WO2005109482A1 - ガス供給集積ユニット - Google Patents
ガス供給集積ユニット Download PDFInfo
- Publication number
- WO2005109482A1 WO2005109482A1 PCT/JP2005/007308 JP2005007308W WO2005109482A1 WO 2005109482 A1 WO2005109482 A1 WO 2005109482A1 JP 2005007308 W JP2005007308 W JP 2005007308W WO 2005109482 A1 WO2005109482 A1 WO 2005109482A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- unit
- gas
- holding member
- flow path
- gas supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/02—Pipe-line systems for gases or vapours
- F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/34—Hydrogen distribution
Definitions
- the present invention relates to a gas supply integrated unit used in a semiconductor manufacturing apparatus or the like, and more particularly, to dichlorosilane which is liable to liquefy unless external heat is removed at room temperature where the vaporization temperature is high. (Or dichlorosilane), WF6, HBr, etc. It is related to a gas supply integrated unit that supplies process gas with high accuracy without liquefaction.
- a silicon oxide thin film or the like formed by a vapor phase has been frequently used as an insulating film in a semiconductor integrated circuit.
- the vapor phase film formation of strong silicon oxide or the like is generally performed by a chemical vapor deposition method on a wafer placed in a film forming tank.
- the gas supply device of Patent Document 1 uses, for example, piping, fittings, gas valves 62 and 64, and an electromagnetic valve with a mass flow meter as shown in FIG.
- the tape-shaped heater 60 is held and arranged in holding grooves 53, 54 formed in the heat transfer block 51 and the sub heat transfer block 52.
- the dichlorosilane (or dichlorosilane) or the like is heated and kept at a temperature higher than the vaporization temperature.
- the upper surface of the heat transfer block 51 is a contact surface 65 that contacts the solenoid valve 61 with a mass flow meter from below, and heats and heats the solenoid valve 61 with a mass flow meter.
- Patent document 1 JP-A-7-286720
- the gas supply device shown in Fig. 9 has a heat transfer block 51 and a sub heat transfer block on both sides of the gas unit. Since the tape-shaped heaters 60 are provided in the holding grooves 53 and 54 formed in the gas unit 52, the width of the gas unit is larger than that of the gas unit that does not require a heater.
- the gas supply device requires many components for heating and keeping heat, such as the heater 60, the heat transfer block 51, and the sub-heat transfer block 52, on both sides of the gas unit, resulting in high costs.
- the gas supply integrated unit of the present invention has the following configuration in order to solve the above problems.
- a second manual valve provided at a position communicating with the passage is integrally connected in series with the passage block and the unit fixing plate, and the cross section of the gas supply integrated unit having a plurality of gas units is U-shaped.
- the gas unit is fitted to the holding member, and a rail to be fastened, and a plate-like shape sandwiched between the holding member and the rail. And a spacer member.
- the gas supply integrated unit of the present invention has the following functions and effects.
- the gas supply integrated unit of the present invention includes a first manual valve provided in an outlet flow path, an air operated valve provided at a position communicating the first manual valve with a process gas common flow path,
- a gas supply integrated unit including a plurality of gas units in which a manual valve and a second manual valve provided at a position communicating the purge gas common flow path are integrally connected in series by a flow path block and a unit fixing plate, Is a U-shape, and a holding member to which the flow path block and the unit fixing plate are fitted is fixed between the holding member, the flow path block and the unit fixing plate. Since the gas unit has the flat heater, the external dimensions of the gas unit can be made exactly the same as those of the gas unit which does not require the flat heater.
- the outer dimensions do not change even in the entire gas supply integrated unit in which the gas units are integrated. Furthermore, since the channel block of the gas unit and the unit fixing plate are heated and maintained from the back, only one flat heater and one holding member are required for one gas unit as components for heating and maintaining the temperature. Therefore, the number of parts can be reduced and the cost can be reduced.
- the gas supply integrated unit of the present invention has a plate-like shape in which the gas unit is fitted to and fastened to the holding member, and a rail which is held between the holding member and the rail. Since there is a spacer member, by removing the spacer member, the flat heater can be removed and another flat heater can be mounted while maintaining the state in which the gas supply integrated pipe can be used. . Thus, the replacement of the flat heater is easy and the maintenance is easy.
- the gas supply integrated unit of the present invention includes one or more flat heaters disposed in contact with the bottom surface of the gas unit, a holding member for holding the flat heater, and a holding member for holding the flat heater.
- the gas heater does not require one flat heater and one holding member for each gas unit. If the plane heater and the holding member are one or two or more in the entire supply and accumulation unit, the number of parts for heating and keeping the gas supply and accumulation unit is small, and the cost can be reduced. Furthermore, the number of flat heaters is reduced. By doing so, wiring becomes easy, and the flat heater can be easily replaced.
- FIG. 1 is a plan view showing a configuration of a gas supply integrated unit according to a first embodiment of the present invention.
- FIG. 2 is a front view of a gas supply integrated unit according to a first embodiment of the present invention.
- FIG. 3 is a circuit diagram showing the configuration of FIG. 1.
- FIG. 4 is a perspective view showing an assembling order of the gas unit according to the first embodiment of the present invention.
- FIG. 5 is a cross-sectional view taken along a line AA in FIG. 1.
- FIG. 6 is a view showing attachment and detachment of a heater 16 in FIG.
- FIG. 7 is a plan view showing a configuration of a gas supply integrated unit according to a second embodiment of the present invention.
- FIG. 8 is a sectional view taken along the line BB of FIG. 7.
- FIG. 9 is a perspective view of a conventional gas supply device.
- FIG. 10 is a diagram illustrating the heat transfer block of FIG. 9.
- FIG. 1 is a plan view showing the configuration of a gas supply integrated unit that supplies process gas to five lines
- FIG. 2 is a front view of FIG.
- FIG. 3 shows the circuit diagram of FIG.
- the two rails 10 and 12 are fixed at both ends in parallel by rail fixing bars 13 and 14.
- the circuit configuration of the equipment to be installed in each of the purge gas unit, process gas unit, and gas units A, B, C, D, and E is shown in Fig. 3.
- the purge gas manual valve 29 is not shown via the purge gas supply port 28!
- the purge gas manual valve 29 is connected to one port of the second manual valves 25A, 25B, 25C, 25D, and 25E via the air operated valve 32, the check valve 33, and the purge gas common flow path 43.
- a pressure gauge 31 is connected to a flow path that connects the purge gas manual valve 29 and the air operated valve 32.
- the other ports of the second manual valves 25A, 25B, 25C, 25D, 25E are connected to one port of the regulators 24A, 24B, 24C, 24D, 24E.
- the process gas manual valve 35 is connected to a process gas tank (not shown) via a process gas supply port 34.
- the process gas manual valve 35 is connected to one of the air operated valves 26A, 26B, 26C, 26D, and 26E via an air operated valve 37 and a process gas common flow path 44.
- a pressure gauge 36 is connected to a flow path connecting the process gas manual valve 35 and the air operated valve 37.
- the other ports of the air operated valves 26A, 26B, 26C, 26D, 26E are connected to one port of the regulators 24A, 24B, 24C, 24D, 24E.
- the other ports of the regulators 24A, 24B, 24C, 24D, 24E are connected to the process gas outlets 21A, 21B, 21C, 21D, 21E via the first manual valves 22A, 22B, 22C, 22D, 22E.
- Regulators 24A, 24B, 24C, 24D, 24E communicate with the first manual valves 22A, 22B, 22C, 22D, 22E.
- Pressure gauges 23A, 23B, 23C, 23D, 23E are connected to the road.
- the end of the process gas common flow path 44 is sealed by the process gas common flow path end manual valve 41.
- the end of the purge gas common flow path 43 is sealed by a purge gas common flow path end manual valve 38.
- FIG. 4 is a perspective view showing an assembling sequence of a gas unit of one line of the gas supply integrated unit.
- the gas unit namely the gas unit, process gas unit and gas units A, B, C, D and E.
- each device is integrally connected in series by a unit fixing plate 15 via a flow path block 46 (see FIG. 2).
- the unit fixing plate 15 and the flat heater 16 disposed below the unit fixing plate 15 are fitted to the U-shaped cross section of the holding member 18.
- the unit fixing plate 15 is fixed to the rails 10 and 12 by fastening means 20 by holding a plate-shaped spacer member 19 between the holding member 18 and the rails 10 and 12.
- process gas is supplied from a process gas tank (not shown) to the process gas supply port 34, the process gas manual valve 35, the air operated valve 37, the process gas common flow path 44, and the air operated valves 26A, 26B, 26C, 26D, 26E.
- Flow to the regulators 24A, 24B, 24C, 24D, and 24E, and the first manual valves 22A, 22B, 22C, 22D, and 22E also pass through the process gas outputs PI 21A, 21B, 21C, 21D, and 21E. It flows to the supply destination.
- a purge gas which is a nitrogen gas
- the process gas manual valve 35 is closed, and the air operate valve 37 is closed by a signal to shut off the flow of the process gas.
- a purge gas which is a nitrogen gas
- a purge gas is introduced into each line of the gas units A, B, C, D and E from a purge gas tank (not shown).
- the purge gas passes through the purge gas manual valve 29, the air operated valve 32, the check valve 33, the purge gas common flow path 43, the second manual valve 25A, 25B, 25C, 25D, 25E, and the regulators 24A, 24B, It flows to 24C, 24D, 24E, and the first manual valves 22A, 22B, 22C, 22D, 22E are also discharged to the exhaust system via the process gas outlets 21A, 21B, 21C, 21D, 21E.
- the purge gas manual valve 29 and the second manual valves 25A, 25B, 25C, 25D, and 25E are closed, and the air operated valve 32 is closed by a signal to stop the flow of the purge gas.
- the plane heater 16 is disposed below the unit fixing plate 15 and is fitted to the U-shaped cross section of the holding member 18.
- the heat is transferred via the unit fixing plate 15 to the purge gas unit, the process gas unit, and the gas unit A. , B, C, D, and E are transmitted to the flow path block 46 and the equipment attached to the flow path block 46.
- FIG. 5 showing a cross section taken along the line AA of FIG. 1 and FIG. 6 showing attachment and detachment of the flat heater 16.
- the unit fixing plate 15 and the flat heater 16 disposed below the unit fixing plate 15 are fitted into the U-shaped cross section of the holding member 18, and the unit fixing plate 15 is attached to the holding member 18, the rail 10, and the rail.
- a plate-shaped spacer member 19 is sandwiched between the rails 12 and fixed to the rails 10 and 12 by fastening means 20.
- the gas supply integrated unit can be used by removing the fastening means 20 and removing the spacer member 16. 6, the flat heater 16 can be removed and another flat heater 16 can be attached as shown in FIG.
- the first manual valve 22 provided in the outlet flow path, the first manual valve 22 and the process gas common flow path 44
- An air operated valve 26 provided at a position communicating the first manual valve 22 and a second manual valve 25 provided at a position communicating the first manual valve 22 and the purge gas common flow path 43 are provided with a flow path block 46 and a unit fixing plate 1.
- a cross-section is U-shaped, and a holding member 18 to which the flow path block 46 and the unit fixing plate 15 are fitted is provided.
- the gas heater has a flat heater 16 sandwiched and fixed between the holding member 18, the flow path block 46 and the unit fixing plate 15, the outer dimensions of the gas unit are completely different from those of the gas unit which does not require the flat heater 16. Can be the same. Therefore, the outer dimensions do not change even in the entire gas supply integrated unit in which the gas units are integrated.
- the flow path block 46 of the gas unit and the unit fixing plate 15 are back-heated and heat-retained, one flat heater and one holding member are provided for one gas unit as heat-insulation parts. Just required, cost can be reduced by reducing the number of parts.
- the gas unit is fitted to the holding member 18 and the rails 10 and 12 to be fastened, and the space between the holding member 18 and the rail 10 and the rail 12 is narrow. Since it has the plate-shaped spacer member 19 to be held, the flat heater 16 can be easily replaced and maintenance is easy. That is, by removing the spacer member 19, the flat heater 16 can be removed and another flat heater 16 can be attached while the gas supply integrated unit can be used.
- FIG. 7 is a plan view showing the configuration of the gas supply integrated unit similar to that of FIG. 1, and FIG. 8 shows a cross section taken along the line BB of FIG. Two rails 10, 12 Force Both ends are fixed in parallel by rail fixing rods 13, 14.
- the purge gas unit, process gas unit, and gas units A, B, C, D, and E move from left to right along the rails 10 and 12 in parallel with the rail fixing bars 13 and 14, respectively, by the unit fixing plate 15.
- the plane heater 17 has a force of one sheet or two or more sheets.
- FIGS. 7 and 8 show an example of two sheets.
- the two flat heaters 17 are in contact with the lower part of the unit fixing plate 15 to which the purge gas unit, the process gas unit, and the gas units A, B, C, D, and E are fixed, respectively, and extend in the longitudinal direction of the unit fixing plate 15. They are arranged orthogonally.
- the two flat heaters 17 are held by holding members 48, respectively, and the holding members 48 are fixed by fastening means 49 and two holding member fixing plates 47.
- One holding member fixing plate 47 is mounted on the left side of the process gas unit in parallel with the rail fixing bar 13, and the other holding member fixing plate 47 is mounted on the right side of the gas unit E in parallel with the rail fixing bar 14. .
- the two holding member fixing plates 47 are fixed at both ends to the rails 10 and 12, respectively.
- the operation and effect of the gas supply integrated unit according to the second embodiment of the present invention will be described.
- the operation of the gas supply integrated unit as a whole is the same as in the first embodiment, and will not be described.
- the plane heater 17 is disposed in contact with the lower part of the unit fixing plate 15 and is held by a holding member 48.
- the process heater is energized while the process gas is flowing through the gas supply integrated unit to generate Joule heat, the heat is transmitted via the unit fixing plate 15 to the purge gas unit, the process gas unit, and the gas unit A. , B, C, D, and E are transmitted to the equipment attached to the flow path block 46.
- FIG. 7 a plan view showing the configuration of the gas supply integrated unit of the second embodiment in FIG. 7 and FIG.
- the mounting state of the left plane heater 17 shows a state in which the holding member 48 is not tightened by the fastening means 49 in FIG. 8, and the mounting state of the right plane heater 17 in FIG. Indicates the state of being tightened by 49.
- the state of the left side heater 17 is also checked by looking at the right side force in FIG. 7 (see FIG. 8).
- the flat heater 17 was pulled out in the direction of arrow K1 shown in FIG. 7, removed, and another flat heater 17 was inserted in the direction of arrow K2 shown in FIG. After that, the holding member 48 is fixed to the holding member fixing plate 47 by the fastening means 49.
- one or more flat heaters 17 disposed in contact with the bottom surface of the gas cut, and the flat heater 17 17 and a holding member fixing plate 47 for fixing the holding member 48 by sandwiching the flat heater 17 between the holding member 48, the flow path block 46 and the unit fixing 15.
- the external dimensions of the gas unit can be made exactly the same as those of the gas unit that does not require the flat heater 17. Therefore, the external dimensions do not change even in the entire gas supply integrated unit in which the gas units are integrated.
- one flat heater 17 and one holding member 48 are not required for each gas unit, and the flat heater 17 and the holding member 48 need only be one or two or more in the entire gas supply integrated unit. Therefore, the number of components for heating and keeping the gas supply integrated unit is small and the cost can be reduced. Further, since the number of the flat heaters 17 is reduced, wiring becomes easy, and the flat heaters 17 can be easily replaced.
- the air supply valve is mounted on the gas supply integrated unit.
- the type and arrangement of the mounted fluid control devices are not limited thereto, and can be changed as appropriate.
- the flat heater 17 when attaching and detaching the flat heater 7, the flat heater 17 is pulled out in the direction of arrow K1 shown in FIG. 7 and removed, and another flat heater 17 is inserted in the direction of arrow K2 shown in FIG.
- the flat heater 17 may be pulled out in the direction of arrow K2 shown in FIG. 7 and removed, and another flat heater 17 may be inserted in the direction of arrow K1 shown in FIG.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Valves (AREA)
- Valve Housings (AREA)
- Pipeline Systems (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020067025097A KR101074265B1 (ko) | 2004-05-10 | 2005-04-15 | 가스 공급 집적 유닛 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004140039A JP4567370B2 (ja) | 2004-05-10 | 2004-05-10 | ガス供給集積ユニット |
| JP2004-140039 | 2004-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005109482A1 true WO2005109482A1 (ja) | 2005-11-17 |
Family
ID=35320469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/007308 Ceased WO2005109482A1 (ja) | 2004-05-10 | 2005-04-15 | ガス供給集積ユニット |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4567370B2 (ja) |
| KR (1) | KR101074265B1 (ja) |
| CN (1) | CN100440454C (ja) |
| TW (1) | TW200538678A (ja) |
| WO (1) | WO2005109482A1 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006134727A1 (ja) * | 2005-06-17 | 2006-12-21 | Fujikin Incorporated | 流体制御装置 |
| JP2012159102A (ja) * | 2011-01-31 | 2012-08-23 | Fujikin Inc | 流体制御装置 |
| JP2014002884A (ja) * | 2012-06-18 | 2014-01-09 | Tem-Tech Kenkyusho:Kk | 集積ガス供給装置用の平面発熱板およびその製造方法 |
| KR20150059794A (ko) * | 2012-11-29 | 2015-06-02 | 가부시키가이샤 후지킨 | 유체 제어 장치 |
| WO2020261985A1 (ja) * | 2019-06-28 | 2020-12-30 | 株式会社フジキン | 流体制御装置 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008014390A (ja) * | 2006-07-05 | 2008-01-24 | Hitachi Metals Ltd | 集積形流体制御装置 |
| US7807222B2 (en) * | 2007-09-17 | 2010-10-05 | Asm International N.V. | Semiconductor processing parts having apertures with deposited coatings and methods for forming the same |
| JP5000469B2 (ja) * | 2007-12-05 | 2012-08-15 | 株式会社キッツエスシーティー | 容器用ブロックバルブ |
| JP5410173B2 (ja) * | 2009-06-30 | 2014-02-05 | Ckd株式会社 | ガス供給装置 |
| JP6966499B2 (ja) * | 2019-03-06 | 2021-11-17 | Ckd株式会社 | ガス供給ユニット及びガス供給方法 |
| US20250075898A1 (en) * | 2021-12-22 | 2025-03-06 | Proterial, Ltd. | Vaporizer |
| KR20230097553A (ko) * | 2021-12-24 | 2023-07-03 | 주식회사 테스 | 기판처리장치용 통합가스시스템 |
| CN118328226B (zh) * | 2024-06-17 | 2024-09-27 | 鸿舸半导体设备(上海)有限公司 | 气体系统集成模块及气体输送控制方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999064780A1 (en) * | 1998-06-08 | 1999-12-16 | Advanced Delivery & Chemical Systems, Ltd. | Chemical delivery system having purge system utilizing multiple purge techniques |
| JP2001073144A (ja) * | 1999-09-03 | 2001-03-21 | Pioneer Electronic Corp | 化学気相成長法における原料供給装置 |
| JP2002173777A (ja) * | 2000-12-01 | 2002-06-21 | C Bui Res:Kk | Cvd装置の金属液体気化ユニット及び気化方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964254A (en) * | 1997-07-11 | 1999-10-12 | Advanced Delivery & Chemical Systems, Ltd. | Delivery system and manifold |
| JP3767897B2 (ja) * | 2004-03-01 | 2006-04-19 | シーケーディ株式会社 | ガス供給集積ユニット |
-
2004
- 2004-05-10 JP JP2004140039A patent/JP4567370B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-15 KR KR1020067025097A patent/KR101074265B1/ko not_active Expired - Fee Related
- 2005-04-15 CN CNB2005800149890A patent/CN100440454C/zh not_active Expired - Fee Related
- 2005-04-15 WO PCT/JP2005/007308 patent/WO2005109482A1/ja not_active Ceased
- 2005-04-21 TW TW094112680A patent/TW200538678A/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999064780A1 (en) * | 1998-06-08 | 1999-12-16 | Advanced Delivery & Chemical Systems, Ltd. | Chemical delivery system having purge system utilizing multiple purge techniques |
| JP2001073144A (ja) * | 1999-09-03 | 2001-03-21 | Pioneer Electronic Corp | 化学気相成長法における原料供給装置 |
| JP2002173777A (ja) * | 2000-12-01 | 2002-06-21 | C Bui Res:Kk | Cvd装置の金属液体気化ユニット及び気化方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006134727A1 (ja) * | 2005-06-17 | 2006-12-21 | Fujikin Incorporated | 流体制御装置 |
| JP2006349075A (ja) * | 2005-06-17 | 2006-12-28 | Fujikin Inc | 流体制御装置 |
| JP2012159102A (ja) * | 2011-01-31 | 2012-08-23 | Fujikin Inc | 流体制御装置 |
| JP2014002884A (ja) * | 2012-06-18 | 2014-01-09 | Tem-Tech Kenkyusho:Kk | 集積ガス供給装置用の平面発熱板およびその製造方法 |
| KR20150059794A (ko) * | 2012-11-29 | 2015-06-02 | 가부시키가이샤 후지킨 | 유체 제어 장치 |
| KR101674849B1 (ko) | 2012-11-29 | 2016-11-09 | 가부시키가이샤 후지킨 | 유체 제어 장치 |
| WO2020261985A1 (ja) * | 2019-06-28 | 2020-12-30 | 株式会社フジキン | 流体制御装置 |
| US12152685B2 (en) | 2019-06-28 | 2024-11-26 | Fujikin Incorporated | Fluid control apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005322797A (ja) | 2005-11-17 |
| JP4567370B2 (ja) | 2010-10-20 |
| KR101074265B1 (ko) | 2011-10-19 |
| TWI343464B (ja) | 2011-06-11 |
| KR20070011549A (ko) | 2007-01-24 |
| CN1950931A (zh) | 2007-04-18 |
| TW200538678A (en) | 2005-12-01 |
| CN100440454C (zh) | 2008-12-03 |
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