WO2006020473A1 - Systeme integre de pompe a vide pousse - Google Patents

Systeme integre de pompe a vide pousse Download PDF

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Publication number
WO2006020473A1
WO2006020473A1 PCT/US2005/027596 US2005027596W WO2006020473A1 WO 2006020473 A1 WO2006020473 A1 WO 2006020473A1 US 2005027596 W US2005027596 W US 2005027596W WO 2006020473 A1 WO2006020473 A1 WO 2006020473A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
cavity
valve
bypass
bypass line
Prior art date
Application number
PCT/US2005/027596
Other languages
English (en)
Other versions
WO2006020473A8 (fr
Inventor
Michael S. Boger
Daimhin Paul Murphy
Christopher M. Bailey
Yoshihiro Enomoto
Original Assignee
The Boc Group, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Boc Group, Inc. filed Critical The Boc Group, Inc.
Priority to KR1020077003237A priority Critical patent/KR101224337B1/ko
Priority to JP2007525664A priority patent/JP4931811B2/ja
Priority to EP05779007.3A priority patent/EP1781946B1/fr
Publication of WO2006020473A1 publication Critical patent/WO2006020473A1/fr
Publication of WO2006020473A8 publication Critical patent/WO2006020473A8/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/042—Turbomolecular vacuum pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
    • F04B17/03—Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by electric motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/06—Venting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/02—Surge control
    • F04D27/0269—Surge control by changing flow path between different stages or between a plurality of compressors; load distribution between compressors

Definitions

  • the present invention relates to the field of pumping of gases and vapors in the field of general vacuum or in the process of semiconductor devices or display screens. More specifically, the present invention relates to an integrated high vacuum pumping system.
  • TMP turbo-molecular pump
  • the TMP used on a wide variety of semiconductor and general applications, relies on a rotating member that rotates near the velocity of the gas molecules to be pumped.
  • a significant feature of such a pump is that the compression ratio of outlet to inlet pressure is very high.
  • the exhaust of the TMP in general, must not be subjected to too high of a pressure. In particular, the differential pressure between the inlet and the outlet of the pump must be kept low.
  • the TMP is generally used within a vacuum system that incorporates a bypass line and some control logic to ensure that the pump is operated only when both the inlet and exhaust pressure is initially low.
  • a typical vacuum system will have a chamber where a process or experiment is to occur, a bypass line with a valve near the inlet to the chamber, a TMP with a valve connected to the exhaust of the TMP, and a valve connected between the inlet of the TMP and the chamber.
  • the exhaust of the TMP, via a valve, is connected to the downstream side of the bypass line.
  • the bypass line used in conjunction with valves both on the inlet and the exhaust of the pump, is used to evacuate the chamber to which the TMP is attached.
  • a secondary pump, or backing pump performs the evacuation. Once the chamber pressure is beneath a certain threshold amount, determined by the design of the TMP, the valve connecting the bypass line to the chamber is closed. Then, the exhaust valve to the TMP is opened and subsequently the valve to the inlet of the TMP is opened. A fluidic connection is now made between the chamber and the backing pump via the inlet valve to the TMP, the TMP itself, and the exhaust valve of the TMP. The TMP now continues to evacuate the chamber.
  • TMPs Due to the intrinsic nature of the TMP vacuum performance, all TMPs require some form of bypass line, bypass valve, inlet valve, and exhaust valve. There are generally some additional gauges connected, for example a pressure gauge or vacuum switch, connected to various points within the vacuum system to monitor its performance and generate signals to external, remote or closely mounted, controllers that actuate the valves.
  • additional gauges connected, for example a pressure gauge or vacuum switch, connected to various points within the vacuum system to monitor its performance and generate signals to external, remote or closely mounted, controllers that actuate the valves.
  • the aforementioned vacuum systems are assembled from various components, for example, air-actuated solenoid vacuum valves, pipes, vacuum seals, throttle valves, gate valves, TMP, and the like.
  • a key feature of this system is that there is universally an assembly of the various components with multiple seals and connections. Conventionally, there is limited integration of the components.
  • the aforementioned known vacuum systems find frequent use in the manufacture of semiconductor devices, for example, in etching processes or in high-density plasma chemical vapor deposition processes.
  • process gases introduced into the chamber that are subsequently pumped through the vacuum system (the TMP and valve assembly).
  • TMP and valve assembly There are several important aspects that are considered in the design of a vacuum system for use in processing including thermal management of the vacuum system, process control through-flow conductance variations, compatibility of the components with the process gases, the amount of total space physically occupied by the vacuum system and the proportions of this space, and the serviceability of the vacuum system.
  • Thermal management of the vacuum system is critical to some processes.
  • the vacuum lines, valves, and TMP are heated to a certain temperature to prevent both corrosion and condensation of the gases onto any of the surfaces in contact with the fluids.
  • Any condensation will create not only solids (by definition), but also a source of particle impurity. Elements of the condensation can separate and find themselves within the gas stream being pumped. These particles can back- stream against the flow of the process gases and land onto the wafer substrate being processed, or other item within the chamber of interest.
  • the separation between critical circuit components and connections on the wafer can be many times smaller than the particle that lands on the device, thus rendering the device on the wafer useless.
  • the mechanism of particle generation is a central point of focus in semiconductor processing. Despite the attention, the fundamental mechanism of particle generation is not fully understood. Nonetheless, temperature differentials, moving parts within the gas stream, and material composition all can exacerbate cleanliness issues.
  • the valve to the inlet of the pump typically a gate valve, throttle-valve, or combination throttle and gate valve
  • the TMP will also be fitted with a heater to keep its internal components warm. It is quite common for these temperatures to be different, thus creating a temperature gradient.
  • the bypass valve and TMP exhaust valve are also heated. Again, the temperatures of the valves may not be the same, and they will be different from that of the TMP. These temperature gradients can exacerbate a particle formation problem.
  • the inlet valve, or valves, to the TMP typically perform two functions, isolation and variation of the flow conductance. Such inlet valves are referred to as gate valves or throttling valves depending upon their function. These functions can be performed by either one valve or by two separate valves. It is increasingly common to use a single valve to perform both functions.
  • the inlet valve, a separate but necessary component to the vacuum system can be of various types, one such type is a pendulum- type. This separate valve is connected to the inlet of the TMP through a vacuum seal and a means of clamping, such as bolts. The valve itself is connected to the vacuum-processing chamber through a similar interface.
  • the valve body itself serves various functions. One function is to support the weight of the TMP through connection to the chamber. Another function is to provide a vacuum seal to both the TMP and chamber, which entails precise machining and the use of special-material vacuum seals. A third function is to have sufficient strength to withstand the torque that can be generated in the event of catastrophic rotor destruction.
  • a further important element to a vacuum system used for processing is that of selecting the correct components that will comprise the vacuum system.
  • Subtle discrepancies in component specification can result in premature failure of the system.
  • the incorrect use of a single vacuum seal with the wrong material in a fluorine-based process can cause a leak of the process gas, that is typically toxic or corrosive, and therefore cause a risk to health.
  • the burden of selecting the correct components and methods of assembly lies with the design engineer. Due to the number of components, the engineering task can be complicated and time-consuming.
  • Yet another key element to a vacuum system used for processing is that of conserving the amount of space used by the vacuum system.
  • the amount of space under the process tool, where the high-vacuum system is normally arranged (or at least a portion of such) is precious due to the large amount of equipment whose performance could benefit by being closer to the processing chamber.
  • the amount of "footprint" space the area consumed by the equipment from a top-down projection, is important. For example, it is important to arrange the vacuum valves in the vacuum system to avoid obstructions with other nearby equipment. It is also desirable to keep the bypass line as close to the TMP as possible to minimize the footprint.
  • Still another key element to a vacuum system used for processing is minimizing the cost and time of repair and service, thus maximizing the amount of available operating time. It is also important to minimize the amount of time required to interchange faulty components (or assemblies) with new ones.
  • Today's TMP-based vacuum systems comprising of a number of components, require a large amount of components to be held in stock for repairs and service. It is also advantageous to have vacuum systems comprise as few components as possible to minimize the amount of stock held for service repairs and replacements.
  • the present invention is directed to an integrated vacuum pumping system for gas delivery comprising a housing with integral flange for connection to a process chamber, and a cavity within the housing.
  • the cavity comprises a turbo-molecular pump (TMP).
  • TMP turbo-molecular pump
  • the housing also incorporates an inlet valve integrated into the housing and moveably connected to the housing. The inlet valve is located within said cavity at a position between the turbo-molecular pump and the process chamber.
  • the housing further incorporates a bypass line integrally located within the housing. The bypass line is oriented in valved communication with the cavity at a plurality of locations along the bypass line, with at least one location being located on either side of the gate valve.
  • a bypass valve is integrally located within the bypass line for regulating bypass flow between the cavity and the process chamber; and an exhaust valve is located integrally within the housing at a distance from the bypass valve and proximate to the cavity.
  • a bypass valve is located within the bypass line for regulating bypass flow within said bypass line between the cavity and the process chamber; and an exhaust valve for regulating flow from the cavity to the bypass line is located proximate to said bypass valve.
  • the bypass valve and the exhaust valve are combined into a three-way valve.
  • the present invention is directed to a method for delivering gas comprising the steps of directing a flow from a source to an apparatus for delivering gas, the apparatus comprising a housing with integral flange for connection to a process chamber, a cavity within said housing, said cavity comprising a turbo-molecular pump, an inlet valve integrated into the housing and moveably connected to the housing, said inlet valve located within said cavity at a position between the turbo-molecular pump and the process chamber, a bypass line integrally located within the housing, said bypass line in valved communication with the cavity at a plurality of locations along the bypass line, with at least one location being located on either side of the gate valve, a bypass valve located within the bypass line for regulating bypass flow between the cavity and the process chamber, and an exhaust valve located at a distance from the bypass valve and proximate to the cavity.
  • the gas flow is conditioned within the cavity and delivered from the cavity.
  • Fig. 1 is a schematic representation of a known TMP system with associated valves and bypass system.
  • Fig. 2 is a schematic representation of a known TMP system showing the key components that comprise a high-vacuum system used for semiconductor processing.
  • Fig. 3 is a schematic representation of one embodiment of the present invention showing the presence of the bypass and exhaust valves integrated into the body of the TMP.
  • Fig. 4 is a schematic embodiment of the present invention that shows the exhaust valve and bypass valve located in close proximity to each other.
  • Fig. 5 is a perspective drawing of one embodiment of the present invention.
  • Fig. 6 is a side view of Fig. 5 with a section N-N illustrated for later reference.
  • Fig. 7 is a cross-sectional drawing of the section N-N shown in Fig. 5.
  • Fig. 8 is a side view of Fig. 5 illustrating a section P-P for future reference.
  • Fig. 9 is a cross-sectional view of the section P-P in Fig. 8.
  • Fig. 10 is an overhead plan view of Fig. 5 showing the compact nature of the integrated system of the present invention.
  • the present invention relates to the integration of a TMP with the associated bypass line and valves so that a single sub-assembly is created.
  • the housing of the TMP is significantly modified to accommodate the associated equipment necessary for constructing a high-vacuum system.
  • This single integrated high-vacuum pumping system addresses the key concerns required in designing and operating a high-vacuum system for general vacuum, semiconductor processing, and flat panel display screen manufacture.
  • the strength of the housing and design of the housing are critical to a successful integration. For example, in the situation when a rotor breaks during operation of the TMP, large forces are generated as both internal pressure and torque on the housing of the TMP.
  • the TMP housing design must withstand these pressures in addition to maintaining the integrity of the ancillary vacuum system components, which have now been integrated within the housing. This improved housing is one source of the integration.
  • This invention is therefore directed towards improvements in the high- vacuum systems often used in semiconductor and flat-panel production, as well as other applications where a high-vacuum system incorporating a TMP is required.
  • a bypass system is required.
  • This invention incorporates the bypass vacuum system and attendant valves into a single unit that addresses and improves upon many factors related to the use and operation of a high- vacuum system.
  • Fig. 1 shows a schematic representation of a known typical high- vacuum system 10 with TMP 14 in fluidic contact with the process chamber 12.
  • the system further comprises a first inlet valve 11 , a second inlet valve 13, exhaust valve 15 and foreline 19, eventually exhausted through pump 17.
  • bypass valve 16 Also in connection with the chamber 12 is bypass valve 16, and bypass vacuum line 18. It is conventional for some applications to heat all of these elements to prevent condensation of the gases being pumped.
  • the pump 14, however, may also have cooling, primarily to cool the motor used to run the pump.
  • valves 11 and 13 can be combined. In almost all cases, some form of vacuum isolation is required of either valve 11 or valve 13. In most cases, some form of conductance varying valve (throttling valve) is used.
  • the order of the valves in fluidic connection with the 12 is chosen by the engineer designing the system and is somewhat arbitrary. However, it is known for the two functions of the inlet valves to be combined in a single valve, for example a pendulum valve.
  • FIG. 2 shows the use of a single throttle / gate valve 62 in connection with chamber 72.
  • the bypass valve 68 connects via seal 71 to a bypass line 65.
  • Various fittings can be located on the bypass line.
  • Such fittings could be an NW-style fitting 71 (one or more) and one or more VCR-type fittings 66.
  • the number and type of fittings is selected according to the number and type of equipment to be connected to the bypass line 65.
  • Bypass line 65 is connected via a vacuum-tight seal 69 to a T-piece
  • This T-piece is further connected to bypass valve 63.
  • the vacuum interfaces/seals shown in 69, 70, and 71 must be of high quality and require additional hardware (not shown), for example an O-ring and clamping, and/or bolts.
  • a known throttle/gate valve assembly 62 is designed to support the weight of the valve itself as well as the weight of the TMP.
  • the bypass valve 68 is combined into the valve body housing.
  • valves and bypass elements are . incorporated into a single housing, as shown schematically in Fig. 3.
  • the valve 62 in Fig. 2 is shown pictohally as feature 36.
  • This valve 36 is integrated into the housing 40 of the TMP 34.
  • the bypass valve 42, with entry port just above valve 36, can be located at the top of the bypass cavity 38.
  • the exhaust valve 44 is shown at the end of the bypass cavity 38 and can be directly attached to the output of the TMP.
  • FIG. 4 A schematic representation showing another embodiment of the present invention is shown in Fig. 4.
  • This configuration 50 shows a bypass valve 42 and exhaust valve 44 in close proximity to each other. Due to the nature of the functions of the valves, valves 42 and 44 can be combined into a 3-way valve. In the 3-way valve case, the exhaust of the TMP is connected to the vacuum foreline, the bypass cavity 38 is connected to the foreline, or both the TMP and bypass cavity are isolated from the vacuum foreline.
  • FIG. 5 A further embodiment of the present invention is shown in the perspective drawing of Fig. 5.
  • configuration 80 the chamber vacuum interface 70 is clearly shown.
  • the TMP housing 40 in two parts, combines the inlet valve 82, bypass valve 42, exhaust valve 44, and has fittings 66 attached.
  • the housing is attached to the base of the TMP 83.
  • the bottom of the bypass line (cavity) 38 is shown and would be connected to the foreline 19 (shown in Fig. 1 ).
  • the valve assembly 82 also shows the presence of an access cover for maintenance and service of the inlet (throttle/gate) valve. A single assembly is thus formed.
  • the inlet (throttle/gate) valve 62 is embedded into the housing of the TMP 38 and shown integrated as 82 whereby a housing is provided for access to the valve 62 for service.
  • the bypass valve 42 and exhaust valve 44 are in close proximity to each other as shown in Fig. 4.
  • the housing 40 and valves 42 and 44 are in thermal contact with each other.
  • the bypass line 38 which is now a milling within the housing 40, valve housing 82, and valves 42 and 44 can reach a similar temperature.
  • This helps to eliminate thermal differentials within the system that could cause particles to shed and migrate back to the process chamber.
  • the temperature gradient present will depend on the thermal conduction of the housing material, (e.g. an aluminum alloy), and the thermal contact between the housing 40 and the valves 42 and 44.
  • one preferred useful alloy for the housing is an aluminum alloy.
  • the aluminum alloy housing of the present invention will afford the assembly the appropriate strength as well as provide desirable thermal characteristics that will enable heat transfer throughout the assembly such that no significant temperature differentials exists.
  • the alloy selection and the design contribute to a thermal differential throughout the assembly of less than about 1 0 C.
  • FIG. 6 A side view of one embodiment of this invention is shown in Fig. 6.
  • This figure shows a section N-N.
  • This section is shown in detail in Fig. 7.
  • the bypass cavity 38 is clearly seen within the housing 40.
  • the housing has channels drilled / machined into it for the bypass cavity 38 and valves 42 and 44.
  • the interface to the chamber 70 is shown at the top of the figure.
  • fittings 66 there are a multitude of fittings 66 shown.
  • valves 42 and 44 are shown with bellows mechanisms. Other types of mechanisms can also be used.
  • Fig. 8 shows a different planar projection of Fig. 5 with section P-P illustrated.
  • Section P-P is shown in detail in Fig. 9.
  • Passageways 122 and 123 are formed by machining / drilling. These passageways support flow through the bypass 38 and valves 42 and 44.
  • the base of the TMP is shown in cross-section as 121.
  • the housing 40 has a cavity 122 in which the TMP stator and rotor elements can be fitted.
  • valve housing 123 is shown whereby valves 42 and 44 can be combined into a single housing. This housing is connected to the TMP housing 40 as well as to the exhaust of the TMP.
  • Fig. 10 shows an overhead pan view of Fig. 5.
  • the fittings 66 are shown as well as the top of the bypass cavity 38.
  • a lid is fit to the top of 38 to provide for ease in machining the bypass cavity 38.
  • the lid has a vacuum seal.
  • the footprint of the system is reduced from that of the system in Fig. 2 by virtue of the location of the bypass 38 and the extension of it from the outside of the TMP. Therefore, an improved compact design is achieved.
  • the design of the TMP housing 40 is important.
  • the housing must be durable enough to withstand the destructive force that may occur in the event of the rotor bursting during normal operation.
  • a conventional valve housing 62 (e.g. shown in Fig. 2) is not designed with these destructive forces in mind, due to the functional requirements of the housing.
  • the problems associated with a rotor burst are confined to a single unit. This allows for optimizations in the design that can affect the amount of torque transmitted to the upper chamber interface.
  • An improved single design also allows for the incorporation of other torque reducing features such as crumple-zones or break-away components within the housing.
  • one of the key requirements for safety in the event of rotor destruction is maintaining vacuum integrity. This is more easily achieved with all elements combined in a single housing, so that all can be considered in the pursuit of an optimum design.
  • the combination of the elements in the prior art into the TMP housing / structure is not obvious due to the effort required to design a TMP housing without integration.
  • the housing design is a special field of expertise where expert analysis and detailed modeling of the strength of the housing is required.
  • the integration offers compactness and ease of use for the user of the high-vacuum system.
  • the inlet (throttle/gate) valve assembly 82 may perform only gating functions, or be eliminated altogether. If conductance variation is required, the valve assembly 82 may be replaced with a smaller diameter assembly and be integrated at the exhaust point 38 of the housing.
  • the exhaust valve 44 may perform the throttling function of valve 82 by using a variable conductance valve for valve 44.
  • a controlled evacuation of the vacuum chamber may also be achieved by using a variable conductance valve as the bypass valve.
  • valve 44 may be augmented with a very small, additional valve, to perform a soft- start function whereby the chamber is evacuated through an additional slow, narrow bypass pipe that circumvents the exhaust valve 44.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Details Of Valves (AREA)

Abstract

La présente invention concerne l'intégration d'une pompe turbomoléculaire (TMP) dans une ligne de dérivation et les soupapes associées, formant un sous-ensemble unique. Le logement de cette pompe turbomoléculaire est sensiblement modifié de manière à pouvoir accueillir l'équipement associé nécessaire à la fabrication d'un système à vide poussé.
PCT/US2005/027596 2004-08-11 2005-08-03 Systeme integre de pompe a vide pousse WO2006020473A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020077003237A KR101224337B1 (ko) 2004-08-11 2005-08-03 가스 운반용 일체형 진공 펌핑 시스템, 가스 운반용 장치 및 가스 운반 방법
JP2007525664A JP4931811B2 (ja) 2004-08-11 2005-08-03 一体型高真空ポンピングシステム
EP05779007.3A EP1781946B1 (fr) 2004-08-11 2005-08-03 Systeme integre de pompe a vide pousse

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/916,081 2004-08-11
US10/916,081 US7140847B2 (en) 2004-08-11 2004-08-11 Integrated high vacuum pumping system

Publications (2)

Publication Number Publication Date
WO2006020473A1 true WO2006020473A1 (fr) 2006-02-23
WO2006020473A8 WO2006020473A8 (fr) 2006-11-16

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Country Status (7)

Country Link
US (1) US7140847B2 (fr)
EP (1) EP1781946B1 (fr)
JP (1) JP4931811B2 (fr)
KR (1) KR101224337B1 (fr)
CN (1) CN100491720C (fr)
TW (1) TWI356131B (fr)
WO (1) WO2006020473A1 (fr)

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* Cited by examiner, † Cited by third party
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JP2009511248A (ja) * 2005-10-07 2009-03-19 エドワーズ・バキューム・インコーポレーテッド ターボポンプを使用する広範囲圧力制御
EP2644893A3 (fr) * 2012-03-30 2017-08-23 Ebara Corporation Appareil d'évacuation sous vide

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100697280B1 (ko) * 2005-02-07 2007-03-20 삼성전자주식회사 반도체 제조 설비의 압력 조절 방법
JP2008088880A (ja) * 2006-09-29 2008-04-17 Anest Iwata Corp 真空排気装置
JP5357679B2 (ja) * 2009-09-24 2013-12-04 入江工研株式会社 コンダクタンスバルブ及び真空ポンプ
JP5304749B2 (ja) * 2010-08-05 2013-10-02 株式会社島津製作所 真空分析装置
US9267605B2 (en) 2011-11-07 2016-02-23 Lam Research Corporation Pressure control valve assembly of plasma processing chamber and rapid alternating process
CN109563617B (zh) * 2016-08-26 2021-06-08 应用材料公司 低压升降杆腔硬件
JP6729408B2 (ja) * 2017-01-13 2020-07-22 株式会社島津製作所 弁装置
US10559451B2 (en) * 2017-02-15 2020-02-11 Applied Materials, Inc. Apparatus with concentric pumping for multiple pressure regimes
US10704715B2 (en) * 2017-05-29 2020-07-07 Shimadzu Corporation Vacuum pumping device, vacuum pump, and vacuum valve
JP6992335B2 (ja) * 2017-09-07 2022-01-13 株式会社島津製作所 真空ポンプ起動制御装置
GB2575450B (en) * 2018-07-09 2022-01-26 Edwards Ltd A variable inlet conductance vacuum pump, vacuum pump arrangement and method
GB2592043A (en) * 2020-02-13 2021-08-18 Edwards Ltd Axial flow vacuum pump

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3097785A (en) * 1961-06-05 1963-07-16 American Can Co Opening means for vermin-proof carton
US3151806A (en) * 1962-09-24 1964-10-06 Joseph E Whitfield Screw type compressor having variable volume and adjustable compression
US4171936A (en) * 1978-03-13 1979-10-23 General Motors Corporation Engine turbocharger with integral wastegate
US4990066A (en) * 1988-08-12 1991-02-05 Hans Kern Metering pump
JPH041481A (ja) * 1990-04-13 1992-01-06 Mitsubishi Electric Corp 真空容器の真空排気機構
JPH041418A (ja) 1990-04-18 1992-01-06 Nissan Motor Co Ltd ２ストローク内燃機関
US6168390B1 (en) * 1997-03-22 2001-01-02 Henkel Kommanditgesellschaft Auf Aktien Dosing pump for dosed liquid conveyance
US20030113215A1 (en) * 2001-12-13 2003-06-19 Lg Electronics Inc. Reverse rotation preventing structure of centrifugal compressor
US6676384B2 (en) * 2001-03-24 2004-01-13 Pfeiffer Vacuum Gmbh Gas friction pump

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3096785A (en) * 1960-06-27 1963-07-09 Ingersoll Rand Co Pipe line pump
JPS5866746A (ja) * 1981-10-16 1983-04-21 Matsushita Electric Ind Co Ltd 熱交換器
JPS62153597A (ja) * 1985-12-27 1987-07-08 Hitachi Ltd 真空ポンプ
JPH07171374A (ja) * 1992-03-23 1995-07-11 Matsushita Electron Corp 排気系バルブの操作方法
JP3160504B2 (ja) * 1995-09-05 2001-04-25 三菱重工業株式会社 ターボ分子ポンプ
JP3543901B2 (ja) * 1996-12-16 2004-07-21 株式会社荏原製作所 トラップ装置
GB9717400D0 (en) * 1997-08-15 1997-10-22 Boc Group Plc Vacuum pumping systems
JPH11210802A (ja) * 1998-01-21 1999-08-03 Kayaba Ind Co Ltd ロータリーダンパ
US6161576A (en) * 1999-06-23 2000-12-19 Mks Instruments, Inc. Integrated turbo pump and control valve system
US6089537A (en) * 1999-06-23 2000-07-18 Mks Instruments, Inc. Pendulum valve assembly
TW460942B (en) * 1999-08-31 2001-10-21 Mitsubishi Material Silicon CVD device, purging method, method for determining maintenance time for a semiconductor making device, moisture content monitoring device, and semiconductor making device with such moisture content monitoring device
JP2002257040A (ja) * 2001-03-05 2002-09-11 Sharp Corp 真空排気装置
JP2003065282A (ja) * 2001-08-22 2003-03-05 Shimadzu Corp ターボ分子ポンプ
GB0229355D0 (en) * 2002-12-17 2003-01-22 Boc Group Plc Vacuum pumping arrangement
US7717684B2 (en) * 2003-08-21 2010-05-18 Ebara Corporation Turbo vacuum pump and semiconductor manufacturing apparatus having the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3097785A (en) * 1961-06-05 1963-07-16 American Can Co Opening means for vermin-proof carton
US3151806A (en) * 1962-09-24 1964-10-06 Joseph E Whitfield Screw type compressor having variable volume and adjustable compression
US4171936A (en) * 1978-03-13 1979-10-23 General Motors Corporation Engine turbocharger with integral wastegate
US4990066A (en) * 1988-08-12 1991-02-05 Hans Kern Metering pump
JPH041481A (ja) * 1990-04-13 1992-01-06 Mitsubishi Electric Corp 真空容器の真空排気機構
JPH041418A (ja) 1990-04-18 1992-01-06 Nissan Motor Co Ltd ２ストローク内燃機関
US6168390B1 (en) * 1997-03-22 2001-01-02 Henkel Kommanditgesellschaft Auf Aktien Dosing pump for dosed liquid conveyance
US6676384B2 (en) * 2001-03-24 2004-01-13 Pfeiffer Vacuum Gmbh Gas friction pump
US20030113215A1 (en) * 2001-12-13 2003-06-19 Lg Electronics Inc. Reverse rotation preventing structure of centrifugal compressor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1781946A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009511248A (ja) * 2005-10-07 2009-03-19 エドワーズ・バキューム・インコーポレーテッド ターボポンプを使用する広範囲圧力制御
EP2644893A3 (fr) * 2012-03-30 2017-08-23 Ebara Corporation Appareil d'évacuation sous vide

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CN100491720C (zh) 2009-05-27
JP4931811B2 (ja) 2012-05-16
TWI356131B (en) 2012-01-11
CN101002020A (zh) 2007-07-18
EP1781946B1 (fr) 2014-07-30
KR20070040810A (ko) 2007-04-17
EP1781946A4 (fr) 2012-12-19
EP1781946A1 (fr) 2007-05-09
WO2006020473A8 (fr) 2006-11-16
JP2008510093A (ja) 2008-04-03
KR101224337B1 (ko) 2013-01-21
TW200624675A (en) 2006-07-16
US20060034715A1 (en) 2006-02-16
US7140847B2 (en) 2006-11-28

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