. 15 are graphs showing the test results in which the three types of conditions (i) and (mouth) are different.
  • FIG. 10 is a graph showing the measurement results of the floating state of a 600 ⁇ 800 ⁇ tO. 7 mm size glass substrate under the conditions of the air flow distribution in FIG.
  • the vertical memory is 0.1 mm squares, and the maximum displacement amount of the upper and lower of the substrate is 0.6 mmp_p located between approximately 0.0-0.6. It is done. From the results of this experiment, it is known that (1) there is no flatness in the form when ascending, and (2) the levitation position is low under the ascent condition.
  • FIG. 12 shows this setting condition in a graph.
  • FIG. 13 is a graph showing the measurement results of the floating state of a glass substrate of 600 ⁇ 800 ⁇ tO. 7 mm size under the conditions of the air flow distribution in FIG.
  • the memory in the vertical direction is a grid in units of 0.1 mm, and the maximum vertical displacement of the substrate is 0.35 mmp_p located between approximately 0.2-0.55 mm. Is known. From the results of this experiment, under the ascent condition, (1) flatness is improved in the form of ascent. (2) It is known that the upper part of the floating position is high.
  • FIG. 14 and Fig. 15 showing the data set (vi) for test B, the three columns in the column direction are open and the four columns in the center of the row are closed. Compared with the left and right columns in the three vertical columns, the air supply is approximately 1Z3. In addition to this setting condition, the overall air supply rate was 42 L / min, and air with uneven supply was distributed and supplied to each pipe.
  • Figure 14 shows this setting condition in a graph.
  • FIG. 15 is a graph showing the measurement result of the floating state of a glass substrate having a size of 600 ⁇ 800 ⁇ t0.7 mm under the air flow rate distribution conditions of FIG.
  • the vertical memory is a 0.1 mm unit cell, and the maximum vertical displacement of the substrate is 0.3 mmp_p, which is located between approximately 0.1 and 0.4 mm. Is known. From the results of this experiment, it is known that, under the ascent condition, (1) the shape of the ascent is sufficiently flat and (2) the overall ascent position is low.
  • the substrate levitation apparatus and the method for levitating the planar transported body of the present invention distribute the holes for ejecting gas from below with respect to the plane of the transported body, The supply amount is adjusted by adjusting the gas supply amount to the gas ejection hole. According to this configuration, the floating state of the substrate of the transported body can be adjusted as appropriate.
  • the hole is individually communicated with the gas supply unit, and the amount of gas ejected from the hole can be adjusted by adjustment of the gas supply adjusting unit.
  • the amount of ejection from each hole can be easily adjusted, and finer adjustment of the floating state of the substrate becomes possible.
  • By individually controlling the amount of gas ejected from each of these vent holes it is possible to adjust the amount of gas ejection in a better form.
  • the gas ejection hole portion is provided with a plurality of holes at regular intervals, the holes are dispersedly arranged in a checkered pattern, and two or more predetermined holes communicate with each other through a single air passage.
  • the road is either row or column Each column is composed of multiple units. This makes it possible to easily manage the amount of gas ejected.
  • the gas can be air, and the amount of gas ejection can be adjusted in a grid-like vertical 1J or horizontal unit, and the pores can be arbitrarily selected to mechanically close the holes.
  • the body ejection is opened / closed for each hole corresponding to the vertical or horizontal row of the substrate size, so that the shape and height of the transported body can be adjusted easily and easily.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention a pour objet un appareil et un procédé de flottement de substrat, garantissant un état de flottement du substrat très efficace. Les 10x10=100 orifices d'éjection de gaz sont agencés sous forme de matrice à dimension d’exécution. Les orifices de deuxième et troisième rang horizontal et de huitième et neuvième rang horizontal, au total quatre rangs dans l'agencement, sont ouverts et les orifices des autres rangs sont fermés. Par conséquent, le nombre d'orifices d'éjection d'air est arrêté à 4x10=40. Aux conditions citées précédemment, viennent s’ajouter une alimentation totale en air réglée à 12 l/mn et un même volume d'air distribué dans chaque tuyau. Par conséquent, un même volume d'air de 0,3 l/mn est éjecté de chacun des 40 orifices d'éjection de gaz. Selon les conditions, un aplatissement suffisant est assuré au moment du flottement du substrat et les conditions de flottement d'une position basse de flottement général sont ainsi obtenues. On obtient ainsi les conditions de flottement permettant le transport facile d’un substrat de verre dont l’importante dimension d’exécution est de 300x400x0,7t.
PCT/JP2004/012078 2004-08-23 2004-08-23 Procédé et appareil de flottement de substrat WO2006021986A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/JP2004/012078 WO2006021986A1 (fr) 2004-08-23 2004-08-23 Procédé et appareil de flottement de substrat

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Application Number Priority Date Filing Date Title
PCT/JP2004/012078 WO2006021986A1 (fr) 2004-08-23 2004-08-23 Procédé et appareil de flottement de substrat

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3900025A4 (fr) * 2018-12-21 2022-09-14 Kateeva, Inc. Dispositifs, systèmes et procédés de commande de flottaison d'un substrat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228342A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 気流搬送装置およびその制御方法
JP2004244186A (ja) * 2003-02-14 2004-09-02 Ckd Corp 薄板の搬送用支持装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228342A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 気流搬送装置およびその制御方法
JP2004244186A (ja) * 2003-02-14 2004-09-02 Ckd Corp 薄板の搬送用支持装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3900025A4 (fr) * 2018-12-21 2022-09-14 Kateeva, Inc. Dispositifs, systèmes et procédés de commande de flottaison d'un substrat

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