WO2006004298A1 - Method for manufacturing black surface-treated copper foil for emi shield - Google Patents
Method for manufacturing black surface-treated copper foil for emi shield Download PDFInfo
- Publication number
- WO2006004298A1 WO2006004298A1 PCT/KR2005/000951 KR2005000951W WO2006004298A1 WO 2006004298 A1 WO2006004298 A1 WO 2006004298A1 KR 2005000951 W KR2005000951 W KR 2005000951W WO 2006004298 A1 WO2006004298 A1 WO 2006004298A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- plated layer
- radiation shielding
- black
- blackened
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 239000011889 copper foil Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000007747 plating Methods 0.000 claims abstract description 30
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 4
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 description 28
- 238000007254 oxidation reaction Methods 0.000 description 28
- 238000007743 anodising Methods 0.000 description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000007853 buffer solution Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 241000905957 Channa melasoma Species 0.000 description 1
- 229910018916 CoOOH Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000019219 chocolate Nutrition 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Definitions
- the present invention relates to a method for preparing a black surface-treated copper foil for electromagnetic radiation shielding and a copper foil produced by the method, which has low light reflectance and no stain and hardly has residues, thereby having a uniform and consistent appearance.
- Plasma display panel shows strong electromagnetic radiation which may be un ⁇ desirable to the health of human, from the display screen, therefore it is required to prevent such electromagnetic radiation by forming a shield.
- a conventional elec ⁇ tromagnetic radiation shield a composite material, which is produced by laminating a copper circuit to an insulating transparent base layer such as PET and the like has been used, wherein the composite material has advantages of an excellent electromagnetic shielding effect and light transmission.
- the composite material is produced by laminating a copper foil having a certain surface roughness onto the transparent base layer, and removing unnecessary parts of the copper foil by etching so as to form a copper circuit with a desired pattern. Appropriate circuit line width and pattern of the copper circuit are selected based on the required level of electromagnetic shielding capability and light transmission.
- the object of the present invention is to provide a surface-blackened copper foil for electromagnetic radiation shielding, which has low reflectance owing to its black- colored surface.
- Another object of the present invention is to provide a surface-blackened copper foil having a uniform appearance, which scarcely has stains and residues, even though the copper foil has a black-colored surface, and a method for manufacturing the same.
- Still another object of the present invention is to provide a surface- blackened copper foil for electromagnetic radiation shielding which has excellent peel strength and a method for manufacturing the same.
- the method for manu ⁇ facturing the surface-blackened copper foil for electromagnetic radiation shielding is characterized by comprising the following steps:
- the pH value of said basic electrolytic bath is 10 or more.
- the copper foil for electromagnetic radiation shielding is an electrolytic copper foil which may be available for the production with wide width, wherein the thickness of said copper foil is 1-35D, and preferably 6-18D, and the surface roughness (Rz: DIN) of said copper foil is 0.1-2.0 D, and preferably 0.5-1.5 D. When the surface roughness is less than 0.1 D, it will result in insufficient adhesion with the transparent substrate thereby decreasing the reliability of the elec ⁇ tromagnetic radiation shield.
- the surface unevenness of the transparent substrate having copper foil adhered thereto becomes greater after forming a circuit by etching, and this will further cause dete ⁇ rioration in display sharpness, undesirably.
- the present invention is mainly characterized in that it is possible to obtain a surface-blackened copper foil having a consistent and uniform appearance without generation of stains or residues even though the surface of the copper foil is black, by oxidizing the surface-blackened copper foil in a basic electrolytic bath.
- the blackening treatment of the copper foil is carried out by placing a copper foil as a cathode in an electroplating bath which contains a metal that develops black color and depositing the metal layer onto the surface of said copper foil cathode.
- a metal that develops black color As the black color-developing metals, Cu, Cr, Al, Co and the like are known in this field of art.
- Cu may develop complete black color but it causes a problem of damaging a copper foil circuit pattern by permeating into the copper foil circuit during the formation of the circuit pattern.
- Cr adversely affects to the etching performance in the formation of a copper foil circuit, thus it is not suitably applicable to the present invention.
- Co is the most suitably applicable metal in the present invention.
- the Co plating for blackening may be carried out by using an Ir electrode as an anode and a copper foil as a cathode with a current not less than a limiting current density, and the black plated layer of Co formed on the surface of the copper foil is in the form of Co oxides such as Co O , CoOOH and CoO.
- the Co concentration in the electroplating bath may be selected in the range of
- the black plated layer may be most efficiently formed in the range of 10-30 g/1.
- Current density which is industrially economic is in the range of 0.1-60 A/ dm , and particularly the range of 5-25 A/dm is preferred.
- the plating time may be in the range of 1-20 seconds, but the plating time may be varied, being out of said range, depending on the current density, the concentration of electrolytic liquid and the like.
- the surface roughness of the copper foil having the layer of plated particles may be in the range acceptable for the use as a copper foil for electromagnetic radiation shielding on the whole, however when observing the surface microscopically, the size or numbers of each nodule deposited on the surface of the copper foil are varied on each part depending on the surface or plating conditions of the copper foil. Further, during the deposition reaction, hydrogen is generated on the cathode, and the part where hydrogen is generated has a slightly different plating thickness as compared to the thickness of other parts.
- a copper foil where a black plated layer is formed is used as an anode in the basic electrolytic bath, and the surface of the black plated layer is oxidized (erosion) for flattening it to a certain extent, thereby reducing the stains or residues as much as possible.
- the electrolytic bath for anodizing oxidation is for a basic electrolysis comprised of a basic solution such as NaOH, KOH and the like, and the preferred current density in anodizing oxidation is 1-30 A/dm 2 , and the time may be selected in the range of 1-20 seconds.
- the current density and the time may be varied depending on the species, composition and temperature of the electrolytic liquid and the like.
- the a nodizing oxidation is may be carried out by using, for example stainless steel as a cathode and a surface-blackened copper foil as an anode.
- pH control of the basic electrolytic bath is a matter to be concerned.
- the pH value of the electrolytic bath should be at least 10 or more, and based on the experimental results of the present applicant, the best results were obtained at the pH value of 13.
- a layer of fine copper particles may be deposited onto the surface of the copper foil before carrying out plating for blackening.
- the deposited copper particles are served as an anchor so that the adhesiveness may become improved by increased peel strength in layering the copper foil onto the transparent substrate, and reduce the reflectance by diffused reflection of external light.
- the fine copper particles may be formed by a treatment for roughing which is applied to a copper foil for a printed circuit board(PCB).
- Such treatment for roughing is typically carried out in a plating bath of copper sulfate, and the amount of copper particles attached during the roughing process is preferably in the range of 0.1-10 g/D.
- the amount is less than said range (roughness being lowered)
- the reflectance becomes reduced but the peel strength (adhesiveness) becomes also lowered disadvan- tageously
- the peel strength becomes raised but the reflectance becomes increased adversely.
- the surface roughness should be maintained in the range of 0.1-2.0D in Rz (DIN standard).
- the reason for maintaining the surface roughness within said specific range is as described above.
- the surface roughness may be naturally maintained in said range.
- an anticorrosive treatment may be made to the copper foil according to the present invention, for example electrolytic chromate treatment and the like. Ad ⁇ ditionally, when plating Zn or Zn-alloy on the surface of the copper foil where black plated layer is not formed, it is possible to prevent discoloration during a heating process in manufacturing an electromagnetic radiation shield.
- Example 1 and then a plating process for blackening and anodizing oxidation were carried out under the conditions given below. [51] - Conditions of the plating process for blackening:
- Example 2 and then a plating process for blackening and anodizing oxidation were carried out under the same conditions as in Example 3.
- Example 5 a plating process for blackening and anodizing oxidation were carried out under the same conditions as in Example 3.
- Example 1 a plating process for blackening and anodizing oxidation were carried out under the conditions given below. [65] - Conditions of the plating process for blackening:
- Example 6 [76] A layer of fine copper particles was formed under the same conditions as in Example 2, and then a plating process for blackening and anodizing oxidation were carried out under the same conditions as in Example 5.
- examples 2, 4 and 6 where a layer of fine copper particles was formed before plating for blackening had improved peel strength as compared to examples 1, 3 and 5 each of which is prepared according to the same corresponding conditions except that the layer of fine copper particles was not formed. Additionally, it also can be recognized from the above table that the examples 3 and 5 where the black plated layer further comprises Ni and Fe respectively, had more improved peel strength relative to example 1 which does not comprise said components.
- the surface-treated copper foil produced by the method of the present invention has a black-colored appearance which has low reflectance, therefore providing an advantage that it does not degrade the brightness of the PDP screen.
- the surface-treated copper foil produced by the present invention has a uniform appearance without stains or residues even though it has a black-colored appearance, a composite material for an electromagnetic radiation shield using the same may be produced with a significantly lowered defective rate, and the screen of a PDP manufactured by using said composite material will have an excellent appearance.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2004-0022642 | 2004-04-01 | ||
| KR1020040022642A KR100603428B1 (ko) | 2004-04-01 | 2004-04-01 | 전자파 차폐용 흑화표면처리 동박의 제조방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006004298A1 true WO2006004298A1 (en) | 2006-01-12 |
Family
ID=35323803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2005/000951 WO2006004298A1 (en) | 2004-04-01 | 2005-03-31 | Method for manufacturing black surface-treated copper foil for emi shield |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3869433B2 (ko) |
| KR (1) | KR100603428B1 (ko) |
| WO (1) | WO2006004298A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2765225A1 (en) * | 2013-02-06 | 2014-08-13 | Nan Ya Plastics Corporation | Composite dual blackened copper foil and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150077943A (ko) * | 2013-12-30 | 2015-07-08 | 일진머티리얼즈 주식회사 | 동박, 이를 포함하는 전기부품 및 전지 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
| JPH07188979A (ja) * | 1993-12-27 | 1995-07-25 | Nikko Gould Foil Kk | 印刷回路用銅箔及びその製造方法 |
| JP2002167691A (ja) * | 2000-11-27 | 2002-06-11 | Furukawa Circuit Foil Kk | 金属箔、それを用いた回路基板用の積層板 |
| US20020182433A1 (en) * | 2000-04-25 | 2002-12-05 | Yasuhiro Endo | Method of producing a roughening-treated copper foil |
-
2004
- 2004-04-01 KR KR1020040022642A patent/KR100603428B1/ko active IP Right Grant
- 2004-05-20 JP JP2004150277A patent/JP3869433B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-31 WO PCT/KR2005/000951 patent/WO2006004298A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
| JPH07188979A (ja) * | 1993-12-27 | 1995-07-25 | Nikko Gould Foil Kk | 印刷回路用銅箔及びその製造方法 |
| US20020182433A1 (en) * | 2000-04-25 | 2002-12-05 | Yasuhiro Endo | Method of producing a roughening-treated copper foil |
| JP2002167691A (ja) * | 2000-11-27 | 2002-06-11 | Furukawa Circuit Foil Kk | 金属箔、それを用いた回路基板用の積層板 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2765225A1 (en) * | 2013-02-06 | 2014-08-13 | Nan Ya Plastics Corporation | Composite dual blackened copper foil and method of manufacturing the same |
| US8957326B2 (en) | 2013-02-06 | 2015-02-17 | Nan Ya Plastics Corporation | Composite dual blackened copper foil and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050097571A (ko) | 2005-10-10 |
| JP2005290541A (ja) | 2005-10-20 |
| KR100603428B1 (ko) | 2006-07-20 |
| JP3869433B2 (ja) | 2007-01-17 |
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